TWI696244B - Circuit arrangement structure of edge of glass substrate and manufacturing method thereof - Google Patents

Abstract

A circuit arrangement structure of edge of glass substrate and a manufacturing method thereof are provided. The circuit arrangement structure of edge of glass substrate includes a glass substrate and a plurality of metal lines. Each side of the glass substrate has a inclined plane, and a leading angle is formed between the front surface and the inclined plane of the glass substrate, and the angle of the lead angle is 45° to 89°. A plurality of metal lines are disposed on the glass substrate from the front surface of the glass substrate via the inclined surface to the back surface of the glass substrate.

Description

Glass substrate edge line configuration structure and manufacturing method thereof

The invention relates to a circuit configuration structure and a manufacturing method thereof, in particular to a glass substrate edge circuit configuration structure and a manufacturing method thereof.

Generally speaking, a common light-emitting diode display screen is composed of a plurality of light-emitting diode glass substrates joined together.

However, the glass substrate is composed of a glass carrier, a light-emitting diode, and traces. Furthermore, the front of the glass carrier is covered with light-emitting diodes, and the traces are wound from the edge of the glass carrier to the reverse side of the glass carrier, and The back of the glass carrier is connected to FPC or IC or other circuits.

However, today's routing process still has many inconveniences, so the industry in related fields still needs to improve it to solve related problems.

In view of the above-mentioned conventional problems, an object of the present invention is to provide a glass substrate edge circuit configuration structure and a manufacturing method thereof, to solve the problems faced in the conventional technology.

Based on the above objective, the present invention provides a glass substrate edge line arrangement structure, which includes a glass substrate and a plurality of metal lines. At least one side of the glass substrate has an inclined surface, and there is a lead angle between the front surface and the inclined surface of the glass substrate, and the angle of the lead angle is 45° to 89°. A plurality of metal lines are respectively arranged on the glass substrate from the front surface of the glass substrate along the lead angle to the back surface of the glass substrate through the inclined surface.

Preferably, the thickness of the metal circuit may be less than 20um.

Based on the above object, the present invention further provides a method for manufacturing a glass substrate edge line configuration structure, which includes the following steps: making a lead angle on at least one side edge of the glass substrate, and the lead angle angle is 45° to 89°. A metal film is coated on at least one edge of the glass substrate. Apply photoresist to at least one edge of the glass substrate. Laser exposure of at least one edge of the glass substrate. Develop yellow light on at least one edge of the glass substrate. Etching at least one edge of the glass substrate. Stripping a film on at least one edge of the glass substrate to form a plurality of metal circuits.

Preferably, the metal film is coated by sputtering or evaporation.

Preferably, the thickness of the metal circuit may be less than 20um.

Based on the above object, the present invention further provides a method for manufacturing a glass substrate edge line configuration structure, which includes the following steps: making a lead angle on at least one side edge of the glass substrate, and the lead angle angle is 45° to 89°. A metal film is coated on at least one edge of the glass substrate. Laser patterning at least one edge of the glass substrate to form a plurality of metal lines.

Preferably, the metal film is coated by sputtering or evaporation.

Preferably, the thickness of the metal circuit may be less than 20um.

According to the above, the glass substrate edge line configuration structure and manufacturing method of the present invention can form a laser exposure or laser pattern on the glass substrate by laying down a slope and a guide angle on at least one edge of the glass substrate Completed in the state.

100: Glass substrate edge line configuration structure

101: Bevel

102: Lead angle

103: positive

104: back

110: glass substrate

120: metal line

S31 to S37, S41 to S43: Steps

FIG. 1 is a schematic diagram of the configuration of the edge circuit of the glass substrate of the present invention.

FIG. 2 is a side view of the layout structure of the edge circuit of the glass substrate of the present invention.

FIG. 3 is a first flow chart of the manufacturing method of the glass substrate edge line layout structure of the present invention.

FIG. 4 is a second flow chart of the manufacturing method of the glass substrate edge line layout structure of the present invention.

In order to better understand the features, contents, advantages and achievable effects of the present invention, the present invention is described in detail in conjunction with the drawings and in the form of expressions of the embodiments, and the purpose of the drawings used therein is only The illustrations and auxiliary descriptions are not necessarily the true scale and precise configuration after the implementation of the present invention, so the scale and configuration relationship of the attached drawings should not be interpreted and limited to the scope of the present invention in practical implementation.

Please refer to FIG. 1 and FIG. 2; FIG. 1 is a schematic diagram of the glass substrate edge circuit layout structure of the present invention; FIG. 2 is a side view of the glass substrate edge circuit layout structure of the present invention. As shown in the figure, the glass substrate edge line arrangement structure 100 of the present invention includes a glass substrate 110 and a plurality of metal lines 120.

In a word, at least one side of the glass substrate 110 mentioned above has an inclined surface 101, and a leading angle 102 between the front surface 103 and the inclined surface 101 of the glass substrate 110 has an angle of 45° to 89°.

Moreover, the plurality of metal lines 120 are respectively disposed on the glass substrate 110 from the front surface 103 of the glass substrate 110 along the lead angle 102 to the back surface 104 of the glass substrate 110 through the inclined surface 101.

Among them, the thickness of the metal circuit 120 is preferably less than 20um.

Although the foregoing description of the method for manufacturing the edge circuit arrangement structure of the glass substrate of the present invention has also described the concept of the method for manufacturing the edge circuit arrangement structure of the glass substrate of the present invention, for clarity, the following flowchart is shown in detail Instructions.

Please refer to FIG. 3, which is a first flowchart of a method for manufacturing a glass substrate edge line configuration structure of the present invention. As shown in the figure, in this embodiment, the edge circuit of the glass substrate of the present invention The manufacturing method of the configuration structure is applicable to the above-mentioned glass substrate edge circuit configuration structure. The manufacturing method of the glass substrate edge circuit configuration structure includes the following steps: In step S31: at least one side edge of the glass substrate is provided with a lead angle The angle is 45° to 89°.

In step S32: apply a metal film to at least one edge of the glass substrate.

In step S33: apply photoresist to at least one edge of the glass substrate.

In step S34: laser exposure on at least one edge of the glass substrate.

In step S35: developing yellow light on at least one edge of the glass substrate.

In step S36: etching at least one edge of the glass substrate.

In step S37: stripping a film on at least one edge of the glass substrate to form a plurality of metal lines.

Furthermore, the metal film can be coated on the glass substrate by sputtering or evaporation.

Among them, the thickness of the metal line is preferably less than 20um.

Please refer to FIG. 4 again, which is a second flowchart of the manufacturing method of the glass substrate edge line configuration structure of the present invention. As shown in the figure, in another embodiment, the manufacturing method of the glass substrate edge line configuration structure of the present invention is applicable to the above glass substrate edge line configuration structure. The manufacturing method of the glass substrate edge line configuration structure includes the following steps: In step S41, at least one side edge of the glass substrate is made a lead angle, and the lead angle is 45° to 89°.

In step S42: apply a metal film to at least one edge of the glass substrate.

In step S43: laser patterning at least one edge of the glass substrate to form a plurality of metal lines.

Furthermore, the metal film can be coated on the glass substrate by sputtering or evaporation.

Among them, the thickness of the metal line is preferably less than 20um.

The detailed description and the embodiments of the manufacturing method of the glass substrate edge line arrangement structure of the present invention have been described in the foregoing description of the glass substrate edge line arrangement structure of the present invention, and will not be repeated here for the sake of brief description.

According to the above, the glass substrate edge line configuration structure and manufacturing method of the present invention can form a laser exposure or laser pattern on the glass substrate by laying down a slope and a guide angle on at least one edge of the glass substrate Completed in the state.

The above-mentioned embodiments are only to illustrate the technical ideas and features of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, but cannot limit the patent scope of the present invention, That is to say, any equivalent changes or modifications made in accordance with the spirit disclosed by the present invention should still be covered by the patent scope of the present invention.

100: Glass substrate edge line configuration structure

101: Bevel

102: Lead angle

103: positive

104: back

110: glass substrate

120: metal line

Claims (8)

A glass substrate edge line configuration structure includes: a glass substrate, at least one side of the glass substrate has a slope, and a leading angle between the front surface of the glass substrate and the slope, the angle of the lead angle is 45° to 89°; and a plurality of metal lines are arranged on the glass substrate from the front surface of the glass substrate along the lead angle through the slope to the back surface of the glass substrate; wherein the plurality of metal circuits are paired A metal film is coated on the at least one edge of the glass substrate, and is formed by laser exposure or laser patterning when the glass substrate is in a flat state. The configuration of the edge circuit of the glass substrate as described in item 1 of the patent application, wherein the thickness of the metal circuit is less than 20um. A method for manufacturing a glass substrate edge line configuration structure includes the following steps: making a lead angle for at least one edge of a glass substrate, the lead angle being 45° to 89°; the at least one for the glass substrate A metal film is applied to one edge; a photoresist is applied to the at least one edge of the glass substrate; a laser exposure is applied to the at least one edge of the glass substrate; a yellow edge is applied to the at least one edge of the glass substrate Photographic development; etching the at least one edge of the glass substrate; and stripping the at least one edge of the glass substrate to form a plurality of metal lines. The method for manufacturing a glass substrate edge line arrangement structure as described in item 3 of the patent application scope, wherein the metal film is coated by sputtering or evaporation. The method for manufacturing a glass substrate edge line configuration structure as described in item 3 of the patent application scope, wherein the thickness of the metal line is less than 20um. A method for manufacturing a glass substrate edge line configuration structure includes the following steps: making a lead angle for at least one edge of a glass substrate, the lead angle being 45° to 89°; the at least one for the glass substrate A metal film is coated on one edge; and the at least one edge of the glass substrate is laser patterned to form a plurality of metal lines. The method for manufacturing a glass substrate edge line arrangement structure as described in item 6 of the patent application range, wherein the metal film is coated by sputtering or evaporation. The method for manufacturing a glass substrate edge line configuration structure as described in item 6 of the patent application range, wherein the thickness of the metal line is less than 20um.

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