CN208833875U - A kind of semiconductor test sample chip encapsulation parameter device - Google Patents
A kind of semiconductor test sample chip encapsulation parameter device Download PDFInfo
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- CN208833875U CN208833875U CN201821576373.3U CN201821576373U CN208833875U CN 208833875 U CN208833875 U CN 208833875U CN 201821576373 U CN201821576373 U CN 201821576373U CN 208833875 U CN208833875 U CN 208833875U
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- test sample
- fixed
- connecting rod
- placing groove
- chip encapsulation
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Abstract
The utility model discloses a kind of semiconductor test sample chip encapsulation parameter devices, including pedestal and insulation board, insulation board is set on the base, and insulation board is equipped with placing groove, the two sides of placing groove are equipped with extension slot, and one end of two extension slots is interconnected with the two sides of placing groove respectively, fixing clip there are two being set in placing groove, piston mechanism is equipped in two extension slots, and one end of two piston mechanisms is connect with the side of two fixing clips respectively, the other side of two fixing clips is equipped with clamping recess, a kind of semiconductor test sample chip encapsulation parameter device of the utility model, it can be good at for test sample being fixed by piston mechanism and two fixing clips, avoiding test sample can not be fixed, the problem of to influence data collection.
Description
Technical field
The utility model relates to semiconductor chip field, specifically a kind of semiconductor test sample chip encapsulation parameter dress
It sets.
Background technique
Semiconductor assembly and test chip, which becomes finished product, to be by chip bonding die, wire bonding, injection molding packaging, is electroplated, cuts and draw
Foot shaping and electrical testing these most basic techniques.Only there are two modes for test at present: 1. probes test: from chip surface
It is tested with probe；2. re-test after encapsulation: all techniques being done completely, then is tested by test machine.It is tested at two
It requires that test sample is fixed in the process, existing equipment does not have the not enough jail that sample is fixed or is fixed
Lean on, be easy to influence the collection of data so that sample is slided in test, it is further influence test as a result, and mostly
All cause the data of detection variant without carrying out insulation processing when number test.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of semiconductor test sample chip encapsulation parameter device
The existing equipment proposed in background technique do not have sample is fixed or is fixed it is not firm enough, be easy so that sample
Slided in test, influence the collection of data, it is further influence test as a result, and when most of tests all not into
Row insulation processing leads to the discrepant problem of data of detection.
To achieve the above object, the utility model provides the following technical solutions:
A kind of semiconductor test sample chip encapsulation parameter device, including pedestal and insulation board, the insulation board setting exist
On pedestal, and the insulation board is equipped with placing groove, the two sides of the placing groove are equipped with extension slot, and two extension slots
One end interconnected respectively with the two sides of placing groove, set in the placing groove there are two fixing clip, two extension slots
It is inside equipped with piston mechanism, and one end of two piston mechanisms is connect with the side of two fixing clips respectively, two institutes
The other side for stating fixing clip is equipped with clamping recess.
It is further: the first fixed link there are two being set on the insulation board, and two first fixed links are located at placement
The side of slot is interconnected by first connecting rod between one end of two first fixed links, and the first connecting rod
Side be equipped with multiple probe placement clamping plates.
Further: the pedestal is equipped with the second fixed link, and the side of second fixed link is equipped with detection device,
Multiple detection probes are equipped at the side of the first connecting rod, the bottom of the detection device passes through multiple data lines point
It is not connect with one end of multiple detection probes.
It is further: hand-held part to be equipped on multiple data lines, and one end of multiple hand-held parts passes through baffle
It is connect with one end of detection probe, and multiple hand-held parts are arranged in multiple probe placement clamping plates.
Further: the piston mechanism includes fixed block, piston tube and fixed connecting rod, the fixed block setting two
It is a, and interconnected between two fixed blocks by piston tube and fixed connecting rod, push plate is equipped in the piston tube, and described
The side of push plate is connected by one end of compressed spring and piston tube, and the other side of the push plate is by the second connecting rod and admittedly
The side of clamp block connects.
Compared with prior art, the utility model has the beneficial effects that
1, it can be good at for test sample being fixed by piston mechanism and two fixing clips, avoid test specimens
Product can not be fixed, thus the problem of influencing data collection.
2, the clamping recess of two fixing clip other sides can further fix test sample, prevent from testing
Sample slides during the test.
3, using for insulation board can be good at that test sample and other equipment is made to insulate during the test, increase
Add the accuracy of test.
Detailed description of the invention
Fig. 1 is a kind of perspective view of semiconductor test sample chip encapsulation parameter device.
Fig. 2 is a kind of top view of semiconductor test sample chip encapsulation parameter device.
Fig. 3 is the enlarged drawing in a kind of Fig. 1 of semiconductor test sample chip encapsulation parameter device at A.
Fig. 4 is a kind of front section view of the piston mechanism of semiconductor test sample chip encapsulation parameter device.
In figure: 1, pedestal；2, insulation board；3, placing groove；4, extension slot；5, piston mechanism；6, fixing clip；7, it clamps recessed
Slot；8, the second connecting rod；9, the first fixed link；10, first connecting rod；11, the second fixed link；12, detection device；13, data
Line；14, detection probe；15, baffle；16, probe placement clamping plate；17, hand-held part；18, fixed block；19, piston tube；20, it compresses
Spring；21, fixed connecting rod；22, push plate.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1~4, in the utility model embodiment, a kind of semiconductor test sample chip encapsulation parameter device, packet
Pedestal 1 and insulation board 2 are included, the insulation board 2 is arranged on pedestal 1, and the insulation board 2 is equipped with placing groove 3, the placement
The two sides of slot 3 are equipped with extension slot 4, and two sides of the one end of two extension slots 4 respectively with placing groove 3 interconnect, institute
Fixing clip 6 there are two setting in placing groove 3 is stated, is equipped with piston mechanism 5, and two pistons in two extension slots 4
One end of mechanism 5 is connect with the side of two fixing clips 6 respectively, and the other side of two fixing clips 6 is equipped with clamping
Groove 7.
First fixed link 9 there are two being set on the insulation board 2, and two first fixed links 9 are located at the one of placing groove 3
Side is interconnected by first connecting rod 10 between one end of two first fixed links 9, and the first connecting rod 10
Side be equipped with multiple probe placement clamping plates 16, the pedestal 1 be equipped with the second fixed link 11, the one of second fixed link 11
Side is equipped with detection device 12, and multiple detection probes 14, the detection dress are equipped at the side of the first connecting rod 10
It sets 12 bottom to connect with one end of multiple detection probes 14 respectively by multiple data lines 13, on multiple data lines 13
Equipped with hand-held part 17, and one end of multiple hand-held parts 17 is connect by baffle 15 with one end of detection probe 14, and multiple
The hand-held part 17 is arranged in multiple probe placement clamping plates 16, and the piston mechanism 5 includes fixed block 18,19 and of piston tube
Fixed connecting rod 21, the fixed block 18 are arranged two, and pass through piston tube 19 and fixed connecting rod between two fixed blocks 18
21 interconnect, and push plate 22 are equipped in the piston tube 19, and the side of the push plate 22 passes through compressed spring 20 and piston tube
19 one end connection, and the other side of the push plate 22 is connect by the second connecting rod 8 with the side of fixing clip 6.
A kind of semiconductor test sample chip encapsulation parameter device of the utility model, passes through piston mechanism and two fixing clamps
Block can be good at for test sample being fixed, and avoiding test sample can not be fixed, to influence data collection
The clamping recess of problem, two fixing clip other sides can further fix test sample, prevent test sample
It slides during the test, using for insulation board can be good at making during the test test sample and other equipment to carry out
Insulation, increases the accuracy of test.
The working principle of the utility model is: by the test sample Jing Guo semiconductor assembly and test foremost twice technique from
It is taken off above production equipment, two fixing clips 6 in placing groove 3 is pushed with hand to two sides then, pass through fixing clip
With the connection relationship between 19 inner pushing plate 22 of piston tube so that side of the push plate 22 into piston tube 19 is mobile so that compression
Spring 20 compresses, and then test sample is placed in the placing groove 3 on insulation board 2, and then come up hand, by compressing bullet
The elastic force of spring 20, so that push plate 22 is mobile to the other side in piston tube 19, and then pushes two fixations aerial 6 mutually to draw close,
So that the two sides of test sample is carried out grafting with the clamping recess 7 on two 6 other sides of fixing clip, can thus to survey
Test agent can be good at being fixed, and avoiding test sample can not be fixed, thus the problem of influencing data collection, so
After will test probe and 14 taken out out of probe placement clamping plate 16, then test sample is detected, collects data, it is quick
Sample packaging and testing conclusion out, using for insulation board 2 can be good at making test sample and other equipment during the test
It insulate, increases the accuracy of test.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (5)
1. a kind of semiconductor test sample chip encapsulation parameter device, which is characterized in that including pedestal (1) and insulation board (2), institute
It states insulation board (2) to be arranged on pedestal (1), and the insulation board (2) is equipped with the two sides of placing groove (3), the placing groove (3)
It is equipped with extension slot (4), and two sides of the one end of two extension slots (4) respectively with placing groove (3) interconnect, it is described to put
It sets and is set in slot (3) there are two fixing clip (6), two extension slots (4) are interior to be equipped with piston mechanism (5), and described in two
One end of piston mechanism (5) is connect with the side of two fixing clips (6) respectively, the other side of two fixing clips (6)
It is equipped with clamping recess (7).
2. a kind of semiconductor test sample chip encapsulation parameter device according to claim 1, which is characterized in that described exhausted
It is set on listrium (2) there are two the first fixed link (9), and two first fixed links (9) are located at the side of placing groove (3), two
It is interconnected between one end of a first fixed link (9) by first connecting rod (10), and the first connecting rod (10)
Side be equipped with multiple probe placement clamping plates (16).
3. a kind of semiconductor test sample chip encapsulation parameter device according to claim 2, which is characterized in that the bottom
Seat (1) is equipped with the second fixed link (11), and the side of second fixed link (11) is equipped with detection device (12), is located at described
Multiple detection probes (14) are equipped at the side of first connecting rod (10), the bottom of the detection device (12) passes through multiple data
Line (13) is connect with one end of multiple detection probes (14) respectively.
4. a kind of semiconductor test sample chip encapsulation parameter device according to claim 1, which is characterized in that Duo Gesuo
It states and is equipped on data line (13) hand-held part (17), and one end of multiple hand-held parts (17) is visited by baffle (15) and detection
One end connection of head (14), and multiple hand-held parts (17) are arranged in multiple probe placement clamping plates (16).
5. a kind of semiconductor test sample chip encapsulation parameter device according to claim 1, which is characterized in that the work
Plug mechanism (5) includes fixed block (18), piston tube (19) and fixed connecting rod (21), and described fixed block (18) setting two, and
It is interconnected between two fixed blocks (18) by piston tube (19) and fixed connecting rod (21), is equipped in the piston tube (19)
Push plate (22), and the side of the push plate (22) is connect by compressed spring (20) with one end of piston tube (19), and described push away
The other side of plate (22) is connect by the second connecting rod (8) with the side of fixing clip (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821576373.3U CN208833875U (en) | 2018-09-27 | 2018-09-27 | A kind of semiconductor test sample chip encapsulation parameter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821576373.3U CN208833875U (en) | 2018-09-27 | 2018-09-27 | A kind of semiconductor test sample chip encapsulation parameter device |
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| Publication Number | Publication Date |
|---|---|
| CN208833875U true CN208833875U (en) | 2019-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821576373.3U Active CN208833875U (en) | 2018-09-27 | 2018-09-27 | A kind of semiconductor test sample chip encapsulation parameter device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112909726A (en) * | 2021-01-20 | 2021-06-04 | 苏州长光华芯光电技术股份有限公司 | Multifunctional testing device for laser chip |
-
2018
- 2018-09-27 CN CN201821576373.3U patent/CN208833875U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112909726A (en) * | 2021-01-20 | 2021-06-04 | 苏州长光华芯光电技术股份有限公司 | Multifunctional testing device for laser chip |
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Address after: 518108 6013, floor 6, building 2, Huike Industrial Park, No.1, industrial Second Road, Shilong community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN BONRDA TECHNOLOGY Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shiyan Street Community in paddy field huilongda Industrial Park plant on the eastern side of building B3 Patentee before: SHENZHEN BONRDA TECHNOLOGY Co.,Ltd. |
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