CN113178421B - Multi-chip packaging positioning device and method for mobile phone integrated circuit - Google Patents
Multi-chip packaging positioning device and method for mobile phone integrated circuit Download PDFInfo
- Publication number
- CN113178421B CN113178421B CN202110377943.6A CN202110377943A CN113178421B CN 113178421 B CN113178421 B CN 113178421B CN 202110377943 A CN202110377943 A CN 202110377943A CN 113178421 B CN113178421 B CN 113178421B
- Authority
- CN
- China
- Prior art keywords
- sliding
- mobile phone
- block
- shell
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229920001971 elastomer Polymers 0.000 claims abstract description 26
- 238000009434 installation Methods 0.000 claims abstract description 17
- 238000001179 sorption measurement Methods 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 43
- 238000010521 absorption reaction Methods 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- 230000001050 lubricating effect Effects 0.000 claims description 27
- 238000003825 pressing Methods 0.000 claims description 26
- 230000000903 blocking effect Effects 0.000 claims description 20
- 239000011247 coating layer Substances 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 240000009087 Crescentia cujete Species 0.000 claims description 3
- 235000005983 Crescentia cujete Nutrition 0.000 claims description 3
- 235000009797 Lagenaria vulgaris Nutrition 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000005461 lubrication Methods 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000011358 absorbing material Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 7
- 239000003921 oil Substances 0.000 description 29
- 239000010687 lubricating oil Substances 0.000 description 22
- 230000000694 effects Effects 0.000 description 14
- 239000004831 Hot glue Substances 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241001233242 Lontra Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention belongs to the technical field of chip packaging, in particular to a multi-chip packaging positioning device of a mobile phone integrated circuit, which comprises a shell; a sliding cavity is formed in the bottom surface of the shell, a sliding block is connected to the inside of the sliding cavity in a sliding mode, clamping grooves are formed in the side walls of the sliding block, clamping cavities are formed in the top surface of the shell respectively, an adsorption plate is arranged at the inner end of each clamping cavity, a sliding groove is formed in the side wall of each clamping cavity, and a clamping block is connected to the inside of each sliding groove in a sliding mode; a multi-chip packaging and positioning method of a mobile phone integrated circuit comprises the following steps: firstly, placing a substrate in a fixing groove, and then mounting a chip body on the substrate to finish the packaging of a single chip body; then, the connection structure between the two shells is utilized to complete the installation of a plurality of chip bodies, and finally the shells are welded on the mobile phone mainboard under the positioning action of the rubber blocks; the invention can improve the efficiency of packaging a plurality of chips, and the mode is firmer, thereby greatly improving the quality and the service life of the chip packaging.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a multi-chip packaging positioning device and a positioning method of a mobile phone integrated circuit.
Background
The cell phone chip packaging chamber is provided with a shell for a semiconductor integrated circuit chip, plays the roles of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit. However, the existing mobile phone chip is inconvenient to package a plurality of chip bodies simultaneously, and the wires on the chip are inconvenient to be arranged. In view of the above problems, innovative design based on the original chip package is urgently needed.
Some technical solutions related to chip packaging also appear in the prior art, such as a chinese patent with patent number 2020200471710, the invention provides an LED chip packaging device, and relates to the technical field of chip packaging. The LED chip packaging device comprises a back plate, wherein the front surface of the back plate is fixedly connected with a driving mechanism and an upper baffle respectively, and side shafts are movably arranged on the front surface of the back plate and on two sides of the lower portion of the upper baffle. This LED chip packaging hardware, improvement and actuating mechanism through the side shield, the side shaft, the cooperation of drive gear and change gear is used, whether the cooperation uses pressure sensor to detect whether there is the pin of excessive play when adopting infrared inductor location, and extrude the pin of excessive play to packaging mechanism inside through the mode of actuating mechanism rotating plate body when there are the pin of excessive play, encapsulate the operation afterwards, avoided stretching out packaging mechanism because the pin length is too long relatively or LED chip location skew degree is too big and lead to, thereby avoided the pin rupture and the emergence that the pin hung bad packaging mechanism side.
As another chinese patent, patent No. 2018109304443, the present invention provides a chip packaging apparatus, including a housing, pins, and a top plate, wherein a fixing groove is formed in the housing, a substrate is mounted on the fixing groove, a chip body is connected to the top of the substrate, a wire arrangement frame is fixed to the top edge of the substrate, a wire arrangement hole is reserved on the upper end surface of the wire arrangement frame, the pins are disposed on one side of the housing, a heat sink is mounted on the other side of the housing, a bottom groove is formed in the bottom edge of the housing, a positioning rod is connected to the edge end of the bottom of the top plate, and the positioning groove is formed in the top end of the housing. This chip packaging hardware carries out the winding displacement through the winding displacement pore pair chip body's circuit on the creel stand, prevents that the use of chip body is influenced in disorder to the circuit, through the locating lever constant head tank that sets up, conveniently installs the roof on the shell to make things convenient for the installation of chip body, through connecting plate and the spread groove that sets up, conveniently encapsulate a plurality of chip bodies.
And when a plurality of chips need to be packaged in the prior art, the operation process is relatively complicated, so that the packaging efficiency of the chips is relatively low, and meanwhile, the firmness of the chips during packaging is relatively poor, so that the quality and the service life of multi-chip packaging are influenced, and the packaged chips and the mobile phone motherboard lack a positioning structure when being installed, so that the shell after the chip packaging is difficult to accurately and quickly connect with the mobile phone motherboard, and the processing quality and the processing efficiency of the mobile phone are influenced.
In view of the above, the invention provides a multi-chip package positioning device and a positioning method thereof for a mobile phone integrated circuit, which improve the efficiency of packaging a plurality of chips, and simultaneously, the method is firmer, thereby greatly improving the quality and service life of the chip package.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a multi-chip packaging positioning device of a mobile phone integrated circuit and a positioning method thereof, which improve the packaging efficiency of a plurality of chips, are firmer, and greatly improve the packaging quality and service life of the chips.
The technical scheme adopted by the invention for solving the technical problems is as follows: a multi-chip packaging positioning device of a mobile phone integrated circuit comprises a shell connected to a mobile phone mainboard, wherein a fixing groove is formed in the shell, a substrate is installed in the fixing groove, the top of the substrate is connected with a chip body, a creel stand is arranged at the outer edge of the top of the substrate, and pins are arranged on the side wall of the shell corresponding to one side of the creel stand; the surface of the shell, which is matched with the mobile phone main board, is provided with a positioning cavity which can form a calabash shape, the cross section area of the positioning cavity on the mobile phone main board is positioned between one half and two thirds of the area corresponding to the diameter of the positioning cavity, and a rubber block matched with the two positioning cavities is arranged in the positioning cavity on the shell; the sliding block type vacuum cleaner is characterized in that sliding cavities are symmetrically formed in the bottom surface of the shell, a sliding block is connected inside the sliding cavity in a sliding mode, an elastic body is connected between the sliding block and the inner end of the sliding cavity, clamping grooves are symmetrically formed in the side wall of the sliding block, a group of inverted funnel-shaped positioning grooves are symmetrically formed in the bottom surface of the shell, a group of positioning rods matched with the positioning grooves are connected to the top surface of the shell, clamping cavities matched with the sliding block are formed in the top surface of the shell respectively, an adsorption plate is arranged at the inner ends of the clamping cavities, the adsorption plate and the sliding block are made of magnetic materials respectively, magnetic poles of one ends, close to each other, of the adsorption plate and the sliding block are opposite, a group of sliding grooves are symmetrically formed in the side wall of the inner ends of the clamping cavities, clamping blocks are connected to the inside of the sliding grooves in a sliding mode, elastic pieces are connected between the clamping blocks and the inner ends of the sliding grooves, and inclined extrusion surfaces are arranged at the outer ends of the clamping blocks; when the mobile phone is in work, when a plurality of chips need to be packaged in the prior art, the operation process is complicated, so that the packaging efficiency of the chips is low, and meanwhile, the firmness of the plurality of chips during packaging is poor, so that the quality and the service life of multi-chip packaging are influenced; when the device is used, a worker firstly places the substrate in the fixing groove, then installs the chip body on the substrate, coats epoxy resin between the substrate and the chip body and between the substrate and the fixing groove, and then sequentially clamps the circuits on the chip body into the wire arranging holes of the wire arranging frame, so that the single chip body is packaged, and the arranged pins can enable the chip body to be connected with external circuits; when a plurality of chip bodies need to be packaged simultaneously, the positioning groove on the bottom surface of the packaged shell is inserted into the positioning rod on the top surface of the other shell, so that the sliding cavities on the two shells are aligned with the clamping cavity and approach to each other, the adsorption plate can attract the sliding block and drive the sliding block to slide into the clamping cavity and extrude the inclined surface on the clamping block, so that the clamping block is stressed to slide towards the inside of the sliding groove and extrude the elastic part, when the free end of the sliding block is attached to the inner end of the clamping cavity, the clamping groove on the sliding block can be aligned with the sliding groove right, the clamping block can be inserted into the clamping groove under the rebound force of the elastic part and fix the sliding block, so that the two shells can be automatically connected into a whole through the sliding block, the installation of a plurality of chip bodies is finished, and the time and labor consuming connection of the two shells is not needed to be carried out through the form of hot melt adhesive, the efficiency of packaging a plurality of chips is improved, meanwhile, the mode is firmer, the condition that the two shells are not firmly connected due to the fact that the hot melt adhesive is affected with damp or deteriorated is reduced, and therefore the quality and the service life of the chip packaging are greatly improved; when the multichip shell which is packaged well needs to be welded on the mobile phone motherboard, the rubber block is clamped inside the positioning cavity on the bottom shell at the moment, and then the other end of the rubber block is pressed into the positioning cavity of the mobile phone motherboard, so that the shell and the mobile phone motherboard can be conveniently and effectively positioned and connected under the action of the rubber block, the shell is conveniently welded on the mobile phone motherboard, and the mounting quality and the mounting efficiency of the shell and the mobile phone motherboard are greatly improved. .
Preferably, the inner ends of the sliding cavities are respectively connected with limiting rods, the inner ends of the sliding blocks are provided with limiting grooves connected with the limiting rods in a sliding mode, and when the inner ends of the limiting grooves are attached to the end portions of the limiting rods, the outer ends of the sliding blocks are flush with the bottom surface of the shell; during operation, the slider can make limiting groove inner and limiting rod end laminate mutually under the effect of elastomer to make the outer end of slider flush mutually with the bottom surface of casing, make the sliding chamber can play better effect of accomodating to the slider, reduce the slider and bulge to the sliding chamber outer end and influence the condition of casing processing, also reduce the too dark shrink of slider simultaneously inside the sliding chamber and with the not enough condition of effort of adsorption plate, make the work of slider can stabilize effectual going on.
Preferably, an air passage communicated with the inner end of one of the chutes is formed in the side wall of the shell, a blocking head is arranged at the outer end of the air passage, the inner ends of the chutes are communicated through an air flow passage, and the clamping block can be driven to move to one side far away from the clamping cavity when the air passage sucks air from the inner ends of the chutes; the during operation, when needs split a plurality of casings of connecting, open the shutoff head this moment to bleed to the air flue through external air pump, make the inside atmospheric pressure of spout reduce and drive the fixture block to the side motion that is close to the elastic component, thereby make the draw-in groove on fixture block and the slider break away from each other, and no longer fix the slider, thereby make the casing of a plurality of connections can carry out convenient and fast's dismantlement when needs maintenance.
Preferably, the inner end of the fixture block is provided with a spherical blocking block, the blocking block is made of rubber materials and is in interference fit with the side wall of the sliding chute, and a gap is formed between the fixture block and the side wall of the sliding chute; the during operation, when external air pump bleeds to the air flue, the atmospheric pressure in the spout can drive fixture block and draw-in groove through the shutoff piece when reducing this moment and break away from mutually, because be the single-point contact between shutoff piece and the spout lateral wall, and no longer contact between fixture block and the spout lateral wall, greatly reduced the fixture block when the motion and the spout between frictional force for the work of fixture block can effectually go on smoothly.
Preferably, a lubricating cavity is formed in one end, close to the elastic piece, of the blocking block, a pressing plate is connected to the inside of the lubricating cavity in a sliding mode, the pressing plate is attached to the side wall of the lubricating cavity, the elastic piece is connected between the pressing plate and the inner end of the lubricating cavity, an arc-shaped mounting groove is formed in the blocking block corresponding to the outer end of the lubricating cavity, an oil absorption layer made of a water absorption material is mounted inside the mounting groove, and lubricating liquid is filled in the lubricating cavity between the oil absorption layer and the pressing plate; during operation, when bleeding to spout inside through the air flue, the inside atmospheric pressure of spout this moment can take lead to drive the clamp plate and move to mounting groove one side to the oil absorption layer that attaches lubricating oil extrudees, makes lubricating oil in the oil absorption layer can flow out to the spout lateral wall on, thereby can reduce follow-up shutoff piece and the produced frictional resistance of spout relative motion, further improved fixture block stability and the validity at the during operation.
Preferably, a screen plate is arranged on the side wall of the mounting groove corresponding to the outer end of the oil absorption layer, and the side wall of the pressing plate close to the oil absorption layer is arranged into an arc shape matched with the shape of the oil absorption layer; during operation, when the clamp plate moves to oil absorption layer one side, the clamp plate can be with oil absorption lamination on the otter board this moment for the inside adsorbed lubricating oil of oil absorption layer can be more abundant outflow under the effect of clamp plate and otter board, and the clamp plate terminal surface of arc form can be more abundant extrudees the oil absorption layer simultaneously, has further improved lubricated effect between shutoff piece and the spout.
Preferably, the screen plate is connected with a coating block through a group of connecting rods, the coating block is attached to the side wall of the sliding groove, a coating layer is arranged on the outer surface of the coating block, a conveying layer attached to the surface of the coating layer is arranged inside the oil absorption layer, and the coating layer and the conveying layer are both made of water absorption materials; during the operation, the transport layer can be carried the lubricating oil in the oil absorption layer to the coating, when the shutoff piece moves under the effect of spout atmospheric pressure, the shutoff piece can drive the coating piece in advance with the coating and slide on the spout lateral wall in advance this moment in step for lubricating oil in the coating can be more abundant comprehensive coating on the spout lateral wall, further reduces the frictional resistance between shutoff piece and the spout.
Preferably, the coating block is spherical and is rotatably connected with the connecting rod, and the coating layer is wrapped on the outer surface of the coating block; the during operation, when the shutoff piece was at the inside motion of spout, the coating piece can drive the coating layer and roll on the spout under the effect of connecting rod this moment for adsorbed lubricating oil more effectively abundant outflow and coating in the coating layer are on the spout lateral wall, also can reduce the frictional resistance between coating piece and the spout lateral wall simultaneously.
Preferably, a storage cavity is arranged in the blocking block, the storage cavity is connected with the side wall of the lubricating cavity through a conveying groove, a piston is connected in the storage cavity in a sliding mode, one end, far away from the conveying groove, of the piston and one end, far away from the conveying groove, of the storage cavity are connected with an elastic assembly, and the end part of the conveying groove can be blocked by the pressing plate in a static state; the during operation, preserve lubricating oil in storing the chamber, and the clamp plate can carry out the shutoff to the port of conveyer trough, reduce lubricating oil and because of the condition that deteriorates for a long time with external environment contact, simultaneously when the clamp plate work finishes and when making a round trip to slide in lubricated chamber under the effect of elastic block, the port of conveyer trough can be crossed for a short time to the clamp plate outer end and no longer to its shutoff, the piston can promote a small part lubricating oil in the storage chamber under elastic component's effect at this moment and flow into lubricated intracavity portion from the conveyer trough, thereby make and to keep the lubricating oil of capacity to use in the lubricated chamber, make the work of lubricated chamber can more lasting stable going on.
A multi-chip packaging positioning method of a mobile phone integrated circuit is suitable for the packaging positioning device and comprises the following steps:
s1: firstly, a substrate is placed in a fixing groove, then a chip body is installed on the substrate, and epoxy resin is coated among the substrate, the chip body and the fixing groove;
s2: then, sequentially clamping the circuits on the chip body into the wire arranging holes of the wire arranging frame to finish the packaging of the single chip body;
s3: then inserting the positioning groove on the bottom surface of the packaged shell into the positioning rod on the top surface of the other shell, and enabling the outer surfaces of the two shells to be attached to each other, so that the sliding blocks on the shells and the clamping cavities are automatically connected into a whole after being matched, and therefore the installation of a plurality of chip bodies is completed; the form that no longer need pass through the hot melt adhesive carries out the connection that wastes time and energy with two casings, has improved the efficiency of a plurality of chip encapsulation, and this mode is more firm simultaneously, reduces the hot melt adhesive and leads to the not firm condition of connecting two casings because of weing or rotting to the quality and the life of chip encapsulation have been improved greatly.
S4: through clamping the rubber block inside the location chamber on the casing of bottom, through pressing into the location intracavity portion of mobile phone motherboard with the other end of rubber block afterwards, weld this casing on mobile phone motherboard and accomplish the installation of both at last.
The invention has the following beneficial effects:
1. according to the invention, the two shells can be automatically connected into a whole through the sliding block by the multi-chip packaging positioning device, so that the installation of a plurality of chip bodies is completed, the two shells do not need to be connected in a time-consuming and labor-consuming manner in a hot melt adhesive manner, the packaging efficiency of a plurality of chips is improved, meanwhile, the manner is firmer, the condition that the two shells are not firmly connected due to the fact that the hot melt adhesive is affected with damp or deteriorated is reduced, and the packaging quality and the service life of the chips are greatly improved; meanwhile, the shell and the mobile phone motherboard can be conveniently and effectively positioned and connected under the action of the rubber block, the shell is conveniently welded on the mobile phone motherboard, and the mounting quality and efficiency of the shell and the mobile phone motherboard are greatly improved.
2. According to the invention, the air is exhausted from the inside of the sliding groove through the air passage, so that the air pressure in the sliding groove can drive the pressing plate to move towards one side of the mounting groove firstly, and the oil absorption layer with the lubricating oil is extruded, so that the lubricating oil in the oil absorption layer can flow out to the side wall of the sliding groove, thereby reducing the friction resistance generated by the relative movement of the subsequent plugging block and the sliding groove, and further improving the stability and effectiveness of the clamping block in work.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a diagram of the method steps of the present invention;
FIG. 2 is a perspective view of the package positioning device of the present invention;
FIG. 3 is a schematic diagram of the structure of the positioning device for packaging of the present invention;
FIG. 4 is an enlarged view at A in FIG. 3;
FIG. 5 is an enlarged view at B in FIG. 3;
FIG. 6 is a schematic view of the construction of the block of the present invention;
in the figure: the chip packaging structure comprises a shell 1, a fixed groove 2, a substrate 3, a chip body 4, a creel stand 5, pins 6, a sliding cavity 7, a sliding block 8, an elastic body 9, a clamping groove 10, a positioning groove 11, a positioning rod 12, a clamping cavity 13, an adsorption plate 14, a sliding groove 15, a clamping block 16, an elastic piece 17, a squeezing surface 18, a limiting rod 19, an air passage 20, a blocking head 21, an air flow channel 22, a blocking block 23, a lubrication chamber 24, a pressing plate 25, an elastic block 26, an oil absorption layer 27, a screen plate 28, a connecting rod 29, a coating block 30, a coating layer 31, a conveying layer 32, a storage cavity 33, a conveying groove 34, a piston 35, an elastic component 36 and a rubber block 37.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the following embodiments.
The first embodiment is as follows:
as shown in fig. 2-5, the multi-chip packaging and positioning device for a mobile phone integrated circuit according to the present invention includes a housing 1 connected to a mobile phone motherboard, wherein a fixing groove 2 is formed in the housing 1, a substrate 3 is installed in the fixing groove 2, a chip body 4 is connected to the top of the substrate 3, a creel stand 5 is disposed at an outer edge of the top of the substrate 3, and a pin 6 is disposed on a side wall of the housing 1 corresponding to one side of the creel stand 5; the mutually matched surfaces of the shell 1 and the mobile phone mainboard are respectively provided with a positioning cavity which can form a calabash shape, the cross section area of the positioning cavity on the mobile phone mainboard is positioned between one half and two thirds of the area corresponding to the diameter of the positioning cavity, and a rubber block 37 matched with the two positioning cavities is arranged in the positioning cavity on the shell 1; the bottom surface of the shell 1 is symmetrically provided with sliding cavities 7, the sliding cavities 7 are internally connected with sliding blocks 8 in a sliding manner, elastic bodies 9 are connected between the sliding blocks 8 and the inner ends of the sliding cavities 7, the side walls of the sliding blocks 8 are symmetrically provided with clamping grooves 10, the bottom surface of the shell 1 is symmetrically provided with a group of inverted funnel-shaped positioning grooves 11, the top surface of the shell 1 is connected with a group of positioning rods 12 matched with the positioning grooves 11, the top surface of the shell 1 is respectively provided with clamping cavities 13 matched with the sliding blocks 8, the inner ends of the clamping cavities 13 are provided with adsorption plates 14, the adsorption plates 14 and the sliding blocks 8 are respectively made of magnetic materials, the magnetic poles of one ends, close to each other, of the adsorption plates 14 and the sliding blocks 8 are opposite, the side walls of the inner ends of the clamping cavities 13 are symmetrically provided with a group of sliding grooves 15, the sliding blocks 16 are connected in the sliding grooves 15 in a sliding manner, and elastic pieces 17 are connected between the clamping blocks 16 and the inner ends of the sliding grooves 15, the outer end of the fixture block 16 is provided with an inclined extrusion surface 18; when the mobile phone is in work, when a plurality of chips need to be packaged in the prior art, the operation process is complicated, so that the packaging efficiency of the chips is low, and meanwhile, the firmness of the plurality of chips during packaging is poor, so that the quality and the service life of multi-chip packaging are influenced, and the packaged chips and a mobile phone mainboard lack a positioning structure during mounting, so that the shell 1 after the chip packaging is difficult to accurately and quickly connect with the mobile phone mainboard, and the processing quality and the processing efficiency of the mobile phone are influenced; when the device is used, a worker firstly places the substrate 3 in the fixing groove 2, then installs the chip body 4 on the substrate 3, coats epoxy resin between the substrate 3 and the chip body 4 and between the substrate 3 and the fixing groove 2, and then sequentially clamps the circuits on the chip body 4 into the wire arranging holes of the wire arranging frame 5, so that the single chip body 4 is packaged, and the arranged pins 6 can enable the chip body 4 to be connected with external circuits; when a plurality of chip bodies 4 need to be packaged simultaneously, the positioning groove 11 on the bottom surface of the packaged shell 1 is inserted into the positioning rod 12 on the top surface of the other shell 1, so that the sliding cavities 7 on the two shells 1 are aligned with the card cavity 13 and approach to each other, the adsorption plate 14 can attract the sliding block 8 at the moment, and drive the sliding block 8 to slide into the card cavity 13 and extrude the inclined surface on the clamping block 16, so that the clamping block 16 slides towards the inside of the sliding groove 15 under the stress and extrudes the elastic part 17, when the free end of the sliding block 8 is attached to the inner end of the card cavity 13, the clamping groove 10 on the sliding block 8 can be aligned with the sliding groove 15, the clamping block 16 can be inserted into the clamping groove 10 under the rebound force of the elastic part 17 and fixes the sliding block 8, so that the two shells 1 can be automatically connected into a whole through the sliding block 8, thereby completing the installation of the plurality of chip bodies 4, the two shells 1 do not need to be connected in a time-consuming and labor-consuming manner in the form of hot melt adhesive, the efficiency of packaging a plurality of chips is improved, meanwhile, the method is firmer, the condition that the two shells 1 are not firmly connected due to the fact that the hot melt adhesive is affected with damp or deteriorates is reduced, and therefore the quality and the service life of chip packaging are greatly improved; when the multi-chip shell 1 that will encapsulate when needs weld on mobile phone motherboard, this moment through clamping the location intracavity portion on bottom casing 1 with rubber piece 37, later through pressing into the location intracavity portion of mobile phone motherboard with the other end of rubber piece 37 for casing 1 and mobile phone motherboard can convenient effectual location and be connected under the effect of rubber piece 37, make things convenient for the casing to weld on mobile phone motherboard, improved the installation quality and the efficiency of casing 1 and mobile phone motherboard greatly.
As an embodiment of the present invention, the inner ends of the sliding cavities 7 are respectively connected with a limiting rod 19, the inner end of the sliding block 8 is provided with a limiting groove connected with the limiting rod 19 in a sliding manner, and when the inner end of the limiting groove is attached to the end of the limiting rod 19, the outer end of the sliding block 8 is flush with the bottom surface of the housing 1; during operation, slider 8 can make the inside laminating mutually of spacing inslot and 19 tip of gag lever post under the effect of elastomer 9, thereby make slider 8's outer end flush with casing 1's bottom surface mutually, make sliding chamber 7 can play better storage effect to slider 8, reduce the condition that slider 8 bulges to sliding chamber 7 outer end and influence casing 1 processing, also reduce the too dark shrink of slider 8 inside sliding chamber 7 and with the not enough condition of effort of adsorption plate 14 simultaneously, make slider 8's work can stabilize effectual going on.
As an embodiment of the present invention, an air passage 20 communicated with an inner end of one of the chutes 15 is formed on a side wall of the housing 1, an outer end of the air passage 20 is provided with a blocking head 21, the inner ends of the chutes 15 are communicated with each other through an air flow channel 22, and when the air passage 20 sucks air into the inner end of the chute 15, the air passage can drive the latch 16 to move to a side far away from the latch cavity 13; the during operation, when needs split a plurality of casings 1 of connecting, open shutoff head 21 this moment to bleed to air flue 20 through external air pump, make the inside atmospheric pressure of spout 15 reduce and drive fixture block 16 to the side motion that is close to elastic component 17, thereby make the draw-in groove 10 on fixture block 16 and the slider 8 break away from each other, and no longer fix slider 8, thereby make a plurality of casings 1 of connecting can carry out convenient and fast's dismantlement when needs maintenance.
As an embodiment of the present invention, a spherical blocking block 23 is disposed at an inner end of the latch 16, the blocking block 23 is made of a rubber material and is in interference fit with a side wall of the sliding groove 15, and a gap is disposed between the latch 16 and the side wall of the sliding groove 15; during operation, when external air pump bleeds air flue 20, atmospheric pressure in spout 15 can drive fixture block 16 and draw-in groove 10 through blocking piece 23 when reducing and break away from mutually, because be the single point contact between blocking piece 23 and the spout 15 lateral wall, and no longer contact between fixture block 16 and the spout 15 lateral wall, greatly reduced fixture block 16 and the spout 15 between frictional force when the motion for fixture block 16's work can effectually go on smoothly.
Example two:
as shown in fig. 6, on the basis of the first embodiment, the present invention provides a technical solution: a lubricating chamber 24 is formed in one end, close to the elastic piece 17, of the blocking block 23, a pressing plate 25 is connected to the inside of the lubricating chamber 24 in a sliding mode, the pressing plate 25 is attached to the side wall of the lubricating chamber 24, an elastic block 26 is connected between the pressing plate 25 and the inner end of the lubricating chamber 24, an arc-shaped installation groove is formed in the blocking block 23 corresponding to the outer end of the lubricating chamber 24, an oil absorption layer 27 made of a water absorption material is installed inside the installation groove, and lubricating liquid is contained in the lubricating chamber 24 between the oil absorption layer 27 and the pressing plate 25; during operation, when air is extracted from the inside of the sliding groove 15 through the air passage 20, the air pressure in the sliding groove 15 can drive the pressing plate 25 to move towards one side of the mounting groove and extrude the oil absorption layer 27 attached with lubricating oil, so that the lubricating oil in the oil absorption layer 27 can flow out to the side wall of the sliding groove 15, the friction resistance generated by the relative movement of the subsequent plugging block 23 and the sliding groove 15 can be reduced, and the stability and effectiveness of the fixture block 16 during operation are further improved.
As an embodiment of the invention, a mesh plate 28 is arranged on the side wall of the installation groove corresponding to the outer end of the oil absorption layer 27, and the side wall of the pressing plate 25 close to the oil absorption layer 27 is arranged into an arc shape matched with the shape of the oil absorption layer 27; during operation, when the pressing plate 25 moves towards the oil absorption layer 27, the pressing plate 25 can press the oil absorption layer 27 on the screen plate 28, so that the lubricating oil absorbed in the oil absorption layer 27 can flow out more sufficiently under the action of the pressing plate 25 and the screen plate 28, meanwhile, the end face of the arc-shaped pressing plate 25 can extrude the oil absorption layer 27 more sufficiently, and the lubricating effect between the plugging block 23 and the sliding groove 15 is further improved.
As an embodiment of the present invention, the mesh plate 28 is connected to a coating block 30 through a set of connecting rods 29, the coating block 30 is attached to the side wall of the chute 15, a coating layer 31 is disposed on the outer surface of the coating block 30, a transport layer 32 attached to the surface of the coating layer 31 is disposed inside the oil absorption layer 27, and both the coating layer 31 and the transport layer 32 are made of water-absorbing materials; during the operation, carry the layer 32 and can carry the lubricating oil in the oil absorption layer 27 to the coating 31 in, when the shutoff piece 23 moves under the effect of spout 15 atmospheric pressure, the shutoff piece 23 can drive coating piece 30 and coating 31 in advance and slide on spout 15 lateral wall in advance this moment in step for lubricating oil in the coating 31 can be more abundant comprehensive coating on spout 15 lateral wall, further reduces the frictional resistance between shutoff piece 23 and the spout 15.
As an embodiment of the present invention, the coating block 30 has a spherical shape and is rotatably connected to the connecting rod 29, and the coating layer 31 is wrapped on the outer surface of the coating block 30; during operation, when the blocking block 23 moves inside the sliding groove 15, the coating block 30 can drive the coating layer 31 to roll on the sliding groove 15 under the action of the connecting rod 29, so that the lubricating oil adsorbed in the coating layer 31 can more effectively and sufficiently flow out and coat on the side wall of the sliding groove 15, and meanwhile, the friction resistance between the coating block 30 and the side wall of the sliding groove 15 can also be reduced.
As an embodiment of the present invention, a storage cavity 33 is provided inside the blocking block 23, the storage cavity 33 is connected with the side wall of the lubrication chamber 24 through a conveying groove 34, a piston 35 is slidably connected inside the storage cavity 33, an elastic component 36 is connected between the piston 35 and one end of the storage cavity 33 far away from the conveying groove 34, and the pressing plate 25 can block the end of the conveying groove 34 in a static state; during operation, lubricating oil is stored in the storage cavity 33, the port of the conveying groove 34 can be blocked by the pressing plate 25, the situation that the lubricating oil is deteriorated due to long-time contact with the external environment is reduced, meanwhile, when the pressing plate 25 finishes operation and slides back and forth in the lubricating chamber 24 under the action of the elastic block 26, the outer end of the pressing plate 25 can temporarily cross the port of the conveying groove 34 and is not blocked any more, at the moment, the piston 35 can push a small part of the lubricating oil in the storage cavity 33 to flow into the lubricating chamber 24 from the conveying groove 34 under the action of the elastic component 36, and therefore sufficient lubricating oil can be kept in the lubricating chamber 24 for use, and the operation of the lubricating chamber 24 can be carried out more durably and stably.
A multi-chip packaging positioning method of a mobile phone integrated circuit is suitable for the packaging positioning device and comprises the following steps:
s1: firstly, a substrate 3 is placed in a fixing groove 2, then a chip body 4 is installed on the substrate 3, and epoxy resin is coated between the substrate 3 and the chip body 4 and between the substrate and the fixing groove 2;
s2: then, the circuits on the chip bodies 4 are sequentially clamped into the wire arranging holes of the wire arranging frame 5, and the single chip bodies 4 are packaged;
s3: then, inserting a positioning groove 11 on the bottom surface of the packaged shell 1 into a positioning rod 12 on the top surface of the other shell 1, and attaching the outer surfaces of the two shells 1, so that the sliding block 8 on the shell 1 and the clamping cavity 13 are automatically connected into a whole after being matched, and the installation of a plurality of chip bodies 4 is completed; the form that no longer need pass through the hot melt adhesive carries out the connection that wastes time and energy with two casings 1, has improved the efficiency of a plurality of chip encapsulation, and this mode is more firm simultaneously, reduces the hot melt adhesive and leads to connecting the not firm condition to two casings 1 because of weing or rotting to the quality and the life of chip encapsulation have been improved greatly.
S4: the rubber block 37 is clamped in the positioning cavity of the bottom end shell 1, then the other end of the rubber block 37 is pressed into the positioning cavity of the mobile phone main board, and finally the shell 1 is welded on the mobile phone main board to complete the installation of the two.
When the packaging structure works, a worker firstly places the substrate 3 in the fixing groove 2, then installs the chip body 4 on the substrate 3, coats epoxy resin between the substrate 3 and the chip body 4 and between the substrate 3 and the fixing groove 2, and then sequentially clamps the circuits on the chip body 4 into the wire arranging holes of the wire arranging frame 5, so that the packaging of the single chip body 4 is completed, and the arranged pins 6 can enable the chip body 4 to be connected with external circuits; when a plurality of chip bodies 4 need to be packaged simultaneously, the positioning groove 11 on the bottom surface of the packaged shell 1 is inserted into the positioning rod 12 on the top surface of the other shell 1, so that the sliding cavities 7 on the two shells 1 are aligned with the card cavity 13 and approach to each other, the adsorption plate 14 can attract the sliding block 8 at the moment, and drive the sliding block 8 to slide into the card cavity 13 and extrude the inclined surface on the clamping block 16, so that the clamping block 16 slides towards the inside of the sliding groove 15 under the stress and extrudes the elastic part 17, when the free end of the sliding block 8 is attached to the inner end of the card cavity 13, the clamping groove 10 on the sliding block 8 can be aligned with the sliding groove 15, the clamping block 16 can be inserted into the clamping groove 10 under the rebound force of the elastic part 17 and fixes the sliding block 8, so that the two shells 1 can be automatically connected into a whole through the sliding block 8, thereby completing the installation of the plurality of chip bodies 4, the two shells 1 do not need to be connected in a time-consuming and labor-consuming manner in the form of hot melt adhesive, the efficiency of packaging a plurality of chips is improved, meanwhile, the method is firmer, the condition that the two shells 1 are not firmly connected due to the fact that the hot melt adhesive is affected with damp or deteriorates is reduced, and therefore the quality and the service life of chip packaging are greatly improved; when the multi-chip shell 1 that will encapsulate when needs weld on mobile phone motherboard, this moment through clamping the location intracavity portion on bottom casing 1 with rubber piece 37, later through pressing into the location intracavity portion of mobile phone motherboard with the other end of rubber piece 37 for casing 1 and mobile phone motherboard can convenient effectual location and be connected under the effect of rubber piece 37, make things convenient for the casing to weld on mobile phone motherboard, improved the installation quality and the efficiency of casing 1 and mobile phone motherboard greatly.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A multi-chip packaging and positioning device for a mobile phone integrated circuit comprises a shell (1) connected to a mobile phone mainboard, wherein a fixing groove (2) is formed in the shell (1), a substrate (3) is installed in the fixing groove (2), the top of the substrate (3) is connected with a chip body (4), a wire arranging frame (5) is arranged at the outer edge of the top of the substrate (3), and pins (6) are arranged on the side wall of the shell (1) corresponding to one side of the wire arranging frame (5); the method is characterized in that: one surfaces of the shell (1) and the mobile phone main board which are matched with each other are respectively provided with a positioning cavity which can form a calabash shape, the cross section area of the positioning cavity on the mobile phone main board is positioned between one half and two thirds of the area corresponding to the diameter of the positioning cavity, and a rubber block (37) matched with the two positioning cavities is arranged in the positioning cavity on the shell (1); the improved structure is characterized in that a sliding cavity (7) is symmetrically formed in the bottom surface of the shell (1), a sliding block (8) is connected in the sliding cavity (7) in a sliding mode, an elastic body (9) is connected between the sliding block (8) and the inner end of the sliding cavity (7), clamping grooves (10) are symmetrically formed in the side wall of the sliding block (8), a set of inverted funnel-shaped positioning grooves (11) are symmetrically formed in the bottom surface of the shell (1), a set of positioning rods (12) matched with the positioning grooves (11) are connected to the top surface of the shell (1), clamping cavities (13) matched with the sliding block (8) are formed in the top surface of the shell (1), an adsorption plate (14) is arranged at the inner end of each clamping cavity (13), the adsorption plate (14) and the sliding block (8) are made of magnetic materials respectively, the magnetic poles of the adsorption plate (14) and the sliding block (8) close to each other are opposite, a set of sliding grooves (15) are symmetrically formed in the side wall of the inner ends of the clamping cavities (13), a clamping block (16) is connected to the inner portion of the sliding groove (15) in a sliding mode, an elastic piece (17) is connected between the clamping block (16) and the inner end of the sliding groove (15), and an inclined extrusion surface (18) is arranged at the outer end of the clamping block (16).
2. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 1, wherein: the inner of the sliding cavity (7) is connected with a limiting rod (19) respectively, the inner of the sliding block (8) is provided with a limiting groove connected with the limiting rod (19) in a sliding mode, and when the inner of the limiting groove is attached to the end portion of the limiting rod (19), the outer end of the sliding block (8) is flush with the bottom surface of the shell (1).
3. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 2, wherein: the air channel (20) communicated with the inner end of one sliding groove (15) is formed in the side wall of the shell (1), a blocking head (21) is arranged at the outer end of the air channel (20), the inner ends of the sliding grooves (15) are communicated through an air flow channel (22), and the air channel (20) can drive the clamping block (16) to move towards one side far away from the clamping cavity (13) when sucking air to the inner ends of the sliding grooves (15).
4. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 3, wherein: the inner end of the clamping block (16) is provided with a spherical blocking block (23), the blocking block (23) is made of rubber materials and is in interference fit with the side wall of the sliding groove (15), and a gap is formed between the clamping block (16) and the side wall of the sliding groove (15).
5. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 4, wherein: lubricating chamber (24) have been seted up to the one end that blocks (23) are close to elastic component (17), lubricating chamber (24) inside sliding connection has clamp plate (25), clamp plate (25) laminate mutually with the lateral wall of lubricating chamber (24), be connected between clamp plate (25) and lubricating chamber (24) the inner flexible piece (26), be provided with curved mounting groove on the blocks (23) that lubricating chamber (24) outer end corresponds, mounting groove internally mounted has oil absorption layer (27) that water-absorbing material made, lubricating fluid is held to lubricating chamber (24) inside between oil absorption layer (27) and clamp plate (25).
6. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 5, wherein: the side wall of the mounting groove corresponding to the outer end of the oil absorption layer (27) is provided with a screen plate (28), and the side wall of the pressing plate (25) close to the oil absorption layer (27) is arranged into an arc shape matched with the shape of the oil absorption layer (27).
7. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 6, wherein: the net plate (28) is connected with a coating block (30) through a group of connecting rods (29), the coating block (30) is attached to the side wall of the sliding chute (15), a coating layer (31) is arranged on the outer surface of the coating block (30), a conveying layer (32) attached to the surface of the coating layer (31) is arranged inside the oil absorption layer (27), and the coating layer (31) and the conveying layer (32) are both made of water absorption materials.
8. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 7, wherein: the coating block (30) is spherical and is rotationally connected with the connecting rod (29), and the coating layer (31) is wrapped on the outer surface of the coating block (30).
9. The multi-chip package positioning device of the mobile phone integrated circuit as claimed in claim 8, wherein: the inside storage chamber (33) that is provided with of shutoff piece (23), it links to each other through conveyer trough (34) to store between chamber (33) and lubrication chamber (24) lateral wall, store inside sliding connection in chamber (33) has piston (35), the one end that conveyer trough (34) were kept away from in piston (35) and storage chamber (33) is connected with elastic component (36), clamp plate (25) can carry out the shutoff to the tip of conveyer trough (34) when quiescent condition.
10. A multi-chip package positioning method for mobile phone integrated circuits, the method is applied to the package positioning device of any one of claims 1-9, and the method comprises the following steps:
s1: firstly, a substrate (3) is placed in a fixing groove (2), then a chip body (4) is installed on the substrate (3), and epoxy resin is coated between the substrate (3) and the chip body (4) and between the substrate and the fixing groove (2);
s2: then, the circuits on the chip body (4) are sequentially clamped into the wire arranging holes of the wire arranging frame (5) to finish the packaging of the single chip body (4);
s3: then inserting a positioning groove (11) at the bottom surface of the packaged shell (1) into a positioning rod (12) at the top surface of the other shell (1), and attaching the outer surfaces of the two shells (1) to each other, so that a sliding block (8) on the shell (1) and a clamping cavity (13) are automatically connected into a whole after being matched, and the installation of a plurality of chip bodies (4) is completed;
s4: the rubber block (37) is clamped in the positioning cavity of the bottom end shell (1), then the other end of the rubber block (37) is pressed into the positioning cavity of the mobile phone main board, and finally the shell (1) is welded on the mobile phone main board to complete the installation of the shell and the mobile phone main board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110377943.6A CN113178421B (en) | 2021-04-08 | 2021-04-08 | Multi-chip packaging positioning device and method for mobile phone integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110377943.6A CN113178421B (en) | 2021-04-08 | 2021-04-08 | Multi-chip packaging positioning device and method for mobile phone integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113178421A CN113178421A (en) | 2021-07-27 |
| CN113178421B true CN113178421B (en) | 2022-03-29 |
Family
ID=76924685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110377943.6A Active CN113178421B (en) | 2021-04-08 | 2021-04-08 | Multi-chip packaging positioning device and method for mobile phone integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113178421B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113645796B (en) * | 2021-08-04 | 2022-11-11 | 宁波群芯微电子股份有限公司 | High-safety integrated circuit packaging device and using method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0558855A2 (en) * | 1992-03-02 | 1993-09-08 | AT&T Corp. | Circuit board stack with novel cross-over cells |
| CN2388708Y (en) * | 1999-09-07 | 2000-07-19 | 英属维京群岛盖内蒂克瓦耳有限公司 | IC encapsulation structure |
| US6188138B1 (en) * | 1996-12-19 | 2001-02-13 | Telefonaktiebolaget Lm Ericsson (Pub) | Bumps in grooves for elastic positioning |
| JP2012089881A (en) * | 2009-07-29 | 2012-05-10 | Kingpak Technology Inc | Image sensor package structure |
| WO2012165908A2 (en) * | 2011-06-01 | 2012-12-06 | 주식회사 아이에스시 | Insert for a semiconductor package |
| TWM471674U (en) * | 2013-07-11 | 2014-02-01 | Aptos Technology Inc | An embedded package structure |
| CN108766939A (en) * | 2018-08-15 | 2018-11-06 | 江苏盐芯微电子有限公司 | A kind of chip packaging device and packaging method |
| CN112560516A (en) * | 2021-01-05 | 2021-03-26 | 南京溪则宏贸易有限公司 | Automatic recovery unit of inside chip of smart card |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10764475B2 (en) * | 2017-05-17 | 2020-09-01 | Tdk Taiwan Corp. | Driving mechanism |
| WO2021055584A1 (en) * | 2019-09-19 | 2021-03-25 | Amphenol Corporation | High speed electronic system with midboard cable connector |
-
2021
- 2021-04-08 CN CN202110377943.6A patent/CN113178421B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0558855A2 (en) * | 1992-03-02 | 1993-09-08 | AT&T Corp. | Circuit board stack with novel cross-over cells |
| US6188138B1 (en) * | 1996-12-19 | 2001-02-13 | Telefonaktiebolaget Lm Ericsson (Pub) | Bumps in grooves for elastic positioning |
| CN2388708Y (en) * | 1999-09-07 | 2000-07-19 | 英属维京群岛盖内蒂克瓦耳有限公司 | IC encapsulation structure |
| JP2012089881A (en) * | 2009-07-29 | 2012-05-10 | Kingpak Technology Inc | Image sensor package structure |
| WO2012165908A2 (en) * | 2011-06-01 | 2012-12-06 | 주식회사 아이에스시 | Insert for a semiconductor package |
| TWM471674U (en) * | 2013-07-11 | 2014-02-01 | Aptos Technology Inc | An embedded package structure |
| CN108766939A (en) * | 2018-08-15 | 2018-11-06 | 江苏盐芯微电子有限公司 | A kind of chip packaging device and packaging method |
| CN112560516A (en) * | 2021-01-05 | 2021-03-26 | 南京溪则宏贸易有限公司 | Automatic recovery unit of inside chip of smart card |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113178421A (en) | 2021-07-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113178421B (en) | Multi-chip packaging positioning device and method for mobile phone integrated circuit | |
| KR102228644B1 (en) | Resin-sealing device and resin-sealing method | |
| KR102119992B1 (en) | Resin sealing device and resin sealing method | |
| CN112858027B (en) | Chip packaging test system and test method thereof | |
| WO2010114216A1 (en) | Apparatus for peeling metal in a via hole penetrating through a semiconductor wafer, and peeling method using same | |
| CN115122250A (en) | Chip clamping device | |
| CN1218183A (en) | Semiconductor integrated circuit testing apparatus | |
| KR20160044975A (en) | Semiconductor package test blade and semiconductor package test apparatus comprising the same | |
| JP2011009589A (en) | Resin sealing die, and resin sealing method | |
| CN116338440B (en) | Semiconductor shot chip testing device | |
| CN202905703U (en) | Combined small-power surface-mount diode lead frame member | |
| CN201589720U (en) | Sampling clamp of sampling device of mass spectrometer | |
| CN218727793U (en) | Module test fixture | |
| CN218594637U (en) | Chip tube feeding mechanism | |
| CN213660376U (en) | Chip picking mechanism and sorting machine | |
| CN207587700U (en) | Smart mobile phone fingerprint chip testing screening system | |
| CN113784565B (en) | Dampproofing packaging body of electronic component | |
| CN219204855U (en) | BGA device bottom filling tool | |
| CN109379836B (en) | Pipeline type electronic board | |
| CN214278329U (en) | Testing jig for flat pin chip diode | |
| CN205177821U (en) | Prevent water tank structure lead frame more | |
| CN208833875U (en) | A kind of semiconductor test sample chip encapsulation parameter device | |
| CN209880580U (en) | Chip packaging body and electronic equipment thereof | |
| US20020130401A1 (en) | Underfill applications using film technology | |
| CN208147271U (en) | Semiconductor welding tooling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |