TWM471674U - An embedded package structure - Google Patents

Description

In-line package structure

The present invention is a package structure, in particular, an integrated package structure having an embedded body.

In recent years, semiconductor packaging technology includes a two-dimensional system on chip (SoC), which aims to integrate an electronic system into a single-chip integrated circuit, and has low power consumption, high performance, and small mounting area. The advantage is that the design time of the system single chip is too long, and different components are packaged on the same IC, and the IC produced by the system still occupies a considerable area, and its application range is limited.

System in Package (SiP) is a new type of packaging technology that can configure all or most of the electronic functions of a system or subsystem on an integrated substrate. Compared with SOC, it is more compact and highly functional. The development cycle has the advantages of short cycle and low price. Among them, the system-in-package includes three-dimensional integrated system-in-package (SiP) 3D IC, and three technologies including 3D integrated through-chip (Through Silicon Via; TSV) 3D IC. .

However, the threshold and manufacturing cost of the perforated 3D IC technology is still too high, and the application has not been widely used. Therefore, it is currently based on multi-chip package (MCP) technology, stack stacking, and package on package. PoP), PiP (Package in Package), embedded substrate (Embedded Technology such as Substrate) is the mainstream technology in the industry.

The system package process such as the MCP technology integrates several ICs into one package. However, the ICs before integration are not all known good good chips, and it is necessary to integrate all ICs. Faced with the complex test process before and after integration and the problem of heat dissipation, even more, when any IC fails, the 3D IC can only be scrapped.

Therefore, how to propose a solution in the current system-level packaging technology is a problem to be solved.

The main purpose of this creation is to propose a package structure that is easy to assemble, expand, test, and replace.

According to the foregoing objective, the present invention provides an in-line package structure including: at least one package, the package includes at least one embedded body, the embedded body has at least one connection port, and the connection port is open to The outside of the package.

The feature of this creation is that it improves the conventional IC chip in the same package but causes a single IC failure and the entire IC is discarded. The high pin count embedded package is used as the carrier and The peripheral IC is plugged into the connection port, and the peripheral IC, the module, the controller (Controller) can be plugged according to the requirements of different functions, or connected to other systems or devices by the cable, thereby facilitating assembly, expansion, and Testing and replacing the advantages of IC parts, this creation has the effect of reducing process time, reducing heat buildup, saving costs, and increasing yield.

11, 11b, 11c, 11d, 11e, 11f, 11z‧‧‧ connection ports

1, 1a, 1b, 1c, 1d, 1e, 1f, 1z‧‧‧ embedded body

21, 21z, 22‧‧‧ metal joints

2, 2b, 2c, 2d, 2e, 2f, 2z‧‧‧ circuit substrate

3, 3b, 3d, 3e, 3f, 3z‧‧‧ package

4‧‧‧Intermediary

5, 5a, 7, 8‧‧‧ electronic carrier

a‧‧‧Micro-USB connector

b‧‧‧Connecting components

C‧‧‧chip

d‧‧‧Electronic components

P‧‧‧terminal

Figure 1-1: Assembly diagram (1) of the first embodiment of the creative process.

Figure 1-2: Assembly diagram (2) of the first embodiment of the creative process.

Figure 1-3: Assembly diagram (1) of the first embodiment of the creative process implemented by another embodiment of the embedded body.

Figure 1-4: Assembly diagram (2) of the first embodiment of the creative process implemented by another embodiment of the embedded body.

Figure 1-5: Assembly diagram (3) of the first embodiment of the creative process.

Figure 1-6: Assembly diagram (1) of the first embodiment of the creative process implemented by another aspect of the package.

Figure 1-7: Assembly diagram (2) of the first embodiment of the authoring process implemented by another aspect of the package.

Figure 2-1: Assembly diagram (1) of the second embodiment of the creative process.

Figure 2-2: Schematic diagram of the assembly of the second embodiment of the authoring process (2).

Figure 2-3: Assembly diagram (3) of the second embodiment of the authoring process.

Fig. 3 is a schematic view showing the assembly of the third embodiment of the creative process.

Figure 4: A combination of the creation structure.

The following is a description of how the structure of the creation is combined and used in conjunction with the attached drawings. It should be easier to understand the purpose, technical content, characteristics and effects of the creation.

First, please refer to the first embodiment of FIG. 1-1 to FIG. 1-5 to illustrate the first embodiment of the in-line package structure of the present invention, and to make the content of the creation easier to understand, a USB 3.0/Micro-USB is created underneath. The steps of the dual-connect flash memory disc are illustrated as an example.

As shown in FIG. 1-1, the creation structure includes a package body 3 including an embedded body 1 having a plurality of connection ports 11 and a circuit substrate 2, the circuit substrate 2 has a flash memory chip (not shown), a control circuit (not shown) and USB 2.0, USB 3.0 metal contacts 21, 22, the embedded body 1 can be a solid molding material (Epoxy Molding) Compound, EMC) or injection molded male or female seat, the following is described by the mother seat and the connection port; at this time, the connection ports 11 have not been exposed outside the package 3; As shown in the figure, the connection port 11 of the package can be exposed by cutting, or can be opened by placing the embedded body 1 on the outside of the package 3 so that the connection ports 11 and 11a can be exposed. In the position, the connection ports 11 are respectively open outside the package body 3; further, the embedded body is implemented in another aspect as shown in Figures 1-3, and the difference from the 1-1 figure is A plurality of embedded sockets 1a having a connection port 11a are connected to the circuit board 2 and then packaged to form a package body 3, as shown in FIGS. 1-4, after the package body 3 is cut, the insides are The individual connection ports 11a of the socket body 1a are exposed to the package body 3; thus, it can be easily as shown in Figure 1-2 or Figure 1-4. The micro-USB connector a is plugged into the connection ports 11 and further assembled as shown in Figures 1-5 by SMT technology or after snapping, bonding (and optionally potting). The technology connects the USB 3.0 connection component b to the package 3. The detailed assembly method has been disclosed in the specification of the Republic of China Patent No. M439795, which mainly includes upgrading the storage disk of the original USB 2.0 interface to be usable. The technical characteristics of the USB 3.0 interface storage disc) form an embedded package structure of the USB 3.0/Micro-USB dual interface connector flash memory disc completed by the embedded package system; the foregoing packaging system is more Alternatively, it can be implemented in a package 3z having a terminal p, that is, As shown in FIG. 1-6, the plurality of terminals p can be injection-molded, hooked or surface-adhesive technology is disposed in the connection port 11z to be engaged with the embedded body 1z, where the surface adhesion technology (SMT) is used for filling. For the implementation, and after the bonding, the terminals p are respectively extended and exposed on the side of the embedded body 1z, and the terminals p are respectively in contact with the metal contacts 21z and electrically connected to the circuit substrate 2z. Finally, a package 3z is formed through the package as shown in FIGS. 1-7. Here, the Micro-USB connector a can be further connected for power source or data transmission to complete an in-line package structure.

The conventional multi-chip package technology is to package two or more types of memory chips in the same BGA package through horizontal placement and/or stacking (vertical) integration, and the first embodiment of the present invention is directed to multi-chip. For the innovative application structure of the packaging technology, please refer to FIG. 2-1 to FIG. 2-3, which includes: Continuation, the second embodiment of the present creation, a ball grid array (BGA) or lattice which can be a high number of balls The package body 3b of the gate array (LGA) is implemented. The package body 3b of the present embodiment is implemented by a package 3b of a BGA, and includes a plurality of embedded body 1b and a circuit substrate 2b, and the embedded body 1b is respectively The circuit board 2b has a plurality of connection ports 11b, and the circuit board 2b has a plurality of chips a or electronic components b, and the pins on the circuit board 2b are connected to the respective On one side, the embedded body 1b is respectively connected to the pins of the single sides and is disposed on the four sides of the circuit board 2b. The authored structure pre-sets the embedded body 1b in the process. After being sealed at a specific location, the connection ports 11b are exposed and open to the package. Four weeks edge 3b; splicing, the present writing further includes an interposer. 4 disposed on the side 3b of the package body, through The interposer 4, the package 3b may be further connected to an electronic carrier 5, wherein the interposer 4 is further a heat dissipating paste, a crucible substrate, a spacer or a film, and the electronic carrier 5 may be any circuit substrate or any A package body, and the interposer 4 and the electron carrier 5 of the embodiment are implemented as a heat dissipating paste and an LGA package as shown in FIG. 1-2; and in order to prevent electromagnetic interference (EMI) after stacking, The circuit board 2b of the package 3b or the electronic carrier 5 may have a sputtering treatment layer (not shown), or the stacked package or the electronic carrier further includes a metal material layer. Therefore, the present invention is an in-line package structure that is easy to assemble, fast, low in cost, and improved in heat dissipation. The package 3b is further applicable to include at least one electronic carrier 7 having a plug connector. The electronic carrier 7 can be another circuit substrate or wafer or electronic component or package or as a line connector for transmission, such as a peripheral IC, a controller, an LGA or BGA package, a cable, a signal line, a transmission line (not shown) The electronic carrier 7 is plugged into the connection ports 11b of the package 3b of the step 2 to form a system-in-package product in which the peripheral ICs are plugged into the package by the embedded package.

3 is a schematic view for explaining the third embodiment of the present invention, which is to use the electronic carrier 5 implemented in the LGA package in the first embodiment as another electronic carrier 5a encapsulated in LGA (ie, the electronic carrier). 5a includes at least one embedded body 1c and a circuit substrate 2c connected to each other, the embedded body having a plurality of connection ports 11c); further, the package 3b of the embodiment is stacked with the electronic carrier 5a And further comprising at least one connecting member 6 electrically connected to the connecting port 11c and the connecting port 11b, and the connecting member 6 can be a wire or a conductive adhesive or a redistribution layer (RDL) The plating line of the technology; as shown in Fig. 3, to illustrate the third embodiment of the creation, the system will be In one embodiment, the electronic carrier 5 implemented in the LGA package is in another LGA-encapsulated electronic carrier 5a (ie, the electronic carrier 5a includes at least one embedded body 1c and a circuit substrate 2c connected to each other, the embedded frame The body has a plurality of connection ports 11c) for implementation; further, after the package body 3b of the embodiment is stacked and coupled with the electronic carrier 5a, the package body 3b further includes at least one connector 6 electrically connected to the connection port. 11c and the connection port 11b, and the connecting member 6 can be a wire or a conductive adhesive or a plating line using a redistribution layer (RDL) technology; in addition, if the horizontally inserted electronic carriers of the electronic carrier 5a 7 is an electronic carrier 5, 5a having the above-mentioned connection ports 11b, 11c, respectively, and the electronic carriers 7 can be further inserted into other plug-in electronic carriers for horizontal expansion to achieve a better degree of expansion, and Each of the electronic carriers 7 can also be vertically stacked by the interposer 4, and since the structure of the present invention is a highly flexible hybrid application (ie, an expansion method of horizontal placement and vertical stacking), creation Good application of the deep structure and scalability.

Furthermore, as shown in FIG. 4, the structure of the fourth embodiment is a stack of three layers, which includes a plurality of packages 3d, 3e, and 3f (the package 3d is implemented by a BGA package, and the package 3e is implemented). 3f, 3e, 3f are respectively connected to the plurality of circuit boards 2d, 2e, 2f by a plurality of interposers 4, and each of the packages 3d, 3e, 3f has an in-line The socket bodies 1d, 1e, and 1f respectively have a plurality of connection ports 11d, 11e, and 11f, and the connection ports 11d, 11e, and 11f are open to the outside of the package body 3d. The in-line package structure further includes at least one electronic carrier 8 electrically connected to the connection port 11d of the package 3d, and the electronic carrier 8 is identical to the electronic carrier 7 to have a plug connector. a circuit substrate or a plug having a plug connector The package is implemented as a line for transmission.

As described above, when the present invention is implemented in the first embodiment, the authoring structure further includes a stack structure in which individual packages are connected by an interposer, and according to the stack structure, the individual packages are electrically connected by a connecting member. The corresponding connection port of the body to complete the embedded package structure applied to the system-in-package.

This creation can link the same type of products in the application of actual products, such as the stacking of flash memory products, or the high number of products that will reach thousands of feet or more complex or applied at high frequencies (such as The 3D package product, MCP, eMCP) product is used as a carrier (for example, a wireless communication module), and further connected to other peripheral IC packages (for example, a GPS positioning module and a multimedia module).

In summary, the application is implemented in a system-level package such as a 3D IC, which can be implemented by vertical stacking, horizontal plugging, stacking and plugging, or horizontally plugging, stacking and plugging, etc. Applicability not only solves the problem of knowing that all ICs are integrated on the same stack, but also improves the yield, saves time, facilitates assembly and facilitates testing.

The foregoing is only a preferred embodiment of the present invention, and its purpose is to enable the skilled person to understand the content of the present invention and implement it, and is not intended to limit the scope of the present invention; Equivalent variations or modifications of the shapes, configurations, and features described herein are intended to be included within the scope of the present application.

1b‧‧‧Inlay body

11b‧‧‧Connect port

2b‧‧‧ circuit board

3b‧‧‧Package

4‧‧‧Intermediary

5‧‧‧Electronic carrier

7‧‧‧Electronic carrier

Claims (11)

An in-line package structure includes: at least one package, the package includes at least one embedded body, the embedded body has at least one connection port, and the connection port is open outside the package. The in-line package structure of claim 1, wherein the package further comprises at least one circuit substrate connected to the inner body. The in-line package structure of claim 1 or 2, further comprising at least one interposer and at least one connecting member, the interposer being disposed on a surface of the package to connect an electronic carrier, the connecting member The individual package and the electronic carrier are electrically connected. The in-line package structure of claim 1 or 2, wherein the connection port is further connected with at least one electronic carrier having an electrical connection plug, the electronic carrier being another at least one circuit having a plug connector a substrate or a chip or an electronic component or package, the electronic carrier being electrically connected to the connection port of the package. The in-line package structure of claim 4, wherein the connection port is further connected with at least one electronic carrier having an electrical connection plug, the electronic carrier being another at least one circuit substrate having a plug connector or a chip or an electronic component or package, the electronic carrier being electrically connected to the connection port of the package. The in-line package structure of claim 3, wherein the interposer is a thermal grease or a ruthenium substrate or a gasket or a film. For example, the in-line package structure of claim 3, wherein the connector is a conductive adhesive or wire or a redistribution layer (RDL) Technical plating line. The in-line package structure of claim 1 or 2, wherein the embedded body is an Epoxy Molding Compound (EMC) or an injection molded male or female seat. The in-line package structure of claim 3, wherein the at least one electronic carrier or the package further comprises a sputtering treatment layer, or the package or the at least one electronic carrier further comprises a Metal layer. The in-line package structure of claim 2, wherein the circuit substrate is a selectively removable metal carrier or a patternable metal carrier. The in-line package structure of claim 10, wherein the package further comprises at least one terminal disposed in the connection port and engaged with the embedded body, the metal contact of the terminal and the circuit substrate Electrical connection.