KR0178601B1 - Stencil printing sheet - Google Patents

Abstract

The present invention provides a stencil printing sheet comprising a resin film and, optionally, a support for a resin film adhered to a resin film by an adhesive, wherein the resin film is arranged on one surface and has a heat melting prevention layer comprising polyethylene wax. Relates to a stencil printing sheet.

The stencil printing sheet of the present invention does not break the resin film during the punching process even at high printing speeds using a dermal head, provides an excellent punched image, and exhibits excellent resistance to thermal melting for a long time.

Description

[Name of invention]

Stencil printing sheet

Detailed description of the invention

The present invention relates to a stencil printing sheet. In particular, the present invention relates to a stencil printing sheet having excellent resistance to thermal melting with a heat head (heat generating member) used in an apparatus for producing a perforated stencil printing sheet.

In making a perforated stencil print sheet, the following two methods are generally used. In one method, the original sheet is attached to the stencil printing sheet, and then irradiated with infrared rays to perforate the sheet corresponding to the dark portion of the original sheet. Another method uses a thermal head. In this method, the information contained in the document is converted into an electrical signal, and perforations are made in the stencil print sheet with a predetermined amount of heat generated in the heat head in accordance with the signal. In recent years, the former method of using infrared rays is gradually losing popularity. In contrast, the latter method using thermal heads is currently employed in most devices for producing perforated stencil print sheets. Therefore, there is a need for a stencil print sheet suitable for thermal heads.

The speed at which stencil print sheets are pierced by the thermal heads used in the apparatus to produce perforated stencil print sheets is getting faster. For example, setting or printing performance by thermal heads for word processors has increased by about four to five times over the last five years. These are due in part to the improved printing speed. When the printing speed is high, when the thermal head and the film of the stencil print sheet are attached to each other by thermal fusion, the resin film of the stencil print sheet tends to be broken. This phenomenon is due to the fact that when the film moves in proportion to the stencil print sheet while the heat head heats its surface, the heat head of the stencil print sheet and the heat generating member of the heat generating member on the surface are poorly adhered by melting. Is caused by. Moreover, when the moving speed of the heat head proportional to the stencil print sheet increases, a considerable amount of film is damaged. Also, under these conditions, perforation will be made at the site of the stencil printing sheet other than the site corresponding to the original. As a result, the quality of the image formed on the printed material is degraded.

Typically, a number of methods have been proposed for preventing thermal fusion of stencil print sheets. For example, a method of applying silicone resin and / or silicone oil to the film surface of a stencil print sheet is disclosed in co-pending Japanese Patent Application Laid-Open Nos. 73-030,570, 83-092,595, 86-295,098, 89-238,992 and 93-064,991. Further, a method of providing a surfactant layer on the film surface of a stencil print sheet is described in co-pending Japanese Patent Application Laid-Open No. 94-041,234. Further, a method of providing a wax layer on the film surface of a stencil print sheet is described in co-pending Japanese Patent Application Laid-Open No. 85-019,592.

However, in methods using liquid materials such as silicone oils or surfactants, these components are transferred to the support layer supporting the resin film over time, thereby gradually increasing the influence of the liquid materials on the thermal melting prevention. Degrades. On the contrary, the method of using a thermosetting resin such as a silicone resin is excellent in suppressing thermal melting and there is no disadvantage in that the resin component moves to the support layer, but this method also has the disadvantage that the thermosetting resin prevents the perforation of the film by the heating member. There is this.

To prevent this, silicone resins and silicone oils are used in combination, or alternatively, surfactants and water-soluble aggregates are used in combination. However, even in this case, the puncture ability decreases because of the presence of the polymer. In addition, over time, the mixed components are separated (spills occur). This lowers the effect of preventing thermal fusion.

If a wax layer is provided, the wax will not be transferred to the support layer supporting the resin film nor will the film puncture ability of the heat generating member decrease. However, the effect of suppressing thermal fusion is still insufficient when perforation is made at a high printing speed.

Accordingly, an object of the present invention is to solve the above problems and provide a stencil printing sheet which provides an excellent perforation image without generating thermal fusion upon contact with the thermal head even under high speed printing conditions, and also provides long-term resistance to thermal fusion. To provide.

In one aspect of the invention, there is provided a stencil printing sheet comprising a resin film and a support for a resin film optionally glued to the resin film, wherein the resin film is arranged on one surface thereof and comprises a polyethylene wax It has a fusion preventing layer.

The average molecular weight of the polyethylene wax is preferably 10,000 or less.

The layer for preventing thermal fusion is preferably prepared by applying polyethylene wax on the surface of the resin film in an amount of 0.01 to 5 g / m 2 on a dry basis.

Since the stencil printing sheet of the present invention uses polyethylene having a very excellent effect of preventing heat fusion as compared with a conventional heat fusion preventive layer, the perforated image provides excellent reproduction of originals without damaging the resin film even at high speed printing. Can be provided. Moreover, polyethylene wax does not migrate to the support layer over time. In addition, since the polyethylene wax consists of a single component, it does not cause spillage, and thus has a continuous effect of preventing thermal melting.

The polyethylene wax used in the present invention is preferably applied to the surface of the resin film of the stencil print sheet as a heat melting inhibitor. The average molecular weight of the polyethylene wax is preferably 10,000 or less in order not to degrade the puncture quality of the resin film. More preferably, it is in the range of 500 to 5,000.

The polyethylene wax is preferably applied in an amount of 0.01 to 5 g / m 2, preferably 0.1 to 2 g / m 2 on a dry basis. When this amount is too small, the effect of suppressing thermal fusion is insufficient and breakage of the resin film easily occurs. On the other hand, the excess amount indicates poor puncture ability.

Polyethylene wax can be used in solid form, such as flakes, or in an emulsion state in which the wax is dispersed in water. The particular form of polyethylene is suitably selected according to the method of apply | coating wax to the surface of a resin film. Polyethylene waxes may include carboxyl groups or hydroxyl groups in the molecule. It may also be substituted with other substitution groups such as methyl and phenol groups.

The heat fusion inhibiting layer comprising polyethylene wax may optionally contain an antistatic agent and other additives. Examples of antistatic agents include organic metal sulfates, quaternary ammonium salts, alkyl phosphates and conventional antistatic agents.

The resin film used in the present invention may be made of polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, polyester, polystyrene, polyurethane, polycarbonate, acrylic resin or silicone resin. Of these, polyvinylidene chloride and polyester are particularly preferred.

The thickness of a resin film is 0.5-20 micrometers normally, More preferably, it is 1-15 micrometers.

The stencil printing sheet of the present invention may be a compound material obtained by adhering a resin film and a support for supporting the resin film together with an adhesive. It may also consist essentially of only a resin film. The support for supporting the resin film may be made of a porous material through which the stencil printing ink is passed or the support may be a flexible sheet that is unable to permeate the ink. When printing is performed through a support, a porous support material is used that passes through a stencil printing ink and comprises Tengjoh (Japanese paper containing high quality, dark purple paper), woven fabric, nonwoven fabric, and the like. When the perforated stencil print sheet is manufactured using a stencil print sheet comprising a support, before printing, the support is removed from the sheet, and then only a resin sheet such as a resin sheet, a woven fabric, a nonwoven fabric, a printing paper, or the like is used for the flexible sheet. Printing can be used. In this regard, a stencil printing sheet made of a resin film does not require any support.

The adhesive for bonding the support and the resin film together is not particularly limited to those capable of adhering the resin film to the support and can be melted with heat from the heat generating member to form perforations.

EXAMPLE

The present invention will now be described by way of examples, which should not be construed as limiting the invention thereto.

Example 1

A polyester pilomo with a thickness of 2.0 μm is adhered to each other using vinyl acetate resin (in an amount of about 1.0 g / m 2 on a dry basis) with a basis weight of 10 g / m 2 and then dried. Subsequently, the polyethylene wax shown in Table 1 is applied on the polyethylene film surface in an amount of 0.5 g / m 2 on a dry basis.

[Examples 2 to 4]

The method of Example 1 was repeated except that the polyethylene wax was replaced with those shown in Table 1 to obtain a stencil print sheet.

Example 5

The same polyethylene wax as used in Example 1 was applied to one surface of a polyester film having a thickness of 2.0 μm in an amount of 0.5 g / m 2 on a dry basis to obtain a stencil printing sheet.

[Comparative Examples 1 to 4]

The method of Example 1 was repeated except that the polyethylene wax was replaced with those shown in Table 1 to obtain a stencil print sheet.

[Test Example]

The stencil printing sheets obtained in Examples 1 to 5 and Comparative Examples 1 to 4 were subjected to heat fusion (the effect of polyethylene wax to prevent heat fusion), and their change over time. And the puncture quality of the stencil print sheet.

(1) Resistance to heat fusion: Perforate each stencil print sheet using a word processor [Oasis 30 AX301, manufacturer: Fujitsu Limited, print speed: 190 characters / sec (print: 10.5 point character, line) Spacing: 3.6 mm)]. The perforated stencil printing sheet thus obtained is printed using a stencil printing apparatus (model RA-205, manufactured by Risogagaku Kogyo K. K.). The breakage of the film is visually confirmed for the printed matter produced. The symbol O indicates that the above is obtained exactly the same as that of the original manuscript, while the symbol X indicates that a phase different from that of the original manuscript is obtained and film breakage occurs.

(2) Change in resistance to heat fusion over time: Each stencil print sheet is left standing at 50 ° C. for one month in a rolled state, that is, in contact with a support layer for preventing thermal fusion. Thereafter, each of the stencil print layers is evaluated by a method similar to that described in (1) above.

(3) Perforation Quality: Each stencil print sheet is perforated using the word processor used in (1) above. Perforation quality was observed in various ways. The symbol O indicates that the image accurately reflects the image of the original manuscript, while the symbol X indicates that a different image from that of the original manuscript is obtained and insufficient puncturing is achieved.

From the above Table 2, the stencil printing sheet of the present invention each comprising a layer for suppressing thermal fusion does not break the film during the perforation, provides a print image faithful to the original document, and exhibits excellent long-term resistance to thermal fusion.

According to the present invention, it is possible to provide a stencil printing sheet which has excellent resistance to thermal melting for a long time and does not break the resin film during the punching process even at a high printing speed using a thermal head. In addition, when polyethylene wax having an average molecular weight of 10,000 or less is used in an amount of 0.01 to 5 g / m 2 on a dry basis, when punctured, an image faithful to an image of the original document is obtained without lowering the quality of the puncture in the resin film. can do.

Claims (4)

A stencil print sheet comprising a resin film and a support for a resin film, optionally bonded to a resin film by an adhesive, wherein the resin film is arranged on one surface of the sheet and includes a heat melting prevention layer comprising polyethylene wax. Containing stencil printing sheet. The stencil printing sheet of claim 1 wherein the polyethylene wax has an average molecular weight of 10,000 or less. The stencil printing sheet according to claim 1, wherein the thermal fusion preventing layer is produced by applying polyethylene wax to the surface of the resin film in an amount of 0.01 to 5 g / m 2 on a dry basis. The stencil printing sheet according to claim 2, wherein the heat fusion preventing layer is produced by applying polyethylene wax to the surface of the resin film in an amount of 0.01 to 5 g / m 2 on a dry basis.