JP2006237158A - Display device - Google Patents

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JP2006237158A
JP2006237158A JP2005047664A JP2005047664A JP2006237158A JP 2006237158 A JP2006237158 A JP 2006237158A JP 2005047664 A JP2005047664 A JP 2005047664A JP 2005047664 A JP2005047664 A JP 2005047664A JP 2006237158 A JP2006237158 A JP 2006237158A
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terminal
display panel
film substrate
stage
electrode
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Tsutomu Matsudaira
努 松平
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Seiko Instruments Inc
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Seiko Instruments Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent displacement in the connection between a high-density display panel with 40 μm pitches, or the like and a film substrate. <P>SOLUTION: A connection terminal is divided into two stages with two types of terminal widths, thick and thin. The first-stage and second-stage terminals of the display panel are allowed to be thick and thin, respectively, the first-stage and second-stage terminals of the corresponding film substrate are allowed to be thin and thick, respectively, and the thick and thin terminals are connected by an anisotropic conductive film, thus enlarging a displacement margin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、パッシブマトリクス液晶パネルやアクティブマトリクス液晶パネルやプラズマディスプレイや有機ELディスプレイ、無機ELディスプレイ、SED、FEDなどのフラットパネルディスプレイとフレキシブル基板の実装構造に関する。   The present invention relates to a mounting structure of a flexible substrate and a flat panel display such as a passive matrix liquid crystal panel, an active matrix liquid crystal panel, a plasma display, an organic EL display, an inorganic EL display, SED, or FED.

従来のSTN型液晶表示装置の側面図を図6に示す。セグメント電極が形成された透明基板とコモン電極が形成された透明基板を対向して、液晶を挟んで保持した表示パネル7と、ドライバIC10が搭載されたフィルム基板9を端子部8を位置合わせして、異方性導電膜で接続した構成である。表示パネル7の各電極に時分割で電圧を印加することにより画面を駆動する。セグメント信号とコモン信号はそれぞれ異なり、ドットマトリクスを構成する電極毎にドライバIC10の出力電極を接続して、信号を印加する。図7に示すように、フィルム基板9は、銅をパターニングしスズメッキや金メッキをした端子が形成されたポリイミドフィルムにセグメント信号とコモン信号を出力するドライバIC10が実装されており、図8で示す表示パネル7の端子部8に異方性導電膜11で接続されている。異方性導電膜11は、エポキシ系の熱硬化型接着剤に、アクリル系の樹脂ボールにニッケルと金を無電解メッキした導電粒子を分散配合し、約15μmのフィルム状にBステージ状態で形成されている。表示パネル7とフィルム基板9の接続は、図9に示すように表示パネルの端子部8上に異方性導電膜11を仮付けし、フィルム基板9の端子6と表示パネルの7の端子1位置合わせをして仮付けし、図10に示すように加熱バーにより加熱圧着して、導電粒子をつぶして接続を取るとともに接着剤を硬化して、接続を保持する。端子の形状は、図11に示す電極幅と電極間のスペースを等間隔で配置した。フィルム基板9の端子6の幅に対して表示パネル7の端子1の幅は若干太くすることで、位置ズレ多少の位置ズレを吸収する。ズレはピッチ方向に対しては10〜15μm以下を要求されるが、ピッチ方向と垂直方向では100μm程度でラフである。   A side view of a conventional STN liquid crystal display device is shown in FIG. The transparent substrate on which the segment electrode is formed and the transparent substrate on which the common electrode is formed are opposed to each other, and the terminal panel 8 is aligned with the display panel 7 holding the liquid crystal and the film substrate 9 on which the driver IC 10 is mounted. The structure is connected by an anisotropic conductive film. The screen is driven by applying a voltage to each electrode of the display panel 7 in a time-sharing manner. The segment signal and the common signal are different from each other, and the signal is applied by connecting the output electrode of the driver IC 10 for each electrode constituting the dot matrix. As shown in FIG. 7, the film substrate 9 has a driver IC 10 for outputting a segment signal and a common signal mounted on a polyimide film on which copper is patterned and tin-plated or gold-plated terminals are formed. An anisotropic conductive film 11 is connected to the terminal portion 8 of the panel 7. The anisotropic conductive film 11 is formed in a B-stage state in a film shape of about 15 μm by dispersing and blending conductive particles obtained by electroless plating of nickel and gold on an acrylic resin ball in an epoxy thermosetting adhesive. Has been. As shown in FIG. 9, the display panel 7 and the film substrate 9 are connected by temporarily attaching an anisotropic conductive film 11 on the terminal portion 8 of the display panel, and the terminal 6 of the film substrate 9 and the terminal 1 of the display panel 7. As shown in FIG. 10, they are aligned and temporarily attached, and are heat-pressed with a heating bar to crush the conductive particles to establish a connection and harden the adhesive to maintain the connection. As for the shape of the terminal, the electrode width and the space between the electrodes shown in FIG. 11 were arranged at equal intervals. By slightly increasing the width of the terminal 1 of the display panel 7 with respect to the width of the terminal 6 of the film substrate 9, a slight positional shift is absorbed. The deviation is required to be 10-15 μm or less with respect to the pitch direction, but it is rough at about 100 μm in the direction perpendicular to the pitch direction.

画素数が160×128(RGB)ドットであれば、セグメント384本とコモン160本で、計544本の電極を接続することになり、表示パネルサイズが1.8インチであれば、接続のピッチは50ミクロンピッチとなった。50ミクロンピッチの場合は、表示パネル7の端子1の幅は25μmでフィルム基板9の端子6の幅は18μmで設計する。フィルム基板9の初期の累積ピッチばらつきと装置実装精度による位置ズレと圧着によるフィルム基板9の伸びのばらつきにより、±17μmとなり安定した接続ができる。良好な接続とは、直径約4μmの導電粒子が約1μmにつぶれ、導通に寄与する導電粒子の個数が5個以上で、ショートが無く、隣の電極との間隔は粒子1.5個分以上のあることであることが望ましい。フィルム基板9の仮付け位置とフィルム基板9の初期寸法と圧着による伸びにより、特に両端の端子の位置ズレが大きかった。表示パネル7とフィルム基板9の電極の重なりが減少した場合、図12に示すように電極の重なり面積が減少し、接続に寄与する導電粒子が存在しない場合や、図13に示すように隣の電極へショートする場合がある。特に微細接続になると位置ズレと共にフィルム基板9の伸びによるズレが発生した。このような場合、フィルム基板9の伸び量をあらかじめ補正した端子設計を用いて圧着する方法が知られている(例えば、特許文献1および特許文献2参照)。   If the number of pixels is 160 × 128 (RGB) dots, a total of 544 electrodes are connected by 384 segments and 160 commons, and if the display panel size is 1.8 inches, the connection pitch Became a 50 micron pitch. In the case of 50 micron pitch, the width of the terminal 1 of the display panel 7 is 25 μm and the width of the terminal 6 of the film substrate 9 is 18 μm. Due to the initial accumulated pitch variation of the film substrate 9, the positional deviation due to the apparatus mounting accuracy, and the variation in the elongation of the film substrate 9 due to the pressure bonding, ± 17 μm is achieved, and a stable connection can be achieved. Good connection means that conductive particles with a diameter of about 4 μm are crushed to about 1 μm, the number of conductive particles contributing to conduction is 5 or more, there is no short circuit, and the distance between adjacent electrodes is 1.5 particles or more. It is desirable that there be. Due to the temporary attachment position of the film substrate 9, the initial dimensions of the film substrate 9, and the elongation due to pressure bonding, the positional deviation between the terminals at both ends was particularly large. When the overlap between the electrodes of the display panel 7 and the film substrate 9 is reduced, the overlapping area of the electrodes is reduced as shown in FIG. 12, and there is no conductive particle contributing to the connection, or as shown in FIG. There may be a short circuit to the electrode. In particular, when the fine connection was made, a displacement due to the elongation of the film substrate 9 occurred together with the positional displacement. In such a case, a method of crimping using a terminal design in which the elongation amount of the film substrate 9 is corrected in advance is known (see, for example, Patent Document 1 and Patent Document 2).

また、フィルム端子6や表示パネルの端子1の間隔が狭くなるため、異物などによるショートの発生の確率が高くなる。一般的には、実装前の端子の洗浄やクリーンルームの防塵の対策処置を基本とするが、圧着による対策として。千鳥状をなすように異方性導電膜11を圧着する方法がしられている(例えば特許文献3参照)。
特開平10−260421号公報(第4頁、第1図) 特開2000−312070号公報(第4頁、第1図) 特開2000−347592号広報(第6項、第2図)
In addition, since the distance between the film terminal 6 and the terminal 1 of the display panel is narrowed, the probability of occurrence of a short circuit due to foreign matter or the like is increased. In general, the basic measures are to clean the terminals before mounting and to prevent dust in clean rooms. There is a method in which the anisotropic conductive film 11 is pressure-bonded so as to form a staggered pattern (see, for example, Patent Document 3).
Japanese Patent Laid-Open No. 10-260421 (page 4, FIG. 1) Japanese Patent Laid-Open No. 2000-312070 (page 4, FIG. 1) Japanese Laid-Open Patent Publication No. 2000-347592 (Section 6, Fig. 2)

しかしながら、パネルの高精細化に伴って、更に狭ピッチとなった。特に40μmピッチでの実装では、(1)フィルム基板の初期寸法のばらつきと、圧着による伸びのばらつきと、実装精度のばらつきにより位置ズレが発生し、隣の端子とショートする、(2)既存設備を使用できないため、新規の高精度の設備導入が必要となり、加工コストが高くなる、という課題があった。そこで本発明は、40μmの狭ピッチでもショートの発生が無く、既存の設備で生産できる安価な表示装置を提供することを目的とする。   However, with the higher definition of the panel, the pitch became narrower. In particular, when mounting at a pitch of 40 μm, (1) positional deviation occurs due to variations in initial dimensions of the film substrate, variations in elongation due to crimping, and variations in mounting accuracy, and short-circuits with adjacent terminals. (2) Existing equipment Therefore, it was necessary to introduce new high-precision equipment, and there was a problem that the processing cost was high. Accordingly, an object of the present invention is to provide an inexpensive display device that does not cause a short circuit even at a narrow pitch of 40 μm and can be produced with existing equipment.

本発明では表示パネルおよびフィルム基板端子の形状を工夫することにより解決した。本発明の表示装置は、表示パネルとフィルム基板の接続している複数の端子はそれぞれ2段になって接続している。さらに、端子の幅は、表示パネルとフィルム基板とも2種類であり、2種類の幅は表示パネルとフィルム基板でほぼ同一の幅であり、端子の幅はその段毎に統一してあり、表示パネルとフィルム基板を接続している端子の幅は表示パネルとフィルム基板で異なる幅である。また、表示パネルとフィルム基板の端子幅は、端子先端側の段の端子幅より2段目の端子幅の方が広くなっている。さらに、2段の端子の間隔が、端子のピッチより大きいこととした。すなわち、表示パネルとフィルム基板の端子は、2段で構成してあり、その電極も太い幅の電極と細い幅の電極の2種類の端子幅である。表示パネルの一段目は、太い幅の電極と2段目の端子に接続する引き回し線の繰り返しで、その2段目は、端子無しと前記引き回し線と接続した細い幅の電極の繰り返しである。フィルム基板の1段目は細い幅の電極と電極無しの繰り返しで、2段目は1段目の細い幅の電極に接続する引き回し電極と太い幅の電極の繰り返しであり、表示パネルとフィルム基板とは、それぞれ太い幅の電極と細い幅の電極を接続する構成とした。このとき表示パネルの太い幅の電極幅とフィルム基板の太い幅の電極幅と、表示パネルの細い幅の電極とフィルム基板の細い幅の電極は全く同じ寸法である必要はない。   The present invention has been solved by devising the shapes of the display panel and the film substrate terminal. In the display device of the present invention, a plurality of terminals connected to the display panel and the film substrate are connected in two stages. Furthermore, there are two types of terminal widths for both the display panel and the film substrate. The two types of widths are almost the same for the display panel and the film substrate, and the terminal widths are unified for each stage. The width of the terminal connecting the panel and the film substrate is different between the display panel and the film substrate. Further, the terminal width of the display panel and the film substrate is wider at the terminal width of the second stage than the terminal width of the stage at the terminal tip side. Furthermore, the interval between the two-stage terminals is larger than the terminal pitch. That is, the terminals of the display panel and the film substrate are configured in two stages, and the electrodes also have two types of terminal widths: a thick electrode and a thin electrode. The first stage of the display panel is a repetition of a lead wire connected to the second stage terminal with a thick width electrode, and the second stage is a repetition of a narrow width electrode connected to the lead line without a terminal. The first stage of the film substrate is a repetition of a thin electrode and no electrode, and the second stage is a repetition of a lead electrode and a thick electrode connected to the first narrow electrode, a display panel and a film substrate. Is a configuration in which a thick electrode and a narrow electrode are connected to each other. At this time, the wide electrode width of the display panel, the wide electrode width of the film substrate, the thin electrode of the display panel, and the thin electrode of the film substrate do not need to have the same dimensions.

本発明の端子形状により、40μmピッチでありながら、従来の55μmピッチ相当にする位置精度で実装することができる。そのため従来の設備を使用しても十分品質の安定した製品を製造することができた。   According to the terminal shape of the present invention, it can be mounted with a positional accuracy equivalent to a conventional 55 μm pitch while being a 40 μm pitch. Therefore, it was possible to produce a product with sufficiently stable quality even when using conventional equipment.

本発明による表示装置の表示パネルとフィルム基板の端子は、2段で構成してあり、その電極も太い幅の電極と細い幅の電極の2種類の端子幅で構成する。表示パネルの一段目は、太い幅の電極と2段目の端子に接続する引き回し線の繰り返しである。初めに引き回し線の線幅は、工程製造能力でのMINの線幅がよい。引き回し線と太い幅の電極とのスペースは従来の構造での実装工程能力上の最小スペースの値と同じにする。フィルム基板のMIN線幅の方が太い場合は、フィルム基板のMIN線幅にあわせてもよい。これらを差し引いて残った寸法を太い幅の電極の幅とする。   The display panel of the display device according to the present invention and the terminals of the film substrate are configured in two stages, and the electrodes are also configured with two types of terminal widths, a thick electrode and a thin electrode. The first stage of the display panel is a repetition of a lead line connected to a thick electrode and a second stage terminal. First, the line width of the lead line is preferably the line width of MIN in the process manufacturing capability. The space between the lead line and the thick electrode is set to the same value as the minimum space in the mounting process capability in the conventional structure. When the MIN line width of the film substrate is thicker, it may be matched with the MIN line width of the film substrate. The dimension remaining after subtracting these is defined as the width of the electrode having a large width.

この1段目の表示パネルの太い幅の電極と接続するフィルム基板の端子は細い幅の電極で、フィルム基板と表示パネルの位置ズレをゼロとしたときに、表示パネルの引き回し線からの間隔を、従来構造での実装工程能力上の可能であるフィルム基板の端子とその隣の表示パネルの端子の間隔の最小の値と同じ値とし、残った寸法をフィルム基板の細い幅の電極の幅とする。表示パネルの引き回し線に位置する部分にはフィルム基板の電極を配置しない。表示パネルの2段目の端子は、電極無しと細い幅の電極の繰り返しで、1段目の太い幅の電極の延長上には端子は配置しない。そして、その隣には1段目のフィルム基板の細い幅の電極とほぼ同じ幅の電極を配置し1段目の引き回し電極と接続する。フィルム基板の2段目の端子は、引き回し電極と太い幅の電極の繰り返しである。1段目の細い幅の電極に接続する引き回し電極を配置する。この引き回し電極の幅は、表示パネルの引き回し電極幅と同じかそれよりも細い方がよい。その隣の太い幅の電極の幅は、1段目の表示パネルの太い幅の電極の幅とほぼ同じ幅とする。1段目と2段目の端子の間隔は広い方がよく、実装機の実装精度の関係があり、接続ピッチ以上の寸法のマージンがあることが望ましい。   The terminal of the film substrate connected to the thick electrode of the first display panel is a thin electrode. When the positional deviation between the film substrate and the display panel is zero, the distance from the display panel lead line is The same value as the minimum value of the distance between the terminal of the film substrate and the terminal of the display panel next to it, which is possible in the mounting process capability in the conventional structure, and the remaining dimension is the width of the thin electrode of the film substrate To do. The electrode of the film substrate is not disposed in the portion located on the lead line of the display panel. The terminals on the second stage of the display panel are repeated with no electrodes and thin electrodes, and no terminals are arranged on the extension of the thick electrodes with the first stage. Next, an electrode having substantially the same width as that of the thin electrode on the first stage film substrate is arranged next to it and connected to the first stage lead-out electrode. The terminal on the second stage of the film substrate is a repetition of the lead-out electrode and the electrode having a large width. A routing electrode connected to the first-stage narrow electrode is disposed. The width of the lead-out electrode is preferably equal to or narrower than the lead-out electrode width of the display panel. The width of the adjacent thick electrode is set to be substantially the same as the width of the thick electrode of the first-stage display panel. The distance between the first stage terminals and the second stage terminals is preferably wide, and there is a relationship with the mounting accuracy of the mounting machine, and it is desirable that there is a margin of dimension more than the connection pitch.

以下に本発明の実施例を図面に基づいて説明する。図1は、本発明の表示パネルの端子の上面図である。表示パネルはカラーSTN方式の表示パネルである。ガラス基板2上に端子1が形成してある。端子1は透明導電膜であるITO(Indium−Tin−Oxide)からなり、スパッタにより製膜した基板をフォト法によりパターニングした。表示パネルの接続する端子は、1段目の端子3と2段目の端子4からなる。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a top view of terminals of a display panel according to the present invention. The display panel is a color STN display panel. A terminal 1 is formed on a glass substrate 2. The terminal 1 is made of ITO (Indium-Tin-Oxide), which is a transparent conductive film, and a substrate formed by sputtering is patterned by a photo method. Terminals to be connected to the display panel include a first-stage terminal 3 and a second-stage terminal 4.

1段目の端子3は、40μm幅の太幅端子と10μm幅の引き回し電極からなり、その電極間隔はそれぞれ15μmである。2段目の端子4は引き回し電極の延長上に23μmの幅の細幅端子を配置している。   The first stage terminal 3 includes a 40 μm wide terminal and a 10 μm wide lead electrode, and the electrode spacing is 15 μm. The terminal 4 in the second stage is provided with a narrow terminal having a width of 23 μm on the extension of the routing electrode.

図2はフィルム基板の端子の透視図である。フィルム基板はポリイミドフィルム5にクロム合金と銅をスパッタし、更に8ミクロンの電解銅メッキをした基板を、フォト法でパターニングし、無電解スズメッキした端子6が形成してある。
フィルム基板の端子も同様に、端子を2段に形成してある。1段目の端子3は、23μmの幅の細幅端子を形成してある。2段目の端子4は1段目の細い幅の電極に接続する10μm幅の引き回し電極と40μmの太い幅の電極からなる。
FIG. 2 is a perspective view of the terminals of the film substrate. A film substrate is formed by sputtering a chromium alloy and copper on a polyimide film 5 and further patterning the substrate by electrolytic plating of 8 microns, and patterning by a photo method, thereby forming the electroless tin-plated terminals 6.
Similarly, the terminals of the film substrate are formed in two stages. The first stage terminal 3 is a narrow terminal having a width of 23 μm. The second-stage terminal 4 is composed of a 10 μm-wide routing electrode connected to the first-stage narrow-width electrode and a 40-μm thick electrode.

図3は、フィルム基板と表示パネルの端子を位置合わせし、異方性導電膜で接続したときの位置関係を示す透視図である。ここで、異方性導電膜の粒子は図示していない。1段目の端子3では、表示パネルの太い幅の電極とフィルム基板の細い幅の電極が接続している。2段目の端子4は、フィルム基板の太い幅の電極と表示パネルの細い幅の電極で接続している。   FIG. 3 is a perspective view showing a positional relationship when the film substrate and the terminal of the display panel are aligned and connected by an anisotropic conductive film. Here, the particles of the anisotropic conductive film are not shown. In the terminal 3 at the first stage, the thick electrode of the display panel and the thin electrode of the film substrate are connected. The terminals 4 at the second stage are connected by electrodes having a large width on the film substrate and electrodes having a small width on the display panel.

図4は、フィルム基板の端子と表示パネルの端子が20μm位置ズレしたときの位置関係を示す透視図である。この状態で、1段目の端子のフィルム基板の細い幅の電極と表示パネルの引き回し電極がショートするまでの間隔がある。また、2段目の端子のフィルム基板の引き回し電極と表示パネルの細い幅の電極の間隔も同様に間隔があり、ショートしていない。異方性導電膜の導電粒子には、アクリル系の樹脂ボールにニッケルと金をメッキした直径4μmの粒子と更に熱可塑系の絶縁被膜を形成した粒子を混合して使用している。数珠つなぎになったときにショートを防止するために絶縁被膜付き粒子を数十パーセント混合している。   FIG. 4 is a perspective view showing the positional relationship when the terminals of the film substrate and the terminals of the display panel are displaced by 20 μm. In this state, there is an interval until the thin electrode on the first stage terminal film substrate and the lead-out electrode on the display panel are short-circuited. Similarly, the distance between the lead electrode on the film substrate of the second stage terminal and the narrow electrode on the display panel is also not short-circuited. As the conductive particles of the anisotropic conductive film, particles having a diameter of 4 μm obtained by plating nickel and gold on an acrylic resin ball and particles formed by further forming a thermoplastic insulating film are used. In order to prevent short-circuiting when the beads are connected, dozens of percent of particles with insulating coating are mixed.

このように、本発明の接続パターンでは、上記のパターン寸法において40μmピッチでも±20μmずれても良品である。従来パターン形状では、40μmピッチでは、±10μmまでであったので、大きくマージンを広げられた。また±20μmのズレマージンは従来パターン形状では55μmピッチと同等となる。更に引き回し線の幅を細くすることにより、若干であるがマージンを広げることも可能である。また、実装装置の縦方向の精度により1段目の端子と2段目の端子のショートが起こり得る。図3のa部の寸法を実装ピッチ以上にすることでショートを防ぐことが可能である。端子部8の長さは、短くするためには異方性導電膜の粒子の数を増やすか、異方性導電膜の構造を粒子無し層と粒子有り層の2層構造のものを用いてもよい。   As described above, the connection pattern of the present invention is a good product even if the pattern size is shifted by 40 μm or ± 20 μm. In the case of the conventional pattern shape, the margin is greatly expanded since the pitch is 40 μm up to ± 10 μm. Further, a deviation margin of ± 20 μm is equivalent to a 55 μm pitch in the conventional pattern shape. Further, by narrowing the width of the lead line, the margin can be slightly increased. Further, a short circuit between the first-stage terminal and the second-stage terminal may occur due to the vertical accuracy of the mounting apparatus. It is possible to prevent a short circuit by setting the dimension of the part a in FIG. In order to shorten the length of the terminal portion 8, the number of particles of the anisotropic conductive film is increased, or the structure of the anisotropic conductive film is a two-layer structure having no particle layer and a particle layer. Also good.

以下に本実施例を図面に基づいて説明する。図5は、本実施例の表示パネルとフィルム基板の端子を接続した上面図である。表示パネルはTFT方式の液晶パネルである。ガラス基板2上に端子1が形成してある。端子1Cr上に樹脂膜を形成し、接続する端子部の樹脂部は開口しており、ITOでカバーした構造である。実施例1では、引き回し線は露出していたが、この実施例2では、引き回し部は樹脂の下にあるために、表面での接触が無い。そのため、1段目の端子3と2段目の端子4では、ショートのマージンが異なり、表示パネルおよびフィルム基板共に1段目の端子幅の幅を大きくすることができる。位置ズレによるショートの制約は、2段目の端子4になる。2段目の端子の構成は実施例1と同様である。この場合は、端子部8の寸法を小さくするためには、1段目の端子3の寸法を2段目の端子4より短くし、できるだけピッチ方向の端子の幅を広く取ることがよい。しかし、この構造に限るものではなく、TFT方式の表示パネルでも、実施例1の構造でもよい。端子部8の長さは、短くするためには異方性導電膜の粒子の数を増やすか、異方性導電膜の構造を粒子無し層と粒子有り層の2層構造のものを用いてもよい。   Hereinafter, this embodiment will be described with reference to the drawings. FIG. 5 is a top view in which the display panel of this embodiment and the terminals of the film substrate are connected. The display panel is a TFT liquid crystal panel. A terminal 1 is formed on a glass substrate 2. A resin film is formed on the terminal 1Cr, and the resin part of the terminal part to be connected is opened and covered with ITO. In Example 1, the routing line was exposed, but in Example 2, since the routing part is under the resin, there is no contact on the surface. For this reason, the first stage terminal 3 and the second stage terminal 4 have different short margins, and the width of the first stage terminal width can be increased for both the display panel and the film substrate. The short-circuit restriction due to misalignment is the terminal 4 at the second stage. The configuration of the second stage terminal is the same as that of the first embodiment. In this case, in order to reduce the dimension of the terminal portion 8, it is preferable to make the dimension of the terminal 3 in the first stage shorter than the terminal 4 in the second stage and to make the width of the terminal in the pitch direction as wide as possible. However, the structure is not limited to this, and a TFT display panel or the structure of the first embodiment may be used. In order to shorten the length of the terminal portion 8, the number of particles of the anisotropic conductive film is increased, or the structure of the anisotropic conductive film is a two-layer structure including a particle-free layer and a particle-containing layer. Also good.

本発明の実施例1の表示パネルの端子部を示す上面図The top view which shows the terminal part of the display panel of Example 1 of this invention 本発明の実施例1のフィルム基板の端子部を示す透視図The perspective view which shows the terminal part of the film substrate of Example 1 of this invention 本発明の実施例1の表示パネルとフィルム基板の端子を位置あわせした状態を示す上面の透視図The perspective view of the upper surface which shows the state which aligned the display panel of Example 1 of this invention, and the terminal of a film substrate 本発明の実施例1の表示パネルとフィルム基板の端子が位置ズレしたときの状態を示す上面の透視図The perspective view of the upper surface which shows a state when the display panel of Example 1 of this invention and the terminal of a film board | substrate have shifted | deviated from position. 本発明の実施例2の表示パネルとフィルム基板の端子を位置あわせした状態を示す上面の透視図The perspective view of the upper surface which shows the state which aligned the display panel of Example 2 of this invention, and the terminal of a film substrate 表示装置を示す側面図Side view showing a display device フィルム基板を示す上面図Top view showing film substrate 表示パネルを示す上面図Top view showing the display panel 従来技術の異方性導電膜を表示パネルに仮付けした状態を示す断面図Sectional drawing which shows the state which temporarily attached the anisotropic conductive film of the prior art to the display panel 従来技術の表示パネルとフィルム基板を異方性導電膜で接続した状態を示す断面図Sectional drawing which shows the state which connected the display panel and film substrate of the prior art with the anisotropic conductive film 従来技術の表示パネルとフィルム基板の接続後の端子の位置関係を示す上面から見た透視図The perspective view seen from the upper surface showing the positional relationship between the terminals after connecting the display panel of the prior art and the film substrate 従来技術の表示パネルとフィルム基板が位置ズレをして異方性導電膜で接続した状態を示す断面図Sectional drawing which shows the state which the display panel and film substrate of the prior art shifted, and were connected with the anisotropic conductive film 従来技術の表示パネルとフィルム基板が位置ズレをして接続した端子の位置関係を示す上面から見た透視図The perspective view seen from the upper surface showing the positional relationship of the terminals where the display panel and the film substrate of the prior art are connected with a positional shift. 従来技術の表示パネルとフィルム基板が位置ズレにより隣の電極とショートをして異方性導電膜で接続した状態を示す断面図Sectional drawing which shows the state which the display panel and film substrate of the prior art short-circuited with the adjacent electrode by position shift, and were connected with the anisotropic conductive film

符号の説明Explanation of symbols

1 表示パネルの端子
2 ガラス基板
3 1段目の端子
4 2段目の端子
5 ポリイミドフィルム
6 Cuにスズメッキをした端子
7 表示パネル
8 接続した端子部
9 フィルム基板
10 ドライバIC
11 異方性導電膜
DESCRIPTION OF SYMBOLS 1 Terminal of display panel 2 Glass substrate 3 Terminal of 1st stage 4 Terminal of 2nd stage 5 Polyimide film 6 Terminal which tin-plated Cu 7 Display panel 8 Connected terminal part 9 Film board 10 Driver IC
11 Anisotropic conductive film

Claims (4)

表示パネルとフィルム基板を異方性導電膜で接続した表示装置において、前記表示パネルと前記フィルム基板の接続している複数の端子は、それぞれ2段になって接続していることを特徴とする表示装置。   In the display device in which the display panel and the film substrate are connected by an anisotropic conductive film, the plurality of terminals connected to the display panel and the film substrate are connected in two stages, respectively. Display device. 前記端子の幅は、前記表示パネルと前記フィルム基板とも2種類であり、前記2種類の幅は前記表示パネルと前記フィルム基板でほぼ同一であり、前記端子の幅はその段毎に統一してあり、前記表示パネルと前記フィルム基板を接続している端子の幅は前記表示パネルと前記フィルム基板で異なる幅であることを特徴とする請求項1に記載の表示装置。   There are two types of terminal widths for the display panel and the film substrate, the two types of widths are substantially the same for the display panel and the film substrate, and the terminal widths are unified for each stage. The display device according to claim 1, wherein a width of a terminal connecting the display panel and the film substrate is different between the display panel and the film substrate. 前記表示パネルと前記フィルム基板の端子幅は、端子先端側の段の端子幅より2段目の端子幅の方が広いことを特徴とする請求項1に記載の表示装置。   2. The display device according to claim 1, wherein terminal widths of the display panel and the film substrate are wider in a terminal width of a second stage than a terminal width of a stage on a terminal tip side. 前記2段の端子の間隔が、前記端子のピッチより大きいことを特徴とする請求項1に記載の表示装置。   The display device according to claim 1, wherein an interval between the two stages of terminals is larger than a pitch of the terminals.
JP2005047664A 2005-02-23 2005-02-23 Display device Pending JP2006237158A (en)

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Cited By (8)

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JP2008071889A (en) * 2006-09-13 2008-03-27 Sony Corp Wiring circuit board connection structure, and electronic device using the same
WO2008059571A1 (en) * 2006-11-15 2008-05-22 Panasonic Corporation Circuit board connection structure and circuit board
JP2011040516A (en) * 2009-08-10 2011-02-24 Sumitomo Electric Printed Circuit Inc Connection structure for printed circuit board, connection structure for printed circuit board in hard disk drive, and electronic equipment
US8106309B2 (en) 2007-12-11 2012-01-31 Samsung Electronics Co., Ltd. Flexible printed circuit, display device including the same, and manufacturing method thereof
US20120312586A1 (en) * 2009-02-26 2012-12-13 Fujitsu Limited Flexible printed board
JP5306369B2 (en) * 2008-11-21 2013-10-02 シャープ株式会社 Substrate for display panel, display panel
JP2016146230A (en) * 2016-03-14 2016-08-12 大日本印刷株式会社 Suspension flexure substrate, suspension, suspension with head, hard disk drive, method for manufacturing the suspension flexure substrate, and method for inspecting the suspension flexure substrate
KR101726577B1 (en) * 2010-02-25 2017-04-27 엘지디스플레이 주식회사 Flexible Printed Circuit Film and Liquid Crystal Display Device using the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008071889A (en) * 2006-09-13 2008-03-27 Sony Corp Wiring circuit board connection structure, and electronic device using the same
WO2008059571A1 (en) * 2006-11-15 2008-05-22 Panasonic Corporation Circuit board connection structure and circuit board
US8106309B2 (en) 2007-12-11 2012-01-31 Samsung Electronics Co., Ltd. Flexible printed circuit, display device including the same, and manufacturing method thereof
JP5306369B2 (en) * 2008-11-21 2013-10-02 シャープ株式会社 Substrate for display panel, display panel
US20120312586A1 (en) * 2009-02-26 2012-12-13 Fujitsu Limited Flexible printed board
TWI419619B (en) * 2009-02-26 2013-12-11 Fujitsu Ltd Flexible printed board
US9295155B2 (en) 2009-02-26 2016-03-22 Fujitsu Limited Flexible printed board
JP2011040516A (en) * 2009-08-10 2011-02-24 Sumitomo Electric Printed Circuit Inc Connection structure for printed circuit board, connection structure for printed circuit board in hard disk drive, and electronic equipment
KR101726577B1 (en) * 2010-02-25 2017-04-27 엘지디스플레이 주식회사 Flexible Printed Circuit Film and Liquid Crystal Display Device using the same
JP2016146230A (en) * 2016-03-14 2016-08-12 大日本印刷株式会社 Suspension flexure substrate, suspension, suspension with head, hard disk drive, method for manufacturing the suspension flexure substrate, and method for inspecting the suspension flexure substrate

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