JP2010177493A - Electronic device and method of connecting terminal of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further ensure electrical conduction between a connection terminal of a first electronic component and that of a second electronic component, and to reduce electrical connection resistance between the connection terminals. <P>SOLUTION: First connection terminals 1 extending along a plurality of first lines L1 radially arranged, for instance, at intervals of equal angles α by passing through a first common intersection CP1 are formed in the first electronic component 4; second connection terminals 5 extending along a plurality of second lines L2 radially arranged, for instance, at the intervals of equal angles α by passing through a second common intersection CP2 are formed in the second electronic component 8; and the first connection terminals 1 and the second connection terminals 5 are superposed on each other and electrically connected to each other. In such an electronic device apparatus, both the first connection terminals 1 and the second connection terminals 5 are formed so that the widths thereof are increased as the first and second connection terminals 1, 5 separate from the first and second common intersections CP1, CP2, respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention is formed on a first electronic component such as a COF (Chip On Film), for example, a plurality of first connection terminals on an insulating substrate, and a second electronic component such as a liquid crystal panel, for example. The present invention relates to an electronic device device in which a plurality of second connection terminals on a glass substrate are overlapped and electrically connected. The present invention also relates to a terminal connection method between a first connection terminal and a second connection terminal in such an electronic device device.

  Conventionally, as shown in FIG. 18, a plurality of first connection terminals 101 are formed on an insulating substrate 103 of a COF (Chip On Film) 104, while a plurality of second connection terminals 101 are formed on a glass substrate 107 of a liquid crystal panel 108. The connection terminals 105 are formed, and the first connection region J1 of the first connection terminals 101 and the second connection region J2 of the second connection terminals 105 are overlapped as shown in FIG. It is connected to the. Reference numerals 102 and 106 in the drawing are first wirings connected to the first connection terminal 101 and second wirings connected to the second connection terminal 105.

  FIG. 20 shows a cross section in the direction of the arrow along the line C-C when the two are overlapped and electrically connected. Heat and pressure are applied to the first connection terminal 101 and the second connection terminal 105 with the anisotropic conductive adhesive 111 interposed therebetween. The anisotropic conductive adhesive 111 is composed of a resin 109 that exhibits insulating properties and adhesive properties, and conductive particles 110 that contribute to electrical connection, and the first connection terminal 101 and the second connection. Terminal 105 is electrically connected through conductive particles 110.

  By the way, the insulating substrate 103 of the COF 104 is generally composed of a thin film-like polyimide or the like, and contracts due to heat applied at the stage of manufacturing the COF 104, and easily expands or contracts depending on the subsequent temperature and humidity. On the other hand, in recent years, miniaturization of the liquid crystal screen has progressed, and the widths and pitches between the first connection terminals 101 and the second connection terminals 105 tend to be reduced. Therefore, when the COF 104 expands or contracts, There is a problem that the pitch dimension between the connection terminals 101 changes, and the alignment with the second connection terminal 105 becomes very difficult.

  Now, when the specified value of the pitch between the terminals of the first connection terminals 101 formed in the COF 104 is P, and the specified value of the pitch between the terminals of the second connection terminals 105 formed in the liquid crystal panel 108 is the same P It is assumed that the COF 104 contracts and the inter-terminal pitch of the first connection terminals 101 becomes P−α.

  At this time, as shown in FIG. 21, in order to minimize the relative displacement between the first connection terminal 101 and the second connection terminal 105, the first connection terminal 101 provided at the center line CL and the first connection terminal 101 When the two connection terminals 105 are aligned with each other, due to the contraction of the COF 104, the outermost dimensions of the first connection terminals 101 are, as shown in FIG. 21, the inter-terminal pitch of the first connection terminals 101. P-α becomes 8P-8α accumulated. Then, the relative positional deviation amount between the outermost first connection terminal 101 and the second connection terminal 105 becomes the largest.

  FIG. 22 shows a cross section in the direction of the arrow along the line DD in FIG. As shown in the drawing, the relative displacement between the first connection terminal 101 and the second connection terminal 105 increases as the distance from the center line CL increases. As the relative displacement amount increases, the number of conductive particles 110 contributing to electrical connection decreases, the connection resistance increases, and the liquid crystal display becomes unstable. In addition, the first connection terminal 101 is short-circuited by the adjacent second connection terminal 105 and the conductive particles 110 therebetween, or the conductivity between the first connection terminal 101 and the second connection terminal 105 is short. There is a problem in that the liquid crystal display is not performed correctly because the particles 110 cannot contact the terminals, resulting in poor connection.

  Thus, in order to solve such a problem, a conventional electronic device device as described in, for example, Patent Document 1 has been proposed.

  That is, as shown in FIG. 23, the first electronic component 210 is formed with a first connection terminal 211 extending along the first straight line L1, and the second electronic component 220 has a second straight line. A second connection terminal 221 extending along L2 is formed, and a plurality of first straight lines L1 are provided radially through the first common intersection P1, and the second straight line L2 is a second common line. Similarly, a plurality of radial lines are provided in order in the same manner at an angle corresponding to each angle between the plurality of first straight lines L1 through the intersection point P2. FIG. 23 shows a case where a plurality of first straight lines L1 and second straight lines L2 are provided radially at an equal angle α.

  In this way, even if the insulating substrate 214 of the first electronic component 210 expands or contracts, the position of the first connection terminal 211 only shifts along the first straight line L1. Accordingly, in a state where the first connection terminal 211 and the second connection terminal 221 are overlapped, one of them is planar in a direction approaching or moving away from the first common intersection P1 or the second common intersection P2. Only by shifting, the first connection terminal 211 and the second connection terminal 221 can be aligned and overlapped. Alternatively, as shown in FIG. 24, after the first common intersection P1 and the second common intersection P2 are aligned, one or both of the first electronic component 210 and the second electronic component 220 are rotated. By moving, the plurality of first connection terminals 211 and the plurality of second connection terminals 221 can be overlapped, and they are electrically connected. Reference numeral 224 in the figure is a substrate such as a glass substrate of the second electronic component 220.

  Therefore, even if the insulating substrate 214 expands or contracts, the first connection terminal 211 and the second connection terminal 221 can be accurately superimposed. Then, as shown in FIG. 25, a plurality of first terminals 211 and a plurality of second terminals 221 are connected by using a conductive paste 225 composed of a resin 226 and conductive particles 227, and conductive The conductive particles 227 can be electrically connected.

JP 2007-242941 A

  However, in recent years, the liquid crystal display tends to be further miniaturized, and accordingly, the pitch of the connection terminals 211 and 221 is reduced, and the width of the connection terminals 211 and 221 is also reduced. Even when used, the number of conductive particles 227 that contribute to electrical connection is insufficient, the electrical connection resistance value cannot be reduced to a required value, and the liquid crystal display becomes unstable. was there.

  Accordingly, an object of the present invention is to further ensure electrical continuity between the first connection terminal of the first electronic component and the second connection terminal of the second electronic component, and to electrically connect the connection terminals. Therefore, it is possible to reduce the connection resistance.

Therefore, the electronic device device according to the first aspect of the present invention is
A first connection terminal extending along a first straight line is formed on a first electronic component such as a COF (Chip On Film),
A second connection terminal extending along the second straight line is formed on the second electronic component such as a liquid crystal panel,
The first connection terminal and the second connection terminal are overlapped and electrically connected.
Here, a plurality of first straight lines are provided radially through the first common intersection, and a second straight line passes through the second common intersection and passes through each angle between the plurality of first straight lines. A plurality of radials are provided at corresponding angles.
The first connection terminal is formed to be wide as the distance from the first common intersection is increased, and the second connection terminal is separated from the second common intersection. .

  Either one or both of the first connection terminal and the second connection terminal is subjected to any one of gold plating, nickel-underlying gold plating, tin plating, tin-lead alloy plating, and tin-bismuth alloy plating. Good.

  The first connection terminal and the second connection terminal are overlapped and electrically connected with the conductive particles contained in the anisotropic conductive adhesive or the conductive particles contained in the anisotropic conductive film interposed therebetween. It is good to do so.

  The plating applied to both the first connection terminal and the second connection terminal is contacted in a state where pressure is constantly applied, and the first connection terminal and the second connection terminal are overlapped with each other. It is preferable to be electrically connected.

  In the electronic device device terminal connection method according to the second aspect of the present invention, the plurality of first connection terminals and the plurality of second connection terminals in the electronic device device according to the first aspect are electrically connected. When connected, after the first common intersection and the second common intersection are aligned, either one or both of the first electronic component and the second electronic component are rotated. The plurality of first connection terminals and the plurality of second connection terminals are overlapped with each other.

  According to the first aspect of the present invention, the first connection terminal is formed to be wide as the first connection terminal is separated from the first common intersection and the second connection terminal is separated from the second common intersection. Therefore, the connection area when the first connection terminal of the first electronic component and the second connection terminal of the second electronic component are overlapped and electrically connected is widened, and The electrical continuity can be further ensured, and the electrical connection resistance between the connection terminals can be reduced.

  In the electronic device device according to the first aspect, one or both of the first connection terminal and the second connection terminal are provided with gold plating, gold plating of nickel base, tin plating, tin lead alloy plating, tin bismuth alloy. When any one of the plating is applied, the rust prevention effect and electrical connection resistance can be reduced.

  Further, the first connection terminal and the second connection terminal are overlapped and electrically connected with the conductive particles contained in the anisotropic conductive adhesive or the conductive particles contained in the anisotropic conductive film interposed therebetween. In this case, the electrical connection resistance can be reduced by increasing the number of conductive particles contributing to electrical connection as the connection area is increased.

  In addition, the plating applied to both the first connection terminal and the second connection terminal is contacted in a state where pressure is constantly applied, and the first connection terminal and the second connection terminal are overlapped. If it is made to be electrically connected, it is not necessary to use a special connection device or a member for connection, and electrical connection can be performed at low cost.

  According to the second aspect of the present invention, after the first common intersection and the second common intersection are aligned, either one or both of the first electronic component and the second electronic component rotate. Since the plurality of first connection terminals and the plurality of second connection terminals are overlapped and electrically connected, only the alignment in the width direction is performed, and the first connection terminal and the second connection terminal are Since alignment in the length direction is unnecessary, alignment can be facilitated.

  In addition, since the first connection terminal is formed wider as the distance from the first common intersection and the second connection terminal away from the second common intersection, both of the first electronic components The connection area when the first connection terminal and the second connection terminal of the second electronic component are overlapped and electrically connected is increased, and the electrical conduction of these connection terminals is further ensured. In addition, the electrical connection resistance between the connection terminals can be reduced.

It is a partial top view of the 1st electronic component and 2nd electronic component which are used with the electronic device apparatus which is an example of this invention. It is a top view which expands and shows a part of 1st connection terminal of the 1st electronic component. It is a top view which expands and shows a part of 2nd connection terminal of the 2nd electronic component. It is a top view which shows the state in which those 1st connection terminals and 2nd connection terminals were overlapped and electrically connected. It is a top view of the 2nd electronic component which attached the 2nd alignment mark on the glass substrate. It is a top view of the 1st electronic component which attached | subjected the 1st mark on the insulated substrate. It is arrow direction sectional drawing which follows the AA line of FIG. It is arrow direction sectional drawing which follows the BB line of FIG. It is an abbreviated plan view showing a case where a second alignment mark is provided in the vicinity of the second connection terminal. It is an abbreviated plan view showing a case where a first alignment mark is provided in the vicinity of the first connection terminal. It is a top view which shows the state which accumulated the mask on the 1st alignment mark shown in FIG. It is a top view which shows the state which performed alignment of those 1st connection terminals and 2nd connection terminals. FIG. 6 is a plan view showing a state in which a mask is superimposed on a first alignment mark provided in the vicinity of a first connection terminal when the first electronic component is expanded. FIG. 10 is a plan view showing a state in which the first connection terminal provided with the first alignment mark and the second connection terminal shown in FIG. 9 are aligned. It is a top view which shows the state which provided the 1st alignment mark of another example in the vicinity of the 1st connection terminal, and overlapped the mask on the 1st alignment mark. It is sectional drawing which shows the state in which pressure is applied and the connection terminals are overlapped and electrically connected. It is sectional drawing which shows the state in which connection terminals were overlapped and electrically connected using the ultraviolet curing adhesive. It is the fragmentary top view of the 1st electronic component and 2nd electronic component which show the terminal shape of the 1st connection terminal of the conventional electronic device apparatus, and a 2nd connection terminal. FIG. 19 is a plan view of a state in which the first connection terminal and the second connection terminal of the electronic device device illustrated in FIG. 18 are overlapped and electrically connected. It is arrow direction sectional drawing which follows the CC line | wire of FIG. FIG. 19 is a state plan view when the first connection terminal and the second connection terminal of the electronic device device shown in FIG. 18 are aligned when the first electronic component contracts. It is arrow direction sectional drawing which follows the DD line | wire of FIG. It is a partial top view of the 1st electronic component and 2nd electronic component which show the terminal shape of the 1st connection terminal of another conventional electronic device apparatus, and a 2nd connection terminal. FIG. 24 is a plan view of a state where the first connection terminal and the second connection terminal of the electronic device device shown in FIG. 23 are aligned. It is a longitudinal cross-sectional view of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a first electronic component 4 and a second electronic component 8 that are used in an electronic device device that is an example of the present invention.

  In this example, the first electronic component 4 is a COF (Chip On Film), and a plurality of first connection terminals 1 and first wirings 2 connected thereto are formed on the insulating substrate 3. Each of the plurality of first connection terminals 1 extends along a first straight line L1 provided in a plurality of radial directions through the first common intersection CP1, and is connected to the first wiring 2 as it is. The first connection terminal 1 and the first wiring 2 are formed by etching a copper foil or the like, and in order to enhance the rust prevention effect and the electrical connection effect to be performed later, gold plating, nickel base It is preferable that any one of gold plating, tin plating, tin-lead alloy plating, and tin-bismuth alloy plating is applied. A region indicated by a in the figure is a connection region of the plurality of first connection terminals 1. The length of each first connection terminal 1 is determined by this connection region a.

  Each first connection terminal 1 may be stepped or stepwise as the distance from the first common intersection CP1 with the first straight line L1 as the center line so that the first straight line L1 passes through the center of the terminal width. Although it is good, it is formed in a taper shape with a thick tip so as to be continuously curved or linearly wide as in this example. Specifically, as can be seen from FIG. 2 which shows a part enlarged, for example, the dimension IG1 near the center between the first connection terminals, which is necessary to ensure electrical insulation characteristics and the like so as not to cause a short circuit, The first connecting terminal width IW1 near the center is preferentially secured and is anisotropic in order to facilitate alignment with a plurality of second connecting terminals 5 to be described later. In order to reduce the electrical connection resistance when connecting using a conductive conductive adhesive, it is set as wide as possible.

  On the other hand, the outer dimension OW1 of the first connection terminal width is preferably set as wide as possible in order to reduce the electrical connection resistance in the same manner as described above, and from the center dimension IW1 of the first connection terminal width. Is set to a large value (OW1> IW1). The outer dimension OG1 between the first connection terminals is set to be equal to or larger than the center dimension IG1 between the first connection terminals (OG1 ≧ IG1). The first wiring 2 extends with a constant width while maintaining the dimension IW1 closer to the center of the first connection terminal width.

  On the other hand, the second electronic component 8 is a liquid crystal panel in this example. As shown in FIG. 1, a plurality of second connection terminals 5 and second wirings 6 connected thereto are provided on a glass substrate 7. Is formed. A plurality of second connection terminals 5 are provided in a similar manner in a plurality of radial directions in turn, at an angle corresponding to each angle between the plurality of first straight lines L1 through the second common intersection CP2. Extending along the straight line L2 and connected to the second wiring 6 as it is. For example, when the arrangement angle of the first connection terminal 1 is A °, B °, C °, A °, B °, C °,... In order from the end, the arrangement angle of the second connection terminal is also Similarly, in order from the end, A °, B °, C °, A °, B °, C °,..., And a plurality of first connection terminals 1 and a plurality of second connection terminals 5. The corresponding placement angles are all equal.

Incidentally, in this example, a plurality of first connection terminals 1 and a plurality of second connection terminals 5 are both provided in a radial pattern at an equal angle α. The second connection terminal 5 and the second wiring 6 are formed of a metal oxide film such as an ITO film (InO ₃ ), on which a rust prevention effect and an electrical connection effect to be performed later are enhanced. It is preferable that any one of gold plating, nickel base gold plating, tin plating, tin lead alloy plating, and tin bismuth alloy plating is applied. This gold plating or the like may be applied to one of the first connection terminal 1 and the second connection terminal 5, or may be applied to both. In addition, a region denoted by reference sign b in the figure is a connection region for the plurality of second connection terminals 5. The length of the second connection terminal 5 is determined by the connection region b. It is preferable that the second electronic component 8 is set as long as possible within a range that can be provided.

  Each of the second connection terminals 5 may be stepped according to the distance from the second common intersection CP2 with the second straight line L2 as the center line so that the second straight line L2 passes through the center of the terminal width. As in this example, it is formed in a tapered shape so as to be continuously wide. Specifically, as can be seen from FIG. 3 that shows a part enlarged, for example, the dimension IG2 near the center between the second connection terminals, which is necessary to ensure electrical insulation characteristics and the like so as not to cause a short circuit, The center-side dimension IW2 of the second connection terminal width is preferentially secured, and is anisotropic in order to facilitate alignment with the plurality of first connection terminals 1 described later. In order to reduce the electrical connection resistance when connecting using a conductive conductive adhesive, it is set as wide as possible. In this example, IW1 = IW2.

  On the other hand, the outer dimension OW2 of the second connection terminal width is preferentially ensured as the center dimension IG2 between the second connection terminals, which is necessary to ensure electrical insulation characteristics and the like. In addition, in order to facilitate alignment with a plurality of first connection terminals 1 to be described later, which is performed later in the same manner as described above, the electrical connection resistance when connecting using an anisotropic conductive adhesive is set. In order to make it small, it is preferable to set it as wide as possible, and it is set to a value (OW2> IW2) larger than the center dimension IW2 of the second connection terminal width. The outer dimension OG2 between the second connection terminals is set to be equal to or larger than the center dimension IG2 between the second connection terminals (OG2 ≧ IG2), and in particular, the dimension OG2 = IG2. It is preferable.

  That is, the pitch between the first connection terminal 1 and the second connection terminal 5 is the smallest at the portion closest to the first common intersection CP1 or the second common intersection CP2, so that a predetermined interval required at this portion is obtained. (IG1 in FIG. 2, IG2 in FIG. 3) is secured, and the widths (IW1 in FIG. 2 and IW2 in FIG. 3) of the first connection terminal 1 and the second connection terminal 5 in this portion are determined. The widths of the first connection terminal 1 and the second connection terminal 5 are not constant as in the conventional example, but are continuous or stepped away from the first common intersection CP1 or the second common intersection CP2. Widely formed. If the condition of the portion with the smallest pitch between the connection terminals is the same as in the conventional example, IG1 in FIG. 2 and IG2 in FIG. 3 can be made the same as the minimum gap in the conventional example, and IW1 in FIG. 3 is the same as the width of the first connection terminal 1 and the second connection terminal 5 of the conventional example. Therefore, in the case of the present invention, since it is formed so as to be farther from the first common intersection CP1 or the second common intersection CP2 based on the width, it is always possible to “make the connection area wider” than the conventional example. I can say that. At this time, the interval is not always less than the minimum gap. That is, the relationship is set so that OG1 ≧ IG1 in FIG. 2 and OG2 ≧ IG2 in FIG. In this example, OW1 = OW2 is set.

  The first electronic component 4 and the second electronic component 8 are aligned with the terminal surfaces facing each other, and the first connection terminal 1 and the second connection terminal 5 are overlapped and electrically connected. Is done. In FIG. 4, the state is shown by omitting the insulating substrate 3, the glass substrate 7, and the anisotropic conductive adhesive 11 described later. At this time, the plurality of radial lines L1 passing through the first common intersection CP1 and the plurality of second straight lines L2 passing through the second common intersection CP2 are respectively the first common intersection CP1 or the second Are provided at the same equi-angle α at the same interval α, so that the positions coincide with each other and can overlap with each other, and the plurality of radial lines L1 and L2 on the radial lines L1 and L2 The positions of the first connection terminal 1 and the plurality of second connection terminals 5 are also coincident and can be in an overlapping state.

  Here, a case where the first electronic component 4 is expanded or contracted relative to the second electronic component 8 will be considered. When the X direction and the Y direction shown in FIG. 1 are expanded or contracted at the same rate, the plurality of first connection terminals 1 similarly exist on the plurality of first straight lines L1, and the first common intersection point Only the distance from CP1 changes.

  Therefore, when the first electronic component 4 expands relative to the second electronic component 8, the plurality of first connection terminals 1 are the second common along the plurality of radial lines L1. Since only the direction away from the intersection point CP <b> 2 is shifted, the plurality of first connection terminals 1 can be accurately aligned with the second connection terminals 5.

  On the other hand, when the first electronic component 4 contracts relative to the second electronic component 8, the plurality of first connection terminals 1 are second along the plurality of radial lines L1. Since it only shifts in the direction approaching the common intersection CP2, the plurality of first connection terminals 1 can be accurately aligned with the second connection terminals 5. In this way, when the plurality of first connection terminals 1 and the plurality of second connection terminals 5 are accurately aligned, as shown in FIG. 4, the first common intersection CP1 and the second common intersection CP2 Will coincide and overlap.

  Therefore, by aligning the positions of the first common intersection CP1 and the second common intersection CP2, it is possible to easily align the plurality of first connection terminals 1 and the plurality of second connection terminals 5. it can. Therefore, for example, a mark for alignment is provided at the positions of the first common intersection CP1 and the second common intersection CP2, and the first common intersection CP1 and the second common intersection CP2 are aligned using the marks. Then, one or both of the first electronic component 4 and the second electronic component 8 are rotated, and the plurality of first connection terminals 1 and the plurality of second connection terminals in the illustrated electronic device device are displayed. 5 is preferably overlapped and electrically connected.

  More specifically, as shown in FIG. 5, when the second common intersection CP2 is on the glass substrate 7, for example, the center point of the second mark 23 having a round shape is defined as the second common intersection CP2. These are formed using the same process as that of the second connection terminal 5. Further, as shown in FIG. 6, when the first center point CP1 is on the insulating substrate 3, for example, the center point of the first mark 22 having a round shape is made to coincide with the first common intersection CP1. The first connection terminal 1 is formed using the same process.

  Then, the second alignment mark 23 and the first alignment mark 22 formed are overlapped and aligned, and at the same time, the second connection terminal 5 formed on the Y axis shown in FIGS. 5 and 6 and the Y axis The first connection terminals 1 formed in the above are overlapped for alignment. Then, the positions of the other plurality of second connection terminals 5 and the plurality of first connection terminals 1 can also be accurately matched.

  In the example shown in FIG. 1, the first common intersection CP1 is located on the insulating substrate 3 of the first electronic component 4, and a mark can be provided at that position, but the second common intersection CP2 Since the position is located outside the glass substrate 7 of the second electronic component 8 and located in the space, no mark can be provided. Therefore, although it is difficult in the example shown in FIG. 1, in another example, when marks can be provided at the positions of the first common intersection CP1 and the second common intersection CP2, it is preferable to provide them.

  Next, consider a case where the first electronic component 4 expands or contracts with respect to the second electronic component at different rates in the X direction and the Y direction shown in FIG.

  When the expansion rate or the contraction rate in the X direction and the Y direction are slightly different, the alignment of the plurality of first connection terminals 1 and the plurality of second connection terminals 5 is performed using the same method as described above. However, the alignment error that occurs is negligible, and there is no problem. However, if there is a large difference between the expansion rate or contraction rate in the X direction and the Y direction, a mark is provided at the position of the first common intersection CP1 and the second common intersection CP2, and alignment is performed using this mark. When the method of performing is used, the alignment error may not be negligible. In such a case, it is preferable to use a method in which only the alignment of the plurality of first connection terminals 1 and the plurality of second connection terminals 5 is performed without using marks, and the alignment error is small enough to be ignored. can do.

  Now, after aligning the plurality of first connection terminals 1 and the plurality of second connection terminals 5, as shown in FIGS. 7 and 8, a resin 9 that exhibits insulation and adhesiveness, Heat and pressure are applied by sandwiching an anisotropic conductive adhesive 11 composed of electrically conductive particles 10 having electrical conductivity between the first electronic component 4 and the second electronic component 8. Then, the first connection terminal 1 and the second connection terminal 5 are electrically connected by contact or pressure contact of the conductive particles 11. 7 shows an arrow-direction cross section along the line AA in FIG. 4, and FIG. 8 shows an arrow-direction cross section along the line BB in FIG.

  As shown in FIGS. 7 and 8, the first connection terminal 1 and the second connection terminal 5 are fixed by a resin 9 constituting the anisotropic conductive adhesive 11, and the first connection terminal 1 It is electrically connected by the conductive particles 10 that are in contact with or pressed against both of the second connection terminals 5.

  Incidentally, the conductive particles 10 constituting the anisotropic conductive adhesive 11 are dispersed almost uniformly in the resin 9 constituting the anisotropic conductive adhesive 11. Therefore, the total number of the conductive particles 10 contributing to the electrical connection increases with probability as the contact area between the first connection terminal 1 and the second connection terminal 5 increases. As the width of the first connection terminal 1 and the second connection terminal 5 increases, the contact area increases and the number of conductive particles 10 contributing to electrical connection increases.

  Further, the distance from the first common intersection point CP1 or the second common intersection point CP2 is at a position farther in the cross-sectional portion in FIG. 8 than in the cross-sectional portion in FIG. Therefore, when FIG. 7 and FIG. 8 are compared, the width of the first connection terminal 1 and the second connection terminal 5 shown in FIG. 8 is wider, and the number of conductive particles 10 contributing to electrical connection is also greater. The cross-sectional portion of FIG. 8 is larger than the cross-sectional portion of FIG.

  As described above, the widths of the plurality of first connection terminals 1 and the plurality of second connection terminals 5 are provided so as to become wider as the distance from the first common intersection CP1 or the second common intersection CP2 increases. Since the area increases as the area becomes wider, the total number of conductive particles 10 that contribute to electrical connection can be increased, and the electrical connection resistance can be reduced. Therefore, the problem that the liquid crystal display of the second electronic component 8 which is a liquid crystal panel becomes unstable can be eliminated.

  In the example described above, the plurality of first connection terminals 1 and the plurality of second connection terminals 5 are electrically connected with the conductive particles 10 included in the anisotropic conductive adhesive 11 interposed therebetween. Although the case has been described, electrical connection may be made by sandwiching conductive particles contained in the anisotropic conductive film instead of the anisotropic conductive adhesive.

  Next, in the electronic device device according to the present invention, each of the plurality of first connection terminals 1 and the plurality of second connection terminals 5 is overlapped, and the position is determined using a device that combines the image recognition device and the automatic position control device. A method for performing the alignment will be described. In this method, for example, positioning marks formed on both ends of a dry plate previously set in an exposure machine are recognized using an image recognition device, and calculation processing is performed to obtain an X coordinate and a Y coordinate. To remember. Next, the image of the sprocket holes formed at both ends of the product and used for conveyance is recognized and the position thereof is grasped, and the X and Y coordinates are calculated and stored, and the X and Y coordinates of the dry plate and the product are stored. Positioning is performed so that the coordinates coincide with each other using an automatic positioning device.

  Here, since the second electronic component 8 which is a liquid crystal panel is formed of the glass substrate 7, the substrate is hardly affected by humidity and heat, and the amount of expansion and contraction is negligible and negligible. is there. For this reason, since the amount of change in dimension between the plurality of second connection terminals 5 is very small, the dimension does not change when the plurality of first connection terminals 1 and the plurality of second connection terminals 5 are aligned. It can be handled as a thing.

  On the other hand, the first electronic component 4 which is a COF is generally formed of an insulating substrate 3 using a polyimide film. The polyimide film is easily affected by humidity and heat, and is larger than the glass substrate 7. Inflates and contracts. Therefore, the dimension between the plurality of first connection terminals 1 formed on the insulating substrate 3 varies greatly as compared with the second connection terminals 5 formed on the glass substrate 7.

  More specifically, the first electronic component 4 is formed of the insulating substrate 3. The insulating substrate 3 is generally formed using an organic material such as polyimide as described above. It shrinks by heating in the processing step, and expands (expands) by moisture absorption of the finished product after processing. On the other hand, the copper foil generally used as a material for forming the first connection terminal 1 and the first wiring 2 has almost no shrinkage due to heating in the processing step, and is expanded by moisture absorption after processing. Nor.

  In this way, there is a difference in characteristics, and the first connection terminal 1 and the first wiring 2 are formed along the Y-axis direction in the case of FIG. 6, for example. One wiring 2 functions to restrain expansion and contraction of the insulating substrate 3. Therefore, the expansion rate (expansion rate) and contraction rate of the first electronic component 4 tend to be larger in the X-axis direction of FIG.

  For example, when the case where the first electronic component 4 contracts is considered, the X-axis direction shown in FIG. 6 is contracted (reduced) due to this tendency. Therefore, the first common intersection CP1 and the second common intersection CP2 When a mark is provided at the position and alignment is performed using this mark, the plurality of first connection terminals 1 provided on the first straight line L1 approach the Y-axis direction shown in FIG. And a relative shift occurs with respect to the plurality of second connection terminals 5. The reverse is true when the first electronic component 4 expands (expands).

  Therefore, next, with respect to the alignment method of the plurality of first connection terminals 1 and the plurality of second connection terminals 5, the case where the dimension between the plurality of first connection terminals 1 does not change and the case where the dimensions change greatly This will be explained separately. First, the case where the dimension between the plurality of first connection terminals 1 does not change will be described.

  When the dimension between the plurality of first connection terminals 1 does not change, first, as shown in FIG. 9, the second alignment mark 13 is placed on the left and right sides, for example, in the vicinity of the second connection terminals 5 at both ends. One (two in total) is provided on the second straight line L2 passing through the second common intersection CP2. The second alignment mark 13 is formed at the same time using the same formation method as that of the second connection terminal 5. In FIG. 9, only the second connection terminals 5 located at both ends and the center are shown, and the other second connection terminals 5 and the glass substrate 7 are omitted.

  Next, as shown in FIG. 10, first alignment marks 12 are first passed through the first common intersection CP 1, for example, in the vicinity of the first connection terminals 1 at both ends, five each on the left and right sides (total of ten). On the straight line L1. The first alignment mark 12 is formed at the same time using the same formation method as that of the first connection terminal 1. In FIG. 10, only the first connection terminal 1 located at both ends and the center is shown, and the other first connection terminals 1 and the insulating substrate 3 are omitted.

  Here, when the plurality of first connection terminals 1 and the plurality of second connection terminals 5 face each other and are aligned, the second straight line L2 passing through the second alignment mark 13 and the first The first straight line L1 passing through the alignment mark 12 is overlapped. The first alignment marks 12 provided at the left and right centers of the plurality of first alignment marks 12 are designed and formed so as to overlap with the second alignment marks 13.

  Then, in order to align the plurality of first connection terminals 1 and the plurality of second connection terminals 5, the plurality of first connection terminals 1 and the plurality of second connection terminals 5 are made to face each other. , Set to a predetermined position.

  Thereafter, each of the formed left and right second alignment marks 13 (two in total) is recognized using an image recognition device to obtain the center position, and the center positions of the left and right second alignment marks 13 are further determined. The distance between each other and the center between the distances are obtained by calculation processing, and stored as X2 coordinate axis and Y2 coordinate axis information shown in FIG. In order to make the image recognition apparatus used here less susceptible to the shape defect of the second alignment mark 13, a method of obtaining a center of gravity from the area and recognizing the position of the center of gravity as the center position of the alignment mark is used. preferable.

  Next, each of the five left and right first alignment marks 12 formed as shown in FIG. 10 is recognized and captured by an image recognition device, and an arithmetic process is performed to obtain the center of gravity of the area. The center of gravity position is recognized as the center position of the first alignment mark 12 group. By this method, the center of the position of each of the five first alignment marks 12 on the left and right sides coincides with the center position of one first alignment mark 12 provided at the center. By the way, this image recognition apparatus may use what was used for recognition of the 2nd alignment mark 13, and may use another thing. However, for the same reason as described above, it is preferable to use a system in which the position of the center of gravity is obtained from the area and the position of the center of gravity is recognized as the position of the alignment mark.

  Then, the distance between the recognized center positions of the left and right first alignment marks 12 and the center between the distances are obtained by calculation processing, and stored as X1 coordinate axis and Y1 coordinate axis information shown in FIG. Then, temporary positioning is performed by moving the first electronic component 4 using an automatic position control device so that the coordinate axis coincides with a preset position.

  Next, after performing temporary positioning, as shown in FIG. 11, a mask 14 that is preliminarily provided in the image recognition apparatus and in which the periphery of the mask slit 15 is shielded is superimposed on the image of the image recognition apparatus. By the way, the first alignment mark 12 and the first connection terminal 1 that overlap the light shielding portion are shielded from light and are not recognized, but are shown in FIG. 11 for explanation. The center position of the mask slit 15 is set so as to coincide with the center of the second alignment mark 13, and the width of the mask slit 15 is set to a dimension that can accommodate one first alignment mark 12. Is formed.

  Here, since the above is a description of the case where the dimension between the plurality of first connection terminals 1 has not changed, the first alignment mark 12 is formed as designed, and is shown in FIG. Thus, the state coincides with the center of the mask slit 15. Then, in this state, the first alignment mark 12 in the mask slit 15 is recognized by the image recognition device, the position of the center of gravity is obtained from the area, and the position of the center of gravity is obtained as the center point 16 for alignment. Then, the distance between the left and right alignment center points 16 is calculated to determine the center, and as shown in FIG. 11, the calculation processing is performed to determine and store the X3 coordinate axis and the Y3 coordinate axis.

  Then, using an automatic position control device, position control is performed so that the X2 coordinate axis and the Y2 coordinate axis which are obtained from the X3 coordinate axis and the Y3 coordinate axis and the second alignment mark 13 and stored are coincident with each other. Then, as shown in FIG. 12, the plurality of second connection terminals 5 and the plurality of first connection terminals 1 can be made to coincide with each other accurately.

  The above is a case where the first electronic component 4 does not expand or contract and the dimensions between the plurality of first connection terminals 1 can be formed as designed. Next, an alignment method when the first electronic component 4 expands and the dimension between the first connection terminals 1 becomes larger than the design value will be described.

  First, as shown in FIG. 9, each of the left and right (total two) second alignment marks 13 is recognized using an image recognition device to obtain the center position, and further, the left and right second alignment marks The distance between the 13 center positions and the center between the distances are obtained by calculation processing, and stored as X2 coordinate axis and Y2 coordinate axis information shown in FIG.

  Next, as shown in FIG. 10, each of the five left and right first alignment marks 12 formed as one is recognized and captured by an image recognition device, and is subjected to arithmetic processing to obtain the center of gravity of the area, The center of gravity position is recognized as the center position of the first alignment mark 12 group. By this method, the center of the position of each of the five first alignment marks 12 on the left and right sides coincides with the center position of one first alignment mark 12 provided at the center.

  Thereafter, the distance between the recognized center positions of the left and right first alignment marks 12 and the center between the distances are obtained by arithmetic processing and stored as X1 coordinate axis and Y1 coordinate axis information shown in FIG. Then, temporary positioning is performed by moving the first electronic component 4 using an automatic position control device so that the coordinate axis coincides with a preset position.

  Then, after positioning, as shown in FIG. 13, a mask 14 previously mounted on the image recognition apparatus and formed in the same manner as described above is superimposed on the image of the image recognition apparatus. Here, the first electronic component 4 expands, the dimension between the first connection terminals 1 becomes larger than the design value, and the distance between the center positions of the left and right first alignment marks 12 is also increased. Yes. FIG. 13 shows a state where, for example, the center of the fourth first alignment mark 12 from the left and right ends coincides with the center of the mask slit 15 in the axial direction.

  In this state, the first alignment mark 12 in the mask slit 15 is recognized by the image recognition device, the center of gravity position is obtained from the area, and the center of gravity position is obtained as the alignment center point 16. Thereafter, the distance between the left and right alignment center points 16 is calculated to obtain the center, and the X3 coordinate axis and Y3 coordinate axis shown in FIG. 13 are obtained and stored.

  Next, position control is performed using an automatic position control device so that the X2 coordinate axis and the Y2 coordinate axis which are obtained from the X3 coordinate axis and the Y3 coordinate axis and the second alignment mark 13 and are stored coincide with each other. Then, as shown in FIG. 14, the plurality of second connection terminals 5 and the plurality of first connection terminals 1 can be aligned.

  By the way, the above explanation is the alignment method when the first electronic component 4 expands and the dimension between the first connection terminals 1 becomes larger than the design value. Even when the dimensions between the first connection terminals 1 are reduced and become smaller than the design value, alignment can be similarly performed by using the same method.

  The method of providing the first alignment marks 12 in a round shape with five each on the left and right (total of ten) has been described. However, in such a shape, depending on the amount of expansion or contraction of the first electronic component 4, two first alignment marks 12 may be included in the width of the mask slit 15. In this case, the alignment center point 16 is set at a position where the center of gravity is biased toward the larger area of the first alignment mark 12. Therefore, an error occurs in the alignment accuracy.

  Therefore, the first alignment mark 12 may be provided in a long shape as shown in FIG. Then, the distance between the first alignment marks 12 recognized by the image recognition apparatus is calculated to obtain the center, and as shown in FIG. 15, the X1 coordinate axis and the Y1 coordinate axis are calculated to obtain the coordinate axis. Temporary positioning is performed by moving the first electronic component 4 using an automatic position control device so as to coincide with the position. In order to make it less susceptible to the shape defect of the first alignment mark 12, it is preferable to use a method of obtaining the center of gravity from the area and recognizing the position of the center of gravity as the center position of the alignment mark.

  Thereafter, as shown in FIG. 15, the mask 14 is overlaid on the image of the image recognition apparatus. In this state, the first alignment mark 12 in the mask slit 15 is recognized by the image recognition device, the center of gravity position is obtained from the area, and the center of gravity position is obtained as the alignment center point 16. Then, the distance between the left and right alignment center points 16 is calculated to obtain the center, and the X3 coordinate axis and the Y3 coordinate axis shown in FIG. 15 are obtained and stored. When such one long shape is used, the area of the first alignment mark 12 in the mask slit is not biased, so that the alignment center point 16 is also set to a position free of bias.

  Therefore, by using an automatic position control device, position control is performed so that the X2 coordinate axis and the Y2 coordinate axis obtained and stored from the X3 coordinate axis and the Y3 coordinate axis and the second alignment mark 13 are matched, The second connection terminal 5 and the plurality of first connection terminals 1 can be accurately matched and matched.

  Next, a comparison with the prior art will be described. For example, when the method of Patent Document 1 shown in FIGS. 23 to 25 is used, the outermost first terminal 211 and the second terminal 221 are widened to increase the area. Is formed with a certain width. Therefore, problems such as large electrical connection resistance and unstable liquid crystal display cannot be eliminated.

  In contrast, in the present invention, the center-side dimension IW1 of the first connection terminal width shown in FIG. 2 and the center-side dimension IW2 of the second connection terminal width shown in FIG. 3 are set to the same width (IW1 = IW2). Further, when the same value as the widths of the first terminal 211 and the second terminal 221 in the prior art is used, the first connection terminal width outside the first connection terminal width is located away from the first and second common intersections CP1 and CP2. The offset dimension OW1 and the outer dimension OW2 of the second connection terminal width are formed wider and have a relationship of OW2> IW2 and OW1> IW1. Therefore, when the lengths of the conventional connection terminal and the connection terminal of the present invention are the same, the first connection terminal 1 and the second connection terminal 2 of the present invention are larger than the areas of the conventional first terminal 211 and the second terminal 221. The area of the connection terminal 5 becomes wider, the total number of conductive particles contributing to electrical connection can be increased, and the electrical connection resistance can be reduced, so that the liquid crystal display becomes unstable. And so on.

  By the way, as another example, plating is performed on both of the plurality of first connection terminals and the plurality of second connection terminals, the plating faces each other and is contacted with pressure constantly applied, The first connection terminal and the second connection terminal may be overlapped and electrically connected.

  For example, as shown in FIG. 4, after aligning the plurality of first connection terminals 1 and the plurality of second connection terminals 5, as shown in FIG. 16, the first electronic component 4 (COF) The pressing plate 21 and the second electronic component 8 are fixed in a state where an elastic body 19 is interposed between the pressing plate 21 and a force is applied to sandwich the elastic body 19. If it does in this way, the force which always contacts will be added to the 1st connecting terminal 1 and the 2nd connecting terminal 5 by the repulsive force of the elastic body 19, and the state which always contacted can be maintained. Therefore, an electrically stable connection can be made.

  Further, when the connection is made using such a method, the first electronic component 4 (COF) and the first connection terminal 1 have flexibility, so that the first connection terminal 1 and the second connection terminal 5 are connected to each other. It is possible to make electrical connection by making contact at more than a point (actually, a large number of points), and the connection resistance can be reduced. Since the areas of the first connection terminal 1 and the second connection terminal 5 of the present invention can be increased, the number of contact points can be further increased, so that the connection resistance can be further reduced.

  Here, since it is necessary to apply a uniform pressure to the first electronic component 4 (COF), it is preferable to use a rubber-based elastic body 19 that can follow a fine shape. Since it is necessary to generate a repulsive force over a wide range, it is preferable to select a type with little aging deterioration.

  In addition to using an anisotropic conductive adhesive, for example, as shown in FIG. As shown in FIG. 4, after aligning the plurality of first connection terminals 1 and the plurality of second connection terminals 5, as shown in FIG. After interposing between the connection terminal 1 and the second connection terminal 5, the first electronic component 4 (COF) and the ultraviolet curable adhesive 17 are bonded to the holding jig 18 to which the elastic body 19 is attached and the second electronic component 4 (COF). A pressure is applied between the electronic components 8 and the ultraviolet ray 20 is irradiated in this state to cure the ultraviolet curable adhesive 17. As a result, a force that maintains the contact state is always applied to the first connection terminal 1 and the second connection terminal 5 due to the curing shrinkage phenomenon caused by the curing of the ultraviolet curable adhesive 17, and the contact always occurs. Therefore, an electrically stable connection is made.

  Further, when the connection is made using such a method, the first electronic component 4 (COF) and the first connection terminal 1 have flexibility, so that the first connection terminal 1 and the first connection terminal 1 are the same. The two connection terminals 5 can be brought into contact with each other at four or more points (in reality, a large number of points) to be electrically connected, and the connection resistance can be reduced. And since the area of the 1st connection terminal 1 and the 2nd connection terminal 5 which are used with the electronic device apparatus of this invention can be increased, the number of contact points can be increased further and connection resistance is made smaller. be able to. The elastic body 19 is used to apply pressure uniformly, and it is preferable to use a rubber-based elastic body that is not easily affected by the ultraviolet ray 20 and has excellent ultraviolet resistance.

DESCRIPTION OF SYMBOLS 1 1st connection terminal 2 1st wiring 3 Insulating substrate 4 1st electronic component 5 2nd connection terminal 6 2nd wiring 7 Glass substrate 8 2nd electronic component 9 Resin 10 Conductive particle 11 Anisotropy Conductive adhesive 12 First alignment mark 13 Second alignment mark 14 Mask 15 Mask slit 16 Center point 17 for alignment 17 UV curable adhesive 18 Holding jig 19 Elastic body 20 Ultraviolet ray 21 Holding plate 22 First mating Symbol 23 Second alignment symbol a First connection terminal connection region b Second connection terminal connection region CP1 First common intersection point CP2 Second common intersection point L1 First straight line L2 Second straight line OW1 First Outer dimension IW1 of the first connection terminal width OG1 Outer dimension IG1 of the first connection terminal width IG1 Outer dimension of the first connection terminal center OW2 Outside of the second connection terminal width Shifting dimension IW2 Centering dimension OG2 of second connection terminal width OG2 Outer dimensioning between second connection terminals IG2 Centering dimension between second connection terminals

Claims (5)

A first connection terminal extending along a first straight line that is radially provided through the first common intersection is formed on the first electronic component,
A second connection extending along a second straight line provided radially to the second electronic component through a second common intersection at an angle corresponding to each angle between the plurality of first straight lines. Terminals are formed,
In the electronic device device in which the first connection terminal and the second connection terminal are overlapped and electrically connected,
An electronic device characterized in that both the first connection terminals are formed wider as the distance from the first common intersection and the second connection terminals are separated from the second common intersection. apparatus. The electronic device device according to claim 1.
Either one or both of the first connection terminal and the second connection terminal is subjected to any one of gold plating, gold plating of a nickel base, tin plating, tin lead alloy plating, and tin bismuth alloy plating. An electronic device device characterized by that. The electronic device device according to claim 1 or 2,
The first connection terminal and the second connection terminal are overlapped and electrically connected with sandwiching conductive particles contained in the anisotropic conductive adhesive or conductive particles contained in the anisotropic conductive film. An electronic device device characterized by being made. The electronic device device according to claim 2.
The plating applied to both the first connection terminal and the second connection terminal is contacted in a state where pressure is constantly applied, and the first connection terminal and the second connection terminal overlap each other. And an electronic device that is electrically connected. 3. When the plurality of first connection terminals and the plurality of second connection terminals are electrically connected to each other in the electronic device device according to claim 1, the first common intersection and the second connection terminals After the common intersection is aligned, either one or both of the first electronic component and the second electronic component are rotated, and a plurality of the first connection terminals and a plurality of the second electronic components are rotated. A terminal connection method for an electronic device, wherein the connection terminal is overlapped.

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