CN113257694B - 电子元件邦定装置及方法 - Google Patents
电子元件邦定装置及方法 Download PDFInfo
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- CN113257694B CN113257694B CN202110685302.7A CN202110685302A CN113257694B CN 113257694 B CN113257694 B CN 113257694B CN 202110685302 A CN202110685302 A CN 202110685302A CN 113257694 B CN113257694 B CN 113257694B
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000033001 locomotion Effects 0.000 claims abstract description 56
- 238000000926 separation method Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000001179 sorption measurement Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008275 binding mechanism Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110685302.7A CN113257694B (zh) | 2021-06-21 | 2021-06-21 | 电子元件邦定装置及方法 |
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CN202110685302.7A CN113257694B (zh) | 2021-06-21 | 2021-06-21 | 电子元件邦定装置及方法 |
Publications (2)
Publication Number | Publication Date |
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CN113257694A CN113257694A (zh) | 2021-08-13 |
CN113257694B true CN113257694B (zh) | 2021-09-28 |
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CN202110685302.7A Active CN113257694B (zh) | 2021-06-21 | 2021-06-21 | 电子元件邦定装置及方法 |
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CN (1) | CN113257694B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61289638A (ja) * | 1985-06-18 | 1986-12-19 | Matsushita Electric Ind Co Ltd | ボンデイング装置 |
CN103620756A (zh) * | 2011-04-15 | 2014-03-05 | 米尔鲍尔股份公司 | 将电子元件从第一载体转移至第二载体的装置和方法 |
CN109475076A (zh) * | 2018-12-14 | 2019-03-15 | 北京德鑫泉物联网科技股份有限公司 | 一种倒贴片生产设备及生产方法 |
CN213278026U (zh) * | 2020-11-12 | 2021-05-25 | 东莞普莱信智能技术有限公司 | 一种高精度和高效率的微型电子元件定位贴合装置 |
-
2021
- 2021-06-21 CN CN202110685302.7A patent/CN113257694B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61289638A (ja) * | 1985-06-18 | 1986-12-19 | Matsushita Electric Ind Co Ltd | ボンデイング装置 |
CN103620756A (zh) * | 2011-04-15 | 2014-03-05 | 米尔鲍尔股份公司 | 将电子元件从第一载体转移至第二载体的装置和方法 |
CN109475076A (zh) * | 2018-12-14 | 2019-03-15 | 北京德鑫泉物联网科技股份有限公司 | 一种倒贴片生产设备及生产方法 |
CN213278026U (zh) * | 2020-11-12 | 2021-05-25 | 东莞普莱信智能技术有限公司 | 一种高精度和高效率的微型电子元件定位贴合装置 |
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CN113257694A (zh) | 2021-08-13 |
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PB01 | Publication | ||
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Application publication date: 20210813 Assignee: Suzhou Heyu Finance Leasing Co.,Ltd. Assignor: Guangjingtuo intelligent equipment (Suzhou) Co.,Ltd. Contract record no.: X2024980002253 Denomination of invention: Electronic component bonding device and method Granted publication date: 20210928 License type: Exclusive License Record date: 20240301 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Electronic component bonding device and method Granted publication date: 20210928 Pledgee: Suzhou Heyu Finance Leasing Co.,Ltd. Pledgor: Guangjingtuo intelligent equipment (Suzhou) Co.,Ltd. Registration number: Y2024980006332 |