CN113291032A - 一种可热成型的电子产品皮革后盖及其生产工艺 - Google Patents

一种可热成型的电子产品皮革后盖及其生产工艺 Download PDF

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CN113291032A
CN113291032A CN202110444373.8A CN202110444373A CN113291032A CN 113291032 A CN113291032 A CN 113291032A CN 202110444373 A CN202110444373 A CN 202110444373A CN 113291032 A CN113291032 A CN 113291032A
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layer
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刘文亮
谢金沛
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Hengshan County Jiacheng New Material Co ltd
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Abstract

一种可热成型的电子产品皮革后盖及其生产工艺,涉及电子产品结构设计领域,其包括在带有皮革纹理的压纹纸或压纹膜上涂覆涂料,涂料中添加有温致变色材料或光致变色材料或不同颜色且相融的色浆或色膏,然后烤干固化定型,得到带有压纹纸或压纹膜的皮革层;在皮革层的表面涂布丙烯酸胶或硅胶或压敏胶,从而在皮革层上形成一层胶粘层;在胶粘层上贴覆一层离型膜;撕掉压纹纸或压纹膜,并在皮革层的另一表面涂布抗污涂料,从而在皮革层的另一表面形成抗污层;剥开离型膜,将胶粘层贴覆于有机复合材料层上,得到一体式的复合皮革;将一体式的复合皮革热压成型,从而得到电子产品皮革后盖。本发明不仅美观性较好,而且还能提升功能性和产品质量。

Description

一种可热成型的电子产品皮革后盖及其生产工艺
技术领域
本发明涉及电子产品结构设计领域,尤其指一种可热成型的电子产品皮革后盖及其生产工艺。
背景技术
随着电子产品的普及程度提高,手机、平板等产品已成为消费者生活中不可或缺的伴侣,这些产品外形的特征性能以及特异化性能对消费者来说也尤其重要。以手机产品为例,当下消费者对手机后盖的特性也越来越关注,在手机后盖的造型、色彩、材质、功能搭配和装饰等方面,都开始产生一定的时尚要求。然而目前的手机后盖大多为硬质塑料或金属或玻璃、陶瓷材质制成的,在功能性和美观性上略显不足,而且防爆效果也不理想,不符合轻量化设计。
目前像一些高端的手机、平板,其后盖通常会设置有皮革材料,以提升产品的外观效果并提高消费者的使用体验度,这类皮革后盖的生产工艺方法一般是采用皮革贴合到已经成型的产品壳体上,在贴合后会存在曲边以及弧顶拉伸纹络变形等问题,而且生产过程中只能通过片材与片材贴合的方式完成,这又导致了产能以及效率处于较低的水平。不仅如此,目前这类产品壳体采用的是PC或PC+PMMA等有机板材热压成型,其变形率大、易产生开裂,导致产品的整体质量效果不佳。
发明内容
本发明的目的在于提供一种可热成型的电子产品皮革后盖的生产工艺,通过该生产工艺加工出的电子产品皮革后盖不仅美观性较好,而且还能提升功能性和产品质量。
为了解决上述技术问题,本发明采用如下技术方案:一种可热成型的电子产品皮革后盖的生产工艺,包括以下步骤:
一、在带有皮革纹理的压纹纸或压纹膜上涂覆涂料,所述涂料中添加有温致变色材料或光致变色材料或不同颜色且相融的色浆或色膏,然后烤干固化定型,得到带有压纹纸或压纹膜的皮革层。
二、在所述皮革层的表面涂布丙烯酸胶或硅胶或压敏胶,从而在所述皮革层上形成一层胶粘层。
三、在所述胶粘层上贴覆一层离型膜。
四、撕掉所述压纹纸或压纹膜,并在所述皮革层的另一表面涂布抗污涂料,从而在所述皮革层的另一表面形成抗污层。
五、剥开所述离型膜,将胶粘层贴覆于有机复合材料层上,得到一体式的复合皮革,其中,所述有机复合材料层为有机复合板材或卷材裁切而成。
六、将所述一体式的复合皮革热压成型,从而得到电子产品皮革后盖;或者可将所述一体式的复合皮革再贴合一层或多层有机复合材料层后进行同步热压成型,从而得到电子产品皮革后盖。
优选地,所述抗污层也可在步骤六设置成型,其中,可在步骤六中所述电子产品皮革后盖的表面喷涂或者刷涂自干型的抗污层。
更优选地,所述涂料为PU胶或硅胶。
更优选地,所述皮革层的厚度为50-300um,其拉断强度≥5MPa,断裂伸长率≥300%,压缩比≥25%。
更优选地,所述胶粘层的厚度为5-20um,其粘性≥1500gf。
更优选地,所述抗污涂料为PU系或硅系材料制成。
更优选地,所述有机复合材料层为单层的PC材料或PC与PMMA共混材料或PET材料或ABS材料;或者所述有机复合材料层为添加有玻璃纤维补强材料的有机复合板材;所述有机复合材料层的厚度为0.2-0.8mm。
另外,本发明还提供一种通过上述的可热成型的电子产品皮革后盖的生产工艺制备的电子产品皮革后盖,其包括皮革层,所述皮革层通过在带有皮革纹理的压纹纸或压纹膜上涂覆的涂料固化成型,并且所述涂料中添加有温致变色材料或光致变色材料或不同颜色且相融的色浆或色膏,所述皮革层一面涂覆有抗污层、另一面通过胶粘层贴覆有一层或多层有机复合材料层。
本发明的有益效果在于:本发明的皮革层与有机复合材料层复合后形成一个整体再进行热压成型并得到电子产品皮革后盖,不会出现那种因皮革层贴合到已成型电子产品后盖上而造成的曲边以及弧顶拉伸纹络变形等问题,相比于先成型电子产品后盖再贴膜的工艺而言,本发明的工艺方法效率更高、更有利于提高产能以及产品质量。
另外,通过设置带有皮革纹理且有色彩的皮革层,可提高手机后盖的美观性,其中的色彩可提前进行混合搭配,若涂料中添加的是温致变色材料或光致变色材料,还可使得手机后盖根据环境的温度或光线刺激进行色彩的变换,从而获得功能性并提高美观效果。不仅如此,皮革层表面涂布的抗污层还可实现抗污防爆裂、缓冲防摔裂的效果,而皮革层由于本身是涂料固化形成的,因此在能展现皮革纹理的同时,相较于真皮材质而言还能具有较强的稳定性、耐老化性和耐黄变性能,并且色彩更加光泽,触感也足够舒适,功能性较好。
附图说明
图1为本发明实施例中的整体结构示意图;
图2为本发明实施例中步骤三得到的结构示意图。
附图标记为:
1——皮革层 2——胶粘层 3——离型膜
4——抗污层 5——有机复合材料层 6——压纹纸
7——压纹膜。
具体实施方式
为了便于本领域技术人员的理解,下面结合实施例与附图对本发明作进一步的说明,实施方式提及的内容并非对本发明的限定。
一种可热成型的电子产品皮革后盖的生产工艺,包括以下步骤:
一、在带有皮革纹理的压纹纸或压纹膜上涂覆涂料,涂料中添加有温致变色材料或光致变色材料或不同颜色且相融的色浆或色膏,然后烤干固化定型,得到带有压纹纸或压纹膜的皮革层1。
二、在皮革层1的表面涂布丙烯酸胶或硅胶或压敏胶,从而在皮革层1上形成一层胶粘层2。
三、在胶粘层2上贴覆一层离型膜3(得到如图2所示的结构)。
四、撕掉压纹纸或压纹膜,并在皮革层1的另一表面涂布抗污涂料,从而在皮革层1的另一表面形成抗污层4。
五、剥开离型膜3,将胶粘层2贴覆于有机复合材料层5上,得到一体式的复合皮革,其中,有机复合材料层5为有机复合板材或卷材裁切而成。
六、将一体式的复合皮革热压成型,从而得到电子产品皮革后盖;或者可将一体式的复合皮革再贴合一层或多层有机复合材料层5后进行同步热压成型,从而得到电子产品皮革后盖。
上述实施方式提供的可热成型的电子产品皮革后盖的生产工艺,可使皮革层1与有机复合材料层5复合后形成一个整体再进行热压成型并得到电子产品皮革后盖,不会出现那种因皮革层1贴合到已成型电子产品后盖上而造成的曲边以及弧顶拉伸纹络变形等问题,相比于先成型电子产品后盖再贴膜的工艺而言,本发明的工艺方法效率更高、更有利于提高产能以及产品质量。
另外,通过设置带有皮革纹理且有色彩的皮革层1,可提高手机后盖的美观性,其中的色彩可提前进行混合搭配,若涂料中添加的是温致变色材料或光致变色材料,还可使得手机后盖根据环境的温度或光线刺激进行色彩的变换,从而获得功能性并提高美观效果。不仅如此,皮革层1表面涂布的抗污层还可实现抗污防爆裂、缓冲防摔裂的效果,而皮革层1由于本身是涂料固化形成的,因此在能展现皮革纹理的同时,相较于真皮材质而言还能具有较强的稳定性、耐老化性和耐黄变性能,并且色彩更加光泽,触感也足够舒适,功能性较好。
作为优选地,抗污层4也可在步骤六设置成型,具体来说,可在步骤六中电子产品皮革后盖的表面喷涂或者刷涂自干型的抗污层4。
作为更优选地,涂料为PU胶或硅胶,选择为硅胶时,其耐温性以及环保型优于传统的PVC或者其他人造革,同步在热压成型时不会软化,避免形成纹络消失变浅等不良产品。
在本实施例中,皮革层1的厚度为50-300um,其拉断强度≥5MPa,断裂伸长率≥300%,压缩比≥25%;胶粘层2的厚度为5-20um,其粘性≥1500gf;抗污涂料为PU系或硅系材料制成。
有机复合材料层5为单层的PC材料或PC与PMMA共混材料或PET材料或ABS材料;或者有机复合材料层5为添加有玻璃纤维补强材料的有机复合板材,采用玻璃纤维补强的有机复合板材,具有良好的抗变形性和耐摔性能,优于传统陶瓷、钢化玻璃等无基材材料,也优于一般的有机板材。本实施例中的有机复合材料层5的厚度为0.2-0.8mm。
另外,本实施例还提供一种根据上述可热成型的电子产品皮革后盖的生产工艺制备的电子产品皮革后盖,如图1所示,其包括皮革层1,皮革层1通过在带有皮革纹理的压纹纸或压纹膜上涂覆的涂料固化成型,并且所述涂料中添加有温致变色材料或光致变色材料或不同颜色且相融的色浆或色膏,皮革层1一面涂覆有抗污层4、另一面通过胶粘层2贴覆有一层或多层有机复合材料层5。
上述实施例为本发明较佳的实现方案,除此之外,本发明还可以其它方式实现,在不脱离本技术方案构思的前提下任何显而易见的替换均在本发明的保护范围之内。
为了让本领域普通技术人员更方便地理解本发明相对于现有技术的改进之处,本发明的一些附图和描述已经被简化,并且为了清楚起见,本申请文件还省略了一些其它元素,本领域普通技术人员应该意识到这些省略的元素也可构成本发明的内容。

Claims (7)

1.一种可热成型的电子产品皮革后盖的生产工艺,其特征在于,包括以下步骤:
一、在带有皮革纹理的压纹纸或压纹膜上涂覆涂料,所述涂料中添加有温致变色材料或光致变色材料或不同颜色且相融的色浆或色膏,然后烤干固化定型,得到带有压纹纸或压纹膜的皮革层(1);
二、在所述皮革层(1)的表面涂布丙烯酸胶或硅胶或压敏胶,从而在所述皮革层(1)上形成一层胶粘层(2);
三、在所述胶粘层(2)上贴覆一层离型膜(3);
四、撕掉所述压纹纸或压纹膜,并在所述皮革层(1)的另一表面涂布抗污涂料,从而在所述皮革层(1)的另一表面形成抗污层(4);
五、剥开所述离型膜(3),将胶粘层(2)贴覆于有机复合材料层(5)上,得到一体式的复合皮革,其中,所述有机复合材料层(5)为有机复合板材或卷材裁切而成;
六、将所述一体式的复合皮革热压成型,从而得到电子产品皮革后盖;或者可将所述一体式的复合皮革再贴合一层或多层有机复合材料层(5)后进行同步热压成型,从而得到电子产品皮革后盖。
2.根据权利要求1所述的可热成型的电子产品皮革后盖的生产工艺,其特征在于:所述抗污层(4)也可在步骤六设置成型,其中,可在步骤六中所述电子产品皮革后盖的表面喷涂或者刷涂自干型的抗污层(4)。
3.根据权利要求1所述的可热成型的电子产品皮革后盖的生产工艺,其特征在于:所述涂料为PU胶或硅胶。
4.根据权利要求1所述的可热成型的电子产品皮革后盖的生产工艺,其特征在于:所述皮革层(1)的厚度为50-300um,其拉断强度≥5MPa,断裂伸长率≥300%,压缩比≥25%。
5.根据权利要求1所述的可热成型的电子产品皮革后盖的生产工艺,其特征在于:所述胶粘层(2)的厚度为5-20um,其粘性≥1500gf。
6.根据权利要求1所述的可热成型的电子产品皮革后盖的生产工艺,其特征在于:所述有机复合材料层(5)为单层的PC材料或PC与PMMA共混材料或PET材料或ABS材料;或者所述有机复合材料层(5)为添加有玻璃纤维补强材料的有机复合板材;所述有机复合材料层(5)的厚度为0.2-0.8mm。
7.一种根据权利要求1-6中任一项所述的可热成型的电子产品皮革后盖的生产工艺制备的电子产品皮革后盖,其特征在于:包括皮革层(1),所述皮革层(1)通过在带有皮革纹理的压纹纸或压纹膜上涂覆的涂料固化成型,并且所述涂料中添加有温致变色材料或光致变色材料或不同颜色且相融的色浆或色膏,所述皮革层(1)一面涂覆有抗污层(4)、另一面通过胶粘层(2)贴覆有一层或多层有机复合材料层(5)。
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