CN217389109U - Circuit structure and endoscope - Google Patents
Circuit structure and endoscope Download PDFInfo
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- CN217389109U CN217389109U CN202221321213.0U CN202221321213U CN217389109U CN 217389109 U CN217389109 U CN 217389109U CN 202221321213 U CN202221321213 U CN 202221321213U CN 217389109 U CN217389109 U CN 217389109U
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Abstract
The utility model discloses a circuit structure and endoscope, the circuit structure that discloses includes flexible circuit board and hard circuit board, the flexible circuit board is provided with a plurality of interval distribution's pad group, pad group includes electrically connected's first pad and second pad, first pad and second pad distribute in the both sides of flexible circuit board thickness direction, the hard circuit board is provided with the third pad, third pad and first pad second pad welded connection, and third pad electric connection is in the surface of one in first pad and the second pad; in the above-mentioned scheme, first pad and second pad all with the welding of third pad to this realizes flexible circuit board and stereoplasm circuit board electric connection, this kind of connected mode has evaded the space that adopts the connector to connect the existence among the correlation technique and has occupy big and the pencil is connected and have the inconvenient technical problem of connection, has the space and occupies for a short time and connect convenient characteristics.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit structure and endoscope.
Background
A Flexible Printed Circuit (FPC) is a Flexible Circuit board, which is referred to as a Flexible board for short; a PCB (Printed Circuit Board) is a rigid wiring Board, called a hard Board for short.
In the related art, the flexible circuit board and the hard circuit board are mainly connected through a connector or a wiring harness, the connector is adopted for connection, so that the manufacturing cost is increased, the defect of large occupied space is also existed, the development of the electronic product towards light and thin is not facilitated, meanwhile, due to the existence of the plugging contact points, the vibration resistance of the connection position is poor, and the connection failure is easily caused; the wiring harness is adopted, the corresponding relation between each wire and the welding point needs to be checked one by one, the workload is large, and errors are prone to occurring.
Therefore, it is an urgent technical problem to be solved by those skilled in the art to provide a circuit structure formed by connecting a flexible circuit board and a rigid circuit board, and having convenient connection and small occupied space.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a circuit structure to the space that the flexible circuit board among the solution correlation technique is connected the circuit structure that forms with the stereoplasm circuit board and is existed occupies big and connect inconvenient technical problem.
In order to solve the above problem, the utility model adopts the following technical scheme:
in a first aspect, the utility model provides a circuit structure, the utility model discloses a circuit structure includes:
the flexible circuit board is provided with a plurality of pad groups distributed at intervals, each pad group comprises a first pad and a second pad, the first pads and the second pads are distributed on two sides of the flexible circuit board in the thickness direction, and the first pads are electrically connected with the second pads;
the hard circuit board is provided with a third bonding pad, the third bonding pad is connected with the first bonding pad and the second bonding pad in a welding mode, and the third bonding pad is electrically connected to the outer surface of one of the first bonding pad and the second bonding pad.
Furthermore, the first bonding pad and the second bonding pad are symmetrically distributed on two sides of the flexible circuit board.
Further, in a direction perpendicular to the hard circuit board, the first pad has a first projected area, the second pad has a second projected area, the third pad has a third projected area, and the first projected area and the second projected area are both located in the third projected area.
Furthermore, the hard circuit board is provided with a soft board connecting area, the third bonding pads are arranged in the soft board connecting area, and the soft board connecting area is provided with a welding positioning mark.
Furthermore, the flexible circuit board is provided with a hard board connection area, the first bonding pad and the second bonding pad are arranged on the hard board connection area, and the welding positioning mark is matched with the outline shape of the hard board connection area.
Furthermore, the circuit structure further comprises a reinforcing plate, the reinforcing plate is fixedly connected with the flexible circuit board, and the reinforcing plate is adjacent to the hard board connecting area.
Further, the first pad, the second pad and the third pad are all strip-shaped pads.
Furthermore, the flexible circuit board is provided with a conductive through hole, and a metal connecting piece or conductive filler is arranged in the conductive through hole to electrically connect the first bonding pad and the second bonding pad.
Further, the third pad connects the first pad and the second pad by solder.
In a second aspect, the present invention further provides an endoscope, which includes a handle portion, an insertion portion and the circuit structure, wherein the hard circuit board is disposed in the handle portion, the flexible circuit board is connected to the hard circuit board, and at least a portion of the flexible circuit board extends to the insertion portion.
The utility model discloses a technical scheme can reach following beneficial effect:
first, the utility model discloses a circuit structure, when flexible circuit board and hard circuit board are connected, the third pad forms electric connection with first pad and second pad through soldering tin, adopts the mode of pad welding to connect flexible circuit board and hard circuit board, has both avoided adopting the connector to connect the technical problem that the space that exists occupies greatly and the shock resistance is poor among the correlation technique, has avoided the problem that the connection work load that the pencil connection exists is big, the connection is inconvenient again, have connect convenient, the space occupies characteristics little and low in manufacturing cost;
the second and third bonding pads are respectively connected with the first bonding pad and the second bonding pad in a soldering manner, so that the connecting area of the flexible circuit board and the hard circuit board is increased, and the welding strength of the flexible circuit board and the hard circuit board is ensured; meanwhile, when one of the first bonding pad and the second bonding pad and the third bonding pad form an open circuit, the flexible circuit board and the hard circuit board can still be ensured to be in an electric connection state, and the connection reliability of the flexible circuit board and the hard circuit board is improved;
thirdly, the first bonding pad and the second bonding pad with the same connection attribute are symmetrically distributed on two sides of the flexible circuit board, so that short circuit between bonding pad groups can be avoided, and the safety of electrical connection is ensured;
the fourth projection area, the first projection area and the second projection area are all located in the third projection area, so that the flexible circuit board and the hard circuit board have the largest contact area, and the welding strength is improved; and the strip-shaped third bonding pad can play a role in auxiliary positioning, so that the welding accuracy is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a circuit configuration according to an embodiment of the present application;
FIG. 3 is a second schematic diagram of a circuit structure according to an embodiment of the present application;
fig. 4 is a schematic structural view of an endoscope according to an embodiment of the present application.
In the figure:
100-flexible circuit board, 110-first pad, 120-second pad; 200-a hard circuit board, 210-a third welding disc, 220-a welding positioning mark; 300-a stiffening plate; 400-soldering tin; 500-handle portion, 600-insertion portion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
Referring to fig. 1 to 3, an embodiment of the present application discloses a circuit structure, where the disclosed circuit structure includes a flexible circuit board 100 and a hard circuit board 200, the flexible circuit board 100 may be an FPC, and the hard circuit board 200 may be a PCB.
The flexible circuit board 100 is provided with a plurality of pad groups distributed at intervals, each pad group includes a first pad 110 and a second pad 120 electrically connected to each other, in the thickness direction of the flexible circuit board 100, the flexible circuit board 100 has a first side and a second side opposite to each other, the first pad 110 is provided on the first side of the flexible circuit board 100, the second pad 120 is provided on the second side of the flexible circuit board 100, the first pad 110 and the second pad 120 electrically connected to each other have a one-to-one correspondence relationship, that is, connection attributes between the pad groups may be different, and connection attributes of the first pad 110 and the second pad 120 located in the same pad group are the same.
In an alternative embodiment, the flexible circuit board 100 may be provided with a conductive via penetrating through the flexible circuit board 100, and a metal connector or a conductive filler is provided in the conductive via to electrically connect the first pad 110 and the second pad 120, so that the connection properties of the first pad 110 and the second pad 120 are the same.
The hard circuit board 200 is provided with a third pad 210, when the flexible circuit board 100 is connected to the hard circuit board 200, the flexible circuit board 100 can be supported on the hard circuit board 200, the third pad 210 is connected to the first pad 110 and the second pad 120 by a solder 400, and the third pad 210 is electrically connected to the outer surface of the first pad 110 or the second pad 120. The connecting mode avoids the technical problems of large occupied space and poor vibration resistance in the prior art due to the adoption of the connector for connection, is beneficial to realizing the thinning of the whole product with the circuit structure in a limited space, also avoids the technical problems of large connecting workload and inconvenient connection in the wire harness connection, and has the characteristics of small occupied space and convenient connection.
Meanwhile, the third bonding pad 210 is respectively connected with the first bonding pad 110 and the second bonding pad 120 through the soldering tin 400, so that the connection area of the flexible circuit board 100 and the hard circuit board 200 is increased, the connection strength of the flexible circuit board 100 and the hard circuit board 200 is ensured, and when one of the first bonding pad 110 and the second bonding pad 120 is disconnected with the third bonding pad 210 to form an open circuit, the other bonding pad is still connected with the third bonding pad 210, so that the flexible circuit board 100 and the hard circuit board 200 are still in an electric connection state at the point, and the connection stability of the flexible circuit board 100 and the hard circuit board 200 is improved.
In a further technical scheme, the first bonding pad 110 and the second bonding pad 120 are symmetrically distributed on the first side and the second side of the flexible circuit board 100, the symmetrical layout mode is easy to produce and manufacture, and in the connection process, workers can conveniently judge the position of the first bonding pad 110 or the second bonding pad 120 relative to the third bonding pad 130, so that the bonding pads can be accurately butted, the problems of judgment errors and welding errors caused by staggered distribution of the first bonding pad 110 and the second bonding pad 120 are avoided, the condition of short circuit among a plurality of bonding pad groups can also be avoided, and the safety of a circuit structure is ensured.
In the direction perpendicular to the hard circuit board 200, the first pad 110 has a first projection area, the second pad 120 has a second projection area, and the third pad 210 has a third projection area, in this embodiment, the first projection area and the second projection area are both smaller than the third projection area, and in the case where the flexible circuit board 100 and the hard circuit board 200 are connected, the first projection area and the second projection area respectively fall within the third projection area; with such a configuration, the flexible circuit board 100 has a larger contact area with the rigid circuit board 200, thereby improving the soldering strength.
In the embodiment of the present application, the flexible circuit board 100 has a hard board connection region, and the first pad 110 and the second pad 120 are disposed in the hard board connection region; the hard circuit board 200 has a flexible board connection region, and the third pads 210 are disposed in the flexible board connection region, and when the flexible circuit board 100 is connected to the hard circuit board 200 by soldering, the hard board connection region corresponds to the flexible board connection region.
In the embodiment of the present application, referring to fig. 2, the soldering positioning mark 220 is disposed in the flexible board connection area, and based on the existence of the soldering positioning mark 220, when performing soldering operation, a worker may first see the soldering positioning mark 220 and realize that the hard board connection area of the flexible circuit board 100 needs to be placed in the area marked by the soldering positioning mark 220, so as to assist in positioning the soldering between the flexible circuit board 100 and the hard circuit board 200, and improve the accuracy of soldering.
In an alternative embodiment, the weld locator 220 matches the contour of the hard plate attachment area. For example, the welding positioning mark 220 may be a mark line, and in the case that the flexible circuit board 100 is a square board, the welding positioning mark 220 may be two corner mark lines, and during welding, as long as the welding portion of the flexible circuit board 100 is placed in the area marked by the welding positioning mark 220, the first pad 110 or the second pad 120 can be accurately butted with the third pad 210; of course, the welding positioning mark may be a positioning recess provided in the hard circuit board 200, besides the mark line, and the positioning recess matches with the profile shape of the hard board connection region.
In a further technical scheme, the first pad 110, the second pad 120 and the third pad 210 are all strip-shaped pads, and the length of the third pad 210 is greater than the length of the first pad 110 and the length of the second pad 120, so that in addition to the welding positioning mark 220, in the welding process, the third pad 210 itself can play a role in auxiliary positioning, and the welding accuracy is improved. For example, referring to fig. 2 and 3, the third pad 210 is connected to the outer surface of the second pad 120, the first pad 110 is located on a side of the flexible circuit board 100 facing away from the rigid circuit board 200, and during the soldering process, a worker can judge the relative positions of the second pad 120 and the third pad 210 by observing the exposed portions of the first pad 110 and the third pad 210, which is beneficial to improving the soldering accuracy.
In the embodiment of the present application, the circuit structure further includes a reinforcing plate 300, the reinforcing plate 300 is connected and fixed with the flexible circuit board 100, for example, the reinforcing plate 300 may be connected with the flexible circuit board 100 by means of adhesive bonding, and the reinforcing plate 300 is adjacent to the hard board connection region; so set up down, stiffening plate 300 can play the design effect to the hardboard connection region of flexible circuit board 100, avoids flexible circuit board 100 bending deformation to influence welding process, and after the welding was accomplished, also can avoid the welding point not hard up.
Referring to fig. 4, an endoscope is further disclosed in the embodiments of the present application, and the endoscope includes a handle portion 500, an insertion portion 600, and the aforementioned circuit structure, wherein the rigid circuit board 200 is disposed in the handle portion 500, a portion of the flexible circuit board 100 is located in the handle portion 500 and connected to the rigid circuit board 200, and another portion of the flexible circuit board 100 may extend to a front end of the insertion portion 600 and may be electrically connected to the camera module and the light source module at the front end of the insertion portion 600; this configuration is advantageous in reducing the space occupied by the circuit structure in the handle section 500, and is advantageous in downsizing the handle section 500 of the endoscope.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element identified by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention.
Claims (10)
1. A circuit structure, comprising:
the flexible printed circuit board (100) is provided with a plurality of pad groups distributed at intervals, each pad group comprises a first pad (110) and a second pad (120), the first pads (110) and the second pads (120) are distributed on two sides of the flexible printed circuit board (100) in the thickness direction, and the first pads (110) are electrically connected with the second pads (120);
the hard circuit board (200), the hard circuit board (200) is provided with a third pad (210), the third pad (210) with the first pad (110) with the second pad (120) welded connection, and the third pad (210) electric connection in the first pad (110) with the second pad (120) one's surface.
2. The circuit structure of claim 1, wherein the first pad (110) and the second pad (120) are symmetrically distributed on both sides of the flexible circuit board (100).
3. The circuit structure of claim 1, wherein the first pad (110) has a first projected area, the second pad (120) has a second projected area, and the third pad (210) has a third projected area, in a direction perpendicular to the rigid circuit board (200), the first and second projected areas being located within the third projected area.
4. The circuit structure of claim 1, wherein the rigid circuit board (200) has a flexible board connection area, and a plurality of the third pads (210) are disposed on the flexible board connection area, and the flexible board connection area is provided with a soldering positioning mark (220).
5. The circuit structure of claim 4, wherein the flexible circuit board (100) has a hard board connection area, the first pad (110) and the second pad (120) are disposed on the hard board connection area, and the solder positioning mark (220) matches a contour shape of the hard board connection area.
6. The circuit structure of claim 5, further comprising a stiffener (300), wherein the stiffener (300) is fixedly connected to the flexible circuit board (100), and the stiffener (300) is adjacent to the hard board connection region.
7. The circuit structure of claim 1, wherein the first pad (110), the second pad (120), and the third pad (210) are each strip pads.
8. The circuit structure of any of claims 1 to 7, wherein the flexible circuit board (100) is provided with conductive vias, and metal connectors or conductive fillers are provided in the conductive vias to electrically connect the first pads (110) and the second pads (120).
9. The circuit structure of any of claims 1 to 7, wherein said third pad (210) connects said first pad (110) and said second pad (120) by means of solder (400).
10. An endoscope comprising a handle portion (500), an insertion portion (600) and a circuit arrangement according to any of claims 1 to 9, wherein said rigid circuit board (200) is provided within said handle portion (500), said flexible circuit board (100) is connected to said rigid circuit board (200), and at least part of said flexible circuit board (100) extends to said insertion portion (600).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202221321213.0U CN217389109U (en) | 2022-05-30 | 2022-05-30 | Circuit structure and endoscope |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221321213.0U CN217389109U (en) | 2022-05-30 | 2022-05-30 | Circuit structure and endoscope |
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Publication Number | Publication Date |
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CN217389109U true CN217389109U (en) | 2022-09-06 |
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CN202221321213.0U Active CN217389109U (en) | 2022-05-30 | 2022-05-30 | Circuit structure and endoscope |
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2022
- 2022-05-30 CN CN202221321213.0U patent/CN217389109U/en active Active
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