CN113166492B - 封装组合物 - Google Patents
封装组合物 Download PDFInfo
- Publication number
- CN113166492B CN113166492B CN201980079999.4A CN201980079999A CN113166492B CN 113166492 B CN113166492 B CN 113166492B CN 201980079999 A CN201980079999 A CN 201980079999A CN 113166492 B CN113166492 B CN 113166492B
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- Prior art keywords
- layer
- encapsulating
- weight
- encapsulation
- resin
- Prior art date
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 119
- 239000000203 mixture Substances 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 140
- 239000003463 adsorbent Substances 0.000 claims description 76
- 229920005989 resin Polymers 0.000 claims description 74
- 239000011347 resin Substances 0.000 claims description 74
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 44
- 150000001875 compounds Chemical class 0.000 claims description 34
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 21
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims description 21
- 229920000642 polymer Polymers 0.000 claims description 20
- 238000004382 potting Methods 0.000 claims description 18
- 239000000178 monomer Substances 0.000 claims description 16
- 125000000524 functional group Chemical group 0.000 claims description 15
- 239000003999 initiator Substances 0.000 claims description 14
- 150000003254 radicals Chemical class 0.000 claims description 13
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229920005672 polyolefin resin Polymers 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 4
- 229920001519 homopolymer Polymers 0.000 claims description 3
- 238000003921 particle size analysis Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 93
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 45
- -1 olefin compound Chemical class 0.000 description 26
- 125000004432 carbon atom Chemical group C* 0.000 description 25
- 239000007787 solid Substances 0.000 description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 13
- 125000000217 alkyl group Chemical group 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 12
- 239000000806 elastomer Substances 0.000 description 12
- 239000011241 protective layer Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 8
- 235000021355 Stearic acid Nutrition 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 8
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 239000008117 stearic acid Substances 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 7
- 239000011256 inorganic filler Substances 0.000 description 7
- 229910003475 inorganic filler Inorganic materials 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 229920002367 Polyisobutene Polymers 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 229920006280 packaging film Polymers 0.000 description 5
- 239000012785 packaging film Substances 0.000 description 5
- 239000003760 tallow Substances 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 229920005549 butyl rubber Polymers 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 125000006165 cyclic alkyl group Chemical group 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 2
- CXMYWOCYTPKBPP-UHFFFAOYSA-N 3-(3-hydroxypropylamino)propan-1-ol Chemical compound OCCCNCCCO CXMYWOCYTPKBPP-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 2
- 229910001638 barium iodide Inorganic materials 0.000 description 2
- 229940075444 barium iodide Drugs 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 2
- 229910001622 calcium bromide Inorganic materials 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 2
- 229910001623 magnesium bromide Inorganic materials 0.000 description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 description 2
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 2
- 229910001641 magnesium iodide Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 125000005641 methacryl group Chemical group 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- AOLPZAHRYHXPLR-UHFFFAOYSA-I pentafluoroniobium Chemical compound F[Nb](F)(F)(F)F AOLPZAHRYHXPLR-UHFFFAOYSA-I 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001631 strontium chloride Inorganic materials 0.000 description 2
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 2
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 2
- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- XOGPDSATLSAZEK-UHFFFAOYSA-N 2-Aminoanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 XOGPDSATLSAZEK-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-M 4-aminobenzoate Chemical compound NC1=CC=C(C([O-])=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-M 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
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- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
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- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
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- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
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- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 239000002594 sorbent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/84—Passivation; Containers; Encapsulations
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- C—CHEMISTRY; METALLURGY
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/22—Oxides; Hydroxides of metals
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- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/04—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of alkali metals, alkaline earth metals or magnesium
- B01J20/041—Oxides or hydroxides
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- B01J20/22—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material
- B01J20/26—Synthetic macromolecular compounds
- B01J20/261—Synthetic macromolecular compounds obtained by reactions only involving carbon to carbon unsaturated bonds
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- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28002—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their physical properties
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- B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
- B01J20/28016—Particle form
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- B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
- B01J20/28033—Membrane, sheet, cloth, pad, lamellar or mat
- B01J20/28035—Membrane, sheet, cloth, pad, lamellar or mat with more than one layer, e.g. laminates, separated sheets
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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Abstract
本申请涉及封装组合物、包含其的封装膜、包含其的有机电子器件、以及使用其制造有机电子器件的方法，本申请提供了这样的封装组合物：其能够有效地阻挡从外部引入到有机电子器件中的水分或氧气并且实现具有极小的边框部分结构的有机电子器件。
Description
技术领域
相关申请的交叉引用
本申请要求基于于2018年12月7日提交的韩国专利申请第10-2018-0157182号的优先权的权益，其公开内容通过引用整体并入本文。技术领域
本申请涉及封装组合物、包含其的封装膜、包含其的有机电子器件、和使用其制造有机电子器件的方法。
背景技术
有机电子器件(organic electronic device，OED)意指包括利用空穴和电子产生电荷的交流电的有机材料的层的器件，并且其实例可以包括光伏器件、整流器、变送器(transmitter)和有机发光二极管(OLED)等。
有机电子器件中的有机发光二极管(OLED)具有比常规光源更低的功耗和更快的响应速度，并且有利于使显示装置或照明设备变薄。此外，OLED具有优异的空间利用率，使得其有望应用于各种领域，包括各种便携式装置、监视器、笔记本电脑和电视机。
在OLED的商业化和应用发展中，最重要的问题是耐久性问题。包含在OLED中的有机材料和金属电极等非常容易被外部因素例如水分氧化。因此，包括OLED的产品对环境因素高度敏感。因此，已经提出了各种方法来有效地阻挡来自外部的氧气或水分渗入有机电子器件例如OLED中。
此外，尽管随着多年的研究和开发已经大量生产了OLED，但显示器的发展方向旨在逐渐减少边框部分，并且为了像这样减少边框部分，处于防止从外部渗入水分的阻挡性能必须达到极限的情况。
发明内容
技术问题
本申请提供了封装组合物、包含其的封装膜、和包含其的有机电子器件，所述封装组合物可以有效地阻挡从外部引入到有机电子器件中的水分或氧气并且可以实现具有非常小的边框部分结构的有机电子器件。
技术方案
本申请涉及封装组合物。所述封装组合物可以应用于例如进行有机电子器件例如OLED的包封或封装。
在本说明书中，术语“有机电子器件”意指具有以下结构的制品或器件：该结构包括在彼此面对的电极对之间的利用空穴和电子产生电荷的交流电的有机材料层，并且其实例可以包括光伏器件、整流器、变送器和有机发光二极管(OLED)等，但不限于此。在本申请的一个实例中，有机电子器件可以为OLED。
示例性封装组合物可以为用于封装有机电子元件的组合物。封装组合物可以包含封装树脂、和经脂族烃化合物表面处理的水分吸附剂。封装树脂可以包含烯烃树脂。通过同时包含树脂和特定的水分吸附剂，本申请即使在苛刻的条件下也可以有效地阻挡水分。
在本申请的一个实施方案中，封装树脂可以为可交联树脂或可固化树脂。在一个实例中，树脂可以为可光固化树脂或热固性树脂。在一个实例中，封装树脂的玻璃化转变温度可以小于0℃、小于-10℃、或小于-30℃、小于-50℃、或小于-60℃。下限没有特别限制，但可以为-100℃或更高。在此，玻璃化转变温度可以为单独的封装树脂的组合物在固化或交联之后的玻璃化转变温度。
本申请可以包含烯烃树脂作为封装树脂。烯烃树脂可以包含烯烃化合物的均聚物或共聚物。在一个实例中，封装树脂可以为衍生自丁烯的聚合物。在本申请中，术语“衍生自丁烯的聚合物”可以意指聚合物中的一个或更多个聚合单元由丁烯形成。由于衍生自丁烯的聚合物具有非常低的极性、是透明的、并且几乎不受腐蚀的影响，因此其在用作封装材料或密封材料时可以实现优异的水分阻挡特性和耐久可靠性。
在本申请中，衍生自丁烯的聚合物也可以为丁烯单体的均聚物；通过使丁烯单体与另外的可聚合单体共聚而获得的共聚物；使用丁烯单体的反应性低聚物；或其混合物。在本申请中，衍生的聚合物可以意指单体以聚合单元的形式形成聚合物。丁烯单体可以包括例如1-丁烯、2-丁烯或异丁烯。
可与丁烯单体或衍生物聚合的另外的单体可以包括例如异戊二烯、苯乙烯或丁二烯。通过使用共聚物，可以保持诸如可加工性和交联度的物理特性，并因此封装组合物在施加至有机电子器件时可以确保其自身的耐热性。
此外，使用丁烯单体的反应性低聚物可以包括具有反应性官能团的丁烯聚合物。低聚物的重均分子量可以为500g/mol至5000g/mol。此外，丁烯聚合物可以与具有反应性官能团的另外的聚合物连接。另外的聚合物可以为但不限于(甲基)丙烯酸烷基酯。反应性官能团可以为羟基、羧基、异氰酸酯基或含氮基团。此外，反应性低聚物与另外的聚合物可以通过多官能交联剂进行交联，并且多官能交联剂可以为选自异氰酸酯交联剂、环氧交联剂、氮丙啶交联剂和金属螯合物交联剂中的至少一者。
在一个实例中，本申请的衍生自丁烯的聚合物可以为二烯化合物与包含一个碳-碳双键的烯烃化合物的共聚物。这样的共聚物可以在封装树脂骨架中包含不饱和基团例如双键。在此，烯烃化合物可以包括丁烯等，以及二烯可以为可与烯烃化合物聚合的单体，二烯可以包括例如异戊二烯或丁二烯等。例如，包含一个碳-碳双键的烯烃化合物与二烯的共聚物可以为丁基橡胶。
在本申请中，聚合物的重均分子量(MW)可以为使得压敏粘合剂组合物可以被模制成膜形状的程度。例如，聚合物的重均分子量可以为约10,000g/mol至2,000,000g/mol、100,000g/mol至1,500,000g/mol、150,000g/mol至1,300,000g/mol、330,000g/mol至1,000,000g/mol或350,000g/mol至900,000g/mol左右。在本申请中，术语重均分子量意指通过GPC(凝胶渗透色谱)测量的相对于标准聚乙烯的换算值。然而，树脂组分不一定必须具有上述重均分子量。例如，即使当树脂组分的分子量没有成为足以形成膜的水平时，也可以在组合物中混入单独的粘结剂树脂。在本说明书中，术语聚合物和树脂组分可以互换地使用。
本申请的封装组合物可以包含水分吸附剂。在本说明书中，术语“水分吸附剂”可以意指例如能够通过与其的化学反应而除去渗入到封装膜中的水分或湿气的化学反应性吸附剂。
如上所述，水分吸附剂的表面可以经脂族烃化合物表面处理，其中脂族烃化合物可以包含至少一个极性官能团。极性官能团可以包括例如羟基、羧基、胺基、丙烯酰基、甲基丙烯酰基、醛基、环氧基、酸酐基、酰胺基、磷酸酯基团、或其组合。通过使用水分吸附剂，本申请可以特别地提高与上述封装树脂的相容性，从而实现优异的水分阻挡性能。
在本申请的一个实施方案中，水分吸附剂的表面可以被脂族烃化合物包围。脂族烃化合物可以为例如在其分子结构中包含极性官能团的化合物，并且其结构没有特别限制，只要其具有极性官能团即可。在一个实例中，极性官能团可以位于脂族烃化合物的末端。在一个实例中，脂族烃化合物可以为碳数在5至50或10至40的范围内的化合物，其中所述化合物可以具有线性、支化或环状结构。碳数的下限可以为例如8、10、13、15、16、或17或更大，上限可以为例如45、40、35、30、28、25、23、20、19、或18或更小。脂族烃化合物包围水分吸附剂的表面的结构可以是极性官能团存在于表面上以与水分吸附剂接触并且通过极性官能团连接非极性主链的结构。该结构可以提高水分吸附剂与封装树脂的相容性，可以实现优异的水分阻挡性能，并且与现有技术相比可以分散大量的水分吸附剂。脂族烃化合物可以使用一种表面活性剂，并且其没有特别限制，只要其具有所述结构即可，其可以包括例如硬脂酸、棕榈酸、油酸、油胺、十八烷基胺、花生酸、亚油酸、磷酸二正丁酯、月桂醇聚醚-4-羧酸、月桂醇聚醚-6-羧酸或月桂醇聚醚-11-羧酸。
在一个实例中，水分吸附剂可以被粉碎成颗粒的形式，从而以均匀分散的状态存在于封装组合物中。在此，均匀分散的状态可以意指其中水分吸附剂即使在封装组合物的任何部分中也以相同的密度或基本上相同的密度存在的状态。在此，可用的水分吸附剂可以包括例如金属氧化物、硫酸盐或有机金属氧化物等。具体地，硫酸盐的实例可以包括硫酸镁、硫酸钠或硫酸镍等，有机金属氧化物的实例可以包括辛酸氧化铝等。在此，金属氧化物的具体实例可以包括：五氧化二磷(P2O5)、氧化锂(Li2O)、氧化钠(Na2O)、氧化钡(BaO)、氧化钙(CaO)或氧化镁(MgO)等；金属盐的实例可以包括硫酸盐，例如硫酸锂(Li2SO4)、硫酸钠(Na2SO4)、硫酸钙(CaSO4)、硫酸镁(MgSO4)、硫酸钴(CoSO4)、硫酸镓(Ga2(SO4)3)、硫酸钛(Ti(SO4)2)或硫酸镍(NiSO4)；金属卤化物例如氯化钙(CaCl2)、氯化镁(MgCl2)、氯化锶(SrCl2)、氯化钇(YCl3)、氯化铜(CuCl2)、氟化铯(CsF)、氟化钽(TaF5)、氟化铌(NbF5)、溴化锂(LiBr)、溴化钙(CaBr2)、溴化铯(CeBr3)、溴化硒(SeBr4)、溴化钒(VBr3)、溴化镁(MgBr2)、碘化钡(BaI2)或碘化镁(MgI2)；或金属氯酸盐如高氯酸钡(Ba(ClO4)2)或高氯酸镁(Mg(ClO4)2)等，但不限于此。作为可以包含在封装组合物中的水分吸附剂，还可以使用上述结构中的一者，或者还可以使用两者或更多者。在一个实例中，当使用两者或更多者作为水分吸附剂时，可以使用煅烧白云石等。
可以根据应用将这样的水分吸附剂控制为合适的尺寸。水分吸附剂的根据D90的颗粒尺寸分析的颗粒直径为8μm或更小。在一个实例中，可以将水分吸附剂的平均颗粒直径控制为8μm或更小、7μm或更小、或者6μm或更小左右。下限没有特别限制，但可以为0.1μm、0.5μm或1μm。颗粒直径可以通过根据D90的颗粒尺寸分析来测量。具有以上范围内的尺寸的水分吸附剂由于与水分的反应速率不太快而易于储存，并且可以有效地除去水分而不损坏被封装的元件。此外，如上所述，与常规水分吸附剂相比，具有比常规水分吸附剂更小的颗粒尺寸的水分吸附剂可以以更大的量分散在封装组合物中。
水分吸附剂的含量没有特别限制，其可以考虑期望的阻挡特性来适当地选择。在一个实例中，相对于100重量份的封装树脂，水分吸附剂可以以150重量份至15000重量份、180重量份至1400重量份、220重量份至1300重量份、250重量份至1200重量份、280重量份至1100重量份、或300重量份至1000重量份的量包含在内。在一个实例中，相对于100重量份的所述封装树脂，水分吸附剂以150重量份至1500重量份的范围包含在内。与现有技术相比，本申请可以包含大量的水分吸附剂，从而实现优异的水分阻挡性能。常规地，当如上所述包含大量的水分吸附剂时，在形成膜时发生团聚或沉积或者发生层间裂纹，但本申请可以通过使用特定的水分吸附剂来解决该问题。
在一个实例中，封装组合物还可以包含增粘剂，其中该增粘剂的软化点可以为145℃或更低、或者130℃或更低。增粘剂的软化点可以例如在20℃至130℃或50℃至125℃的范围内。在一个实例中，增粘剂的重均分子量可以在约300g/mol至5,000g/mol或500g/mol至3500g/mol的范围内。此外，增粘剂可以是由在分子结构中具有在3至15、或5至10的范围内的碳数的单体聚合的聚合物。此外，增粘剂可以在分子结构中具有环结构，其中该环结构可以为单环结构，但不限于此，并且其可以具有双环结构或三环结构。通过使用特定的增粘剂，本申请可以具有优异的与如上所述的封装树脂的相容性，从而实现本申请中预期的物理特性。另一方面，在本说明书中，除非另有说明，否则软化点可以根据ASTM E28标准来测量。
在一个实例中，增粘剂可以包括例如戊间二烯化合物、苯乙烯化合物、α-甲基苯乙烯化合物、异戊二烯化合物、环戊二烯化合物或二环戊二烯化合物。增粘剂的含量可以根据需要适当地进行调节。相对于100重量份的封装树脂，增粘剂可以以140重量份至450重量份、149重量份至410重量份或150重量份至405重量份的范围包含在内。本申请的增粘剂具有优异的与如上所述的特定的封装树脂和水分吸附剂的相容性，并因此，可以将增粘剂的含量范围调节为高于常规增粘剂的含量范围，从而有效地实现膜的粘接性能和水分阻挡特性。
在本申请的一个实施方案中，本申请的封装组合物可以包含可活性能量射线聚合的化合物，其可以通过照射活性能量射线与上述封装树脂一起聚合。可活性能量射线聚合的化合物可以意指这样的化合物：其包含一个或更多个、或者两个或更多个例如能够通过照射活性能量射线而参与聚合反应的官能团，例如包含烯键式不饱和双键的官能团(例如丙烯酰基或甲基丙烯酰基)和诸如环氧基或氧杂环丁烷基的官能团。在本申请中，封装树脂可以在固化或交联之前具有不饱和基团，其中当使多官能的可活性能量射线聚合的化合物交联时，不饱和基团使得所述化合物可以一起参与交联。在一个实例中，本申请的封装组合物可以通过包含具有高的与封装树脂的相容性并且能够与封装树脂一起形成特定的交联结构的可活性能量射线聚合的化合物来固化或交联。
可活性能量射线聚合的化合物可以为多官能的可活性能量射线聚合的化合物，其可以为例如多官能丙烯酸脂(MFA)。
可以通过活性能量射线的照射而聚合的多官能的可活性能量射线聚合的化合物可以满足以下式1。此外，相对于100重量份的封装树脂，可活性能量射线聚合的化合物可以以2重量份至35重量份、3重量份至30重量份、5重量份至25重量份、8重量份至20重量份、10重量份至18重量份或12重量份至18重量份的量包含在内。
[式1]
在式1中，R1为氢或具有1至4个碳原子的烷基，n为2至10或2至6的数，以及X表示衍生自具有3至30个碳原子的线性、支化或环状烷基的残基。在此，当X为衍生自环状烷基的残基时，X可以为例如衍生自具有3至30个碳原子、6至28个碳原子、8至22个碳原子或12至20个碳原子的环状烷基的残基。此外，当X为衍生自线性烷基的残基时，X可以为衍生自具有3至30个碳原子、6至25个碳原子或8至20个碳原子的线性烷基的残基。此外，当X为衍生自支化烷基的残基时，X可以为衍生自具有3至30个碳原子、5至25个碳原子或6至20个碳原子的支化烷基的残基。
在本说明书中，术语“衍生自烷基的残基”可以意指作为特定化合物的残基的由烷基构成的残基。在一个实例中，在上式1中，当n为2时，X可以为亚烷基。此外，当n为3或更大时，X可以通过释放烷基中的两个或更多个氢而键合至式1的(甲基)丙烯酰基。
在本说明书中，除非另有说明，否则术语“烷基”可以意指具有1至30个碳原子、1至25个碳原子、1至20个碳原子、1至16个碳原子、1至12个碳原子、1至8个碳原子或1至4个碳原子的烷基。烷基可以具有线性、支化或环状结构，其可以任选地经一个或更多个取代基取代。
在本说明书中，除非另有说明，否则术语“亚烷基”可以意指具有2至30个碳原子、2至25个碳原子、2至20个碳原子、2至16个碳原子、2至12个碳原子、2至10个碳原子或2至8个碳原子的亚烷基。亚烷基可以具有线性、支化或环状结构，其可以任选地经一个或更多个取代基取代。
可以没有限制地使用可以通过照射活性能量射线而聚合的可活性能量射线聚合的化合物，只要其满足上式1即可。例如，所述化合物可以包括1,4-丁二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,8-辛二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、二环戊基二(甲基)丙烯酸酯、环己烷-1,4-二甲醇二(甲基)丙烯酸酯、三环癸烷二甲醇(甲基)二丙烯酸酯、二羟甲基二环戊烷二(甲基)丙烯酸酯、新戊二醇改性的三羟甲基丙烷二(甲基)丙烯酸酯、金刚烷二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯、或其混合物。
作为可活性能量射线聚合的化合物，可以使用包含2个或更多个官能团、其中重均分子量可以为小于1,000g/mol、800g/mol或更小、或者450g/mol或更小并且下限为例如100g/mol或更大的化合物。可活性能量射线聚合的化合物中包含的环结构可以为碳环结构或杂环结构；或者单环结构或多环结构。
在本申请的一个实施方案中，封装组合物还可以包含自由基引发剂以能够诱导如上所述的可活性能量射线聚合的化合物的聚合反应。自由基引发剂可以为光引发剂或热引发剂。光引发剂的具体类型可以考虑固化速率和黄化的可能性等而适当地选择。例如，可以使用基于苯偶姻、基于羟基酮、基于氨基酮或基于氧化膦的光引发剂等，并且具体地，可以使用苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻异丙基醚、苯偶姻正丁基醚、苯偶姻异丁基醚、苯乙酮、二甲基氨基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基-2-苯基苯乙酮、2-羟基-2-甲基-1-苯基丙烷-1-酮、1-羟基环己基苯基酮、2-甲基-1-[4-(甲硫基)苯基]-2-吗啉代-丙烷-1-酮、4-(2-羟基乙氧基)苯基-2-(羟基-2-丙基)酮、二苯甲酮、对苯基二苯甲酮、4,4’-二乙基氨基二苯甲酮、二氯二苯甲酮、2-甲基蒽醌、2-乙基蒽醌、2-叔丁基蒽醌、2-氨基蒽醌、2-甲基噻吨酮、2-乙基噻吨酮、2-氯噻吨酮、2,4-二甲基噻吨酮、2,4-二乙基噻吨酮、苄基二甲基缩酮、苯乙酮二甲基缩酮、对二甲基氨基苯甲酸酯、低聚[2-羟基-2-甲基-1-[4-(1-甲基乙烯基)苯基]丙酮]和2,4,6-三甲基苯甲酰基-二苯基-氧化膦等。
相对于100重量份的可活性能量射线聚合的化合物，自由基引发剂还可以以0.2重量份至20重量份的比率包含在内。由此，可以有效地诱导可活性能量射线聚合的化合物的反应，并且还可以防止由于固化之后的残余组分而引起的经固化或交联的封装组合物的物理特性的劣化。
在一个实例中，如有需要，封装组合物还可以包含无机填料。在本说明书中，术语“无机填料”可以意指与水分没有反应性或具有比上述水分吸附剂的反应性更低的反应性，但是可以阻挡或阻碍水分或湿气在膜内运动的材料。作为无机填料，例如，可以使用以下中的一者或两者或更多者：粘土、滑石、二氧化硅、针状二氧化硅、板状二氧化硅、多孔二氧化硅、沸石、二氧化钛或氧化锆。此外，无机填料可以经有机改性剂等进行表面处理以促进有机物质的渗透。作为这样的有机改性剂，例如，可以使用有机改性剂等，其为二甲基苄基氢化牛油季铵、二甲基二氢化牛油季铵、甲基牛油双-2-羟基乙基季铵、二甲基氢化牛油2-乙基己基季铵、二甲基脱氢牛油季铵或其混合物。
无机填料的含量没有特别限制，可以考虑期望的阻挡特性而适当地选择。在一个实例中，相对于100重量份的封装树脂，无机填料可以以5重量份至100重量份的量包含在内。
此外，封装组合物除了上述的构成之外，还可以根据用途和以下将描述的制造方法而包含各种添加剂。
在本申请的一个实施方案中，在室温下，封装组合物可以为处于固化或未固化状态的固体或半固体。在本说明书中，术语室温可以为约15℃至35℃、20℃至30℃或约25℃的温度。
本申请还涉及封装膜。封装膜可以包括含有上述封装组合物的封装层。封装层可以为单层或者两个或更多个层的多层结构。在封装层中，封装树脂可以以总树脂组分重量的5重量％或更大、10重量％至85重量％、12重量％至83重量％、15重量％至80重量％、17重量％至78重量％或20重量％至73重量％的量包含在内。在本说明书，树脂组分可以包含封装树脂或上述增粘剂(增粘树脂)。此外，封装层中可以包含组分例如如上所述的可活性能量射线聚合的化合物、增粘剂、自由基引发剂、水分吸附剂或无机填料，但不限于此。此外，封装层可以为包含所述组分的压敏粘合剂或粘合剂，并且上述封装组合物可以为压敏粘合剂组合物或粘合剂组合物。
封装层可以为单层或者两个或更多个层的多层结构。当封装层为多层结构时，可以在两个或更多个封装层中的至少一者中包含封装树脂。
另一方面，考虑到封装膜应用于有机电子元件的封装，可以控制水分吸附剂的含量以防止元件的物理和化学损坏。例如，当封装膜封装有机电子元件时，可以在面向元件的封装层中形成少量的水分吸附剂，或者可以不包含水分吸附剂。在一个实例中，当将面向元件的封装层定义为第二层时，第二层可以包含相对于包含在封装膜中的水分吸附剂的总质量的0％至20％的水分吸附剂。此外，当封装膜封装有机电子元件并且将形成在第二层的一侧(与有机电子元件方向相反的一侧)上的封装层定义为第一层时，第一层可以包含相对于包含在封装膜中的水分吸附剂的总质量的80％至100％的水分吸附剂。此外，在这样的结构中，本申请的第一层的厚度与第二层的厚度的比率可以在1.2至8或1.5至5的范围内。在该结构中，本申请可以在使水分阻挡性能最大化的同时实现有机电子元件的稳定性。
待进一步层合的第二层和第一层的层合顺序没有特别限制。此外，封装膜可以由三个或更多个层构成，并且例如，第一层可以以两个或更多个层包括在内，或者第二层可以以两个或更多个层包括在内。
在本申请的一个实施方案中，封装膜还可以包括金属层。在本申请的一个实施方案中，封装膜还可以包括形成在封装层上的金属层。金属层可以为单层或者两个或更多个的多层结构。金属层中的至少一者的热导率可以为例如50W/mK至800W/mK。此外，金属层中的至少一者的线性膨胀系数可以为20ppm/℃或更小。
在本申请的一个实施方案中，金属层的热导率可以为50W/mK或更大、80W/mK或更大、90W/mK或更大、100W/mK或更大、110W/mK或更大、120W/mK或更大、130W/mK或更大、140W/mK或更大、150W/mK或更大、200W/mK或更大、或者210W/mK或更大。热导率的上限没有特别限制，其可以为800W/mK或更小或者700W/mK或更小。由于至少一个金属层具有如上的高热导率，因此可以更快地释放在金属层粘接过程期间在粘接界面处产生的热。热导率可以在0℃至30℃的温度范围内的任一温度下测量。
在本说明书中，术语“热导率”是表示材料能够通过传导而传递热的能力的程度，其中单位可以由W/mK表示。单位表示材料在相同温度和距离下传递热的程度，其意指热的单位(瓦特)比距离的单位(米)和温度的单位(开尔文)。在本说明书中，热导率可以意指根据ASTM E1461测量的热导率。热导率可以利用根据ASTM E1461测量的热扩散率和已知的比热值来计算。
在一个实施方案中，金属层中的至少一者的线性膨胀系数可以在20ppm/℃或更小、18ppm/℃或更小、15ppm/℃或更小、13ppm/℃或更小、9ppm/℃或更小、5ppm/℃或更小、或者3ppm/℃或更小的范围内。线性膨胀系数的下限没有特别限制，但可以为0ppm/℃或更大、或者0.1ppm/℃或更大。通过调节金属层的线性膨胀系数，本申请可以在在高温下驱动的面板中实现膜的尺寸稳定性和耐久可靠性。线性膨胀系数可以通过根据ASTM E831的标准来测量。
在本申请的一个实施方案中，封装膜的金属层的厚度可以在3μm至500μm、10μm至450μm、20μm至400μm、30μm至350μm或40μm至200μm的范围内。通过控制金属层的厚度，本申请可以在实现足够的散热效果的同时提供薄膜的封装膜。金属层可以为薄金属箔或沉积有金属的聚合物基础层。金属层没有特别限制，只要其满足上述热导率或线性膨胀系数并且是包含金属的材料即可。金属层可以包含以下中的任一者：金属、金属氧化物、金属氮化物、金属碳化物、金属氮氧化物、金属硼氧化物及其组合。例如，金属层可以包含其中将一种或更多种金属元素或非金属元素添加到一种金属中的合金，并且可以包括例如Invar或不锈钢(SUS)。此外，在一个实例中，金属层可以包含铁、铬、铜、铝镍、铁氧化物、铬氧化物、硅氧化物、铝氧化物、钛氧化物、铟氧化物、锡氧化物、铟锡氧化物、钽氧化物、锆氧化物、铌氧化物及其组合。金属层可以通过电解、或辊压(rolling)、热蒸镀、电子束蒸镀、溅射、反应溅射、化学气相沉积、等离子体化学气相沉积或电子回旋共振源等离子体化学气相沉积方法来沉积。在本申请的一个实例中，金属层可以通过反应溅射来沉积。
在一个实例中，本申请的封装膜还可以包括形成在金属层上的保护层。保护层可以包含树脂组分。构成保护层的材料没有特别限制。在一个实例中，保护层可以为能够阻挡水分渗透的防水层。在一个实例中，构成保护层的树脂组分可以包含选自以下中的一者或更多者：聚有机硅氧烷、聚酰亚胺、基于苯乙烯的树脂或弹性体、基于聚烯烃的树脂或弹性体、基于聚氧化烯的树脂或弹性体、基于聚酯的树脂或弹性体、基于聚氯乙烯的树脂或弹性体、基于聚碳酸酯的树脂或弹性体、基于聚苯硫醚的树脂或弹性体、基于聚酰胺的树脂或弹性体、基于丙烯酸酯的树脂或弹性体、基于环氧的树脂或弹性体、基于有机硅的树脂或弹性体、和基于氟的树脂或弹性体，但不限于此。
在本申请的一个实施方案中，在保护层与金属层之间还可以包括压敏粘合剂或粘合剂。压敏粘合剂或粘合剂的材料没有特别限制，并且可以使用已知的材料。在一个实例中，压敏粘合剂或粘合剂可以为丙烯酸类、基于环氧的、基于氨基甲酸酯的、基于有机硅的或基于橡胶的压敏粘合剂或粘合剂。此外，在一个实施方案中，压敏粘合剂或粘合剂的材料可以与如上所述的封装层的材料相同或不同。
在一个实例中，封装膜还可以包括基础膜或离型膜(在下文中，任选地称为“第一膜”)，并且可以具有封装层形成在基础膜或离型膜上的结构。该结构还可以包括形成在封装层或金属层上的基础膜或离型膜(在下文中，任选地称为“第二膜”)。图1是示出示例性封装膜10的截面图，该封装膜10包括形成在基础膜或离型膜1上的封装层11。此外，图2是示出示例性封装膜10的截面图，该封装膜10包括形成在封装层11上的上述金属层12和形成在金属层上的上述保护层13。
在本申请中，可用的第一膜的具体种类没有特别限制。在本申请中，例如，可以使用该领域的一般聚合物膜作为第一膜。在本申请中，例如，作为基础膜或离型膜，可以使用聚对苯二甲酸乙二醇酯膜、聚四氟乙烯膜、聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、氯乙烯共聚物膜、聚氨酯膜、乙烯-乙酸乙烯酯膜、乙烯-丙烯共聚物膜、乙烯-丙烯酸乙酯共聚物膜、乙烯-丙烯酸甲酯共聚物膜或聚酰亚胺膜等。此外，在本申请的基础膜或离型膜的一侧或两侧上还可以进行适当的离型处理。作为用于基础膜的离型处理的离型剂的实例，可以使用醇酸树脂系列、有机硅系列、氟系列、不饱和酯系列、聚烯烃系列或蜡系列等，其中，就耐热性而言，优选使用基于醇酸树脂的、基于有机硅的或基于氟的离型剂，但不限于此。
在本申请中，这样的基础膜或离型膜(第一膜)的厚度没有特别限制，其可以根据待应用的应用来适当地选择。例如，在本申请中，第一膜的厚度可以为10μm至500μm，优选为20μm至200μm左右。如果厚度小于10μm，则在制造过程期间可能容易发生基础膜的变形，而如果厚度超过500μm，则经济效率低。
本申请的封装膜中包括的封装层的厚度没有特别限制，其可以考虑膜所应用的用途根据以下条件来适当地选择。封装层的厚度可以为5μm至200μm、10μm至100μm、或15μm至60μm左右。当封装层为多层时，厚度可以意指多层的厚度。如果封装层的厚度小于5μm，则可能无法表现出足够的水分阻挡能力，而如果厚度超过200μm，则难以确保可加工性，由于水分反应性而引起的厚度膨胀大，使得可能损坏有机发光元件的沉积膜，并且经济效率低。
本申请还涉及有机电子器件。如图3所示，有机电子器件可以包括：基底21；形成在基底21上的有机电子元件22；和封装有机电子元件22的整个表面的上述封装膜10。封装膜可以封装形成在基底上的有机电子元件的整个表面，例如上部和侧面二者。封装膜10可以包括含有处于交联或固化状态的封装组合物的封装层11。此外，有机电子器件可以形成为使得封装层接触有机电子元件的顶部。
在此，有机电子元件可以为例如有机发光元件。
封装层可以形成为有机电子器件中的结构粘合剂，所述结构粘合剂用于在表现出优异的水分阻挡特性的同时有效地固定和支撑基底和金属层。图3是示例性有机电子器件的截面图，其中包括封装层11、金属层12和保护层13的封装膜10一体地封装有机电子元件22的整个表面。
此外，不管有机电子器件的形状(例如顶部发射或底部发射)如何，封装层都可以形成为稳定的封装层。
此外，本申请的有机电子元件可以包括保护层(钝化膜)。保护层可以防止对元件的电极的损坏，所述保护膜可以由本技术领域中的常规材料形成，并且例如，可以包含作为无机材料的SiNx或Al2O3等。保护层可以为其中交替沉积有有机层和无机层的钝化层。
本申请还提供了用于制造有机电子器件的方法。所述制造方法可以包括将上述封装膜施加至其上形成有有机电子元件的基底以覆盖有机电子元件的步骤。此外，所述制造方法还可以包括使封装膜固化或交联的步骤。封装膜的固化或交联步骤可以意指封装层的固化或交联，并且固化可以在封装膜覆盖有机电子元件之前或之后进行。
在本说明书中，术语“固化”可以意指本发明的封装层通过加热或UV照射过程等形成交联结构以制造成压敏粘合剂的形式。或者，其可以意指使粘合剂组合物固体化并作为粘合剂附接。
在一个实例中，在所述制造方法中，有机电子元件可以通过以下形成：通过诸如真空蒸镀或溅射的方法在用作基底的玻璃或聚合物膜上形成透明电极，在透明电极上形成由例如空穴传输层、发光层和电子传输层等构成的发光有机材料层，然后在发光有机材料层上进一步形成电极层。随后，可以放置封装膜的封装层以覆盖经受以上过程的基底的有机电子元件的整个表面。
有益效果
本申请提供了封装组合物、包含其的封装膜、和包含其的有机电子器件，所述封装组合物可以有效地阻挡从外部引入到有机电子器件中的水分或氧气并且可以实现具有非常小的边框部分结构的有机电子器件。
附图说明
图1和图2是示出根据本申请的一个实例的封装膜的截面图。
图3是示出根据本申请的一个实例的有机电子器件的截面图。
[附图标记说明]
10：封装膜
1：离型膜或基础膜
11：封装层
12：金属层
13：保护层
21：基底
22：有机电子元件
具体实施方式
在下文中，将通过根据本发明的实施例和不根据本发明的比较例更详细地描述本发明，但是本发明的范围不受以下实施例限制。
实施例1
(1)封装层第一层溶液的制备
作为水分吸附剂，将表面上经硬脂酸表面处理的CaO(Aldrich)与作为溶剂的甲苯混合以制备浓度为50重量％的固体含量的水分吸附剂溶液。
除了以上之外，在室温下向反应器中引入100重量份的作为封装树脂的聚异丁烯树脂(来自BASF的B50，重均分子量为340,000g/mol)和340重量份的作为增粘剂的来自HIKOREZ的H2100(软化点102℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为40重量％左右。将预先制备的水分吸附剂溶液混合使得相对于100重量份的封装树脂，水分吸附剂的量为570重量份，并均质化。
(2)封装层第二层溶液的制备
在室温下，向反应器中引入100重量份的作为封装树脂的聚异丁烯树脂(来自BASF的B50，重均分子量为340,000g/mol)和150重量份的作为增粘剂的来自HIKOREZ的H2100(软化点102℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为40重量％左右。
(3)封装膜的生产
将以上制备的第一层溶液施加到离型PET的离型表面上，并在110℃下干燥10分钟以形成厚度为40μm的层。
将以上制备的第二层溶液施加到离型PET的离型表面上，并在130℃下干燥3分钟以形成厚度为10μm的层。
将两个层层合以制造具有两层封装层的封装膜。
(4)一体化有金属层的封装膜的生产
将经离型处理的PET从以上生产的两层封装层的第一层表面上剥离，并层合封装层使得预先准备的金属层(铝)接触第一层。
对层合的金属一体化封装膜进行刀切割以生产期望形状的封装膜。
实施例2
以与实施例1中相同的方法生产封装膜，不同之处在于如下制备第一层溶液。
(1)封装层第一层溶液的制备
作为水分吸附剂，将表面上经硬脂酸表面处理的CaO(Aldrich)与作为溶剂的甲苯混合以制备浓度为50重量％的固体含量的水分吸附剂溶液。
除了以上之外，在室温下向反应器中引入100重量份的作为封装树脂的丁基橡胶(来自EXXON的BR065)和150重量份的作为增粘剂的来自SUKOREZ的SU120(软化点120℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为45重量％左右。将预先制备的水分吸附剂溶液混合使得相对于100重量份的封装树脂，水分吸附剂的量为300重量份，并均质化。
实施例3
以与实施例1中相同的方法生产封装膜，不同之处在于如下制备第一层溶液。
(1)封装层第一层溶液的制备
作为水分吸附剂，将表面上经硬脂酸表面处理的CaO(Aldrich)与作为溶剂的甲苯混合以制备浓度为50重量％的固体含量的水分吸附剂溶液。
除了以上之外，在室温下向反应器中引入100重量份的作为封装树脂的聚异丁烯树脂(来自BASF的B50，重均分子量为340,000g/mol)和400重量份的作为增粘剂的来自HIKOREZ的H2100(软化点102℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为48重量％左右。将预先制备的水分吸附剂溶液混合使得相对于100重量份的封装树脂，水分吸附剂的量为1000重量份，并均质化。
实施例4
以与实施例1中相同的方法生产封装膜，不同之处在于如下制备第一层溶液。
(1)封装层第一层溶液的制备
作为水分吸附剂，将表面上经硬脂酸表面处理的CaO(Aldrich)与作为溶剂的甲苯混合以制备浓度为50重量％的固体含量的水分吸附剂溶液。
除了以上之外，在室温下向反应器中引入100重量份的作为封装树脂的丁基橡胶(来自EXXON的BR065)和148重量份的作为增粘剂的来自SUKOREZ的SU120(软化点120℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为45重量％左右。将预先制备的水分吸附剂溶液混合使得相对于100重量份的封装树脂，水分吸附剂的量为300重量份，并均质化。
实施例5
以与实施例1中相同的方法生产封装膜，不同之处在于如下制备第一层溶液。
(1)封装层第一层溶液的制备
作为水分吸附剂，将表面上经硬脂酸表面处理的CaO(Aldrich)与作为溶剂的甲苯混合以制备浓度为50重量％的固体含量的水分吸附剂溶液。
除了以上之外，在室温下向反应器中引入100重量份的作为封装树脂的聚异丁烯树脂(来自BASF的B50，重均分子量为340,000g/mol)和420重量份的作为增粘剂的来自HIKOREZ的H2100(软化点102℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为48重量％左右。将预先制备的水分吸附剂溶液混合使得相对于100重量份的封装树脂，水分吸附剂的量为1000重量份，并均质化。
实施例6
以与实施例1中相同的方法生产封装膜，不同之处在于如下制备第一层溶液。
(1)封装层第一层溶液的制备
作为水分吸附剂，将表面上经硬脂酸表面处理的CaO(Aldrich)与作为溶剂的甲苯混合以制备浓度为50重量％的固体含量的水分吸附剂溶液。
除了以上之外，在室温下向反应器中引入100重量份的作为封装树脂的聚异丁烯树脂(来自BASF的B50，重均分子量为340,000g/mol)和340重量份的作为增粘剂的来自HIKOREZ的H2140(软化点140℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为40重量％左右。将预先制备的水分吸附剂溶液混合使得相对于100重量份的封装树脂，水分吸附剂的量为570重量份，并均质化。
比较例1
以与实施例1中相同的方法生产封装膜，不同之处在于如下制备第一层溶液。
(1)封装层第一层溶液的制备
作为水分吸附剂，将CaO(Aldrich)与作为溶剂的甲苯混合以制备浓度为50重量％的固体含量的水分吸附剂溶液。
除了以上之外，在室温下向反应器中引入100重量份的作为封装树脂的聚异丁烯树脂(来自BASF的B50，重均分子量为340,000g/mol)和380重量份的作为增粘剂的来自HIKOREZ的H2100(软化点102℃)。然后，向其中引入5重量份的作为可活性能量射线聚合的化合物的1,6-己二醇二丙烯酸酯和1重量份的光自由基引发剂(Irgacure 819)，并将混合物用甲苯稀释使得固体含量为40重量％左右。将预先制备的水分吸附剂溶液混合使得相对于100重量份的封装树脂，水分吸附剂的量为570重量份，并均质化。
比较例2
以与实施例1中相同的方法生产封装膜，不同之处在于，作为水分吸附剂，表面用基于环氧的硅烷偶联剂((3-缩水甘油氧基丙基)三甲氧基硅烷)而不是硬脂酸进行处理。
实验例1：涂层外观
目视观察实施例和比较例中生产的封装膜的涂层外观，当水分吸附剂颗粒发生团聚时，将其分类为X，当外观优异没有团聚时，将其分类为O。
实验例2：粘接特性
将实施例和比较例中生产的封装膜各自层合在其上形成有有机电子元件的玻璃基底上，使得封装层覆盖该元件，并使用高压釜在40℃和5atm的条件下进行加压、加热和压制以制备试样。然后，再次剥离封装膜，并观察外观。在粘接在一起并且根本没有气泡的情况下，将其分类为O；当出现3个或更少的气泡时，将其分类为△；而当出现多于3个气泡时，将其分类为X。
实验例3：切割特性
当对实施例和比较例中生产的各封装膜进行刀压切割时，观察膜的端部(边缘部分)的形状。在刀压切割的情况下，当封装膜是脆的时，由于切割时的应力，端部通常无法被切割成期望的形状。当封装膜端部的一部分封装层脱落损失并且形状未保持为矩形形状时，将其分类为X；当保持端部(边缘部分，顶点部分)的形状，但封装层的一部分脱落损失时，将其分类为△；而当在没有损失封装层的情况下保持形状并且良好地切开端部时，将其分类为O。
实验例4：水分阻挡特性
在尺寸为100mm×100mm的玻璃基底上以5mm×5mm的尺寸和100nm的厚度沉积钙，并附接实施例和比较例的各封装膜以覆盖钙的整个表面。在85℃和85％相对湿度的恒温恒湿室中观察获得的试样，从而观察当钙由于因水分渗入导致的氧化反应而开始变得透明时的时间。当透明开始时间为700小时或更长时，将其表示为O；当透明开始时间小于700小时且为500小时或更长时，将其分类为△；而当透明开始时间小于500小时时，将其分类为X。
[表1]
| 涂层外观 | 粘接特性 | 切割特性 | 水分阻挡特性 | |
| 实施例1 | O | O | O | O |
| 实施例2 | O | O | O | O |
| 实施例3 | O | O | O | O |
| 实施例4 | O | O | O | △ |
| 实施例5 | O | O | △ | O |
| 实施例6 | O | △ | O | △ |
| 比较例1 | X | △ | O | X |
| 比较例2 | X | X | O | X |
Claims (16)
1.一种封装组合物，包含：含有烯烃树脂的封装树脂、和经脂族烃化合物表面处理的水分吸附剂，
其中所述脂族烃化合物包含至少一个极性官能团，
其中相对于100重量份的所述封装树脂，所述水分吸附剂以150重量份至1500重量份的范围包含在内，
其中所述封装组合物还包含软化点为130℃或更低的增粘剂，其中相对于100重量份的所述封装树脂，所述增粘剂以149重量份至410重量份的范围包含在内。
2.根据权利要求1所述的封装组合物，其中所述封装树脂为衍生自丁烯的聚合物。
3.根据权利要求2所述的封装组合物，其中所述封装树脂为丁烯单体的均聚物；通过使所述丁烯单体与另外的可聚合单体共聚而获得的共聚物；使用所述丁烯单体的反应性低聚物；或其混合物。
4.根据权利要求1所述的封装组合物，其中所述脂族烃化合物的碳数在5至50的范围内。
5.根据权利要求1所述的封装组合物，其中所述水分吸附剂的根据D90的颗粒尺寸分析的颗粒直径为8μm或更小。
6.根据权利要求1所述的封装组合物，其中所述增粘剂的重均分子量在300g/mol至5000g/mol的范围内。
7.根据权利要求1所述的封装组合物，其中所述增粘剂是由在分子结构中具有在3至15的范围内的碳数的单体聚合的聚合物。
8.根据权利要求1所述的封装组合物，还包含可活性能量射线聚合的化合物。
9.根据权利要求8所述的封装组合物，其中相对于100重量份的所述封装树脂，所述可活性能量射线聚合的化合物以2重量份至35重量份的范围包含在内。
10.根据权利要求1所述的封装组合物，还包含自由基引发剂。
11.一种封装膜，包括含有根据权利要求1所述的封装组合物的封装层，其中所述封装层为单层结构、或者两个或更多个层的多层结构。
12.根据权利要求11所述的封装膜，其中所述封装层为两个或更多个层的多层结构，以及所述封装层包括：第一层，所述第一层包含水分吸附剂；和第二层，所述第二层不包含水分吸附剂、或者包含量低于所述第一层的所述水分吸附剂的量的水分吸附剂。
13.根据权利要求12所述的封装膜，其中所述第一层的厚度与所述第二层的厚度的比率在1.2至8的范围内。
14.根据权利要求11所述的封装膜，还包括形成在所述封装层上的金属层。
15.一种有机电子器件，包括：基底；形成在所述基底上的有机电子元件；和封装所述有机电子元件的整个表面的根据权利要求11所述的封装膜。
16.一种用于制造有机电子器件的方法，包括将根据权利要求11所述的封装膜施加至其上形成有有机电子元件的基底以覆盖所述有机电子元件的步骤。
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| JP5365891B2 (ja) | 2006-10-13 | 2013-12-11 | 日本ゼオン株式会社 | 発光素子用樹脂組成物、発光素子用積層体、発光素子 |
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| WO2014189291A1 (ko) * | 2013-05-21 | 2014-11-27 | 주식회사 엘지화학 | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
| TWI548682B (zh) | 2013-06-19 | 2016-09-11 | Ｌｇ化學股份有限公司 | 封裝膜 |
| KR20150016878A (ko) | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
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- 2019-12-09 TW TW108144958A patent/TWI813827B/zh active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20040105993A (ko) * | 2003-06-10 | 2004-12-17 | 금호타이어 주식회사 | 타이어용 인너라이너 코팅제 조성물 |
| WO2010084939A1 (ja) * | 2009-01-23 | 2010-07-29 | 味の素株式会社 | 樹脂組成物 |
| JP2013020900A (ja) * | 2011-07-14 | 2013-01-31 | Ube Material Industries Ltd | 有機ｅｌ素子用水分吸着剤及びその製造方法 |
| KR20160096045A (ko) * | 2015-02-04 | 2016-08-12 | 주식회사 엘지화학 | 점착제 조성물 |
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| US20220029133A1 (en) | 2022-01-27 |
| KR102626267B1 (ko) | 2024-01-18 |
| KR20230152613A (ko) | 2023-11-03 |
| WO2020117024A1 (ko) | 2020-06-11 |
| JP7354251B2 (ja) | 2023-10-02 |
| CN113166492A (zh) | 2021-07-23 |
| JP2022511037A (ja) | 2022-01-28 |
| TWI813827B (zh) | 2023-09-01 |
| KR20200070140A (ko) | 2020-06-17 |
| EP3878903A1 (en) | 2021-09-15 |
| TW202035548A (zh) | 2020-10-01 |
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