CN113223989A - 微型led巨量转移至显示器面板的方法 - Google Patents
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Abstract
本发明为一种微型LED巨量转移至显示器面板的方法,其包括下列步骤;提供一形成有多个微型LED晶粒的晶圆;提供一复合膜,其包括有一基材及于该基材表面形成有耐热的热减黏感压胶,该耐热的热减黏感压胶初始黏着力大于加热后的黏着力;将该复合膜贴附于多个LED晶粒上,使该多个微型LED黏着于该耐热的热减黏感压胶;将该黏着有多个微型LED晶粒的复合膜转移贴附于该显示器面板上;及经加热制程使该等LED晶粒固定于该显示器面板上,并至常温时将该复合膜自显示器面板上移除,以完成多个微型LED巨量转移至显示器面板上。
Description
本发明是关于一种微型LED巨量转移至面板显示器的方法,特别是指一种利用复合膜黏着晶圆上的多个微型LED晶粒,将其直接转移置放于显示器面板上的方法。
【背景技术】
一种主动发光的OLED显示器技术已应用于手机、电视屏幕等产品中,表现出优异的色彩性能,但是OLED在效能及寿命上与LED还是有较大的差距。高效能长寿的微LED显示数组作为一另一种主动发光显示技术已成为新技术开发的重点。但是目前的LED显示器的制造工艺要比OLED显示器困难许多,如何降低LED面板显示器的制备难度,成为目前本领域技术人员需解决的一个技术难题。诸如一个显示器面板使用的微LED数量庞大且微LED尺寸相当微小,要如何将大量且微小LED置放于面板上,以现有的设备及工艺技术实为重大的难题,且如何提高生产效率及精确度更是业界待克服的重要议题。
【发明内容】
本发明为一种微型LED巨量转移至显示器面板的方法,其包括有,提供一形成有多个微型LED晶粒的晶圆;提供一复合膜,其包括有一基材及于该基材表面形成有耐热的热减黏感压胶,该耐热的热减黏感压胶初始黏着力大于加热后的黏着力;将该复合膜贴附于多个LED晶粒上,使该多个微型LED黏着于该耐热的热减黏感压胶;将该黏着有多个微型LED晶粒的复合膜转移贴附于该显示器面板上;及经加热制程使该等LED晶粒固定于该显示器面板上,并至常温时将该复合膜自显示器面板上移除,以完成多个微型LED巨量转移至显示器面板上。
【附图说明】
图1为本发明使用的复合膜示意图。
图2本为本发明微型LED巨量转移至显示器面板的方法的第一示意图。
图3为本发明微型LED巨量转移至显示器面板的方法的第二示意图。
图4为本发明微型LED巨量转移至显示器面板的方法的第三示意图。
图5为本发明微型LED巨量转移至显示器面板的方法的第四示意图。
图6为本发明微型LED巨量转移至显示器面板的方法的流程图。
图1-图6中,各符号说明如下:
复合膜 10
基材 12
耐热之热减黏感压胶 14
LED晶圆 16
LED晶粒 18
显示器面板 20
提供一复合膜 S1
提供一具有多个LED晶粒的晶圆 S2
将LED晶圆进行切割成LED晶粒 S3
将复合膜贴黏于该等晶粒上 S4
将复合膜上的晶粒转移至显示器面板上 S5
移除复合膜 S6
【具体实施方式】
本发明微型LED巨量转移至显示器面板的方法,请参阅图1及图6,图1为本发明使用的复合膜示意图,首先,提供一复合膜10(S1),其包括有一聚酰亚胺膜的基材12及于基材12一侧形成有耐热的热减黏感压胶14,其初始黏着力大于加热后至常温时的黏着力。
本发明的其中一实施方式如下:取一容器250ml,倒入一耐热丙烯酸系压克力黏着剂如HT-6555-1 50g(从台湾新综工业股份有限公司购得),添加交联剂N 0.5g(从台湾新综工业股份有限公司购得)、23G(聚乙醇#1000-二甲基丙烯酸脂)3g(从新中村化学公司购得)、1G(乙二醇二甲基丙烯酸酯)5g(从新中村化学公司购得)、1,1,3,3-四甲基丁基过氧化氢0.5g(从台湾景明化工股份有限公司购得),均匀搅拌10min,使用刮刀控制间隙以得到后续涂布胶厚在40um的情况下,涂布在的聚酰亚胺基材的一面,放置于烘箱中以100℃/30min烘烤条件去除溶剂,取出样品覆盖离型膜即可形成复合膜的耐热的热减黏感压胶层。
黏着力测试方法
将上述复合膜切断为宽度1吋(inch),长度150毫米(mm),用2公斤(kg)的辊使其贴合于在23℃(室温情况下)进行过镜面处理的抛光钢板上。所述抛光钢板是使用前用无尘布沾湿酒精及丙酮进行清洁并放置1小时。如为下表中的热制程前黏着力,即是在室温下将贴合在抛光钢板上的复合膜,于剥离速度300mm/分钟、剥离角度180度下进行剥离,并测定黏着力(单位:gf/1inch)。如为下表中的热制程后黏着力,即是在经过烘箱150℃/4hrs条件下烘烤后,在将贴合在抛光钢板上的复合膜,于剥离速度300mm/分钟、剥离角度180度下进行剥离,并测定黏着力(单位:gf/1inch)。
厚度测试方法
将尚未涂布前的样品先使用SYLVAC进阶标准型电子表测量五个不同区域厚度取平均值记录,接下来在将涂布完感压胶后的样品一样使用SYLVAC进阶标准型电子表测量五个不同区域厚度取平均值记录,最后将这两种平均值相减的差值即为感压胶层的厚度。
经测试,本实施方式中热制程前黏着力为1082gf/inch,第二表面的热制程后黏着力为132gf/inch。
请配合参阅图2及图3,提供一LED晶圆16,于晶圆16上形成多个LED晶粒18(S2),将LED晶圆18进行切割成LED晶粒(S3),将复合膜10的耐热的热减黏感压胶14黏贴于多个晶粒18上(S4)。
请配合参阅图4,将复合膜10上的LED晶粒18转至一显示器面板20上(S5)上。
请配合参阅图5,进行加热固定制程,使LED晶粒固定于显示器面板20上,并至常温时,使耐热的热减黏感压胶14解黏,移除复合膜10(S6)。
如是,微型LED晶粒18于晶圆16上制作/切割完成后,可通过复合膜10将其黏着转移至复合膜的耐热的热减黏感压胶14上,再将其转移至显示器面板20上,经加热制程使耐热的热减黏感压胶14解黏,后将复合膜移除,从而可成功地将微LED晶粒18巨量地转移至显示器面板20上,其制作上更为简便,精准度更高。
而在耐热的热减黏感压胶初始黏着力小于200gf/inch,或者加热后至常温时的黏着力150gf/inch,容易引起晶粒掉落、错位或很难将微LED晶粒巨量地转移至显示器面板。
上述特定实施例的内容是为了详细说明本发明,然而,该实施例系仅用于说明,并非意欲限制本发明。本领域技术人员可理解,在不悖离后附申请专利范围所界定的范畴下针对本发明。所进行的各种变化或修改均落入本发明的一部分。
Claims (4)
1.一种微型LED巨量转移至显示器面板的方法,其特征在于,其包括有;
提供一形成有多个微型LED晶粒的晶圆;
提供一复合膜,其包括有一基材及于所述基材表面形成有耐热的热减黏感压胶,所述耐热的热减黏感压胶初始黏着力大于加热后的黏着力;
将所述复合膜转贴附于多个LED晶粒上,使所述多个微型LED黏着于所述耐热的热减黏感压胶;
将所述黏着有多个微型LED晶粒的复合膜转移贴附于所述显示器面板上;及
经加热制程使所述多个微型LED晶粒固定于所述显示器面板上,并至常温时将所述复合膜自显示器面板上移除,以完成多个微型LED巨量转移至显示器面板上。
2.根据权利要求1所述的微型LED巨量转移至显示器面板的方法,其中,
基材选自聚酰亚胺膜。
3.根据权利要求1所述的微型LED巨量转移至显示器面板的方法,其特征在于,所述耐热的热减黏感压胶初始黏着力大于200gf/inch,加热后的黏着力小于150gf/inch。
4.根据权利要求3所述的微型LED巨量转移至显示器面板的方法,其特征在于,所述加热为在150℃/4hrs条件下的加热。
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