CN1131616A - Stencil printing sheet - Google Patents

Stencil printing sheet Download PDF

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Publication number
CN1131616A
CN1131616A CN95121691A CN95121691A CN1131616A CN 1131616 A CN1131616 A CN 1131616A CN 95121691 A CN95121691 A CN 95121691A CN 95121691 A CN95121691 A CN 95121691A CN 1131616 A CN1131616 A CN 1131616A
Authority
CN
China
Prior art keywords
stencilization
plate
resin molding
tissuemat
hot melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN95121691A
Other languages
Chinese (zh)
Other versions
CN1075002C (en
Inventor
奥田贞直
小又悟
桥元博英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riso Kagaku Corp
Original Assignee
Riso Kagaku Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riso Kagaku Corp filed Critical Riso Kagaku Corp
Publication of CN1131616A publication Critical patent/CN1131616A/en
Application granted granted Critical
Publication of CN1075002C publication Critical patent/CN1075002C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/24Stencils; Stencil materials; Carriers therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/24Stencils; Stencil materials; Carriers therefor
    • B41N1/245Stencils; Stencil materials; Carriers therefor characterised by the thermo-perforable polymeric film heat absorbing means or release coating therefor

Landscapes

  • Printing Plates And Materials Therefor (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)

Abstract

A stencil printing sheet is disclosed comprising a resin film and optionally a support for the resin film which is fixed to the resin film with an adhesive, wherein the resin film has a layer for preventing thermal fusion including a polyethylene wax and arranged on one surface thereof. The stencil printing sheet does not cause breakage of the resinous film during a perforating process even at a high printing speed using a thermal head, provides excellent perforation images, and exhibits a long-lasting, excellent resistance to thermal fusion.

Description

The stencilization plate
The present invention relates to a kind of stencilization plate.More particularly, the present invention relates to a kind of stencilization plate, have excellent heat-resisting fusibleness hot (heater element) that it is used in the equipment of preparation perforation stencilization plate.
In the preparation of perforation stencilization plate, use following two kinds of methods usually.In one approach, the processing drawing is fixed on the stencilization plate, they form onboard corresponding to the blacking of manuscript perforation partly with infrared radiation then.Other method is used hot head.In this method, be included in the information of processing in the drawing and be converted into the signal of telecommunication, and the predetermined total amount of heat that produces according to this signal by the heat head and on the stencilization plate, form perforation.In recent years, the ultrared method of preceding a kind of application had become not too popular.On the other hand, a kind of method of using heat head in back is then adopted in great majority prepare the equipment of perforated template printed panel now.Therefore, need suitably to be fit to the stencilization plate of heat head.
The speed of the heat head perforation stencilization plate that uses in the equipment of preparation perforation stencilization plate has become more and more higher.For example, in the past 5 years, the print throughput that is provided with of the thermal printer head by word processor is brought up near 4 to 5 times.This part ground is because the improvement of print speed printing speed.For high print speed printing speed, when perforated plate, because hot melt, heat head and stencilization plate film are bonded to each other, and the result is easy to take place the breaking of resin molding of stencilization plate.This phenomenon produces owing to this is true, that is, because fusing, film is bonded on the heater element, and wherein, when heating masterplate printing plate surface and when the stencilization plate moves, the heater element of heat head and the separation property on stencilization plate surface are poor.In addition, if heat head increases with respect to the transfer velocity of stencilization plate, cause the breaking of film of significant so.In addition, under these conditions, will not to form perforation on the part corresponding to the stencilization plate of the part of manuscript.As a result, reduced the quality of the image that on printing material, forms.
Usually, there have been many methods to be used for preventing the hot melt of stencilization plate.For example, Japanese patent application 48-30570,58-92595,61-295098,1-238992 and 5-64991 discloses the method that is coated with silicone resin and/or silicone oil on the film surface of stencilization plate.Japanese patent application 6-41234 also discloses the method that a surfactant layer is provided on the film surface of stencilization plate.In addition, Japanese patent application 60-19592 has disclosed the method that a wax layer is provided on the film surface of stencilization plate.
Yet in the method for the liquid substance of application examples such as silicone oil or surfactant, As time goes on, these components are transferred on the supporting layer of supporting resin molding, thereby destroy the effect that liquid substance prevents hot melt gradually.On the other hand, though the method for the thermosetting resin of application examples such as silicone resin is preventing that aspect the hot melt be good, and resin Composition is not become the shortcoming transfer on the supporting layer, these methods are defectiveness also, that is, this thermosetting resin has stoped the heater element membrana perforata.
In order to prevent these, applied in any combination silicone resin and silicone oil, or applied in any combination surfactant and water-soluble polymer.But even in these cases, the ability of perforation is owing to the existence of polymer reduces.In other words, As time goes on, the composition of mixing is separated from each other (causing the bleeding phenomenon), thereby has reduced to prevent the effect of hot melt.
If the wax layer is provided, wax will not transferred on the supporting layer of supporting resin molding, also will not reduce the perforate membrane ability of thermal element.Yet when forming perforation under high print speed printing speed, the effect that prevents hot melt not enough.
Therefore, even the good perforation image of hot melt and the stencilization plate that long heat-resisting fusibleness also is provided are not provided when an object of the present invention is to address the above problem and provide one the contact of heat head also can be provided under high print speed printing speed.
In one aspect of the invention, a stencilization plate that comprises resin molding and be attached to the resin molding holder on the resin molding arbitrarily with bonding agent is provided, it is characterized in that, this resin molding have one prevent hot melt form by Tissuemat E and be arranged in lip-deep coating of resin molding.
The mean molecule quantity of Tissuemat E preferably is not more than 10000.
The coating that prevents hot melt preferably by on surface resin film with 0.01 to 5g/m 2Amount (on the basis of drying) coating Tissuemat E prepare.
Because compare with traditional hot melt layer that prevents, stencilization plate of the present invention is used has the Tissuemat E that well prevents the hot melt effect, even the reproduction of the manuscript that may obtain to provide good does not cause the perforation image that resin molding breaks yet under high print speed printing speed.In addition, As time goes on, Tissuemat E can not transferred on the supporting layer.In addition,, Tissuemat E forms because being single composition, thus do not produce the bleeding phenomenon, thereby showed the long duration of action that prevents hot melt.
The Tissuemat E of using among the present invention preferably is coated on the surface resin film of stencilization plate as the hot melt inhibitor.For the perforation quality that prevents resin molding reduces, the mean molecule quantity of Tissuemat E preferably is not more than 10000.Be more preferably in 500 to 5000 scope.
Hope is with 0.01-5g/m 2Amount coating Tissuemat E, and 0.1-2g/m preferably 2(on the basis of drying).If amount very little, prevent that the effect of hot melt from producing breaking of resin inadequately and easily.On the other hand, excessively then produce bad punching quality.
Tissuemat E can be used with the solid form of for example small pieces, or uses with the emulsion form of dispersing wax in water.According to the concrete form of suitably selecting Tissuemat E in the method for the surface applied wax of resin molding.In the Tissuemat E molecule carboxyl or hydroxyl can be arranged.Also can get and replace by other modification bases of for example methyl and phenolic group.
The coating that comprises Tissuemat E that prevents hot melt can at random contain antistatic agent and other additives.For example, antistatic agent comprises metal organic sulfonate, quaternary ammonium salt, alkylphosphonic and other antistatic agents commonly used.
The used resin molding of the present invention can be made up of polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, polyester, polystyrene, polyurethane, Merlon, polyacrylic resin or silicone resin.In the middle of them, polyvinylidene chloride and polyester are good especially.
Thickness of resin film is generally at 0.5 to 20 μ m, and 1 to 15 μ m preferably.
Stencilization plate of the present invention can be resin molding and support the holder of resin molding to stick together with bonding agent and the composite that obtains.In other words, can only form basically by resin molding.Support the holder of resin molding to be made up of the porous material that allows ink for stencilling to pass, perhaps this holder can be the plate of the deflection of oil-tight China ink.When will carry out printing through a holder time, use the porous support materials that comprises Tengjon (high-quality, their Japan paper comprises the paper mulberry tree), textile or non-textile etc. that allows ink for stencilling to pass through.Have in application under the situation of stencilization plate production perforation stencilization plate of holder, before printing, peel holder on the slave plate off, therefore, only carry out printing with resin molding, can application examples such as the plate of deflections such as resin plate, textile, non-textile, printing paper.In this connection, the stencilization plate of being made up of resin molding does not basically require any holder.
There is no particular restriction bonding agent that resin molding and holder stick together, as long as it can be attached to resin molding on the holder, thereby and can form perforation by the heat melts of coming from heater element.
Below, the present invention will be described by embodiment, and these embodiment should not be construed as limitation of the present invention.
Embodiment 1:
2.0 polyester film that μ m is thick and basic weight are 10g/m 2Porous Tengjon paper with vinyl acetate resin (with the following about 1.0g/m of drying condition 2Amount) stick together each other and dry.Then, with the Tissuemat E shown in the table 1 with 0.5g/m 2The amount on (on the dry basis) is coated on the surface of polyethylene film.
Embodiment 2-4:
Repeat the process of embodiment 1, different is to obtain the stencilization plate by those replacement Tissuemat Es shown in the table 1.
Embodiment 5:
With consistent Tissuemat E used among the embodiment 1 with 0.5g/m 2Amount (on the dry-basis) be coated on the surface of the thick polyester film of 2.0 μ m, thereby obtain the stencilization plate.
Comparative example 1-4:
Repeat the process of embodiment 1, different is with those replacement Tissuemat Es shown in the table 1, thereby obtains the stencilization plate.
Table 1
Name of product (manufactory) amount (wt%) mean molecule quantity embodiment 1 highwax 1120H 100 1200
(Mitsui?Petrochemical
Industries, Ltd) embodiment 2 Highwax 4051E 100 3200
(Mitsui?Petrochemical
Industries, Ltd) embodiment 3 Sunwax E-300 100 2000
(Sanyo?Chemical
Industries, Ltd) embodiment 4 PDX 6,641 100 5,000
(Johnson Polymer Co.) comparative example 1 LG wax (wax) [montan wax] 100 800
(BASF) comparative example 2 KF-96-100,000cp 100-
[silicone oil]
(Shin-etsu?Chemical
Co., Ltd.) comparative example 3 KS-770A[heat-curable silicones 50-
Resin]
KF-96-1,000CP 50 -
[silicone oil]
(Shin-etsu?Chemical
Co., Ltd) comparative example 4 Hostaphat KL340 50-
[phosphate surfactant active]
(Matsumoto?Kosho?Ltd.)
Macrogol 1540 50-
[water-soluble polymer]
(Wako?Pure?Chemical
Industries.Ltd)
The test example
Estimate heat-resisting fusibleness (Tissuemat E is in the effect that prevents on the hot melt), the variation of the heat-resisting fusibleness of passing in time and the perforation quality of stencilization plate of the stencilization plate of embodiment 1 to 5 and comparative example 1 to 4 acquisition.
(1) heat-resisting fusibleness:
Bore a hole each stencilization plate (by the Oa-sis30Ax301 that FujitsuLtd. produces, print speed printing speed: 190 character per seconds with word processor.(printing: 10.5 point character, line space: 3.6mm)).The perforation stencilization plate of Huo Deing is subjected to the printing (by RA-205 type of RisoKagakuKogyoK.K production) of stencil printing apparatus like this.But naked eyes confirm breaking of film on the printed matter of gained.Symbol " o " expression has obtained and the consistent best image of original manuscript, and symbol " X " expression has obtained the image different with original manuscript and film rupture takes place.
(2) As time goes on, the variation of heat-resisting fusibleness:
Allow each stencilization plate 50 ℃ of spreadings of bearing month, prevent that specifically hot melt layer from contacting with holder.After this, estimate each stencilization plate in the mode similar to above-mentioned (1).
(3) perforation quality:
With word processor of using in above-mentioned (1) each stencilization plate of boring a hole.Perusal perforation quality.Symbol " o " expression has obtained the image of the original manuscript of accurate reflection, and symbol " x " expression has obtained the image different with original manuscript and can not form enough perforation.
Table 2
Variation perforation quality embodiment 1 zero zero zero embodiment 2 zero zero zero embodiment 3 zero zero zero embodiment 4 zero zero zero embodiment 5 zero zero zero comparative examples 1 that heat-resisting fusibleness is passed in time * 00 comparative examples, 2 zero * zero comparative example 3 zero * * comparative example 4 zero * zero
Can understand from above-mentioned table 2: during boring a hole, each stencilization plate of the present invention with the coating that prevents hot melt does not cause breaking of film, and the printed image of faithful to original manuscript is provided, and shows permanent good heat-resisting fusibleness.
According to the present invention, can provide have permanent good heat-resisting fusibleness and the perforation The mould that breaks of generation tree adipose membrane not in the process even under the condition of the high speed printing of using the heat head The version printed panel. In addition, when take total amount as 0.01 to 5g/m2(on the dry basis) uses flat When average molecular weight is not more than 10000 Tissuemat E, when perforation, can obtain faithful to original The image of manuscript, and do not reduce the quality that resin molding is bored a hole.

Claims (4)

1. stencilization plate, it comprises resin molding and optional is attached to resin molding holder on the resin molding with bonding agent that it is characterized in that this resin molding has the coating that prevents hot melt, this coating comprises Tissuemat E and is arranged on the surface of resin molding.
2. stencilization plate according to claim 1 is characterized in that the mean molecule quantity of Tissuemat E is not more than 10,000.
3. stencilization plate according to claim 1 is characterized in that, by with total amount 0.01 to 5g/m 2(on the dry basis) coating Tissuemat E on the surface of resin molding prepares the coating that prevents hot melt.
4. stencilization plate according to claim 2 is characterized in that, by with total amount 0.01 to 5g/m 2(on the dry basis) coating Tissuemat E on the surface of resin molding prepares the coating that prevents hot melt.
CN95121691A 1994-12-21 1995-12-21 Stencil printing sheet Expired - Fee Related CN1075002C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP318631/1994 1994-12-21
JP318631/94 1994-12-21
JP6318631A JPH08175045A (en) 1994-12-21 1994-12-21 Screen printing stencil paper

Publications (2)

Publication Number Publication Date
CN1131616A true CN1131616A (en) 1996-09-25
CN1075002C CN1075002C (en) 2001-11-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN95121691A Expired - Fee Related CN1075002C (en) 1994-12-21 1995-12-21 Stencil printing sheet

Country Status (7)

Country Link
EP (1) EP0718120B1 (en)
JP (1) JPH08175045A (en)
KR (1) KR0178601B1 (en)
CN (1) CN1075002C (en)
AU (1) AU698100B2 (en)
DE (1) DE69504288T2 (en)
TW (1) TW303405B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114393912A (en) * 2021-11-03 2022-04-26 浙江硕克科技有限公司 Novel composite construction half tone

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722053A (en) * 1980-07-16 1982-02-04 Ricoh Co Ltd Electrographic mimeography
JPS5923719B2 (en) * 1981-01-19 1984-06-04 アジア原紙株式会社 mimeograph paper
CN1008257B (en) * 1985-07-03 1990-06-06 赫尔·亨利·谢韦特 Method for making container by shaping semi-igidity base and apparatus for making same
JPH01135684A (en) * 1987-11-24 1989-05-29 Fuji Photo Film Co Ltd Thermal recording material
JP2825830B2 (en) * 1989-01-12 1998-11-18 旭化成工業株式会社 High-sensitivity heat-sensitive multilayer film and method for producing stencil sheet using the same
DE69031619T2 (en) * 1989-11-14 1998-03-12 Toray Industries LAMINATED POLYESTER FILM
JPH06155906A (en) * 1992-11-19 1994-06-03 Ricoh Co Ltd Reversible thermal recording method
JP3297712B2 (en) * 1993-04-13 2002-07-02 株式会社リコー Heat-sensitive stencil master supply cassette and its mounting / removing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114393912A (en) * 2021-11-03 2022-04-26 浙江硕克科技有限公司 Novel composite construction half tone
CN114393912B (en) * 2021-11-03 2023-04-07 浙江硕克科技有限公司 Composite construction half tone

Also Published As

Publication number Publication date
DE69504288D1 (en) 1998-10-01
TW303405B (en) 1997-04-21
DE69504288T2 (en) 1999-05-06
CN1075002C (en) 2001-11-21
EP0718120A1 (en) 1996-06-26
EP0718120B1 (en) 1998-08-26
KR960021556A (en) 1996-07-18
AU698100B2 (en) 1998-10-22
KR0178601B1 (en) 1999-04-01
AU4059495A (en) 1996-06-27
JPH08175045A (en) 1996-07-09

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Granted publication date: 20011121

Termination date: 20101221