CN208147271U - Semiconductor welding tooling - Google Patents
Semiconductor welding tooling Download PDFInfo
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- CN208147271U CN208147271U CN201820762464.XU CN201820762464U CN208147271U CN 208147271 U CN208147271 U CN 208147271U CN 201820762464 U CN201820762464 U CN 201820762464U CN 208147271 U CN208147271 U CN 208147271U
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- slide plate
- negative pressure
- air bag
- support plate
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Abstract
The utility model discloses the semiconductor welding toolings in field of semiconductor processing, including support plate, it is in a strip shape in support plate to be equipped with several mounting grooves, the arranged on left and right sides of support plate is equipped with multiple sliding rails, slide plate is slidably connected on each sliding rail, slide plate upper end is connected with cover board, is all provided with limited position mechanism on each sliding rail；Flexible coating is equipped on the inner bottom surface of each mounting groove, the bottom of each mounting groove is equipped with negative pressure hole, the negative pressure road being connected to negative pressure hole is equipped with inside sliding rail, negative pressure slidably connects sealing plate in road, leash is connected between sealing plate and slide plate, one end that leash is connect with slide plate is located at side of the slide plate far from mounting groove；Slide plate upper end is equipped with the card slot of multiple bar shapeds being parallel to each other, and slide plate is run through at the both ends on card slot length direction.The utility model efficiently solves the problems, such as to cause clamping unstable in carrier and pin using integral type pressing plate in the wire bonding process of existing semiconductor chip.
Description
Technical field
The utility model relates to field of semiconductor processing, and in particular to a kind of semiconductor welding tooling.
Background technique
In semiconductor chip (such as power device) encapsulation process, this process of semiconductor chip bonding wire is particularly important.It is logical
Often, automatic press welder is connected the solder joint on chip with pin lead corresponding on lead frame using ultrasound or heat ultrasound
Come, in order to guarantee firm welding, needs to be close to frame in orbit, so that solder joint is welded on lead securely in bonding wire
On pad.
But existing welding tooling generallys use integral type pressing plate, i.e. the pressing plate carrier and pin of pushing down chip simultaneously,
This method is simple, but the disadvantage is that pressing plate can interfere welding equipment to operate in welding process, and the epoxy resin of pressing plate and chip
Between carrier and pin be rigid contact, easily led to after long-time use pressing plate cannot compress simultaneously semiconductor chip carrier and
Pin reduces product quality so as to cause not prison welding.
Utility model content
The utility model is intended to provide semiconductor welding tooling, adopts in the wire bonding process to solve existing semiconductor chip
The problem of clamping shakiness is caused to carrier and pin with integral type pressing plate.
In order to achieve the above objectives, the basic technology scheme of the utility model is as follows：Semiconductor welding tooling, including support
Plate, in a strip shape in support plate to be equipped with several mounting grooves, the arranged on left and right sides of support plate is equipped with multiple sliding rails, on each sliding rail
Slide plate is slidably connected, slide plate upper end is connected with cover board, is all provided with limited position mechanism on each sliding rail；The inner bottom surface of each mounting groove
On be equipped with flexible coating, the bottom of each mounting groove is equipped with negative pressure hole, is equipped with the negative pressure being connected to negative pressure hole inside sliding rail
Road slidably connects sealing plate in negative pressure road, is connected with leash between sealing plate and slide plate, leash connect with slide plate one
End is located at side of the slide plate far from mounting groove；Slide plate upper end is equipped with the card slot of multiple bar shapeds being parallel to each other, card slot length direction
On both ends run through slide plate.
The principle of this programme is：When practical application, support plate is as semiconductor chip and the filling structure of substrate, mounting groove
As semiconductor chip and the position limiting structure of substrate, slide plate is directed to support plate as guide frame by sliding rail, and slide plate is as half
The filling structure and position limiting structure of conductor pins, cover board are also used as the position limiting structure of semiconductor pin, and position-limit mechanism is for limiting
The position of slide plate on the slide rail, flexible coating are vibrated caused by semiconductor chip for reducing welding equipment in welding process,
Negative pressure hole, negative pressure road, sealing plate, leash constitute the structure that negative-pressure adsorption is carried out to semiconductor chip in mounting groove, leash
As the connector of connection negative-pressure adsorption structure and slide plate, the movement by slide plate to mounting groove generates negative pressure in mounting groove,
Position limiting structure of the card slot as semiconductor pin.Using slide plate by semiconductor pin to the mistake of support plate semiconductor-on-insulator chip transportation
Journey generates negative pressure and semiconductor chip is carried out absorption fixation in mounting groove.
The advantages of this programme is：1, using the split type clamping knot that semiconductor chip carriers and pin are carried out with clamping respectively
Structure, but so that one of drive part is carried out negative pressure to another further through the principle of negative pressure and fix, carrier can be carried out simultaneously
With the clamping of pin, the problem of integral type pressing plate cannot compress carrier and pin simultaneously not will cause；2, using negative-pressure adsorption core
The carrier of piece, it is sufficiently stable to the fixation of chip and chip and carrier will not be damaged, be conducive to improve semiconductor quality；
3, using the movement and the fixed fixation for realizing chip carrier to pin, power input is taken full advantage of, it is more energy saving.
Preferred embodiment one is equipped with several as a kind of improvement of basic scheme on the inside bottom wall of mounting groove and card slot
Joint-cutting, the joint-cutting on card slot bottom wall are arranged along card slot cross-directional.It can be to ultrasonic wave by joint-cutting as being preferably placed such that
The vibration of semiconductor chip and pin carries out absorption weakening in welding process, and guarantees to support chip and stablizing for pin.
Preferred embodiment two, preferably one a kind of improvement are fixed with sealing film flexible in negative pressure hole.As excellent
Select such setting that can pull downward on sealing film formation sucker when generating negative pressure in negative pressure road more stable to chip progress
Absorption, and sealing film flexible will not cause to wear to chip.
Preferred embodiment three, preferably two a kind of improvement, position-limit mechanism include being arranged in sliding rail close to support plate
The slope of one end, slope are connected with trigger mechanism, the high-end close support plate setting on slope, the high-end distance to support plate in slope
More than or equal to the width of slide plate.It can be by it during slide plate is slided to support plate by slope as being preferably placed such that
It is upwardly directed close to one end of support plate, the pin on slide plate is enabled to fall in the welding position of chip from the top down, without
Be it is laterally inserted, avoid insertion the abrasion caused by chip；By oblique behind the welding position that pin reaches on chip
Slope can carry out limit to slide plate prevents it to be detached from support plate with pin under the action of negative pressure in negative pressure road.
Preferred embodiment four, preferably three a kind of improvement, slope include hinged guide plate on the slide rail, and guide plate is remote
It is hinged from one end of support plate and sliding rail；Trigger mechanism includes the groove being arranged in below guide plate on sliding rail, is equipped with and rings in groove
Air bag is answered, response air bag upper end is fixed with top plate, and top plate upper end is fixed with mandril, and the top of mandril and the bottom end of guide plate offset,
Be embedded with triggering air bag on slide plate on the outside of card slot, trigger and being communicated with tracheae between air bag and response air bag, cover board be equipped with
Trigger the corresponding crushing block of air bag.As the trigger mechanism being preferably placed such that by cover board on slide plate when the fixation of pin squeeze
Extruding of the briquetting to triggering air bag passes through top plate and mandril for guide plate after response air bag expansion so that gas enters response air bag
It jacks up upwards and forms slope, and the process that cover board is opened after the completion of welding can be proceeded as described above inversely, so that ramp down, just
It is resetted in slide plate.
Preferred embodiment five, preferably four a kind of improvement, negative pressure Dao Neimi of the sealing plate far from support plate side
Envelope is fixed with sprue, and the middle part of sprue is equipped with the joint-cutting passed through for leash, and the bottom of cover board is equipped with air bag, air bag and sprue it
Between be communicated with balance pipe, balance pipe is arranged through sprue.As the better tightness so that negative pressure road is preferably placed such that, in turn
So that sealing film has better suction, and can be by the gas in sealing plate moving process in pushing negative pressure road by balance pipe
The pin on slide plate is preferably limited and clamped into air bag.
Preferred embodiment six, preferably five a kind of improvement, cover board are to be hinged on slide plate far from support plate one end
Magnet plate, slide plate are martensitic stainless steel.Draw as being preferably placed such that cover board is fixed on slide plate by magnetic force
The limit of foot, limit effect are more stable.
Detailed description of the invention
Fig. 1 is the right side structure schematic diagram of the utility model embodiment；
Fig. 2 is the top view of the utility model embodiment middle slide plate.
Specific embodiment
It is further described below by specific embodiment：
Appended drawing reference in Figure of description includes：Support plate 1, sealing film 2, mounting groove 3, sliding rail 4, sealing plate 5, response
Air bag 6, mandril 8, tracheae 9, slide plate 10, triggering air bag 11, crushing block 12, cover board 13, air bag 14, leash 15, is put down at guide plate 7
Weigh pipe 16, sprue 17, negative pressure road 18, card slot 19.
Embodiment is substantially as shown in Fig. 1：Semiconductor welding tooling, including support plate 1, it is in a strip shape in support plate 1 to set
There are several mounting grooves 3, the arranged on left and right sides of support plate 1 slidably connects on each sliding rail 4 integrally formed with multiple sliding rails 4
Slide plate 10, multiple slide plates 10 link into an integrated entity and the synchronous slide on sliding rail 4, and 10 upper end of slide plate is connected with cover board 13, each cunning
Limited position mechanism is all provided on rail 4.Cover board 13 is to be hinged on magnet plate of the slide plate 10 far from 1 one end of support plate, and slide plate 10 is geneva
Body stainless steel plate.Flexible coating is equipped on the inner bottom surface of each mounting groove 3, the bottom of each mounting groove 3 is equipped with negative pressure hole,
Sealing film 2 flexible is fixed in negative pressure hole.It is equipped with the negative pressure road 18 being connected to negative pressure hole inside sliding rail 4, is slided in negative pressure road 18
It is dynamic to be connected with sealing plate 5, leash 15, one end that leash 15 is connect with slide plate 10 are connected between sealing plate 5 and slide plate 10
Side positioned at slide plate 10 far from mounting groove 3.As shown in connection with fig. 2,10 upper end of slide plate is equipped with the card of multiple bar shapeds being parallel to each other
Slide plate 10 is run through at slot 19, the both ends on 19 length direction of card slot.It is equipped on the inside bottom wall of mounting groove 3 and card slot 19 several
Joint-cutting, the joint-cutting on 19 bottom wall of card slot are arranged along 19 cross-directional of card slot.
Position-limit mechanism includes that sliding rail 4 is arranged in close to the slope of 1 one end of support plate, and slope includes being hinged on sliding rail 4
Guide plate 7, the one end of guide plate 7 far from support plate 1 and sliding rail 4 are hinged.Slope is connected with trigger mechanism, the high-end close support on slope
Plate 1 is arranged, and the high-end distance to support plate 1 in slope is equal to the width of slide plate 10.Trigger mechanism includes being arranged below guide plate 7 to slide
Groove on rail 4, groove is interior to be equipped with response air bag 6, and response 6 upper end of air bag is fixed with top plate, and top plate upper end is fixed with mandril 8,
The top of mandril 8 and the bottom end of guide plate 7 offset.As shown in connection with fig. 2, triggering air bag is embedded on the slide plate 10 in 19 outside of card slot
11, it triggers and is communicated with tracheae 9 between air bag 11 and response air bag 6, cover board 13 is equipped with crushing block corresponding with triggering air bag 11
12。
Sealing is fixed with sprue 17 in negative pressure road 18 of the sealing plate 5 far from 1 side of support plate, and the middle part of sprue 17, which is equipped with, to be supplied
The bottom of the joint-cutting that leash 15 passes through, cover board 13 is equipped with air bag 14, and balance pipe 16 is communicated between air bag 14 and sprue 17, puts down
The pipe 16 that weighs is arranged through sprue 17.
Specific implementation process is as follows：When carrying out the pin welding of semiconductor chip, semiconductor chip is fixed by silver paste
It is placed into after in epoxy resin carrier in mounting groove 3, opens the cover board 13 on slide plate 10, pin is put into card slot 19, is drawn
One end of foot towards support plate 1 reaches outside card slot 19.Then cover board 13 is adsorbed on slide plate 10 using magnetic force by rotating plate 13
Upper end, the crushing block 12 on cover board 13 squeeze triggering air bag 11, and the gas triggered in air bag 11 enters response air bag by tracheae 9
6, the response expansion of air bag 6 becomes larger jacks up top plate and mandril 8 upwards, and the jack-up of guide plate 7 is formed slope upwards by mandril 8.Then lead to
It crosses external force and pushes slide plate 10 to support plate 1 along sliding rail 4, cylinder, hydraulic cylinder, lead screw pair etc. can be used in external force.Slide plate 10 moves
During pull sealing plate 5 mobile to the direction far from support plate 1 in negative pressure road 18 by tensing leash 15 so that close
Sealing plate 5 in the negative pressure road 18 of 1 side of support plate gas pressure reduce so that sealing film 2 under the action of air pressure balance to
Lower recess is to carry out absorption fixation to the epoxy resin carrier in mounting groove 3.And the gas between sealing plate 5 and sprue 17
Body is entered in the air bag 14 on cover board 13 by balance pipe 16, so that air bag 14 of the magnetic suck on the cover board 13 of 10 upper end of slide plate
Pin is further pressed in card slot 19 by expansion.After slide plate 10 passes through slope, pin is pressed in the core in mounting groove 3 from the top down
Then on piece can be welded and pin is connected on chip.It is again turned on cover board 13 after the completion of welding, rotating plate 13 makes
It obtains cover board 13 no longer to cover on the pin being pressed on slide plate 10, air bag 14 is detached from the extruding to pin, and crushing block 12 is detached to triggering
The extruding of air bag 11, setting reset spring is allowed to reset in triggering air bag 11, and triggering air bag 11 resets so that response air bag 6 is multiple
Position, and then guide plate 7 resets, the ramp down on sliding rail 4 to disappearing, then by same external force by slide plate 10 to separate support plate
1 direction is mobile, the relaxation of leash 15 during slide plate 10 is mobile, the negative pressure road 18 between sealing film 2 and sealing plate 5
Interior negative pressure attracts sealing plate 5 to 1 direction of support plate, so that sealing plate 5 resets, while it is no longer right that sealing film 2 is restored
The epoxy resin carrier of semiconductor is adsorbed, and can remove soldered semiconductor from support plate 1.It seals in the process
The movement of plate 5 draws back the gas on cover board 13 in air bag 14 in the negative pressure road 18 between sealing plate 5 and sprue 17, is convenient for down
Clamped one time.
It is used in the present embodiment and is respectively provided with the structures such as slide plate 10, sliding rail 4 in the symmetrical two sides of support plate 1, but can also root
It is realized according to needing to be arranged in the other direction same structure and clamping is welded to the pin of different shape semiconductor.
Claims (7)
1. semiconductor welding tooling, it is characterised in that：It is in a strip shape in support plate to be equipped with several mounting grooves, branch including support plate
The arranged on left and right sides of fagging is equipped with multiple sliding rails, and slide plate is slidably connected on each sliding rail, and slide plate upper end is connected with cover board,
Limited position mechanism is all provided on each sliding rail；Flexible coating, the bottom of each mounting groove are equipped on the inner bottom surface of each mounting groove
It is equipped with negative pressure hole, the negative pressure road being connected to negative pressure hole is equipped with inside sliding rail, slidably connects sealing plate, sealing plate in negative pressure road
Leash is connected between slide plate, one end that leash is connect with slide plate is located at side of the slide plate far from mounting groove；On slide plate
End is equipped with the card slot of multiple bar shapeds being parallel to each other, and slide plate is run through at the both ends on card slot length direction.
2. semiconductor welding tooling according to claim 1, it is characterised in that：The inside bottom of the mounting groove and card slot
Several joint-cuttings are equipped on wall, the joint-cutting on card slot bottom wall is arranged along card slot cross-directional.
3. semiconductor welding tooling according to claim 2, it is characterised in that：It is fixed in the negative pressure hole flexible
Seal film.
4. semiconductor welding tooling according to claim 3, it is characterised in that：The position-limit mechanism includes being arranged in institute
Sliding rail is stated close to the slope of support plate one end, slope is connected with trigger mechanism, the high-end close support plate setting on slope, slope height
The distance of support plate is held to be greater than or equal to the width of slide plate.
5. semiconductor welding tooling according to claim 4, it is characterised in that：The slope include it is hinged on the slide rail
Guide plate, the one end of guide plate far from support plate and sliding rail are hinged；The trigger mechanism includes being arranged in below guide plate on sliding rail
Groove, groove is interior to be equipped with response air bag, and response air bag upper end is fixed with top plate, and top plate upper end is fixed with mandril, the top of mandril
It offsets with the bottom end of guide plate, triggering air bag is embedded on the slide plate on the outside of the card slot, trigger and connect between air bag and response air bag
It is connected with tracheae, the cover board is equipped with crushing block corresponding with triggering air bag.
6. semiconductor welding tooling according to claim 5, it is characterised in that：The sealing plate is far from support plate side
Negative pressure road in sealing be fixed with sprue, the middle part of sprue is equipped with the joint-cutting passed through for leash, and the bottom of the cover board is equipped with
Air bag, is communicated with balance pipe between air bag and sprue, balance pipe is arranged through sprue.
7. semiconductor welding tooling according to claim 6, it is characterised in that：The cover board is separate to be hinged on slide plate
The magnet plate of support plate one end, the slide plate are martensitic stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820762464.XU CN208147271U (en) | 2018-05-21 | 2018-05-21 | Semiconductor welding tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820762464.XU CN208147271U (en) | 2018-05-21 | 2018-05-21 | Semiconductor welding tooling |
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| Publication Number | Publication Date |
|---|---|
| CN208147271U true CN208147271U (en) | 2018-11-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820762464.XU Active CN208147271U (en) | 2018-05-21 | 2018-05-21 | Semiconductor welding tooling |
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| Country | Link |
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| CN (1) | CN208147271U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381102A (en) * | 2018-05-21 | 2018-08-10 | 重庆市嘉凌新科技有限公司 | Semiconductor welding tooling |
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2018
- 2018-05-21 CN CN201820762464.XU patent/CN208147271U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381102A (en) * | 2018-05-21 | 2018-08-10 | 重庆市嘉凌新科技有限公司 | Semiconductor welding tooling |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230327 Address after: 646606 Building 12, Yingtian Intelligent Terminal Industrial Park, No. 9, Liangang Road, Shangzhuang Village, Luohan Street, South Sichuan Lingang District, Sichuan Free Trade Zone, Luzhou, Sichuan Patentee after: Luzhou Loongson Micro Technology Co.,Ltd. Address before: 401326 no.66-75, sendi Avenue, Xipeng Town, Jiulongpo District, Chongqing Patentee before: CHONGQING JIALINGXIN TECHNOLOGY CO.,LTD. |
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| TR01 | Transfer of patent right |