CN113228264B - 散热器和热交换器 - Google Patents

散热器和热交换器 Download PDF

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Publication number
CN113228264B
CN113228264B CN202080006941.XA CN202080006941A CN113228264B CN 113228264 B CN113228264 B CN 113228264B CN 202080006941 A CN202080006941 A CN 202080006941A CN 113228264 B CN113228264 B CN 113228264B
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CN
China
Prior art keywords
refrigerant
flow path
fin plate
concave
convex
Prior art date
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Active
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CN202080006941.XA
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English (en)
Chinese (zh)
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CN113228264A (zh
Inventor
酒井义治
秦哲郎
鸟饲岳
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UACJ Corp
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UACJ Corp
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Publication of CN113228264A publication Critical patent/CN113228264A/zh
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Publication of CN113228264B publication Critical patent/CN113228264B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202080006941.XA 2019-02-08 2020-02-06 散热器和热交换器 Active CN113228264B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-021316 2019-02-08
JP2019021316A JP6924787B2 (ja) 2019-02-08 2019-02-08 ヒートシンク及び熱交換器
PCT/JP2020/004585 WO2020162549A1 (ja) 2019-02-08 2020-02-06 ヒートシンク及び熱交換器

Publications (2)

Publication Number Publication Date
CN113228264A CN113228264A (zh) 2021-08-06
CN113228264B true CN113228264B (zh) 2025-02-14

Family

ID=71947839

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080006941.XA Active CN113228264B (zh) 2019-02-08 2020-02-06 散热器和热交换器

Country Status (5)

Country Link
US (1) US11935815B2 (enExample)
JP (2) JP6924787B2 (enExample)
CN (1) CN113228264B (enExample)
DE (1) DE112020000282T5 (enExample)
WO (1) WO2020162549A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1063052S1 (en) * 2022-01-18 2025-02-18 Delta Electronics, Inc. Cooling fin

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013249A (ja) * 2010-06-29 2012-01-19 T Rad Co Ltd プレート積層型ヒートシンク

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4721412B2 (ja) * 2005-06-28 2011-07-13 本田技研工業株式会社 冷却器およびその製造方法
JP2010114174A (ja) * 2008-11-05 2010-05-20 T Rad Co Ltd ヒートシンク用コア構造
JP6026808B2 (ja) * 2012-08-03 2016-11-16 株式会社ティラド 積層型ヒートシンクのコア
JP6108928B2 (ja) * 2013-04-16 2017-04-05 三菱電機株式会社 空気調和装置
JP6132347B2 (ja) * 2013-07-31 2017-05-24 株式会社Uacj アルミニウム合金ブレージングシートおよびその製造方法
JP2016004805A (ja) * 2014-06-13 2016-01-12 昭和電工株式会社 液冷式冷却装置
JP6391535B2 (ja) * 2015-06-09 2018-09-19 株式会社前川製作所 冷媒熱交換器
EP3352215B1 (en) * 2015-09-18 2021-08-25 T.RAD Co., Ltd. Laminated core type heat sink
JP6274709B2 (ja) * 2016-01-21 2018-02-07 株式会社Uacj 熱交換器用ヒートシンク及び該ヒートシンクを備えた熱交換器
JP7028526B2 (ja) * 2017-01-13 2022-03-02 三桜工業株式会社 冷却装置及び冷却装置の製造方法
JP6917230B2 (ja) * 2017-07-20 2021-08-11 昭和電工株式会社 放熱器およびこれを用いた液冷式冷却装置
JP6823906B1 (ja) * 2019-12-13 2021-02-03 株式会社Uacj 熱交換器用二重管

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013249A (ja) * 2010-06-29 2012-01-19 T Rad Co Ltd プレート積層型ヒートシンク

Also Published As

Publication number Publication date
JP7210646B2 (ja) 2023-01-23
WO2020162549A1 (ja) 2020-08-13
JP2020129599A (ja) 2020-08-27
JP6924787B2 (ja) 2021-08-25
CN113228264A (zh) 2021-08-06
US11935815B2 (en) 2024-03-19
US20210358834A1 (en) 2021-11-18
DE112020000282T5 (de) 2021-10-07
JP2021153200A (ja) 2021-09-30

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