CN113286442A

CN113286442A - Active metal brazing substrate and solder resist method thereof

Info

Publication number: CN113286442A
Application number: CN202010105281.2A
Authority: CN
Inventors: 江文忠
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-02-20
Filing date: 2020-02-20
Publication date: 2021-08-20

Abstract

The invention relates to an active metal brazing substrate, which comprises: a carrier plate; a temporary solder mask layer formed on the carrier plate according to the region except the required circuit pattern; a solder layer formed on the carrier plate according to the required circuit pattern relative to the temporary solder mask layer; and a circuit layer formed on the soldering layer. Therefore, the temporary solder mask can be used for preventing the active metal solder of the welding layer from wetting the circuit pattern, so as to solve the problem that the prior art can cause the reduction of the insulativity between the circuits or the occurrence of short circuit, and have the effect of avoiding the reduction of the insulativity between the circuits or the occurrence of short circuit.

Description

Active metal brazing substrate and solder resist method thereof

Technical Field

The invention relates to an active metal brazing substrate and a brazing method thereof, in particular to a design that a temporary brazing resistance layer and a welding layer are formed on a carrier plate, and active metal solders of the welding layer are prevented from wetting outside a circuit pattern by the temporary brazing resistance layer.

Background

An active metal brazing substrate (such as a copper-clad ceramic substrate) with high bonding strength, which is formed by brazing a metal sheet (such as copper foil) on a carrier (such as a ceramic plate) by using an active metal (such as silver, copper and titanium); however, in the first method of manufacturing the active metal brazing substrate, active metal solder is printed on a carrier plate in a full-page manner, then a full-page metal sheet is attached to the active metal solder for vacuum welding, then an image transfer etching step is performed according to a required circuit pattern, and after the metal sheet is etched, a welding layer is etched, but some brazing materials may remain, which may cause insulation between circuits to be reduced or short circuit occurs; in addition, another method for manufacturing the active metal brazing substrate is to print the active metal solder on the carrier plate directly according to the required circuit pattern, then attach the whole metal sheet to the active metal solder for vacuum welding, and then perform the image transfer etching step according to the required circuit pattern.

Disclosure of Invention

The main objective of the present invention is to solve the problem of the background art that may cause the insulation between the lines to be reduced or short-circuited, and to have the effect of avoiding the insulation between the lines to be reduced or short-circuited.

In order to achieve the above effects, the active metal brazing substrate of the present invention comprises: a carrier plate; a temporary solder mask layer formed on the carrier plate according to the region except the required circuit pattern; a solder layer formed on the carrier plate according to the required circuit pattern relative to the temporary solder mask layer; and a circuit layer formed on the soldering layer.

In addition, the carrier plate is made of silicon nitride (Si)₃N₄) Or aluminum nitride (AlN), the solder mask is a mixture of 84.9-89.8 wt% of release powder, 0.1-5 wt% of bonding agent and 10.1-15 wt% of solvent, the welding layer is made of silver-copper-titanium (AgCuTi), and the circuit layer is made of copper foil; wherein the release powder adopted by the solder mask layer is alpha Al with the weight ratio of 50-99.9%₂O₃And 0.1 to 50 percent of Y₂O₃，αAl₂O₃The granularity of the solder mask is 0.1-3 mu m, the bonding agent adopted by the solder mask is PVB (polyvinyl butyral), and the solvent adopted by the solder mask is glycerol.

The solder-resisting method for active metal soldering base plate is characterized by that the temporary solder-resisting paste is printed on the carrier plate according to the region except for required circuit pattern, and the active metal solder is printed on the carrier plate according to the required circuit pattern, then the whole metal sheet is stuck on the temporary solder-resisting paste and active metal solder to make vacuum soldering, then according to the required circuit pattern the image transfer is made on the metal sheet, and the metal circuit on the active metal solder and active metal solder is remained.

Furthermore, the material of the carrier is silicon nitride (Si)₃N₄) Or aluminum nitride (AlN), and 84.9-89.8 wt% of release powder0.1 to 5 percent of bonding agent and 10.1 to 15 percent of solvent are blended, the active metal solder is silver copper titanium (AgCuTi), and the metal sheet is copper foil; wherein the release powder of the solder resist paste is alpha Al with the weight ratio of 50-99.9%₂O₃And 0.1 to 50 percent of Y₂O₃，αAl₂O₃The granularity of the solder paste is 0.1-3 mu m, the bonding agent of the solder paste is PVB (polyvinyl butyral), and the solvent of the solder paste is glycerol.

Thus, the solder resist paste is printed on the carrier board according to the area except the required circuit pattern to form a temporary solder resist layer, and the active metal solder is printed on the carrier board according to the required circuit pattern to form a soldering layer, so that the active metal solder of the soldering layer is prevented from wetting out of the circuit pattern by the temporary solder resist layer.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Description of reference numerals: 10 a carrier plate; 20 a temporary solder resist layer; 30 welding layers; 40a circuit layer; 40a sheet metal.

Detailed Description

First, referring to fig. 1, the present invention includes: a carrier 10, which may be silicon nitride (Si)₃N₄) Or aluminum nitride (AlN); a temporary solder mask layer 20, which is formed on the carrier plate 10 by printing according to the area except the required circuit pattern, wherein the temporary solder mask layer is prepared by 84.9-89.8% of release powder, 0.1-5% of bonding agent and 10.1-15% of solvent by weight ratio into solder mask paste; a solder layer 30 printed on the carrier 10 by silver copper titanium (AgCuTi) as active metal solder according to the required circuit pattern corresponding to the temporary solder mask layer 20; and a circuit layer 40, the whole metal sheet 40a is jointed on the temporary solder mask layer 20 and the welding layer 30 for vacuum welding, and then the metal sheet is subjected to image transfer according to the required circuit pattern to form a metal circuit on the welding layer 30; wherein the release powder is alpha Al with the weight ratio of 50-99.9% and the granularity of 0.1-3 mu m₂O₃And 0.1 to 50 percent of Y₂O₃The bonding agent is PVB (polyvinyl butyral), the solvent is glycerol, and the metal sheet is copper foil.

Based on the structure, the invention mixes 84.9-89.8% of release powder, 0.1-5% of bonding agent and 10.1-15% of solvent by weight ratio into solder resist paste, and prints on the carrier plate 10 according to the area outside the required circuit pattern to form the temporary solder resist layer 20, and prints on the carrier plate 10 according to the required circuit pattern to form the soldering layer 30 by taking silver copper titanium (AgCuTi) as active metal solder, so that the temporary solder resist layer 20 can be used for preventing the active metal solder of the soldering layer 30 from wetting the circuit pattern, thereby having the effect of avoiding the insulation reduction or short circuit between circuits.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. An active metal brazing substrate, comprising:

a carrier plate;

a temporary solder mask layer formed on the carrier plate according to the region except the required circuit pattern;

a solder layer formed on the carrier plate according to the required circuit pattern relative to the temporary solder mask layer; and

a circuit layer formed on the welding layer.

2. The active metal brazing substrate according to claim 1, wherein the carrier is made of silicon nitride or aluminum nitride, the solder mask is made of a blend of 84.9-89.8 wt% of release powder, 0.1-5 wt% of a bonding agent and 10.1-15 wt% of a solvent, the solder layer is made of silver, copper and titanium, and the circuit layer is made of copper foil.

3. The active metal brazing substrate according to claim 2, wherein the release powder used for the solder mask layer is 50 to 99.9 weight percent of alpha Al₂O₃And 0.1 to 50 percent of Y₂O₃The bonding agent adopted by the solder mask layer is PVB, and the solder mask layer adoptsThe solvent of (a) is glycerol.

4. The active metal brazing substrate according to claim 3, wherein α Al₂O₃The particle size of (B) is 0.1 to 3 μm.

5. A solder-resisting method for soldering active metal substrate features that the temporary solder-resisting paste is printed on the carrier plate according to the area except the needed circuit pattern, the active metal solder is printed on the carrier plate according to the needed circuit pattern, the whole metal plate is adhered to the temporary solder-resisting paste and the active metal solder for vacuum welding, and the metal plate is image-transferred according to the needed circuit pattern to leave the metal lines on the active metal solder and the active metal solder.

6. The solder resist method for the active metal brazing substrate according to claim 5, wherein the carrier is made of silicon nitride or aluminum nitride, the solder resist paste is prepared by mixing 84.9-89.8 wt% of release powder, 0.1-5 wt% of binder and 10.1-15 wt% of solvent, the active metal solder is silver, copper and titanium, and the metal sheet is copper foil.

7. The solder resist method for an active metal solder substrate according to claim 6, wherein the release powder of the solder resist paste is 50 to 99.9% by weight of alpha Al having a particle size of 0.1 to 3 μm₂O₃And 0.1 to 50 percent of Y₂O₃The bonding agent of the solder paste resistance is PVB, and the solvent of the solder paste resistance is glycerol.

8. The solder resist method for an active metal brazing substrate according to claim 7, wherein α Al is₂O₃The particle size of (B) is 0.1 to 3 μm.