1292482 14107twf.doc 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種構裝元件及其製作與檢驗方 法，且特別是有關於一種軟性構裝基材及其衝切製程與衝 切精度檢驗方法。 【先前技術】 在南度情報化社會的今日，多媒體應用的市場不斷 地急速擴張著。積體電路封裝技術亦需配合電子裝置的數 位化、網路化、區域連接化以及使用人性化的趨勢發展。 為達成上述的要求，必須強化電子元件的高速處理化、多 功能化、積集化、小型輕量化及低價化等多方面的要求， 於是積體電路封裝技術也跟著朝向微型化、高密度化發 展。焊線接合技術是半導體產業發展以來，持續沿用的封 裝技術，但由於電子元件高密度封裝的趨勢，使得焊線接 合技術逐漸無法用在封裝密度較高的封裝體中。因此，取 代焊線接合技術的軟片承載型封裝（Tape Carrier Package，TCf)技術因應而生。 一般而言，軟片承載型封裝技術包括捲帶自動接合 (Tape Automated Bonding，簡稱TAB)技術及晶片_薄膜 (Chip On Film ,簡稱COF)接合技術，其通常應用於多種 層面’如液晶面板(liquid crystal panel)與驅動晶片（办^⑽ 間的電性連接就是其中一種應用。以液晶面板與驅動晶片 之接合製程為例，其係提供一軟性構裝基材(如TAB料帶 或COF料帶），並將晶片藉由TAB封裝技術或c〇F封裝 技術配置於此軟性構裝基材上。之後，進行一衝切步驟， 1292482 14107twf.doc 以將配置有晶片的軟性構裝基材分割為多_立 7L。之後’再將構裝單it與液晶面板接合，以使曰' 搞接至液晶面板。由於藉由TCP封裝技術 = 封裝體體積小、重量輕’且構裝單元本身具有 = (^邊)的特性’故可以使得難體在與液晶面板接人 後’能夠輕易地折·曾至液晶面板的背面，: 顯示模組(LCM)的厚度能夠進一步地薄化。 定侍液曰曰 、甬：。Γί意ίί，習知在進行軟性構裝基材的衝切時， 工件對位的誤差，使得衝切後所得到的 ^早兀位於原先理想的衝切區域之外，因此在完成衝^ ^後’通常會再進行衝_度檢驗的動作，以確 3方^否=72切精度内。習知騎衝切精度檢 ⑽方^ U係由光學顯微鏡（〇ptical Mic_〇Pe ,，並以人眼輯檢視，故財式的可信度與操作人P， 規ί接S關ί ’且操作人員亦需熟記各產品的衝切精度盥 存在有誤觸風險。此外，由於習知之衝切精 C光學顯微鏡進行χ、γ軸之量測，因此動: g。，谷易造成人力資源· t，導致生產效率無法有效 【發明内容】 爲好有2此’本發明的目的就是在提供—種軟性構裝 ί古於以較為簡便的方式進行衝切精度檢驗，進而 徒同精度檢驗之準確性與整體之生產效率。 1可的另—目的是提供—種衝切精度檢驗方法， /、了對軟性構裝基材提供簡便且快速之衝切精度檢驗，以 1292482 14l07twf.doc 得到較高之準確性與檢驗效率。 本發明的又—目的一 方法’其可麵_敍性财構裝以的製作 產效率。 ，膝而精度檢驗之準輕與整體之生 基於上述或其他目的，本 材，其具有至少-衝切區*，本用;^出一種軟性構裝基 元。其中，軟性難單元具有一額軟= 係松跨配置於衝切輯之邊緣，且每 直衝切區，緣之方向上的長度係額定衝切兩倍: 由—2本發_較佳實_所述之軟性構裝基材，其 切精度圖案例如是以衝切區域之邊緣為中心線而 呈鏡像對稱’而衝切區域例如是呈矩形。其中，每一衝切 精度，案例如是位於衝切區域的轉角上，且衝切精度圖案 例如是呈L形。此外，每一衝切精度圖案更例如是由一 第一區塊與々第二區塊所構成，且第一區塊與第二區塊例 如是分別位於衝切區域的相鄰兩邊上。 承上所述，上述之每一衝切精度圖案亦可以是由一 第一折線與一第二折線所構成，其中第一折線與第二折線 係分別位於衝切區域的相鄰兩邊上，且第一折線與第二折 線例如是呈U形。此外，第一折線與第二折線亦可分別 位於衝切區域之轉角的内外兩側，且第一折線與第二折線 例如是呈L形。 1292482 14107twf.doc 依照本發明的較佳實施例所述之軟性 例如更包括一配線圖案，並中配堍R ^ 土材，，、 腳，且這些引腳係延伸至衝切區域外。此外 衝切區域邊緣的交界處例如具有1縮部，用以作 =圖案’而配線圖案例如更具有多個橫桿，其係配 =區域内’且橫桿與衝切區域之邊緣的最短距離係等於 額讀切精度。另外’橫桿之鄰近於衝切區域邊緣的一端 ::是呈圓弧狀，而衝切精度圖案與配線圖案例如是相同 I J只 本發明提出-種衝切精度檢驗方法，其適用於 之軟性構裝紐，以X在衝切紐錄性構裝單元之衝 誤差。本發明之衝切精度檢驗方法係觀察軟性構裝 =切精度_，其中若軟性構裝單元具有每—衝切精度 圖案的—雜，躲性職單元之㈣誤差制、於額 刀精度，而若軟性難單元無法具有每—衝域度 :部份’職性構裝單元之衝切縣敍於敏衝切 本發明提出一種軟性構裝單元的製作方法，其 於y軟性猶紐’射軟性構裝基材具有至少—衝切區 =以及多倾切精度圖案，*每—衝切精度圖案係橫跨配 置於衝切區域之邊緣，且每―衝切精度圖案之垂直 域邊緣之方向上的長度係一額定衝切精度的兩倍。首先，° 沿衝=區域對軟性構裝基材進行衝切，以形成至少一軟性 冓褒單元之後，藉由衝切精度圖案對軟性構裳單元進行 1292482 14107twf.doc 衝切精度檢驗。 依”?、本發明的較佳實施例所述之軟性構裝單元的製 作方法八中進行衝切精度檢驗的方法係觀察軟性構裝單 元上之衝切精度圖案，若軟性構裝單元具有每一衝切精度 圖案的―部份，職性職單it讀切誤差制、於額定衝 切精度，而若軟性構裝單元無法具有每一衝切精度圖案的 一部份，則軟性構裝單元之衝切誤差係大於額定衝切精 度。 依照本發明的較佳實施例所述之軟性構裝單元的製 作方法，其中軟性構裝基材例如具有一配線圖案，而在對 軟性構裝基材進行衝狀前，例如更包括配置—晶片於衝 切區域内，並使晶片與配線圖案耦接，而配置晶片的方法 例如是捲帶自動接合技術或晶片_薄膜接合技術。 本發明提出一種液晶顯示模組，其包括一液晶顯示 ，板：-印刷電路板以及—軟性構裝單元，其中軟性構裝 早=係耦接於液晶顯示面板與印刷電路板之間，而軟性構 裳單元沿-第-方向具有—額輯切精度。此外，軟性構 裝單元之相對兩侧邊緣分別具有一衝切精度圖案，而這些 衝切精度圖案沿第-方向上之長度的總合係額定衝切精度 的兩倍。 依照本發明的較佳實施例所述之液晶顯示模組，其 例=更包括-晶片酉己置於軟性構裝單元上，&藉由軟性構 ，單元搞接至液晶顯示面板與印刷電路板。此外，液晶顯 不面板例如具有-引出端，而軟性構裝單元例如具有一外 1292482 14107twf.dc 晶顯不 間 f腳接合(outer lead bonding，〇LB)端，且軟性構裝單元係 藉由外引腳接合端耦接至液晶顯示面板之引出端。另外， 上述之液晶顯示模組例如更包括一導電膠，其係配置於液 面板之引出端與軟性構裝單元之外引腳接合端之 依照本發明的較佳實施例所述之液晶顯示模組，其 中印刷電路板例如具有多個接點，而軟性構裝單元例如具 有一印刷電路板(printed circuit board, PCB)接合端，且軟 性構裝單元储由印刷電路板接合端減至印刷電路板之 接點。此外，上述之液晶顯示模組例如更包括一導電膠， 其係配置於印刷電路板之接點與軟性構裝單元之印刷^路 板接合端之間。 h本發明提出一種液晶顯示模組的製作方法。首先， 提供-軟性構裝基材，其中軟性構裝基材具有至少一衝切 3以及多個衝域度圖案’每一衝切精度圖案係橫跨配 喜=切區域之邊緣，且每—衝切精度圖案之垂直衝切區 邊、味之方向上的長度係-額定衝切精度的兩倍。接著， j切區域對軟性構裝基材進行衝切，則彡成至少一軟性 板，並且將軟性構裝單元耦接於液 板之間。 H70 °然後，藉_切精度_對軟性構裝單元進行 ^刀精度檢驗。之後，提供一液晶顯示面板與—印刷 曰曰顯示面板與印刷電路 作二本 1292482 14107twf.doc ^單元上之衝切精度圖案，錄性構裝單元具有每 圖ΪΓ部份’職性構裝單元之衝切誤差係小於額 部份’則軟崎單元之衝:誤有差:：= 依照本發_難#_所敎 性構裝基材例如具有-配線圖案，：: 裝基材進行衝切之前，例如更包括配置—晶片 =域内，並使晶片與配線圖案她。此外，片 (方：括捲帶自動接合技術(，或晶片-薄膜接合:: =明更提出另-種軟性構裒基材，其具有至少— 衝切區域’用以衝切形成—軟性構裝單元。 額ί=度，性構装基材上設有多二: 士 ^案^置於衝切區域内，且衝_度圖案盘衝 切區域之邊緣的最短距_#於額定衝城度。’、 好發明的較佳實施例所述之另-種軟性構裝基 1，其中衝切精度圖案例如是多個橫桿。此外，橫桿 近於衝切區域邊軸—端例如是呈圓弧狀。 本發明更提種衝⑽度檢驗方法，其適用於 基材，用以在衝切後檢驗軟性構裝 ϋ之r精度圖案’其中若軟性構裝單元具有完整之ϊ 衝刀精度圖案’則軟性構裝單元之衝切誤差係小於額定 1292482 14107twf.doc 衝切精 額定衝切精 =度’而若軟性構裝單元無法具有完整之每一 Ϊ圖案’則軟性構襄單元之衝切誤差係大於 度。 本發明更提出另一種軟性構裝單元的製作方法 用於一軟性構裝基材，其中軟性 夷 、 區域以及多個衝切枰声岡安 、土材一有至>、一衝切 3二i精度圖案與衝切區域之邊緣的最短距離係 r衛^切精度。百先，沿衝切區域對紐構裝基材進 仃衝切’則Μ至少-紐姆單元。之後，藉 度圖案對紐縣單域㈣姆度檢驗。 ^ 依照本發_較佳實關所述 =製作綠，其中進行衝婦度檢驗的方法例如 ί性構裝單元上之衝_度_，若軟性構裝單元^2 j母—衝切精賴案’職性構裝單元之衝切誤差係小 =額定衝姆度，g概構裝單元無法具有完整之每一 度_，職性财單元之衝城錢大於額定衝1292482 14107twf.doc IX. Description of the invention: [Technical field of the invention] The present invention relates to a component and a method for fabricating and inspecting the same, and more particularly to a flexible substrate and a punching process and punching thereof Cutting accuracy test method. [Prior Art] In the Southern Information Society, the market for multimedia applications is rapidly expanding. Integrated circuit packaging technology also needs to be developed in line with the digitalization, networking, regional connectivity and user-friendly trends of electronic devices. In order to achieve the above requirements, it is necessary to strengthen the requirements for high-speed processing, multi-function, integration, small size, light weight, and low cost of electronic components. Therefore, the integrated circuit packaging technology is also oriented toward miniaturization and high density. Development. Wire bonding technology is a continuous encapsulation technology since the development of the semiconductor industry. However, due to the trend of high-density packaging of electronic components, wire bonding technology has gradually disappeared into packages with higher package densities. Therefore, the Tape Carrier Package (TCf) technology, which replaces wire bonding technology, has been developed. In general, the film-loading type packaging technology includes Tape Automated Bonding (TAB) technology and Chip On Film (COF) bonding technology, which is generally applied to various levels such as liquid crystal panels (liquid crystal panels). The electrical connection between the crystal panel and the driver chip (10) is one of the applications. Taking the bonding process of the liquid crystal panel and the driver wafer as an example, it provides a soft structural substrate (such as a TAB tape or a COF tape). And the wafer is disposed on the flexible substrate by TAB packaging technology or c〇F packaging technology. Thereafter, a die-cutting step is performed, 1292482 14107 twf.doc, to divide the flexible structure substrate on which the wafer is disposed It is more than 7L. After that, the assembly unit is joined to the liquid crystal panel so that it can be connected to the liquid crystal panel. Because of the TCP package technology = small package size and light weight, the package unit itself has = (^ edge) characteristic 'so that the difficult body can be easily folded after the LCD panel is connected to the back of the LCD panel: The thickness of the display module (LCM) can be further thinned. liquid曰曰,甬:.Γί意ίί, the conventional error in the alignment of the workpiece during the blanking of the soft-structured substrate, so that the early 兀 obtained after the punching is outside the original ideal punching area. Therefore, after the completion of the rush ^ ^ 'usually, the rushing degree test will be performed again to confirm the 3 square = no = 72 cutting accuracy. The conventional riding punching precision inspection (10) square ^ U system by optical microscope (〇ptical Mic _〇Pe, and inspected by the human eye, so the credibility of the financial formula and the operator P, the regulation is connected to S Guan ί 'and the operator also needs to memorize the punching precision of each product, there is a risk of accidental touch In addition, due to the conventional punching and cutting C optical microscope, the measurement of χ and γ axes is carried out, so that: g., Gu Yi causes human resources, and the production efficiency cannot be effective. [Inventive content] The object of the present invention is to provide a soft structure in which the punching precision test is performed in a relatively simple manner, and the accuracy of the accuracy test and the overall production efficiency are accommodating. Punching precision inspection method, /, to provide a simple and flexible substrate The rapid punching precision test obtains higher accuracy and inspection efficiency with 1292482 14l07twf.doc. The method of the present invention is also a method of producing a production efficiency. The quasi-lightness of the inspection and the overall life are based on the above or other purposes, the material, which has at least a die-cut zone*, is used; a soft-construction primitive, wherein the soft-hard unit has a softness = loose The span is arranged at the edge of the punching cut, and each straight punching zone, the length in the direction of the edge is twice the rated punching: the soft-structured substrate described by -2 of the hair _ better _ The precision pattern is, for example, mirror-symmetrical with the edge of the punched area as a center line, and the punched area is, for example, rectangular. Here, for each punching precision, for example, the corner is located on the corner of the punching area, and the punching precision pattern is, for example, L-shaped. In addition, each of the punching precision patterns is formed, for example, by a first block and a second block, and the first block and the second block are respectively located on adjacent sides of the punched area. As described above, each of the punching precision patterns may be formed by a first fold line and a second fold line, wherein the first fold line and the second fold line are respectively located on adjacent sides of the punching area, and The first fold line and the second fold line are, for example, U-shaped. In addition, the first fold line and the second fold line may also be respectively located on the inner and outer sides of the corner of the punching area, and the first fold line and the second fold line are, for example, L-shaped. 1292482 14107twf.doc Softness in accordance with a preferred embodiment of the present invention, for example, further includes a wiring pattern, and is provided with ^R^ soil material, feet, and these pins extend beyond the die cut region. In addition, the boundary of the edge of the die-cut area has, for example, a constriction for making a pattern and the wiring pattern has, for example, a plurality of crossbars, which are in the area of the region and the shortest distance between the crossbar and the edge of the die-cut region. The system is equal to the reading accuracy. In addition, the end of the crossbar adjacent to the edge of the punching area: is in the shape of an arc, and the punching precision pattern and the wiring pattern are, for example, the same IJ. The present invention proposes a punching precision inspection method, which is suitable for softness. Constructing a button, X is in the punching of the New Zealand component of the punching error. The punching precision inspection method of the invention observes the soft structure=cutting precision_, wherein if the soft structural unit has a pattern of each punching precision pattern, the (4) error system of the hiding unit is used, and the precision of the fore knife is If the soft hard unit can not have the degree of per-rushing degree: part of the 'employment structure unit' Chongqi County Xu Yumin punching the present invention proposes a method of making a soft structural unit, which is soft in the softness of the y soft The structured substrate has at least a die-cut area= and a multi-tilt precision pattern, and the *per-cutting precision pattern is spanned across the edge of the punched area and in the direction of the vertical domain edge of each punching precision pattern The length is twice the rated punching accuracy. First, the soft-structured substrate is die-cut along the rushing area to form at least one soft 冓褒 unit, and the soft-cutting unit is subjected to the 1292482 14107 twf.doc punching precision test by the punching precision pattern. According to the manufacturing method of the flexible structural unit according to the preferred embodiment of the present invention, the method for performing the punching precision inspection is to observe the punching precision pattern on the flexible structural unit, if the flexible structural unit has A part of the punching precision pattern, the job order is read and cut error system, and the rated punching accuracy is obtained. If the soft component unit cannot have a part of each punching precision pattern, the soft component unit The punching error is greater than the rated punching precision. According to a preferred embodiment of the present invention, the flexible component substrate has a wiring pattern, and the flexible substrate is Before the punching, for example, the configuration further includes: arranging the wafer in the punching region and coupling the wafer to the wiring pattern, and the method of arranging the wafer is, for example, a tape automatic bonding technique or a wafer-film bonding technique. The present invention provides a liquid crystal. The display module comprises a liquid crystal display, a board: a printed circuit board and a flexible component unit, wherein the soft structure is coupled to the liquid crystal display panel and the printed circuit board. The soft structure unit has a precision in the first direction. In addition, the opposite side edges of the flexible component unit respectively have a punching precision pattern, and the punching precision patterns are along the length in the first direction. The total matching system has twice the punching precision. According to the liquid crystal display module of the preferred embodiment of the present invention, the example includes: the wafer has been placed on the flexible component unit, & The unit is connected to the liquid crystal display panel and the printed circuit board. Further, the liquid crystal display panel has, for example, a lead-out terminal, and the flexible component unit has, for example, an outer 1292482 14107 twf.dc crystallographic outer joint. 〇 LB), and the flexible component is coupled to the terminal of the liquid crystal display panel by the external pin bonding end. In addition, the liquid crystal display module further includes a conductive adhesive, which is disposed on the liquid panel. A liquid crystal display module according to a preferred embodiment of the present invention, wherein the printed circuit board has a plurality of contacts, for example, the flexible package unit has The printed circuit board (PCB) is connected to the printed circuit board, and the liquid crystal display module further includes a conductive adhesive. The invention is disposed between the contact of the printed circuit board and the bonding end of the printed circuit board of the flexible component unit. The invention provides a method for fabricating the liquid crystal display module. Firstly, a soft-structured substrate is provided, wherein the softness is provided. The structured substrate has at least one die cut 3 and a plurality of punch pattern patterns. Each punching precision pattern crosses the edge of the matching hi=cut region, and each vertical punching precision pattern has a vertical punching edge and taste. The length in the direction is twice the rated punching precision. Then, the j-cut region is die-cut to the soft-structured substrate, then twisted into at least one flexible plate, and the flexible component is coupled to the liquid plate. between. H70 ° Then, by using the cutting accuracy _, the soft component is tested for the accuracy of the tool. After that, a liquid crystal display panel and a printing display panel and a printed circuit are provided for the punching precision pattern on the unit 1292482 14107 twf.doc ^, and the recording assembly unit has a part of the job configuration unit. The punching error is less than the amount of the part of the 'soft saki unit's punch: error is poor::= according to the hair _ difficult #_ 构 构 构 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如 例如Before cutting, for example, it also includes the configuration - wafer = domain, and the wafer and wiring pattern her. In addition, the sheet (including: tape-and-tape automatic bonding technology (or wafer-film bonding:: = Ming proposed another soft-structured substrate, which has at least - die-cut region) for die-cutting formation - soft structure The unit is provided. The amount of ί= degrees, the structure of the substrate is provided with two more: Shi ^ ^ ^ placed in the punching area, and the shortest distance of the edge of the punching area of the punching pattern _# in the rated rushing city A further flexible construction substrate 1 according to a preferred embodiment of the invention, wherein the punching precision pattern is, for example, a plurality of cross bars. Further, the cross bar is adjacent to the edge of the die cutting region. The utility model further provides a punching (10) degree inspection method, which is suitable for a substrate, and is used for inspecting a r-precision pattern of a soft structure after punching, wherein if the soft structural unit has a complete boring knife The precision pattern 'the punching error of the soft component is less than the rated 1292482 14107twf.doc punching fine rated punching fine = degree 'and if the soft component can not have a complete pattern of each 'the soft structure unit The punching error is greater than the degree. The invention further proposes the fabrication of another flexible component unit. The method is applied to a soft structural substrate, wherein the softness, the area, and the plurality of punching and squeaking squeaking gangs, the soil materials have a >, and the shortest distance of the edge of the punching area and the edge of the punching area r Wei ^ cutting precision. Hundreds of first, along the die-cut area to the new structure of the substrate into the 仃 仃 cut 'then at least - Newm unit. After that, the degree pattern on the New County single field (four) um test. ^ According to this _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The punching error of the structural assembly unit is small = the rated grading degree, and the g-structured unit cannot have a complete degree _, the rushing money of the professional financial unit is greater than the rated rush
-依照本發明的較佳實施例所述之另一種軟性構裳單 凡的製作方法，其中軟性構裝基材例如具有—配線圖案， 而在對軟性構裝基材進行衝切之前，例如更包括配置一晶 ^於衝切區域内，並使晶片與配線圖案耦接。此外，配^ 晶片的方法例如是捲帶自動接合技術(17^)或晶片_薄膜 合技術(COF)。 、 本發明更提出另一種液晶顯示模組，其包括一液曰曰 12 1292482 14107twf.doc f示面板、—印刷電路板以及-軟性構裝單元。軟性構裝 二:ί耦顯示面板與印刷電路板之間，其中軟‘ 二早兀化弟一方向具有一額定衝切精度，且軟性構裝 二ί相J兩侧邊緣分別具有一衝切精度圖案，而衝切精 二圖案，-方向上與軟性構裝單元邊緣之最短距離的總 5係額定衝切精度的兩倍。 电，較佳實⑽所狀&餘晶顯示模 、/、 w更匕括一晶片配置於軟性構裝單元上，並由 人性構裝早兀搞接至液晶顯示面板與印刷電路板。此夕^， ”示面板例如具有—弓丨出端，而軟性構裝單元例如具 耗接: 且軟性構裝單元係藉由外引腳接合端 稿接至液日日顯不面板之引出端。另外，上述之另 顯示模組例如更包括—導電膠 曰曰 之引出端與軟性構裝單元之外引腳：=:顯不面板 租，Π本發明的較佳實施例所述之另—種液晶顯示模 2 Ρ刷電路板例如具有多個接點，而軟性構裝單元 刷電路板接合端，且軟性構裝單元係藉由印 電路板接3端触至印刷電路板之接點。此外，上 =^晶顯示模_如更包括—導電膠，其係配置於 =路板之接點與軟性構裝單元之印刷電路板接合端之 本毛明更提出另一種液晶顯示模組的製作方法。首 ’提供-軟性構裝基材’其中軟性構裝單元沿—第 向具有-額定衝切精度，且軟性構裝單元之相對兩側邊緣 13 1292482 14107twf.doc 刀別具有一衝切精度圖案，而這些衝切精度圖案沿第— ^上與紐構裝單元邊緣之最短雜_合係較衝切梦 又的兩倍。接著，沿衝切區域對軟性構裝基材進行衝切7 性構料元。然後，藉由衝切精度_對 衝切精度檢驗。之後，提供—液晶顯示 面^與一印刷電路板，並且將軟性構裝單元減於液晶顯 不面板與印刷電路板之間。 曰； 組的ϊίί發明的較佳實施例所述之另—種液晶顯示模 軟性+進行衝切精度檢驗的方法例如是觀察 ^構裝早70上之衝域度_，若軟性構裝單元具有每 度圖案的-部份’則軟性構裝單元之衝切誤差係 衝域度，而若軟性構裝單元無法具有每一衝切 =Γί的—部份’職性難單元之衝娜差係大於額 疋衝切精度。 依照本發_較佳實_所述之另―觀 法，其中軟性構祕材例如具有—配線圖案，、 ^軟性構裝基材進行衝切之前，例如更包括配置一晶 切區域内，並使晶片與配線圖案輕接。此外，配置 減帶自_合技術_)偏·薄膜接合 軟性ίί”上ίί軟性構裝基材、衝切精度檢驗方法、 、组的早疋6!w方法、液晶顯示模組以及液晶顯示模 ^ 4作方法中，額定衝切精度例如是介於oimm至 ϋ· 15mm 之間。 觀佩 7twf.doc 基於上述，本發明係於軟性構裝基材的衝切 緣=置多個衝切精·案’以在衝城藉由這些衝切精， 圖J對所形摘祕難單元進行衝域度檢驗，盆中^ 於^發明之衝域度_的設料於_，使得操作 透過目視或藉由放域進行觀察觸，因而有助於 k南私驗之準確度與整體之生產效率。 、 為讓本發明之上述和其他目的、特徵和優點 顯易懂，下文郷較佳實補，並配合所式 說明如下。 忭坪、、、田 【實施方式】- A method of fabricating a soft structure according to a preferred embodiment of the present invention, wherein the flexible substrate has, for example, a wiring pattern, and before the die-cutting of the flexible substrate, for example, The method includes disposing a crystal in the punching region and coupling the wafer to the wiring pattern. Further, the method of arranging the wafer is, for example, a tape automatic bonding technique (17^) or a wafer-film bonding technique (COF). The present invention further proposes another liquid crystal display module comprising a liquid helium 12 1292482 14107 twf.doc f display panel, a printed circuit board and a flexible component unit. Soft assembly 2: 耦 between the display panel and the printed circuit board, where the soft 'two early 兀 弟 弟 一 一 has a rated punching precision, and the soft fabric has a punching precision on both sides of the edge The pattern, while the die-cut pattern, is twice the total punching accuracy of the total 5 series in the direction of the shortest distance from the edge of the flexible component. The electric, preferably (10) shape & residual crystal display mode, /, w further includes a wafer disposed on the flexible component unit, and is connected to the liquid crystal display panel and the printed circuit board by humanity. In this case, the display panel has, for example, a bow-out end, and the flexible component unit is, for example, consumable: and the flexible component unit is connected to the lead end of the liquid-day display panel by the outer-pin joint end In addition, the other display module includes, for example, a lead-out end of the conductive adhesive and a pin outside the flexible package unit: =: a panel rent, which is described in the preferred embodiment of the present invention. The liquid crystal display module 2 has a plurality of contacts, for example, and the flexible component unit brushes the board junction ends, and the flexible component unit contacts the contacts of the printed circuit board by the printed circuit board terminals. In addition, the upper = ^ crystal display mode _, for example, further includes a conductive adhesive, which is disposed at the junction of the = board and the printed circuit board of the flexible component unit, and proposes another liquid crystal display module. The manufacturing method. The first 'providing-soft-constructed substrate' in which the flexible component unit has a --punching precision along the first direction, and the opposite side edges of the flexible component unit 13 1292482 14107twf.doc has a die-cutting Precision pattern, and these punching precision patterns along the first ^ The shortest miscellaneous _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Accuracy _ punching accuracy test. After that, provide a liquid crystal display surface and a printed circuit board, and reduce the soft component unit between the liquid crystal display panel and the printed circuit board. 曰; Another method for liquid crystal display mode softness described in the example is to perform the punching accuracy test, for example, to observe the degree of rush of the structure of the structure 70, and if the soft component unit has the - part of the pattern per degree, then the softness The punching error of the structural unit is the rushing degree, and if the soft structural unit cannot have each punching = Γί - part of the 'employment difficulty unit', the rushing difference is greater than the frontal punching precision. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The wiring pattern is lightly connected. In addition, the configuration is reduced with self-contracting technology _) ·Film bonding softness ίί" ίί soft structural substrate, punching accuracy inspection method, group early 6! w method, liquid crystal display module and liquid crystal display module method, the rated punching accuracy is, for example Between oimm and ϋ·15mm. Based on the above, the present invention is based on the punching edge of a soft-structured substrate = a plurality of punching and cutting cases, in order to use the punching fines in the city, and the drawing is difficult to grasp. The unit performs the rushing degree test, and the setting of the rushing area _ in the basin is made in _, so that the operation can be visually observed or viewed by the zoning, thereby contributing to the accuracy and overallity of the k-nan private test. Production efficiency. The above and other objects, features, and advantages of the present invention will become apparent from the following description.忭平,、,田 【Embodiment】
/下列實施例係以TAB料帶為例來說明本發明之特 徵，然而在不脫離本發明之精神範圍内，其更可以是C〇f 料帶、軟性電路板(FPC)或其他可藉由衝切成型之軟性構 裝基材。 [弟一實施例]The following embodiments illustrate the features of the present invention by taking the TAB tape as an example, but it may be a C〇f tape, a flexible circuit board (FPC) or the like, without departing from the spirit of the invention. A soft-formed substrate that is die cut. [Department of an embodiment]
、、、明參考圖1，其緣示本發明之一種液晶顯示器之TAB 料帶的上視示意圖（不包含封膠）。TAB料帶1〇〇上例如係 架構於-軟片1()2上，其中軟片撤之兩侧例如具有多個 傳動孔(sprocket hole)l〇4，且TAB料帶1〇〇上例如劃分 有多個矩形之衝切區域110(僅繪示一個）。此外，每一衝 刀£域110内例如糟由銅治貼覆、微影钮刻製程以及焊罩 塗佈等步驟而形成有對位標記(alignment mark)l 12以及配 線圖案(僅繪示部分之引腳114)，且引腳114依其外接元 件的不同又可分為與液晶面板(未繪示)連接之外引腳接合 15 1292482 14107twf.doc 端114a以及與電路板連接之印刷電路板接合端114b。 此外，本發明之TAB料帶1〇〇上例如可配置有多個 晶片120,其中晶片120例如是驅動晶片，其係對應配置 於衝切區域110内，並耦接至引腳114，而晶片120與部 分之軟片102上更例如可覆蓋有封裝膠體(未繪示）。 請再參考圖1，TAB料帶1〇〇在沿衝切區域11〇衝 切後，可形成多個軟性構裝單元(未繪示）。本發明為了提 ，快速之衝切精度檢測，以判斷軟性構裝單元的衝切誤差 疋否位於一額定衝切精度内，係於形成配線圖案的同時於 TAB料帶1〇〇上設置多個衝切精度圖案13〇。其中，每一 衝切精度圖案130係橫跨於衝切區域11〇之邊緣，且每一 衝切精度圖案110之垂直衝切區域11〇邊緣之方向上的長 度係額S衝切精度的兩倍。—般而言，目前常見之衝切設 備所具有之衝切精度通常介於G lmm至心咖之間。° 國 、 斤、、、曰示之丁AB料帶為例，其中假設額定衝 精，為a，而衝切精度圖案130例如是呈L型，且位於 切區域11G之鄰近於外引腳接合端114&的兩轉角上。 外，衝切精度圖㈣係以衝切區域11〇之邊緣為中心 =呈鏡像對稱，亦即衝切精度圖案13()之内㈣侧與 :j 11G邊緣的距離皆為a。如此—來，當在衝切完成後 =檢查雛構裝單元(未㈣)上之衝城朗 端=衝切誤差大於衝切精度時，則位於鄰近外引腳接 a的兩轉角上的衝城度圖案⑽將至少有一個 /殘留於衝切所得之軟性構裝單元(未繪示)上。相對地 1292482 14107twf.doc 亦可ί二疋’在本實施例中，衝切精度圖案130 而其輪廓線亦可為實線或虛線等不同之 端"’衝切精度圖帛13〇除可位於鄰近外引腳接合 ^的兩轉角上之外，亦可位於鄰近印刷電路板接合Referring to Figure 1, there is shown a top view of a TAB tape of a liquid crystal display of the present invention (without sealing). The TAB tape 1 is, for example, framed on the film 1 (2), wherein the film has two sprocket holes l〇4 on both sides, and the TAB tape 1 is divided, for example. A plurality of rectangular punched areas 110 (only one is shown). In addition, in each punching field 110, for example, a copper mark, a lithography button process, and a solder mask coating process are formed to form an alignment mark 12 and a wiring pattern (only a part is shown) The pin 114), and the pin 114 can be further divided into a liquid crystal panel (not shown) according to the external component of the pin bonding 15 1292482 14107twf.doc end 114a and the printed circuit board connected to the circuit board Engaged end 114b. In addition, the TAB tape of the present invention can be configured, for example, with a plurality of wafers 120, wherein the wafers 120 are, for example, driving wafers, which are correspondingly disposed in the die-cut region 110 and coupled to the leads 114, and the wafers The portion of the film 120 and the portion of the film 102 can be covered, for example, with an encapsulant (not shown). Referring again to Figure 1, after the TAB tape 1 is punched along the die-cut region 11 , a plurality of flexible components (not shown) may be formed. In order to improve the rapid punching precision detection, the present invention determines whether the punching error of the soft component is within a rated punching precision, and is formed on the TAB tape 1 形成 while forming the wiring pattern. The punching precision pattern is 13〇. Wherein, each of the punching precision patterns 130 straddles the edge of the punching area 11〇, and the length of each vertical punching area 11 in the direction of the edge of each punching precision pattern 110 is S punching precision Times. In general, the punching accuracy of the current punching equipment is usually between G lmm and heart. ° Country, jin, 、, 曰 之 AB 料 AB tape as an example, which assumes the rated rushing, is a, and the punching precision pattern 130 is, for example, L-shaped, and is located adjacent to the outer pin joint of the dicing region 11G The ends of the ends 114 & In addition, the punching accuracy map (4) is centered on the edge of the punched area 11〇 = mirror image symmetry, that is, the distance between the inside (4) side of the punching precision pattern 13 () and the edge of the :j 11G is a. In this way, when the punching is completed = the inspection of the chick assembly unit (not (4)) on the punching hill end = the punching error is greater than the punching accuracy, then the punch is located on the two corners adjacent to the outer pin a The city pattern (10) will have at least one/residue on the soft component unit (not shown) obtained by die cutting. Relatively 1292482 14107twf.doc can also be used in this embodiment, the punching precision pattern 130 and its contour line can also be a solid line or a dotted line and other different ends "' punching accuracy map 帛13〇 Located adjacent to the two corners of the outer pin bond, it can also be located adjacent to the printed circuit board.
的兩轉角上，或是選擇性地設置於衝切區域110 的任何角落上。 ^ 了上述之L·形衝切精度圖案之外，本發明更提出 ς他多種不同樣式之衝切精度圖案，下文係以多個實施例 =說明如下，縣簡化說明，諸如“、定位標記或封 裝膠體等相關元件將不再重複贅述。 [弟一實施例]The two corners are either selectively disposed at any corner of the die cut region 110. ^ In addition to the L-shaped punching precision pattern described above, the present invention further proposes a plurality of different styles of punching precision patterns, which are described below with a plurality of embodiments = a simplified description of the county, such as ", positioning marks or Related components such as encapsulants and the like will not be described again.
、册請參考圖2，其繪示本發明之第二實施例之一種ταβ 的上視示意圖。如圖2所示，衝切精度圖案23〇例如 疋位於鄰近外引腳接合端214a的兩轉角上，且每一精度 圖案230係由一第一區塊232與一第二區塊234所構成， 其中第一區塊232與第二區塊234係呈矩形，並橫跨於衝 切區域210的相鄰兩邊緣上。此外，第一區塊232與第二 區塊234之位於衝切區域21 〇邊緣之内外兩側的沿伸長度 係分別等於額定衝切精度a。一般而言，目前常見之衝切 设備所具有之衝切精度通常介於0.1mm至0.15mm之間。 如此一來，若衝切後之外引腳接合端214a的兩轉角皆殘 17 1292482 14107twfl.doc/006 _丨 M°i 修正日期93.11.9 ^有第-區塊232’將可判_方向之衝切誤差係位於額 =衝切精度a内，而若衝切後之外引腳接合端214a的兩 轉角皆殘留有第二區塊234，將可_ γ方向之衝切誤差 係位於額定衝切精度a内。反之，若有其中—第一區塊幻2 或-第二區塊234完全被移除，則衝切誤差係大於額定 切精度a。 在本實施例中，第-區塊232與第二區塊234同樣 可為空心®案’而其輪麟亦可為實線或虛料不同之線 1此外，第一區塊232與第二區塊234除可位於鄰近外 引腳接合端2i4a的兩轉角上之外，亦可位於鄰近印刷電 路板接合端214b的兩轉角上’或是選擇性地設置於衝切 區域210的任何角落上。當然，上述之第一區塊⑽與第 -區塊234亦可遠離轉角，亦即設置於衝切區域21〇之邊 緣的中央部位，其同樣可達到判斷衝切精度的目的。 [第二實施例] 請參考圖Μ，其繪示本發明之第三實施例之一種 TAB料▼的上視不意圖。如目3A所示，衝切精度圖案 330例如是位於鄰近外引腳接合端31如的兩轉角上，且 每-精度圖案330係由-第一折線332與一第二折線334 所構成。其中，第一折線332與第二折線334係呈u形， 並橫跨於衝切區域310的相鄰兩邊緣上，且第一折線332 ，第二折線334之開口係朝向所對應之轉角配置。此外， 第一折線332與第二折線334之位於衝切區域31〇邊緣之 内外兩^延伸長度係分別等於額定衝切精度a。一般而 言’目前常見之衝切設備所具有之衝切精度 18 1292482 14107twf.doc 通苇介於0.1mm至〇·ι5mm之間。如此一來，藉由第一 折線332將可判斷X方向之衝切精度，而藉由第二區塊334 將可判斷Y方向之衝切精度。 此外，請參考圖3B，其繪示本發明之第三實施例之 另一種TAB料帶的上視示意圖。本實施例之衝切精度圖 案330與上述不同之處在於其第一折線332與一第二折線 334之開口係遠離其所對應之轉角配置。 另外，請參考圖3C，其繪示本發明之第三實施例之 又一種TAB料帶的上視示意圖。本實施例之衝切精度圖 案330與上述不同之處在於其第一折線332之開口係朝向 所對應之轉角配置，而第二折線334之開口係遠離其所對 應之轉角配置。 在本實施例中，第一折線332與第二折線334之線 型可為實線或虛線，而第一折線332與第二折線334亦可 位於鄰近印刷電路板接合端314b的兩轉角上，或是選擇 性地設置於衝切區域310的任何角落或側邊上。當然，上 述之第一折線332與第二折線334亦可遠離衝切區域31〇 之轉角’而改為設置於衝切區域31〇之邊緣的中央部位， 其同樣可達到判斷衝切精度的目的。 [第四實施例] 睛參考圖4，其繪示本發明之第四實施例之一種TAB 料帶的上視示意圖。如圖4所示，衝切精度圖案430例如 是由L形之一第一折線432與一第二折線434所構成， 其中每一精度圖案430係位於鄰近外引腳接合端414a的 19 1292482Please refer to FIG. 2, which is a top view of a ταβ according to a second embodiment of the present invention. As shown in FIG. 2, the punching precision pattern 23, for example, is located at two corners adjacent to the outer pin engaging end 214a, and each precision pattern 230 is composed of a first block 232 and a second block 234. The first block 232 and the second block 234 are rectangular and span across adjacent edges of the die cut region 210. In addition, the elongations of the first block 232 and the second block 234 on the inner and outer sides of the edge of the punched region 21 are respectively equal to the rated punching accuracy a. In general, the punching precision of the current common punching equipment is usually between 0.1 mm and 0.15 mm. In this way, if the two corners of the pin-engaging end 214a are both after the die-cutting, the residual angle is 17 1292482 14107 twfl.doc/006 _丨M°i corrected date 93.11.9 ^The first block 232' will be judged _ direction The punching error is located in the amount = punching accuracy a, and if the second corner 234 remains in both corners of the pin engaging end 214a after punching, the punching error in the _ γ direction is at the rated The punching accuracy is within a. On the other hand, if there is - the first block magic 2 or - the second block 234 is completely removed, the punching error is greater than the rated cutting accuracy a. In this embodiment, the first block 232 and the second block 234 may be hollow®, and the wheel may be a solid or a different material. In addition, the first block 232 and the second block The block 234 can be located at either of the two corners adjacent to the bonded terminal 214b of the printed circuit board, or can be selectively disposed at any corner of the die cut region 210. . Of course, the first block (10) and the first block 234 may be located away from the corner, that is, at the central portion of the edge of the punching area 21, which can also achieve the purpose of judging the punching precision. [Second Embodiment] Referring to the drawings, a top view of a TAB material ▼ of a third embodiment of the present invention is shown. As shown in FIG. 3A, the punching precision pattern 330 is, for example, located at two corners adjacent to the outer pin engaging end 31, and the per-precision pattern 330 is composed of a first fold line 332 and a second fold line 334. The first fold line 332 and the second fold line 334 are u-shaped and straddle the adjacent edges of the punched area 310, and the openings of the first fold line 332 and the second fold line 334 are oriented toward the corresponding corners. . In addition, the inner and outer lengths of the first fold line 332 and the second fold line 334 located at the edge of the punched region 31 are respectively equal to the rated punching precision a. Generally speaking, the punching precision of the current common punching equipment 18 1292482 14107twf.doc is between 0.1mm and ι·ι5mm. In this way, the punching accuracy of the X direction can be judged by the first folding line 332, and the punching precision of the Y direction can be judged by the second block 334. In addition, please refer to FIG. 3B, which is a top view of another TAB tape according to a third embodiment of the present invention. The punching accuracy pattern 330 of the present embodiment is different from the above in that the opening of the first folding line 332 and the second folding line 334 are away from the corresponding corner arrangement. In addition, please refer to FIG. 3C, which is a top view of still another TAB tape according to a third embodiment of the present invention. The punching accuracy pattern 330 of the present embodiment differs from the above in that the opening of the first fold line 332 is disposed toward the corresponding corner, and the opening of the second fold line 334 is disposed away from the corresponding corner configuration. In this embodiment, the line shape of the first fold line 332 and the second fold line 334 may be a solid line or a broken line, and the first fold line 332 and the second fold line 334 may also be located at two corners adjacent to the printed circuit board joint end 314b, or It is selectively disposed on any corner or side of the die cut region 310. Certainly, the first fold line 332 and the second fold line 334 may be further away from the corner of the punching area 31〇 and may be disposed at the central portion of the edge of the punching area 31〇, which can also achieve the purpose of determining the punching precision. . [Fourth Embodiment] Eye Referring to Fig. 4, there is shown a top view of a TAB tape of a fourth embodiment of the present invention. As shown in FIG. 4, the punching precision pattern 430 is formed, for example, by an L-shaped first fold line 432 and a second fold line 434, wherein each precision pattern 430 is located adjacent to the outer pin joint end 414a.
Hl07twf.doc 兩轉角上，且第一折線432與第二折、線⑽係分別位於其 所對應之轉角的内外兩側。此外，第-折線432與第二折 Ϊ 434之相距於衝切區域410邊緣的最短距離分別等於額 ，衝切精度a，以藉由第一折線432與第二折線434來判 斷/X方向與γ方向上的衝切精度。一般而言，目前常見 之衝切設備所具有之衝切精度通常介於0.1mm至〇.15mm 之間。 在本實施例中，第一折線432與第二折線434之線 型可為實線或虛線，而第一折線432與第二折線434亦可 位於鄰近印刷電路板接合端414b的兩轉角上，或是選擇 性地設置於衝切區域410的任何角落或側邊上。 [第五實施例] 請參考圖5，其繪示本發明之第五實施例之一種τΑΒ 料帶的上視示意圖。如圖5所示，印刷電路板接合端51仙 例如係延伸至衝切區域510外，且每一印刷電路板接合端 514b與衝切區域510邊緣的交界處例如具有一頸縮部 516，用以構钱衝切精度圖案530。其中，頸縮部516之 位於衝切區域510邊緣之内外兩侧的長度係分別等於額定 衝切精度a。一般而言，目前常見之衝切設備所具有之衝 切精度通常介於0.1mm至0.15mm之間。若γ方向之衝 切誤差大於額定衝切精度a時，則所得到之軟性構裝單元 (未繪示)上將可能殘留有完整的頸縮部516,或是頸縮部 516將完全被移除。此外，若Y方向之衝切誤差位於額定 衝切精度a内時，則每一印刷電路板接合端5141)上將殘 20 1292482 14107twf.doc 留有部分之頸縮部516。 Γΐΐ考圖5，在本實施例中，為了檢測X方向上 衝刀精度，本發明更可於衝切區域5 ==圖案’其例如是兩橫桿518。橫桿 =位於印刷電路板接合端514b的 =接^同時形成。此外，橫桿51二、二 邊緣的-端係呈圓弧狀， 4 W域51G之邊緣的最短轉鱗於額定 j曰有沾518的-部份將被切除，其中圓弧狀 ^於判斷橫桿518是否遭咖除，而 ^面 則可判定x方向之衝切誤差係位於ΐ: 在本實施例中，橫桿518亦可為空心圖案， =之線型可為實線或虛線，且橫桿S18亦可改為設= 外引腳接合端514a之兩侧，或是選擇性地設置 _ 域510的對角處。此外，本發明亦可單獨使用上述之掃二 518之設計來判斷衝切誤差，亦即可於χ方㈣= 之相對兩側皆形成橫桿518，以藉由橫桿5 ^斷 = 與Υ方向之衝切精度。 增X方向 基於上述，上文係聽本制之多種不同樣 切精度圖案’然喊麟用以限定本發明，任何 技藝者在參照上述實施例後’當可基於本發明項 徵，並對衝切精度圖案(或橫桿)之外形、位置加以變=特 21 1292482 14107twf.doc 以符合實際狀況與不同的設計需求。此外，雖然上述實施 例係以TAB料帶為例，然而在不脫離本發明之精神範圍 内，上述之精度衝切圖案更可應用於諸如c〇F料帶或軟 性電路板等可藉由衝切成型之軟性構裝基材，惟其基本^ 構與設計方式皆與上述實施例類似，在此不再重複 了 [第六實施例] 請參考圖6，其緣示本發明之軟性構裝單元與液晶面 ，接合後的示意圖。如圖6所示，軟性構裝單元64〇例如 疋由一 TAB或COF料帶衝切而得，其甲晶片62〇例如是 以TAB技術或COF技術配置於軟性構裝單元64〇上。此 外，軟性構裝單元640之外引腳接合端614a例如是藉由 導電膠630與液晶面板650上之引出端652接合，而軟性 構裝單元640之印刷電路板接合端6隱則是藉由導電膠 與一印刷電路板660之接點662接合。由於軟性構裝 單元640具有可撓性(fiexible)，因此晶片62〇或印刷電^ 板660在與液晶面板650接合後，可輕易地折彎至液晶面 板650的背面，使得整體之液晶顯示模組6〇〇能夠進一 地薄型化。 值得一提的是，本發明之軟性構裝基材並非僅可用 於液晶面板與其驅動晶片之接合，其中依據其型離的不同 (如TAB料帶、C0F料帶或軟性電路板等），更^應用於 其他領域之電子元件的構裝上。 ' /綜上所述’本發明之軟性構裝基材的衝㈣域邊緣 係設置有多個衝切精度@案’其有助於在衝切後供操作人 22 1292482 14107twfl.d〇c/006 修正日期93.11.9 員以目視的方式進行衝切精度檢驗。因此 提^軟性構裝基材、衝城度檢驗方法以及軟性構I單 方法將可提供快速且準確之衝切精度檢驗 棱回檢驗之準確度與整體之生產效率。 遲而 、，然本發明已以較佳實關揭露如上，然其並非用 以限^本發明，任何熟f此技藝者，林麟本發明之精 神^範圍内’當可作些許之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。Hl07twf.doc is on both corners, and the first fold line 432 and the second fold line (10) are respectively located on the inner and outer sides of the corresponding corner. In addition, the shortest distance between the first-folding line 432 and the second folding line 434 from the edge of the punching area 410 is equal to the amount, the punching precision a, to determine the /X direction by the first folding line 432 and the second folding line 434. Punching accuracy in the gamma direction. In general, the punching precision of the current common punching equipment is usually between 0.1 mm and 〇.15 mm. In this embodiment, the line shape of the first fold line 432 and the second fold line 434 may be a solid line or a broken line, and the first fold line 432 and the second fold line 434 may also be located at two corners adjacent to the printed circuit board joint end 414b, or It is selectively disposed on any corner or side of the die cut region 410. [Fifth Embodiment] Referring to Figure 5, there is shown a top view of a τΑΒ tape of a fifth embodiment of the present invention. As shown in FIG. 5, the printed circuit board bonding end 51 extends, for example, to the outside of the punching area 510, and each printed circuit board bonding end 514b and the edge of the punching area 510 have a necking portion 516, for example. The precision pattern 530 is punched out by constructing money. The length of the neck portion 516 located on the inner and outer sides of the edge of the punched portion 510 is equal to the rated punching accuracy a, respectively. In general, the punching precision of conventional punching equipment is usually between 0.1 mm and 0.15 mm. If the punching error in the gamma direction is greater than the rated punching accuracy a, the resulting necking portion 516 may remain on the resulting flexible component (not shown), or the necking portion 516 will be completely displaced. except. In addition, if the punching error in the Y direction is within the rated punching accuracy a, a portion of the necking portion 516 is left on each of the printed circuit board engaging ends 5141). Referring to Fig. 5, in the present embodiment, in order to detect the accuracy of the punch in the X direction, the present invention is more capable of punching the area 5 == pattern ', which is, for example, two cross bars 518. Crossbar = is formed at the junction of the printed circuit board bond end 514b. In addition, the end of the second and second edges of the crossbar 51 is arcuate, and the shortest turn of the edge of the 4 W domain 51G is cut off at the rated j曰 518 518, where the arc is determined. Whether the crossbar 518 is riddled, and the ^face can determine that the punching error in the x direction is located at ΐ: In this embodiment, the crossbar 518 can also be a hollow pattern, and the line type of = can be a solid line or a broken line, and The crossbar S18 can also be set to either side of the outer pin engaging end 514a or alternatively to the opposite corner of the _ field 510. In addition, the present invention can also use the above-mentioned design of the sweeping 518 alone to judge the punching error, that is, the crossbar 518 can be formed on the opposite sides of the square (four)=, by the crossbar 5^== Punching accuracy of the direction. Increasing the X direction is based on the above, and the above is a variety of different cutting precision patterns that are used to define the present invention. Those skilled in the art can refer to the above embodiments, and can be based on the present invention. The shape and position of the precision pattern (or crossbar) are changed = special 21 1292482 14107twf.doc to meet the actual situation and different design requirements. In addition, although the above embodiment is exemplified by the TAB tape, the above-mentioned precision die-cutting pattern can be applied to a material such as a c〇F tape or a flexible circuit board, etc., without departing from the spirit of the invention. The soft-formed substrate is formed, but its basic structure and design are similar to those of the above embodiment, and will not be repeated here. [Sixth embodiment] Please refer to FIG. 6, which shows the soft structure of the present invention. A schematic diagram of the unit and the liquid crystal surface after bonding. As shown in Fig. 6, the flexible package unit 64 is, for example, die-cut from a TAB or COF tape, and the wafer 62 is, for example, disposed on the flexible package unit 64 by TAB technology or COF technology. In addition, the pin bonding end 614a of the flexible component 640 is bonded to the lead end 652 of the liquid crystal panel 650 by the conductive paste 630, for example, by the printed circuit board bonding end 6 of the flexible component unit 640. The conductive paste is bonded to a contact 662 of a printed circuit board 660. Since the flexible package unit 640 is fiexible, the wafer 62 or the printed circuit board 660 can be easily bent to the back surface of the liquid crystal panel 650 after being bonded to the liquid crystal panel 650, so that the entire liquid crystal display mode Group 6 can be thinned into one place. It is worth mentioning that the flexible structural substrate of the present invention is not only applicable to the bonding of the liquid crystal panel and its driving wafer, and depending on the type of the separation (such as TAB tape, C0F tape or flexible circuit board, etc.), ^Applicable to the construction of electronic components in other fields. 'In summary, the blunt (four) domain edge of the flexible structural substrate of the present invention is provided with a plurality of punching precision @ cases' which contribute to the operator 22 292482 14107 twfl.d〇c/ after punching. 006 Correction date 93.11.9 The inspection of the punching accuracy is performed visually. Therefore, the soft-structured substrate, the punching degree inspection method, and the soft-structured method can provide a fast and accurate punching accuracy test. The accuracy of the prismatic inspection and the overall production efficiency. In the past, the present invention has been disclosed above in a preferred manner, but it is not intended to limit the invention, and any skilled person, Lin Lin, in the spirit of the invention, can make some changes. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
【圖式簡單說明】 圖1繪示為本發明之一種液晶顯示器之TAB料帶的 上視示意圖。 圖2繪不為本發明之第二實施例之一種TAB料帶的 上視示意圖。 圖3A〜3C分別繪示為本發明之第三實施例之多種 TAB料帶的上視示意圖。 圖4繪示為本發明之第四實施例之一種TAB料帶的 上視示意圖。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view showing a TAB tape of a liquid crystal display of the present invention. Figure 2 is a top plan view of a TAB tape which is not a second embodiment of the present invention. 3A to 3C are respectively top plan views showing various TAB tapes according to a third embodiment of the present invention. 4 is a top plan view of a TAB tape according to a fourth embodiment of the present invention.
圖5繪示為本發明之第五實施例之一種TAB料帶的 上視不意圖。 圖6綠示為本發明之軟性構裝單元與液晶面板接合 後的不意圖。 【主要元件符號說明】 1G0 : TAB 料帶 102 :軟片 23 1292482 14107twf.doc 104 :傳動孔 110、210、310、410、510 ··衝切區域 112 :對位標記 114 :引腳 114a、214a、314a、414a、514a、614a :夕卜弓丨腳接合 端 114b、214b、314b、414b、514b、614b ··印刷電路 板接合端 120 :晶片 130、230、330、430、530 :衝切精度圖案 232 :第一區塊 234 :第二區塊 332、432 :第一折線 334、434 :第二折線 516 :頸縮部 518 :橫桿 a:額定衝切精度 600 ·液晶顯不核組 620 :晶片 630 ··導電膠 640 :軟性構裝單元 650 ·液晶面板 652 :引出端 660 :印刷電路板 24 1292482^ 662 :接點Fig. 5 is a top view of a TAB tape according to a fifth embodiment of the present invention. Fig. 6 is a green view showing the soft assembly unit of the present invention joined to the liquid crystal panel. [Main component symbol description] 1G0: TAB tape 102: film 23 1292482 14107twf.doc 104: transmission hole 110, 210, 310, 410, 510 · punching area 112: alignment mark 114: pins 114a, 214a, 314a, 414a, 514a, 614a: 丨 丨 丨 接合 114 114b, 214b, 314b, 414b, 514b, 614b · Printed circuit board joint end 120: wafer 130, 230, 330, 430, 530: punching precision pattern 232: first block 234: second block 332, 432: first fold line 334, 434: second fold line 516: necking portion 518: cross bar a: rated punching accuracy 600 · liquid crystal display core group 620: Wafer 630 · · Conductive adhesive 640 : Flexible assembly unit 650 · Liquid crystal panel 652 : Terminal 660 : Printed circuit board 24 1292482 ^ 662 : Contact
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