CN112423464B - Auxiliary measuring circuit of flexible circuit board - Google Patents
Auxiliary measuring circuit of flexible circuit board Download PDFInfo
- Publication number
- CN112423464B CN112423464B CN201910875877.8A CN201910875877A CN112423464B CN 112423464 B CN112423464 B CN 112423464B CN 201910875877 A CN201910875877 A CN 201910875877A CN 112423464 B CN112423464 B CN 112423464B
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- Prior art keywords
- lines
- circuits
- auxiliary
- circuit board
- measuring
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000005259 measurement Methods 0.000 claims description 49
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims 2
- 238000003908 quality control method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses an auxiliary measuring circuit of a flexible circuit board, which comprises a flexible substrate and a circuit layer, wherein the flexible substrate is provided with an upper surface, the circuit layer is positioned on the upper surface, the circuit layer is provided with a plurality of oblique line circuits and two auxiliary measuring circuits, the oblique line circuits are relatively inclined to the side edge of the flexible substrate, the two auxiliary measuring circuits are relatively inclined to the oblique line circuits, and the extension lines of the two auxiliary measuring circuits are respectively intersected with the two oblique line circuits at a first measuring point and a second measuring point.
Description
Technical Field
The present invention relates to a flexible printed circuit, and more particularly to an auxiliary measurement circuit for a flexible printed circuit.
Background
The display has entered the era of no frame or very narrow frame, and its main technique is to make the driving IC and the printed circuit board able to be arranged on the back of the display by means of the flexibility of the flexible circuit board, so that the frame of the display only needs to keep a very small space. A typical flexible circuit board, such as a tape on film (tape on film) package, has a flexible substrate, and a patterned circuit layer and a Chip disposed on the flexible substrate, wherein the patterned circuit layer is used for transmitting signals between the Chip and the printed circuit board and between the Chip and a display substrate, and the patterned circuit layer can be divided into an input terminal and an output terminal according to its connection area with the printed circuit board or the display substrate. The input end of the patterned circuit layer is electrically connected with the printed circuit board so as to receive an input signal from the printed circuit board and transmit the input signal to the chip, and the chip processes the input signal into proper voltage and then transmits the voltage to the output end of the patterned circuit layer and outputs the voltage to the display substrate from the output end for driving.
As the resolution of the display is improved, the number of the output driving signals required by the flexible printed circuit board is gradually increased, and thus, the width and the distance between the lines of the patterned line layer are also gradually decreased, which results in an increase in the difficulty of the quality control, please refer to fig. 1, where if the detection item in the quality control is the distance between the two intersection points Ma of the two outermost inclined lines and the pre-cut line CL, the measurement point needs to be located at the intersection point Ma of the inclined line and the pre-cut line. However, the pre-cut line CL is a virtual line and is not actually formed on the finished product of the flexible printed circuit board, so that the finished product of the flexible printed circuit board cannot be directly aligned with the two intersection points Ma for measurement and may be shifted during quality control, if the measurement point is shifted to two points Mb, the measured distance is greater than the actual value, and if the measurement point is shifted to two points Mc, the measured distance is smaller than the actual value.
Disclosure of Invention
The main objective of the present invention is to position the measurement points of the diagonal lines by the extension lines of the auxiliary measurement lines of the line layer, so as to accurately measure the distance between the diagonal lines.
The invention relates to an auxiliary measuring circuit of a flexible circuit board, which comprises a flexible substrate and a circuit layer, wherein the flexible substrate is provided with an upper surface, the circuit layer is positioned on the upper surface, the circuit layer is provided with a plurality of oblique lines and two auxiliary measuring circuits, the oblique lines are relatively inclined to the side edge of the flexible substrate, the two auxiliary measuring circuits are relatively inclined to the oblique lines, and the extending lines of the two auxiliary measuring circuits are respectively intersected with the two oblique lines at a first measuring point and a second measuring point.
Furthermore, the flexible substrate has a pre-cut line, and the pre-cut line intersects with the two oblique lines at the first measuring point and the second measuring point respectively.
Furthermore, the circuit layer is provided with a plurality of straight lines, each straight line is electrically connected with each oblique line, and each straight line is substantially parallel to the side edge of the flexible substrate.
Furthermore, the auxiliary measuring circuit of the flexible circuit board also comprises a solder mask layer, the plurality of linear circuits are provided with inner pin parts, the linear circuits of the solder mask layer cover part are covered by the solder mask layer, and the inner pin parts of the plurality of linear circuits are exposed by the solder mask layer.
Furthermore, the auxiliary measuring circuit of the flexible circuit board also comprises a chip, wherein the chip is arranged on the upper surface and is electrically connected with the inner pin part of the linear circuit.
Furthermore, the two auxiliary measuring circuits are not electrically connected with the plurality of diagonal lines.
Furthermore, the two auxiliary measuring circuits and the plurality of diagonal lines are obtained by patterning and etching the same metal layer.
Furthermore, the auxiliary measuring circuit of the flexible circuit board further comprises a solder mask layer, the oblique line is covered by the solder mask layer, the first measuring point and the second measuring point of the two oblique lines are exposed by the solder mask layer, and the first measuring point and the second measuring point are positioned at the outer pin parts of the oblique lines.
Furthermore, the two diagonal lines intersecting the extension lines of the two auxiliary measurement lines are two non-parallel lines.
Furthermore, the auxiliary measuring circuit is substantially parallel to the side edge of the flexible substrate.
The auxiliary measuring circuit is used for positioning the measuring points on each inclined line, so that the positioning of the measuring points for quality control and management is facilitated, and the problem of distance measuring errors caused by a plurality of micro offsets of the measuring points can be avoided.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:
FIG. 1 is a schematic diagram of a flexible circuit board of the prior art;
FIG. 2 is a schematic diagram of a flexible printed circuit according to an embodiment of the invention;
FIG. 3 is a cross-sectional view of the FPC according to an embodiment of the present invention;
FIG. 4 is a diagram illustrating a wiring diagram of the FPC according to an embodiment of the present invention;
fig. 5 shows a wiring diagram of the flexible circuit board according to another embodiment of the present invention.
[ description of main element symbols ]
100 flexible circuit board 110 flexible substrate
111 upper surface 112 side edge
120 line layer 121 straight line
122 diagonal line 123 for auxiliary measurement line
130 solder mask layer 140 chip
141 bump EL extension line
First measuring point of CL pre-shear tangent M1
M2 intersection of second measurement points Ma, Mb and Mc
OL outer lead part and IL inner lead part
M measuring point
Detailed Description
In order to make the description of the invention more complete and thorough, the following illustrative description is given for implementation aspects and embodiments of the invention; it is not intended to be the only form in which the embodiments of the invention may be practiced or utilized. The various embodiments disclosed below may be combined with or substituted for one another where appropriate, and additional embodiments may be added to one embodiment without further recitation or description. In the following description, numerous specific details are set forth to provide a thorough understanding of the following embodiments. However, embodiments of the invention may be practiced without these specific details.
The embodiments of the present invention will be described in detail below, but the present invention is not limited to the scope of the examples.
Referring to fig. 2 and fig. 3, which are schematic views of a flexible circuit board 100 according to an embodiment of the present invention, the flexible circuit board 100 includes a flexible substrate 110, a circuit layer 120, a solder mask layer 130 and a chip 140, the flexible substrate 110 has an upper surface 111, the circuit layer 120 is located on the upper surface 111, wherein the flexible substrate 110 may be polyimide (Po yimi de, P I), the circuit layer 120 is obtained by performing patterned etching (Etch) on a metal layer laminated on the upper surface 111, and the metal layer may be copper, or the metal layer may be a double-layer structure formed by a nickel-chromium layer electroplated on the upper surface 111 of the flexible substrate 110 and a copper layer electroplated on the nickel-chromium layer, and the double-layer metal layer is the circuit layer 120 by performing patterned etching (Etch). Referring to fig. 2, in the present embodiment, the circuit layer 120 has a plurality of straight lines 121, a plurality of diagonal lines 122 and two auxiliary measurement lines 123, each diagonal line 122 is electrically connected to each straight line 121, in the present embodiment, the straight lines 121 and the diagonal lines 122 electrically connected to each other are the same line, and the side 112 of the flexible substrate 110 is defined as a straight line or a diagonal line, wherein a line substantially parallel to the side 112 of the flexible substrate 110 is defined as the straight line 121, and a line substantially relatively inclined, i.e., not parallel to the side 112 of the flexible substrate 110 is defined as the diagonal line 122.
Referring to fig. 2 and 3, the solder mask layer 130 covers the portion of the linear circuit 121 and the portion of the diagonal circuit 122, and the solder mask layer 130 exposes the portion of the linear circuit 121 and the portion of the plurality of diagonal circuits 122. In the present embodiment, the portions of the plurality of diagonal lines 122 exposed by the solder mask layer 130 are outer lead portions OL of the diagonal lines 122 for electrically connecting with a substrate (not shown) of a display, the portions of the plurality of linear lines 121 (shown by dotted lines) exposed by the solder mask layer 130 are inner lead portions I L of the linear lines 121 for electrically connecting with the plurality of bumps 141 of the chip 140, and the portions of the plurality of linear lines 121 exposed by the solder mask layer 130 are outer lead portions OL of the linear lines 121 for electrically connecting with a printed circuit board (not shown). In other embodiments, the inner lead portion I L electrically connected to the chip 140 may also be a diagonal line, or the outer lead portions OL at both ends may be diagonal lines, and the invention is not limited thereto.
Referring to fig. 2, the two auxiliary measurement lines 123 are used to assist in positioning measurement points on two diagonal lines 122, wherein the two auxiliary measurement lines 123 are not electrically connected to the multiple diagonal lines 122, and the two auxiliary measurement lines 123 are relatively inclined to the multiple diagonal lines 122, so that an extension line EL of each auxiliary measurement line 123 can intersect the two diagonal lines 122 at a first measurement point M1 and a second measurement point M2, in this embodiment, the two diagonal lines 122 intersecting the extension lines EL of the two auxiliary measurement lines 123 are two non-parallel lines, and the first measurement point M1 and the second measurement point M2 are located at the outer lead portions OL of the two diagonal lines 122 and exposed outside the solder mask layer 130.
Referring to fig. 2, in the present embodiment, by designing the positions of the two auxiliary measurement lines 123 on the upper surface 111, the intersection point of each extension line EL and the two diagonal lines 122 is also the intersection point between the pre-cut line CL and the two diagonal lines 122. Since the two auxiliary measuring lines 123 are formed on the upper surface 111 of the flexible substrate 110, when performing quality control on the finished flexible circuit board 100, the extending line EL of each auxiliary measuring line 123 can position the measuring points at the first measuring point M1 and the second measuring point M2 of the two diagonal lines 122, so as to accurately measure the distance between the two intersections of the two diagonal lines 122 and the pre-cut line CL. In other embodiments, if the distance to be measured of the finished flexible circuit board 100 is not the distance between the intersection points of the plurality of diagonal lines 122 and the pre-cut line CL, the positions of the two auxiliary measuring lines 123 may also be changed such that the extending line EL thereof can intersect with the two diagonal lines 122 at the measuring point to be measured, and the intersection of the first measuring point M1 and the second measuring point M2 with the pre-cut line CL is not limited by the present invention.
Referring to fig. 2, in the present embodiment, each of the auxiliary measuring circuits 123 is substantially parallel to the side 112 of the flexible substrate 110, so as to facilitate extending the extension line EL during the subsequent measurement. However, in other embodiments, each of the auxiliary measurement lines 123 may be a diagonal line that is inclined relative to the side 112 of the flexible substrate 110, and the extending line EL of each of the auxiliary measurement lines 123 and each of the diagonal lines 122 can intersect to locate the measurement point to be measured only if each of the auxiliary measurement lines 123 is not parallel to the diagonal line 122 to be measured.
Referring to fig. 4 and 5, which are layout diagrams of the flexible circuit board in two embodiments, the first measurement point and the second measurement point where the two auxiliary measurement lines 123 (only one side of which is shown in fig. 4) and the two diagonal lines 122 intersect are located on the pre-cut line CL, and since the pre-cut line CL is only shown on the layout diagram, the finished flexible circuit board 100 does not have the pre-cut line CL, so the measurement of the finished flexible circuit board 100 can locate the measurement point on each diagonal line 122 by the extension line EL of the two auxiliary measurement lines 123, wherein the partial enlarged view of fig. 4 can see the measurement point M where the extension line EL of the auxiliary measurement line 123 on the right side intersects the diagonal line 122 on the rightmost side, and similarly the extension line EL of the auxiliary measurement line 123 on the left side intersects the diagonal line 122 on the leftmost side (not shown), therefore, the quality control pipe can be accurately positioned on the measuring point and the distance required to be measured by the quality control pipe can be accurately measured. The flexible printed circuit shown in fig. 5 has four auxiliary measuring lines 123 (only one side is shown in fig. 5), and the extending lines EL of the four auxiliary measuring lines 123 intersect with the two diagonal lines 122 at four measuring points, and the four measuring points are not located on the pre-cut line CL, and the enlarged view of fig. 5 can see that the extending lines EL of the two right auxiliary measuring lines 123 intersect with the two right diagonal lines 122 at two measuring points M, and similarly, the extending lines EL of the left auxiliary measuring line 123 intersect with the left diagonal line 122 at two measuring points (not shown), and the four measuring points can be respectively used for the quality control tube to accurately align with the measuring points to be measured and measure the distance between the two measuring points.
The present invention positions the measurement points on each diagonal line 122 by the auxiliary measurement line 123, which is beneficial to positioning the measurement points for quality control and can avoid the problem of distance measurement error caused by multiple micro-offsets of the measurement points.
The scope of the present invention is defined by the appended claims, and any changes and modifications that may be made by one skilled in the art without departing from the spirit and scope of the present invention are intended to be covered by the following claims.
Claims (9)
1. An auxiliary measuring circuit of a flexible circuit board, comprising:
a flexible substrate having an upper surface; and
the circuit layer is positioned on the upper surface and provided with a plurality of oblique line circuits and two auxiliary measuring circuits, the oblique line circuits are relatively inclined to the side edge of the flexible substrate, the two auxiliary measuring circuits are relatively inclined to the oblique line circuits, the extension lines of the two auxiliary measuring circuits are respectively intersected with the two oblique line circuits at a first measuring point and a second measuring point, the flexible substrate is provided with a pre-shearing line, and the pre-shearing line is respectively intersected with the two oblique line circuits at the first measuring point and the second measuring point.
2. The flexible circuit board of claim 1, wherein the circuit layer has a plurality of straight lines, each of the straight lines is electrically connected to each of the diagonal lines, and each of the straight lines is substantially parallel to the side of the flexible substrate.
3. The auxiliary measurement circuit of claim 2, further comprising a solder mask layer, wherein the plurality of linear circuits have inner lead portions, the solder mask layer covers the linear circuits of the portion, and the solder mask layer exposes the inner lead portions of the plurality of linear circuits.
4. The auxiliary measuring circuit of claim 3, further comprising a chip disposed on the upper surface and electrically connected to the inner lead portion of the linear circuit.
5. The flexible circuit board of claim 1, wherein the two auxiliary measurement circuits are not electrically connected to the slanted lines.
6. The flexible circuit board of claim 1 or 5, wherein the two auxiliary measurement circuits and the plurality of diagonal lines are formed by patterned etching of the same metal layer.
7. The circuit for auxiliary measurement of a flexible circuit board of claim 1, further comprising a solder mask layer covering the diagonal lines of the portion, wherein the solder mask layer exposes the first and second measurement points of the diagonal lines, and the first and second measurement points are located at outer leads of the diagonal lines.
8. The flexible circuit board of claim 1, wherein the two diagonal lines intersecting the extension lines of the two auxiliary measurement lines are two non-parallel lines.
9. The flexible circuit board of claim 1, wherein the auxiliary measurement trace is substantially parallel to the side of the flexible substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108129925A TWI701451B (en) | 2019-08-21 | 2019-08-21 | Measurement-assisted lead of flexible circuit board |
| TW108129925 | 2019-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112423464A CN112423464A (en) | 2021-02-26 |
| CN112423464B true CN112423464B (en) | 2022-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910875877.8A Active CN112423464B (en) | 2019-08-21 | 2019-09-17 | Auxiliary measuring circuit of flexible circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112423464B (en) |
| TW (1) | TWI701451B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003258396A (en) * | 2002-02-28 | 2003-09-12 | Seiko Epson Corp | Electronic device and method of manufacturing the same, semiconductor device and electronic equipment |
| CN1518083A (en) * | 2003-01-28 | 2004-08-04 | ͬ�Ϳ�ҵ��ʽ���� | Thin film type carrier band for mounting electronic device and final defect labelling method of using the carrier band |
| US10177094B1 (en) * | 2018-03-22 | 2019-01-08 | United Microelectronics Corp. | Measurement mark and method for monitoring semiconductor process |
| CN208538837U (en) * | 2018-01-26 | 2019-02-22 | 奕力科技股份有限公司 | Thin film flip chip packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3700714B2 (en) * | 2002-06-21 | 2005-09-28 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
| TWI292482B (en) * | 2004-09-29 | 2008-01-11 | Chi Mei Optoelectronics Corp | Flexible packaging substrate, method of cutting precision test, method of fabricating flexible packaging unit, liquid crystal display module, and method of fabricating of liquid crystal display module |
| JP4068635B2 (en) * | 2005-09-30 | 2008-03-26 | 松下電器産業株式会社 | Wiring board |
| TWI341392B (en) * | 2007-10-12 | 2011-05-01 | Chimei Innolux Corp | Display module |
| KR102097150B1 (en) * | 2013-02-01 | 2020-04-03 | 엘지디스플레이 주식회사 | Flexible display substrate, flexible organic light emitting display device and method for manufacturing the same |
| US9544994B2 (en) * | 2014-08-30 | 2017-01-10 | Lg Display Co., Ltd. | Flexible display device with side crack protection structure and manufacturing method for the same |
| US10353253B2 (en) * | 2015-01-16 | 2019-07-16 | Sharp Kabushiki Kaisha | Mounting substrate and display device |
| CN107926142B (en) * | 2015-08-19 | 2021-05-11 | 株式会社富士 | Measuring apparatus |
-
2019
- 2019-08-21 TW TW108129925A patent/TWI701451B/en active
- 2019-09-17 CN CN201910875877.8A patent/CN112423464B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258396A (en) * | 2002-02-28 | 2003-09-12 | Seiko Epson Corp | Electronic device and method of manufacturing the same, semiconductor device and electronic equipment |
| CN1518083A (en) * | 2003-01-28 | 2004-08-04 | ͬ�Ϳ�ҵ��ʽ���� | Thin film type carrier band for mounting electronic device and final defect labelling method of using the carrier band |
| CN208538837U (en) * | 2018-01-26 | 2019-02-22 | 奕力科技股份有限公司 | Thin film flip chip packaging structure |
| US10177094B1 (en) * | 2018-03-22 | 2019-01-08 | United Microelectronics Corp. | Measurement mark and method for monitoring semiconductor process |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI701451B (en) | 2020-08-11 |
| CN112423464A (en) | 2021-02-26 |
| TW202109067A (en) | 2021-03-01 |
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