CN113141718A - Method for forming connection line on glass substrate through single photoetching head - Google Patents
Method for forming connection line on glass substrate through single photoetching head Download PDFInfo
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- CN113141718A CN113141718A CN202110430398.2A CN202110430398A CN113141718A CN 113141718 A CN113141718 A CN 113141718A CN 202110430398 A CN202110430398 A CN 202110430398A CN 113141718 A CN113141718 A CN 113141718A
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- Prior art keywords
- glass substrate
- circuit
- head
- connection part
- line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a method for forming a connection circuit on a glass substrate through a single photoetching head, wherein the glass substrate comprises an A surface, a B surface and a side surface, the A surface is provided with an A surface circuit, the B surface is provided with a B surface circuit, the connection circuit is formed along the A surface, the B surface and the side surface respectively by rotating the glass substrate through a photoetching head matched with a mechanical arm, and the A surface circuit and the B surface circuit are electrically connected with each other through the connection circuit. The photoetching head is matched with the mechanical arm to expose on two sides of the glass substrate respectively to form the connection circuit which is connected into a whole, and the connection circuit realizes the electrical connection of the electronic circuits on the upper side and the lower side of the glass substrate, so that a flexible circuit board is not needed for switching, the thickness of the whole assembly of the glass substrate can be reduced, the connection circuit formed by exposure also has higher reliability, and the problems of stress pull-off and the like do not exist; the connection line can be formed by exposure of the photoetching head, so that the operation is more convenient, and the production efficiency is favorably improved.
Description
Technical Field
The invention relates to the technical field of manufacturing of electronic display components, in particular to a method for connecting two-side circuits of a glass substrate.
Background
With the rapid development and wide application of various electronic devices, the requirements for display components are also increasing, and the most important development includes light weight and reliability. In display components, electronic circuits are generally formed on both front and back surfaces of a glass substrate by exposure, and in order to connect the electronic circuits on both surfaces, a flexible printed circuit (i.e., FPC) is generally used for connection and external connection. First, the flexible circuit board has a certain thickness and needs a certain space for extending and retracting, which results in a larger thickness of the whole glass substrate assembly and is not favorable for thinning and lightening the display component; secondly, the flexible circuit board is connected with electronic circuits on two sides of the glass substrate in a welding mode, and the flexible circuit board can be loosened after being subjected to certain tensile force or used for a long time, so that the display part can be abnormal or even can not work, and the reliability is poor; thirdly, the operation process of soldering the flexible circuit board is complicated, the technical requirement is high, the production efficiency is low, and the production cost is also high.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for forming a connection circuit on a glass substrate through a single photoetching head, which can realize switching without using a flexible circuit, has higher reliability, and is beneficial to improving the light and thin level and the production efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme: a method of forming a docking line on a glass substrate with a single lithography head, the glass substrate comprising a face a, a face B and side faces, the face a having a face line and the face B having a face B line, the method comprising: the photoetching head is respectively exposed along the A surface, the B surface and the side surface to form a connecting circuit, the connecting circuit realizes the electrical interconnection of the A surface circuit and the B surface circuit, the implementation process of exposing and forming the connecting circuit is carried out according to the following steps,
s1, cleaning the surface of the glass substrate, plating a layer of conductive material on the surface of the glass substrate, and then using a mask with a circuit to cooperate with UV ink to generate circuits on the surface A and the surface B of the glass substrate respectively through exposure-development-etching processes;
s2, fixing the photoetching head, and fixing the glass substrate through the movable mechanism to enable the part of the glass substrate to be exposed to face the photoetching head;
s3, starting the photoetching head, and rotating the glass substrate through the movable mechanism to enable the surface A, the surface B and the side surface of the glass substrate to respectively butt the photoetching head for exposure;
s4, exposing an A-surface connection part on the A surface of the glass substrate, wherein one end of the A-surface connection part is connected with an A-surface circuit on the glass substrate, and the other end of the A-surface connection part extends to the side edge of the glass substrate;
s5, exposing a B-surface connection part on the B surface of the glass substrate, wherein one end of the B-surface connection part is connected with a B-surface circuit on the glass substrate, and the other end of the B-surface connection part extends to the side edge of the glass substrate;
and S6, exposing a side connection part on the side surface of the glass substrate, wherein two ends of the side connection part are respectively connected with the A-surface connection part and the B-surface connection part, so that a complete connection circuit is formed.
The movable mechanism is a manipulator, such as a commonly used four-axis manipulator, a six-axis manipulator, and the like. The manipulator clamps the glass substrate through the clamp thereof, and rotates the side which does not need to expose a connecting line and is convenient for operation.
The thickness of the glass substrate is 0.1-1 mm.
The surface A and the surface B are parallel to each other, and a connection circuit formed by exposure is of a C-shaped structure.
The surface A connection part extends to the side edge of the glass substrate from the surface A line along the shortest line, and the surface B connection part extends to the side edge of the glass substrate from the surface B line along the shortest line.
When exposure operation is carried out, the glass substrate is clamped by the mechanical arm to vertically align the A surface of the glass substrate with the photoetching head for exposure, then the glass substrate is rotated to expose the side surface of the glass substrate to the vertical photoetching head, and finally the glass substrate is rotated to vertically align the B surface with the photoetching head for exposure, so that the sequence is favorable for improving the exposure efficiency. Of course, the order of exposure may be reversed.
The glass substrate is fixed and rotated by the manipulator, the photoetching heads are respectively exposed on two sides and side surfaces of the glass substrate to form a connection circuit which is connected into a whole, and the connection circuit is used for realizing the electrical connection of electronic circuits on the upper side and the lower side of the glass substrate, so that components with physical structures such as a flexible circuit board are not needed for switching, the thickness of the whole assembly of the glass substrate can be greatly reduced, the connection circuit formed by exposure also has higher reliability, and the problems of stress pull-off and the like do not exist; the connection line can be formed by exposure of the photoetching head, so that the operation is more convenient, and the production efficiency is improved and the production cost is reduced. The line width and the line distance of 50um can be met by matching with the existing photoetching process, and the generation of bad phenomena such as line breakage, line shape distortion and the like is greatly reduced.
Drawings
FIG. 1 is a schematic cross-sectional view of a conventional glass substrate;
FIG. 2 is a schematic diagram of the structure of the implementation process of the present invention.
In the figure, 1 is a glass substrate, 11 is a surface, 12 is a surface, 13 is a side surface, 2 is a surface circuit, 3 is a surface circuit, 4 is a connection circuit, 41 is a surface connection part, 42 is a surface connection part, 43 is a side connection part, 5 is a lithography head, 6 is a robot, and 61 is a clamp.
Detailed Description
In this embodiment, referring to fig. 1 and fig. 2, in the method for forming a connection line on a glass substrate by using a single lithography head, the glass substrate 1 includes an a surface 11, a B surface 12, and a side surface 13, and the thickness of the glass substrate 1 is 0.1-1 mm; the surface A11 is provided with a surface A circuit 2, the surface B12 is provided with a surface B circuit 2, a photoetching head 5 is respectively provided with a connecting circuit 4 along the surface A11, the surface B12 and the side surface 13, the surface A circuit 2 and the surface B circuit 3 are electrically connected with each other through the connecting circuit 4, the implementation process is carried out according to the following steps,
s1, cleaning the surface of the glass substrate 1, plating a layer of conductive material on the surface of the glass substrate 1, and then using a mask with a circuit to match with UV ink to generate circuits on the A surface 11 and the B surface 12 of the glass substrate respectively through exposure-development-etching processes, which is only the operation process in the prior art;
s2, fixing the photoetching head 5, and simultaneously fixing the glass substrate 1 by the clamp 61 of the manipulator 6 to ensure that the part to be exposed of the glass substrate 1 faces the photoetching head 5;
s3, starting the photoetching head 5, and rotating the glass substrate 1 through the manipulator 6 to expose the surface A11, the surface B12 and the side surface 13 of the glass substrate 1 to the photoetching head 5 respectively;
s4, firstly, vertically aligning the A surface 11 of the glass substrate 1 to the photoetching head 5 through the manipulator 6 to expose an A surface connection part 41, wherein one end of the A surface connection part 41 is connected with the A surface circuit 2 on the glass substrate 1, and the other end extends to the edge of the side surface 13 of the glass substrate 1;
s5, rotating the glass substrate 1 through the manipulator 6 to enable the side surface 13 to be vertically aligned with the lithography head 5 to expose a side surface connection part 43, wherein one end of the side surface connection part 43 is connected with the A surface connection part 41, and the other end of the side surface connection part 43 extends to the edge of the B surface 12 of the glass substrate 1;
and S6, finally, rotating the glass substrate 1 by the manipulator 6 to enable the surface B12 to be vertically aligned with the lithography head 5 to expose a surface B connection part 42, wherein two ends of the surface B connection part 42 are respectively connected with the side connection part 43 and the surface B circuit 3, and thus a complete connection circuit 4 is formed.
The a surface 11 and the B surface 12 are parallel to each other, and the connection line 4 formed by exposure is approximately in a C-shaped structure or a J-shaped structure.
The a-side connection part 41 extends from the a-side line 2 to the edge of the side surface 13 of the glass substrate 1 along the shortest route, and the B-side connection part 42 extends from the B-side line 3 to the edge of the side surface 13 of the glass substrate 1 along the shortest route.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Claims (6)
1. A method of forming a docking line on a glass substrate with a single lithography head, the glass substrate comprising a face a, a face B and side faces, the face a having a face line and the face B having a face B line, the method comprising: the photoetching head is exposed along the A surface, the B surface and the side surface to form a connecting circuit, the connecting circuit realizes the electrical interconnection of the A surface circuit and the B surface circuit, the implementation process of exposing the connecting circuit is carried out according to the following steps,
s1, cleaning the surface of the glass substrate, plating a layer of conductive material on the surface of the glass substrate, and then using a mask with a circuit to cooperate with UV ink to generate circuits on the surface A and the surface B of the glass substrate respectively through exposure-development-etching processes;
s2, fixing the photoetching head, and fixing the glass substrate through the movable mechanism to enable the part of the glass substrate to be exposed to face the photoetching head;
s3, starting the photoetching head, and rotating the glass substrate through the movable mechanism to enable the surface A, the surface B and the side surface of the glass substrate to respectively butt the photoetching head for exposure;
s4, exposing an A-surface connection part on the A surface of the glass substrate, wherein one end of the A-surface connection part is connected with an A-surface circuit on the glass substrate, and the other end of the A-surface connection part extends to the side edge of the glass substrate;
s5, exposing a B-surface connection part on the B surface of the glass substrate, wherein one end of the B-surface connection part is connected with a B-surface circuit on the glass substrate, and the other end of the B-surface connection part extends to the side edge of the glass substrate;
and S6, exposing a side connection part on the side surface of the glass substrate, wherein two ends of the side connection part are respectively connected with the A-surface connection part and the B-surface connection part, so that a complete connection circuit is formed.
2. The method of forming a docking line on a glass substrate with a single photolithography head as recited in claim 1, wherein: the movable mechanism is a mechanical arm, and the mechanical arm clamps one side of the glass substrate to rotate through a clamp of the mechanical arm.
3. The method of forming a docking line on a glass substrate with a single photolithography head as recited in claim 1, wherein: the thickness of the glass substrate is 0.1-1 mm.
4. The method of forming a docking line on a glass substrate with a single photolithography head as recited in claim 1, wherein: the surface A and the surface B are parallel to each other, and a connection circuit formed by exposure is of a C-shaped structure.
5. The method of forming a docking line on a glass substrate with a single photolithography head as recited in claim 1, wherein: the surface A connection part extends to the side edge of the glass substrate from the surface A line along the shortest line, and the surface B connection part extends to the side edge of the glass substrate from the surface B line along the shortest line.
6. The method of forming a docking line on a glass substrate with a single photolithography head as recited in claim 1, wherein: when exposure operation is carried out, the glass substrate is clamped by the mechanical arm to vertically align the A surface of the glass substrate with the photoetching head for exposure, then the glass substrate is rotated to expose the side surface of the glass substrate to the vertical photoetching head, and finally the glass substrate is rotated to vertically align the B surface with the photoetching head for exposure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110430398.2A CN113141718B (en) | 2021-04-21 | 2021-04-21 | Method for forming connection line on glass substrate through single photoetching head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110430398.2A CN113141718B (en) | 2021-04-21 | 2021-04-21 | Method for forming connection line on glass substrate through single photoetching head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113141718A true CN113141718A (en) | 2021-07-20 |
| CN113141718B CN113141718B (en) | 2022-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110430398.2A Active CN113141718B (en) | 2021-04-21 | 2021-04-21 | Method for forming connection line on glass substrate through single photoetching head |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101403863A (en) * | 2007-10-04 | 2009-04-08 | 株式会社阿迪泰克工程 | Double-side exposal device |
| CN105372941A (en) * | 2014-08-28 | 2016-03-02 | 上海微电子装备有限公司 | Multifunctional exposure machine capable of exposing glass substrate edge |
| US20180079130A1 (en) * | 2014-08-19 | 2018-03-22 | Shin-Etsu Chemical Co., Ltd. | Rectangular substrate for imprint lithography and making method |
| CN207780483U (en) * | 2018-01-26 | 2018-08-28 | 苏州锐材半导体有限公司 | A kind of lithographic multiple exposure device |
| TWI696244B (en) * | 2019-08-21 | 2020-06-11 | 富元精密科技股份有限公司 | Circuit arrangement structure of edge of glass substrate and manufacturing method thereof |
-
2021
- 2021-04-21 CN CN202110430398.2A patent/CN113141718B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101403863A (en) * | 2007-10-04 | 2009-04-08 | 株式会社阿迪泰克工程 | Double-side exposal device |
| US20180079130A1 (en) * | 2014-08-19 | 2018-03-22 | Shin-Etsu Chemical Co., Ltd. | Rectangular substrate for imprint lithography and making method |
| CN105372941A (en) * | 2014-08-28 | 2016-03-02 | 上海微电子装备有限公司 | Multifunctional exposure machine capable of exposing glass substrate edge |
| CN207780483U (en) * | 2018-01-26 | 2018-08-28 | 苏州锐材半导体有限公司 | A kind of lithographic multiple exposure device |
| TWI696244B (en) * | 2019-08-21 | 2020-06-11 | 富元精密科技股份有限公司 | Circuit arrangement structure of edge of glass substrate and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN113141718B (en) | 2022-04-05 |
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