JP2022511037A - 封止組成物 - Google Patents
封止組成物 Download PDFInfo
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- JP2022511037A JP2022511037A JP2021531789A JP2021531789A JP2022511037A JP 2022511037 A JP2022511037 A JP 2022511037A JP 2021531789 A JP2021531789 A JP 2021531789A JP 2021531789 A JP2021531789 A JP 2021531789A JP 2022511037 A JP2022511037 A JP 2022511037A
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Images
Classifications
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Abstract
Description
1:離型フィルム又は基材フィルム
11:封止層
12:メタル層
13:保護層
21:基板
22:有機電子素子
Claims (20)
- オレフィン系樹脂を含む封止樹脂及び脂肪族炭化水素化合物が表面処理された水分吸着剤を含むことを特徴とする、封止組成物。
- 前記封止樹脂は、ブチレンから誘導された高分子であることを特徴とする、請求項1に記載の封止組成物。
- 前記封止樹脂は、ブチレン単量体の単独重合体;ブチレン単量体と重合可能な他の単量体を共重合した共重合体;ブチレン単量体を用いた反応性オリゴマー;又はこれらの混合物であることを特徴とする、請求項2に記載の封止組成物。
- 前記脂肪族炭化水素化合物は、極性官能基を少なくとも一つ以上含むことを特徴とする、請求項1から3のいずれか一項に記載の封止組成物。
- 前記脂肪族炭化水素化合物は、炭素数5~50の範囲内であることを特徴とする、請求項1から4のいずれか一項に記載の封止組成物。
- 前記水分吸着剤は、D90による粒度分析で粒径が8μm以下であることを特徴とする、請求項1から5のいずれか一項に記載の封止組成物。
- 前記水分吸着剤は、封止樹脂100重量部に対して150~1500重量部の範囲内に含まれることを特徴とする、請求項1から6のいずれか一項に記載の封止組成物。
- 軟化点が145℃以下である粘着付与剤をさらに含むことを特徴とする、請求項1から7のいずれか一項に記載の封止組成物。
- 前記粘着付与剤は、重量平均分子量が300~5000g/molの範囲内であることを特徴とする、請求項8に記載の封止組成物。
- 前記粘着付与剤は、分子構造内に炭素数が3~15の範囲内である単量体から重合された重合体であることを特徴とする、請求項8または9に記載の封止組成物。
- 前記粘着付与剤は、封止樹脂100重量部に対して140~450重量部の範囲内に含まれることを特徴とする、請求項8から10のいずれか一項に記載の封止組成物。
- 活性エネルギー線重合性化合物をさらに含むことを特徴とする、請求項1から11のいずれか一項に記載の封止組成物。
- 前記活性エネルギー線重合性化合物は、封止樹脂100重量部に対して2~35重量部の範囲内に含まれることを特徴とする、請求項12に記載の封止組成物。
- ラジカル開始剤をさらに含むことを特徴とする、請求項1から13のいずれか一項に記載の封止組成物。
- 請求項1から14のいずれか一項に記載の封止組成物を含む封止層を含み、前記封止層は、単一層又は2層以上の多層構造であることを特徴とする、封止フィルム。
- 前記封止層は、2層以上の多層構造であり、前記封止層は、水分吸着剤を含む第1層及び前記水分吸着剤を含まないか、前記第1層に比べて少ない含量で前記水分吸着剤を含む第2層を含むことを特徴とする、請求項15に記載の封止フィルム。
- 前記第2層の厚さに対する前記第1層の厚さの割合が1.2~8の範囲内であることを特徴とする、請求項16に記載の封止フィルム。
- 前記封止層上に形成されたメタル層をさらに含むことを特徴とする、請求項15から17のいずれか一項に記載の封止フィルム。
- 基板;前記基板上に形成された有機電子素子;及び前記有機電子素子の全面を封止する請求項15から18のいずれか一項に記載の封止フィルムを含むことを特徴とする、有機電子装置。
- 上部に有機電子素子が形成された基板に請求項15から18のいずれか一項に記載の封止フィルムが前記有機電子素子をカバーするように適用するステップを含むことを特徴とする、有機電子装置の製造方法。
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