CN113192830A - 硅基oled微显示器及其制作方法 - Google Patents
硅基oled微显示器及其制作方法 Download PDFInfo
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- CN113192830A CN113192830A CN202110460824.7A CN202110460824A CN113192830A CN 113192830 A CN113192830 A CN 113192830A CN 202110460824 A CN202110460824 A CN 202110460824A CN 113192830 A CN113192830 A CN 113192830A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 155
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 155
- 239000010703 silicon Substances 0.000 title claims abstract description 155
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
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- 229910010272 inorganic material Inorganic materials 0.000 description 2
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- 239000011368 organic material Substances 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 239000011159 matrix material Substances 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
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- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110460824.7A CN113192830A (zh) | 2021-04-27 | 2021-04-27 | 硅基oled微显示器及其制作方法 |
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CN202110460824.7A CN113192830A (zh) | 2021-04-27 | 2021-04-27 | 硅基oled微显示器及其制作方法 |
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CN202110460824.7A Pending CN113192830A (zh) | 2021-04-27 | 2021-04-27 | 硅基oled微显示器及其制作方法 |
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Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060130470A (ko) * | 2005-06-14 | 2006-12-19 | 박재근 | 투명하고 휘어지는 실리콘 기판 제조 방법 및 그에 따라제조된 실리콘 웨이퍼 |
CN103178083A (zh) * | 2011-12-23 | 2013-06-26 | 株式会社半导体能源研究所 | 发光装置以及其制造方法 |
US20140098549A1 (en) * | 2012-10-10 | 2014-04-10 | Michael Hack | Semi-rigid electronic device with a flexible display |
CN104051494A (zh) * | 2014-05-28 | 2014-09-17 | 中国电子科技集团公司第五十五研究所 | 微型有源矩阵式有机发光显示器及其制作方法 |
CN106681049A (zh) * | 2017-03-23 | 2017-05-17 | 合肥鑫晟光电科技有限公司 | 显示基板的制作方法、显示面板的制作方法及显示面板 |
CN106960634A (zh) * | 2016-01-11 | 2017-07-18 | 三星显示有限公司 | 显示装置及其制造方法 |
JP2018006351A (ja) * | 2017-09-11 | 2018-01-11 | 株式会社半導体エネルギー研究所 | 発光装置 |
CN108365119A (zh) * | 2018-02-07 | 2018-08-03 | 上海瀚莅电子科技有限公司 | 硅基微显示器及其制备方法 |
CN108389888A (zh) * | 2018-04-28 | 2018-08-10 | 京东方科技集团股份有限公司 | 柔性显示面板及其制造方法、显示装置 |
CN108878479A (zh) * | 2018-06-05 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | 曲面显示屏、显示模组及显示终端 |
CN109004006A (zh) * | 2018-07-27 | 2018-12-14 | 京东方科技集团股份有限公司 | 有机发光显示基板及其制作方法、显示装置 |
CN111051972A (zh) * | 2017-09-06 | 2020-04-21 | 弗莱克英纳宝有限公司 | 组装曲状显示装置的方法 |
CN111403462A (zh) * | 2020-03-27 | 2020-07-10 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示面板和显示装置 |
CN112420802A (zh) * | 2020-12-02 | 2021-02-26 | 深圳市芯视佳半导体科技有限公司 | 一种便于散热的硅基oled微显示器的制备方法 |
CN112531006A (zh) * | 2020-12-18 | 2021-03-19 | 上海和辉光电股份有限公司 | 有机发光显示面板和有机发光显示装置 |
CN112614878A (zh) * | 2021-01-19 | 2021-04-06 | 浙江宏禧科技有限公司 | 一种单曲面硅基微型显示器的制造方法 |
-
2021
- 2021-04-27 CN CN202110460824.7A patent/CN113192830A/zh active Pending
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060130470A (ko) * | 2005-06-14 | 2006-12-19 | 박재근 | 투명하고 휘어지는 실리콘 기판 제조 방법 및 그에 따라제조된 실리콘 웨이퍼 |
CN103178083A (zh) * | 2011-12-23 | 2013-06-26 | 株式会社半导体能源研究所 | 发光装置以及其制造方法 |
US20140098549A1 (en) * | 2012-10-10 | 2014-04-10 | Michael Hack | Semi-rigid electronic device with a flexible display |
CN104051494A (zh) * | 2014-05-28 | 2014-09-17 | 中国电子科技集团公司第五十五研究所 | 微型有源矩阵式有机发光显示器及其制作方法 |
CN106960634A (zh) * | 2016-01-11 | 2017-07-18 | 三星显示有限公司 | 显示装置及其制造方法 |
CN106681049A (zh) * | 2017-03-23 | 2017-05-17 | 合肥鑫晟光电科技有限公司 | 显示基板的制作方法、显示面板的制作方法及显示面板 |
CN111051972A (zh) * | 2017-09-06 | 2020-04-21 | 弗莱克英纳宝有限公司 | 组装曲状显示装置的方法 |
JP2018006351A (ja) * | 2017-09-11 | 2018-01-11 | 株式会社半導体エネルギー研究所 | 発光装置 |
CN108365119A (zh) * | 2018-02-07 | 2018-08-03 | 上海瀚莅电子科技有限公司 | 硅基微显示器及其制备方法 |
CN108389888A (zh) * | 2018-04-28 | 2018-08-10 | 京东方科技集团股份有限公司 | 柔性显示面板及其制造方法、显示装置 |
CN108878479A (zh) * | 2018-06-05 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | 曲面显示屏、显示模组及显示终端 |
CN109004006A (zh) * | 2018-07-27 | 2018-12-14 | 京东方科技集团股份有限公司 | 有机发光显示基板及其制作方法、显示装置 |
CN111403462A (zh) * | 2020-03-27 | 2020-07-10 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示面板和显示装置 |
CN112420802A (zh) * | 2020-12-02 | 2021-02-26 | 深圳市芯视佳半导体科技有限公司 | 一种便于散热的硅基oled微显示器的制备方法 |
CN112531006A (zh) * | 2020-12-18 | 2021-03-19 | 上海和辉光电股份有限公司 | 有机发光显示面板和有机发光显示装置 |
CN112614878A (zh) * | 2021-01-19 | 2021-04-06 | 浙江宏禧科技有限公司 | 一种单曲面硅基微型显示器的制造方法 |
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Effective date of registration: 20220927 Address after: 518109 903, yifenghua building, 28 yifenghua Innovation Industrial Park, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Xinshijia Semiconductor Technology Co.,Ltd. Address before: Room 1401, A2 office building, Wanda Plaza, 4229 Donghai Avenue, bengshan District, Bengbu City, Anhui Province 233000 Applicant before: Bengbu core Optoelectronic Technology Co.,Ltd. |
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Application publication date: 20210730 |