CN113163612A - Method for forming connection circuit on glass substrate through multiple photoetching heads - Google Patents
Method for forming connection circuit on glass substrate through multiple photoetching heads Download PDFInfo
- Publication number
- CN113163612A CN113163612A CN202110431785.8A CN202110431785A CN113163612A CN 113163612 A CN113163612 A CN 113163612A CN 202110431785 A CN202110431785 A CN 202110431785A CN 113163612 A CN113163612 A CN 113163612A
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- China
- Prior art keywords
- glass substrate
- head
- photoetching
- connection part
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011521 glass Substances 0.000 title claims abstract description 82
- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 238000001259 photo etching Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000000206 photolithography Methods 0.000 claims description 19
- 238000003032 molecular docking Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a method for forming a connection circuit on a glass substrate through multiple photoetching heads, wherein the glass substrate comprises an A surface, a B surface and a side surface, the A surface is provided with a circuit of the A surface, the B surface is provided with a circuit of the B surface, the connection circuit is formed along the A surface, the B surface and the side surface respectively through the three photoetching heads, and the circuit of the A surface and the circuit of the B surface are electrically connected with each other through the connection circuit. According to the invention, the three photoetching heads are adopted to expose and form the connection circuit which is connected into a whole on the two sides and the side surface of the glass substrate, and the connection circuit realizes the electrical connection of the electronic circuits on the upper side and the lower side of the glass substrate, so that a flexible circuit board is not needed for switching, the thickness of the whole assembly of the glass substrate can be greatly reduced, the connection circuit formed by exposure also has higher reliability, and the problems of stress pull-off and the like do not exist; the connection line can be formed by exposure of the photoetching head, so that the operation is more convenient, and the production efficiency is favorably improved.
Description
Technical Field
The invention relates to the technical field of manufacturing of electronic display components, in particular to a method for connecting two-side circuits of a glass substrate.
Background
With the rapid development and wide application of various electronic devices, the requirements for display components are also increasing, and the most important development includes light weight and reliability. In display components, electronic circuits are generally formed on both front and back surfaces of a glass substrate by exposure, and in order to connect the electronic circuits on both surfaces, a flexible printed circuit (i.e., FPC) is generally used for connection and external connection. First, the flexible circuit board has a certain thickness and needs a certain space for extending and retracting, which results in a larger thickness of the whole glass substrate assembly and is not favorable for thinning and lightening the display component; secondly, the flexible circuit board is connected with electronic circuits on two sides of the glass substrate in a welding mode, and the flexible circuit board can be loosened after being subjected to certain tensile force or used for a long time, so that the display part can be abnormal or even can not work, and the reliability is poor; thirdly, the operation process of soldering the flexible circuit board is complicated, the technical requirement is high, the production efficiency is low, and the production cost is also high.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for forming a connection circuit on a glass substrate through a plurality of photoetching heads, which can realize switching without using a flexible circuit, has higher reliability, and is beneficial to improving the light and thin level and the production efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme: a method of forming a docking line on a glass substrate with a multi-photolithography head, the glass substrate comprising an a-side, a B-side, and a side, the a-side having a-side lines and the B-side having B-side lines, the method comprising: three photoetching heads are provided with connecting lines along the surface A, the surface B and the side surface, the surface A line and the surface B line are electrically connected with each other through the connecting lines, the implementation process is carried out according to the following steps,
s1, cleaning the surface of the glass substrate, plating a layer of conductive material on the surface of the glass substrate, and then using a mask with a circuit to cooperate with UV ink to generate circuits on the surface A and the surface B of the glass substrate respectively through exposure-development-etching processes;
s2, fixing and placing the glass substrate, and arranging a first photoetching head, a second photoetching head and a third photoetching head, wherein the first photoetching head faces to the part to be exposed on the A surface of the glass substrate, the second photoetching head faces to the part to be exposed on the B surface of the glass substrate, and the third photoetching head faces to the side surface of the glass substrate;
s3, starting the first photoetching head, the second photoetching head and the third photoetching head, and respectively exposing the A surface, the B surface and the side surface of the glass substrate corresponding to the first photoetching head, the second photoetching head and the third photoetching head to form a connection circuit;
s4, exposing an A-surface connection part on the A surface of the glass substrate by the first photoetching head, wherein one end of the A-surface connection part is connected with an A-surface circuit on the glass substrate, and the other end of the A-surface connection part extends to the side edge of the glass substrate;
s5, exposing a B-surface connection part on the B surface of the glass substrate by the second photoetching head, wherein one end of the B-surface connection part is connected with a B-surface circuit on the glass substrate, and the other end of the B-surface connection part extends to the side edge of the glass substrate;
and S6, exposing a side connection part on the side surface of the glass substrate by using a third photoetching head, wherein two ends of the side connection part are respectively connected with the A-surface connection part and the B-surface connection part, so that a complete connection circuit is formed.
In this case, the operation of exposing the a-side interface in step S4, the operation of exposing the B-side interface in step S5, and the operation of exposing the side interface in step S6 are performed simultaneously, so as to achieve higher production efficiency.
The surface A and the surface B are parallel to each other, and a connection circuit formed by exposure is of a C-shaped structure.
The surface A connection part extends to the side edge of the glass substrate from the surface A line along the shortest line, and the surface B connection part extends to the side edge of the glass substrate from the surface B line along the shortest line.
When exposure operation is carried out, the first photoetching head is perpendicular to the surface A for exposure, the second photoetching head is perpendicular to the surface B for exposure, and the third photoetching head is perpendicular to the side surface for exposure.
The thickness of the glass substrate is 0.1-1 mm.
The invention adopts the three photoetching heads to expose and form the connecting circuit which is connected into a whole on the two sides and the side surface of the glass substrate, and the connecting circuit realizes the electrical connection of the electronic circuits on the upper side and the lower side of the glass substrate, so that parts with physical structures such as a flexible circuit board are not needed for switching, the thickness of the whole assembly of the glass substrate can be greatly reduced, the connecting circuit formed by exposure also has higher reliability, and the problems of force pull-off and the like do not exist; the connection line can be formed by exposure of the photoetching head, so that the operation is more convenient, and the production efficiency is improved and the production cost is reduced. The line width and the line distance of 50um can be met by matching with the existing photoetching process, and the generation of bad phenomena such as line breakage, line shape distortion and the like is greatly reduced.
Drawings
FIG. 1 is a schematic cross-sectional view of a conventional glass substrate;
FIG. 2 is a schematic view of the structure of the present invention.
In the figure, 1 is a glass substrate, 11 is a surface a, 12 is a surface B, 13 is a side surface, 2 is a surface a circuit, 3 is a surface B circuit, 4 is a connection circuit, 41 is a surface a connection part, 42 is a surface B connection part, 43 is a side surface connection part, 5 is a first photolithography head, 6 is a second photolithography head, and 7 is a third photolithography head.
Detailed Description
In this embodiment, referring to fig. 1 and fig. 2, in the method for forming a connection line on a glass substrate by a multi-photolithography head, the glass substrate 1 includes an a surface 11, a B surface 12, and a side surface 13, the a surface 11 has the a surface line 2, the B surface 12 has the B surface line 2, and the thickness of the glass substrate 1 is 0.1-1 mm. The three photoetching heads are provided with connecting lines 4 along the A surface 11, the B surface 12 and the side surface 13, the A surface line 2 and the B surface line 3 are electrically connected with each other through the connecting lines 4, the implementation process is carried out according to the following steps,
s1, cleaning the surface of the glass substrate 1, plating a layer of conductive material on the surface of the glass substrate 1, and then using a mask with a circuit to match with UV ink to generate circuits on the A surface 11 and the B surface 12 of the glass substrate respectively through exposure-development-etching processes, which is only the operation process in the prior art;
s2, fixing and placing the glass substrate 1, and setting a first optical lithography head 5, a second optical lithography head 6 and a third optical lithography head 7, wherein the first optical lithography head 5 faces the part to be exposed on the a-side 11 of the glass substrate 1 (located at the position from the a-side line 2 to the edge of the a-side 11), the second optical lithography head 6 faces the part to be exposed on the B-side 12 of the glass substrate 1 (located at the position from the B-side line 2 to the edge of the B-side 11), and the third optical lithography head 7 faces the side 13 of the glass substrate 1;
s3, starting the first, second and third photolithography heads 5, 6, 7, and exposing the a-side 11, B-side 12 and side 13 of the glass substrate 1 to form a connecting line 4;
s4, exposing an A-surface connection part 41 on the A-surface 11 of the glass substrate 1 by the first photoetching head 5, wherein one end of the A-surface connection part 41 is connected with the A-surface circuit 2 on the glass substrate 1, and the other end of the A-surface connection part extends to the edge of the side surface 13 of the glass substrate 1;
s5, exposing a B-side connection portion 42 on the B-side 12 of the glass substrate 1 by the second optical head 6, where one end of the B-side connection portion 42 is connected to the B-side line 3 on the glass substrate 1, and the other end extends to the edge of the side surface 13 of the glass substrate 1;
s6, exposing the side surface of the glass substrate 1 with the third photolithography head 7 to form a side surface connection portion 43, where two ends of the side surface connection portion 43 are respectively connected to the a surface connection portion 41 and the B surface connection portion 42, so as to form a complete connection line 4.
In this case, the operation of exposing the a-side interface 41 in step S4 is performed simultaneously with the operation of exposing the B-side interface 42 in step S5 and the operation of exposing the side interface 43 in step S6, so as to achieve higher production efficiency.
The a surface 11 and the B surface 12 are parallel to each other, and the connection line 4 formed by exposure is approximately in a C-shaped structure or a J-shaped structure.
The a-side connection part 41 extends from the a-side line 2 to the edge of the side surface 13 of the glass substrate 1 along the shortest route, and the B-side connection part 42 extends from the B-side line 3 to the edge of the side surface 13 of the glass substrate 1 along the shortest route.
When exposure operation is carried out, the first photoetching head 5 is perpendicular to the A surface 11 for exposure, the second photoetching head 6 is perpendicular to the B surface 12 for exposure, and the third photoetching head 7 is perpendicular to the side surface 13 for exposure.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Claims (6)
1. A method of forming a docking line on a glass substrate with a multi-photolithography head, the glass substrate comprising an a-side, a B-side, and a side, the a-side having a-side lines and the B-side having B-side lines, the method comprising: three photoetching heads are provided with connecting lines along the surface A, the surface B and the side surface, the surface A line and the surface B line are electrically connected with each other through the connecting lines, the implementation process is carried out according to the following steps,
s1, cleaning the surface of the glass substrate, plating a layer of conductive material on the surface of the glass substrate, and then using a mask with a circuit to cooperate with UV ink to generate circuits on the surface A and the surface B of the glass substrate respectively through exposure-development-etching processes;
s2, fixing and placing the glass substrate, and arranging a first photoetching head, a second photoetching head and a third photoetching head, wherein the first photoetching head faces to the part to be exposed on the A surface of the glass substrate, the second photoetching head faces to the part to be exposed on the B surface of the glass substrate, and the third photoetching head faces to the side surface of the glass substrate;
s3, starting the first photoetching head, the second photoetching head and the third photoetching head, and respectively exposing the A surface, the B surface and the side surface of the glass substrate corresponding to the first photoetching head, the second photoetching head and the third photoetching head to form a connection circuit;
s4, exposing an A-surface connection part on the A surface of the glass substrate by the first photoetching head, wherein one end of the A-surface connection part is connected with an A-surface circuit on the glass substrate, and the other end of the A-surface connection part extends to the side edge of the glass substrate;
s5, exposing a B-surface connection part on the B surface of the glass substrate by the second photoetching head, wherein one end of the B-surface connection part is connected with a B-surface circuit on the glass substrate, and the other end of the B-surface connection part extends to the side edge of the glass substrate;
and S6, exposing a side connection part on the side surface of the glass substrate by using a third photoetching head, wherein two ends of the side connection part are respectively connected with the A-surface connection part and the B-surface connection part, so that a complete connection circuit is formed.
2. The method of forming a docking line on a glass substrate with a multi-photolithography head as recited in claim 1, wherein: the operation of exposing the a-side interface at step S4 is performed simultaneously with the operation of exposing the B-side interface at step S5 and the operation of exposing the side interface at step S6.
3. The method of forming a docking line on a glass substrate with a multi-photolithography head as recited in claim 1, wherein: the surface A and the surface B are parallel to each other, and a connection circuit formed by exposure is of a C-shaped structure.
4. The method of forming a docking line on a glass substrate with a multi-photolithography head as recited in claim 1, wherein: the surface A connection part extends to the side edge of the glass substrate from the surface A line along the shortest line, and the surface B connection part extends to the side edge of the glass substrate from the surface B line along the shortest line.
5. The method of forming a docking line on a glass substrate with a multi-photolithography head as recited in claim 1, wherein: when exposure operation is carried out, the first photoetching head is perpendicular to the surface A for exposure, the second photoetching head is perpendicular to the surface B for exposure, and the third photoetching head is perpendicular to the side surface for exposure.
6. The method of forming a docking line on a glass substrate with a multi-photolithography head as recited in claim 1, wherein: the thickness of the glass substrate is 0.1-1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110431785.8A CN113163612A (en) | 2021-04-21 | 2021-04-21 | Method for forming connection circuit on glass substrate through multiple photoetching heads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110431785.8A CN113163612A (en) | 2021-04-21 | 2021-04-21 | Method for forming connection circuit on glass substrate through multiple photoetching heads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113163612A true CN113163612A (en) | 2021-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110431785.8A Pending CN113163612A (en) | 2021-04-21 | 2021-04-21 | Method for forming connection circuit on glass substrate through multiple photoetching heads |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070200276A1 (en) * | 2006-02-24 | 2007-08-30 | Micron Technology, Inc. | Method for rapid printing of near-field and imprint lithographic features |
| CN103985663A (en) * | 2014-05-15 | 2014-08-13 | 中国电子科技集团公司第四十一研究所 | Method for etching two-sided thin film circuit patterns into ultrathin quartz substrate in photoetching mode |
| JP2016200633A (en) * | 2015-04-07 | 2016-12-01 | 日本電気硝子株式会社 | Patterning method of both surfaces of glass substrate |
| TWI696244B (en) * | 2019-08-21 | 2020-06-11 | 富元精密科技股份有限公司 | Circuit arrangement structure of edge of glass substrate and manufacturing method thereof |
| KR20200137112A (en) * | 2019-05-29 | 2020-12-09 | 주식회사 테토스 | Method of forming wiring on side surface of substrate |
-
2021
- 2021-04-21 CN CN202110431785.8A patent/CN113163612A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070200276A1 (en) * | 2006-02-24 | 2007-08-30 | Micron Technology, Inc. | Method for rapid printing of near-field and imprint lithographic features |
| CN103985663A (en) * | 2014-05-15 | 2014-08-13 | 中国电子科技集团公司第四十一研究所 | Method for etching two-sided thin film circuit patterns into ultrathin quartz substrate in photoetching mode |
| JP2016200633A (en) * | 2015-04-07 | 2016-12-01 | 日本電気硝子株式会社 | Patterning method of both surfaces of glass substrate |
| KR20200137112A (en) * | 2019-05-29 | 2020-12-09 | 주식회사 테토스 | Method of forming wiring on side surface of substrate |
| TWI696244B (en) * | 2019-08-21 | 2020-06-11 | 富元精密科技股份有限公司 | Circuit arrangement structure of edge of glass substrate and manufacturing method thereof |
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| PB01 | Publication | ||
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Application publication date: 20210723 |