CN113130345B - Substrate processing system and maintenance method thereof - Google Patents
Substrate processing system and maintenance method thereof Download PDFInfo
- Publication number
- CN113130345B CN113130345B CN201911405388.2A CN201911405388A CN113130345B CN 113130345 B CN113130345 B CN 113130345B CN 201911405388 A CN201911405388 A CN 201911405388A CN 113130345 B CN113130345 B CN 113130345B
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- valve plate
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- sealing
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- 239000000758 substrate Substances 0.000 title claims abstract description 145
- 238000000034 method Methods 0.000 title claims abstract description 115
- 238000012545 processing Methods 0.000 title claims abstract description 50
- 238000012423 maintenance Methods 0.000 title claims description 23
- 230000005540 biological transmission Effects 0.000 claims abstract description 140
- 238000007789 sealing Methods 0.000 claims abstract description 56
- 238000012546 transfer Methods 0.000 claims description 61
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 12
- 230000009286 beneficial effect Effects 0.000 description 7
- 238000010924 continuous production Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Factory Administration (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A substrate processing system and method of operation thereof, wherein the substrate processing system comprises: the transmission cavity is provided with a plurality of first substrate transmission ports; the process chambers are provided with second substrate transmission openings, the second substrate transmission openings are arranged in one-to-one opposite mode to the first substrate transmission openings, and each process chamber is provided with a sealing valve plate which is used for sealing the second substrate transmission openings; the shared valve plate is used for sealing the first substrate transmission port; a transmission track for transmitting the shared valve plate; and the driving device is used for enabling the shared valve plate to seal the first substrate transmission port. The substrate processing system not only can reduce the number of valve plates between the process cavity and the transmission cavity, but also can realize that the vacuum environment in the transmission cavity is not damaged when the process cavity is maintained.
Description
Technical Field
The present invention relates to the field of semiconductors, and more particularly, to a substrate processing system and a maintenance method thereof.
Background
Existing substrate processing systems typically include an equipment front end module, a vacuum Lock (Load Lock), a transfer chamber, and a plurality of process chambers surrounding the transfer chamber. And the mechanical arm is used for taking out the substrate to be processed from the vacuum lock and placing the substrate into any process cavity, wherein the substrate to be processed is processed in the process cavity, and after the substrate to be processed is processed, the mechanical arm takes out the processed substrate from the process cavity and conveys the processed substrate to the external atmosphere.
In the existing substrate processing system, a valve plate is arranged between the transmission cavity and the process cavity, when the process cavity needs maintenance, the vacuum environment of the transmission cavity is destroyed by dismantling the valve plate, so that the transmission cavity is difficult to continuously transmit the substrate to be processed into other process cavities, namely: the substrate processing system is interrupted.
In order to solve the above problems, two valve plates are arranged between the transmission cavity and the process cavity, one valve plate is used for sealing the opening of the process cavity, and the other valve plate is used for sealing the opening of the transmission cavity. When the valve plate of the process chamber needs to be maintained, the valve plate of the transmission chamber seals the transmission chamber, so that the vacuum environment in the transmission chamber is not destroyed, the transmission chamber can also continuously transmit the substrate to be processed for other process chambers, and the substrate processing system is not interrupted.
However, existing substrate processing systems typically provide two valve plates between each process chamber and the transfer chamber, which makes the substrate processing system costly, and the valve plates for sealing the transfer chamber only function when maintenance is required for the process chamber, which makes the valve plates less useful.
Disclosure of Invention
The invention solves the technical problem of providing a substrate processing system and a maintenance method thereof, which are used for reducing the number of valve plates between a process cavity and a transmission cavity and realizing that the vacuum environment in the transmission cavity is not damaged when the process cavity is maintained.
In order to solve the above technical problems, the present invention provides a substrate processing system, comprising: the transmission cavity is provided with a plurality of first substrate transmission ports; the process chambers are provided with second substrate transmission openings, the second substrate transmission openings are arranged in one-to-one opposite mode to the first substrate transmission openings, and each process chamber is provided with a sealing valve plate which is used for sealing the second substrate transmission openings; the shared valve plate is used for sealing the first substrate transmission port; a transmission track for transmitting the shared valve plate; and the driving device is used for enabling the shared valve plate to seal the first substrate transmission port.
Optionally, the process chambers are located on the same side of the transmission chamber; the transmission track is a straight line; the number of the shared valve plates is 1.
Optionally, the process chamber is located on opposite first and second sides of the transfer chamber; the transmission track is a straight line; the number of the transmission tracks is two, the number of the shared valve plates is two, one transmission track is used for transmitting one shared valve plate, one shared valve plate is used for sealing a first substrate transmission port on a first side of the transmission cavity, and the other shared valve plate is used for sealing a first substrate transmission port on a second side of the transmission cavity.
Optionally, the process chambers are circumferentially arranged around the transmission chamber; the transmission track is polygonal or circular arc.
Optionally, the transmission track is located in the transmission cavity.
Optionally, the shared valve plate has a working state and an idle state, when the shared valve plate is in the working state, the shared valve plate seals the first substrate transmission port, and when the shared valve plate is in the idle state, the shared valve plate is located at a position between adjacent process chambers.
Optionally, a mechanical arm is arranged in the transmission cavity and is used for transmitting the substrate to be processed; when the shared valve plate is in an idle state, the shared valve plate is lower than the height of the mechanical arm for transferring the substrate to be processed.
Optionally, the method further comprises: front end module of the equipment and vacuum lock.
Correspondingly, the invention also provides a maintenance method of the substrate transmission system, which comprises the following steps: providing the substrate processing system described above; when one of the sealing valve plates of the process cavity needs maintenance, the shared valve plate moves to a first substrate transmission port opposite to the sealing valve plate needing maintenance along a transmission track, and the shared valve plate seals the first substrate transmission port by using the driving device; and maintaining the sealing valve plate after the first substrate transmission port is sealed.
Optionally, maintaining the sealing valve plate includes: replacing the sealing valve plate or cleaning the sealing valve plate.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:
in the substrate processing system provided by the technical scheme of the invention, two valve plates are not required to be arranged between each process cavity and the transmission cavity, so that the vacuum environment in the transmission cavity is not destroyed when the process cavity is maintained, but a plurality of process cavities share one shared valve plate, when one process cavity needs to be maintained, the shared valve plate moves to a first substrate transmission port opposite to the process cavity along a transmission track, and the shared valve plate seals the first substrate transmission port through a driving device, so that the vacuum environment in the transmission cavity is not destroyed, and the substrates to be processed can still be transmitted into other process cavities for continuous process processing. Therefore, the number of the valve plates between the process cavity and the transmission cavity is reduced, and the vacuum environment in the transmission cavity is not damaged when the process cavity is maintained.
Drawings
FIG. 1 is a schematic diagram of a structure of a shared valve plate in a substrate processing system according to the present invention;
FIG. 2 is a schematic diagram of a structure of a shared valve plate in a substrate processing system according to the present invention;
FIG. 3 is a schematic diagram of a structure of a shared valve plate in another substrate processing system according to the present invention;
FIG. 4 is a schematic diagram of a structure of a shared valve plate in another substrate processing system according to the present invention;
FIG. 5 is a schematic diagram of a structure of a shared valve plate in yet another substrate processing system according to the present invention;
FIG. 6 is a schematic diagram of a structure of a shared valve plate in a further embodiment of a substrate processing system;
fig. 7 is a flow chart of a method of maintaining the present substrate processing system.
Detailed Description
As described in the background art, when the existing substrate processing system maintains one of the process chambers, although the vacuum environment in the transfer chamber can be ensured, the number of valve plates between the process chambers and the transfer chamber is large, so as to solve the above technical problem, the technical scheme of the present invention provides a substrate processing system, which includes: the transmission cavity is provided with a plurality of first substrate transmission ports; the process chambers are provided with second substrate transmission openings, the second substrate transmission openings are arranged in one-to-one opposite mode to the first substrate transmission openings, and each process chamber is provided with a sealing valve plate which is used for sealing the second substrate transmission openings; the shared valve plate is used for sealing the first substrate transmission port; a transmission track for transmitting the shared valve plate; and the driving device is used for enabling the shared valve plate to seal the first substrate transmission port. When the substrate processing system maintains one of the process chambers, the vacuum environment in the transmission chamber can be ensured, and the number of valve plates between the process chambers and the transmission chamber can be reduced.
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
FIG. 1 is a schematic diagram of a structure of a shared valve plate in a substrate processing system according to the present invention.
Referring to fig. 1, a transfer chamber 100 has a plurality of first substrate transfer ports 105; the substrate processing device comprises a plurality of process chambers 101, wherein each process chamber 101 is provided with a second substrate transmission port 106, the second substrate transmission ports 106 are arranged opposite to the first substrate transmission ports 105 one by one, each process chamber 101 is provided with a sealing valve plate 102, and the sealing valve plate 102 is used for sealing the second substrate transmission ports 106; a shared valve plate 104 for sealing the first substrate transfer port 105; a transmission rail 103 for transmitting the shared valve plate 104; a driving means (not shown) for causing the shared valve plate 104 to seal the first substrate transfer port 105.
In this embodiment, the number of the process chambers 101 is 4. In other embodiments, the number of the process chambers is 2 to 3, or the number of the process chambers is more than 3.
In this embodiment, 4 process chambers 101 are located on the same side of the transfer chamber 100, the transfer rails 103 are straight lines, and the number of the shared valve plates 104 is 1, so when one of the process chambers 101 needs maintenance, the shared valve plates 104 are transferred to the first substrate transfer drain 105 opposite to the process chamber 101 along the transfer rails 103, and the shared valve plates 104 are sealed by using the driving device to seal the first substrate transfer port 105, so that the transfer chamber 100 maintains a vacuum environment. After the shared valve plate 104 seals the first substrate transfer port 105, the sealing valve plate 102 of the process chamber 101 is maintained. In the process of maintaining the sealing valve plate 102, the vacuum environment in the transmission cavity 100 can be maintained, which is beneficial to continuously transmitting the substrate to be processed into other process cavities 101, so that the substrate transmission system is not interrupted, and the processing efficiency of the substrate transmission system is improved. In addition, the 4 process chambers 101 share one shared valve plate 104, instead of two valve plates arranged between each process chamber 101 and the transmission chamber, which is beneficial to reducing the number of valve plates between the process chamber 101 and the transmission chamber 100 and improving the utilization rate of the shared valve plate 104.
FIG. 2 is a schematic diagram of a structure of a common valve plate in a substrate processing system according to the present invention.
Referring to fig. 2, when no process chamber 101 needs maintenance, the shared valve plate 104 is located between adjacent process chambers 101, so that the shared valve plate 104 does not affect the transfer of the substrate to be processed between the first substrate transfer port 105 and the second substrate transfer port.
The transmission chamber 100 is internally provided with a mechanical arm, and the mechanical arm is used for transferring the substrate to be processed, when the transfer of the substrate to be processed is still affected by the positioning of the shared valve plate 104 between the adjacent process chambers 101, the height of the shared valve plate 104 in the idle state can be lower than the height of the mechanical arm for transferring the substrate to be processed.
In this embodiment, the transfer rail 103 is located within the transfer chamber 100.
FIG. 3 is a schematic diagram of a structure of a shared valve plate in another substrate processing system according to the present invention.
In this embodiment, the number of the process chambers 101 is 8, wherein 4 is located on the first side 1 of the process chamber 101, and 4 is located on the second side 2 of the process chamber 101; the number of the transmission tracks 103 is two, namely a transmission track 103a and a transmission track 103b, the number of the shared valve plates 104 is two corresponding to the transmission tracks, namely a shared valve plate 104a and a shared valve plate 104b, the transmission track 103a transmits the shared valve plate 104a, and the transmission track 103b transmits the shared valve plate 104b, namely: the 4 process chambers 101 on the first side 1 of the transfer chamber 100 share the shared valve plate 104a and the 4 process chambers 101 on the second side 2 of the transfer chamber 100 share the shared valve plate 104b. When one of the process chambers 101 on the first side 1 of the transfer chamber 101 needs maintenance, the shared valve plate 104a is transferred to the first substrate transfer port 105 opposite to the process chamber 101 along the transfer track 103a, and the shared valve plate 104a is sealed by the driving device to the first substrate transfer port 105 corresponding to the sealing valve plate 102 needing maintenance. After the shared valve plate 104a seals the first substrate transfer port 105, the sealing valve plate 102 of the process chamber 101 is maintained. In the process of maintaining the sealing valve plate 102, the vacuum environment can be maintained in the transmission cavity 100, which is beneficial to continuously transmitting the substrate to be processed into other process cavities 101, so that the substrate transmission system is not interrupted, and the processing efficiency of the substrate transmission system is improved; in addition, the 4 process chambers 101 on the first side 1 of the transmission chamber 100 share one shared valve plate 104a, instead of two valve plates between each process chamber 101 and the transmission chamber, which is beneficial to reducing the number of valve plates between the process chamber 101 and the transmission chamber 100 and improving the utilization rate of the shared valve plate 104. Likewise, when one of the sealing valve plates 102 on the second side 2 of the transfer chamber 100 needs maintenance, the shared valve plate 104b can realize sealing of the transfer chamber 100, which is beneficial to improving the processing efficiency of the substrate transfer system; the 4 process chambers 101 on the second side 2 of the transmission chamber 100 share one shared valve plate 104b, which is beneficial to reducing the number of valve plates between the process chambers 101 and the second side 2 of the transmission chamber 100 and improving the utilization rate of the shared valve plate 104.
The transfer rail 103a and the transfer rail 103b are both located within the transfer chamber 100.
FIG. 4 is a schematic diagram of a structure of a common valve plate in another substrate processing system according to the present invention.
When the first side 1 of the transmission cavity 100 does not have the sealing valve plate 102 and needs maintenance, the shared valve plate 104a is located between the adjacent process cavities 101 on the first side 1 of the transmission cavity 100; when the second side 2 of the transfer chamber 100 does not have a sealing valve plate 102 for maintenance, the shared valve plate 104a is located between adjacent process chambers 101 on the second side 2 of the transfer chamber 100.
The transmission chamber 100 is internally provided with a mechanical arm, and the mechanical arm is used for transferring the substrate to be processed, when the transfer of the substrate to be processed is still affected by the positioning of the shared valve plate 104 between the adjacent process chambers 101, the height of the shared valve plate 104 in the idle state can be lower than the height of the mechanical arm for transferring the substrate to be processed.
Fig. 5 is a schematic diagram of a structure of a shared valve plate in a substrate processing system according to another embodiment of the present invention.
In this embodiment, the transmission cavity 100 is a hexahedron, and each surface of the hexahedron is correspondingly provided with a process cavity 101, and the transmission track 103 is illustrated as an arc.
In other embodiments, the transfer lumen and transfer rail may be other shapes.
In this embodiment, 6 process chambers 101 are disposed around the transfer chamber 100, and the transfer rail 103 has a circular arc shape. When one of the process chambers 101 needs maintenance, the shared valve plate 104 moves along the transfer track 103 to the first substrate transfer port 105 opposite to the process chamber 101, and the shared valve plate 104 seals the first substrate transfer port 105 by using the driving device, so that the vacuum environment in the transfer chamber 100 is not destroyed, and the transfer chamber 100 can also transfer the substrates to be processed for other process chambers, namely: the substrate processing system is not interrupted and the number of valve plates between the process chamber 101 and the transfer chamber 100 is small.
In this embodiment, the transfer chamber 100 has a mechanical arm, and when the sealing valve plate 102 in one of the process chambers 101 needs maintenance, the shared valve plate 104 is lifted, so that the sealing valve plate 104 seals the first substrate transfer port 105 opposite to the process chamber 101.
FIG. 6 is a schematic diagram of a structure of a shared valve plate in a substrate processing system according to another embodiment of the present invention.
In this embodiment, when no sealing valve plate 102 needs maintenance, the shared valve plate 104 is located between adjacent process chambers 101, and the height of the shared valve plate 104 is lower than that of the mechanical arm, so that the shared valve plate 104 does not affect the transfer of the substrate to be processed between the first substrate transfer port 105 and the second substrate transfer port 106.
Fig. 7 is a flow chart of a method of maintaining the present substrate processing system.
Referring to fig. 7, step S1: providing the substrate processing system described above; step S2: when one of the sealing valve plates of the process cavity needs maintenance, the shared valve plate moves to a first substrate transmission port opposite to the sealing valve plate needing maintenance along a transmission track, and the shared valve plate seals the first substrate transmission port by using the driving device; step S3: and maintaining the sealing valve plate after the first substrate transmission port is sealed.
Two valve plates are not required to be arranged between each process cavity and the transmission cavity, so that the vacuum environment in the transmission cavity is not destroyed when the process cavity is maintained, a plurality of process cavities share one shared valve plate, when one process cavity needs to be maintained, the shared valve plate moves to a first substrate transmission port opposite to the process cavity along a transmission track, and the shared valve plate seals the first substrate transmission port through a driving device, so that the vacuum environment in the transmission cavity is not destroyed, and the substrates to be processed can still be transmitted to other process cavities in the transmission cavity to continue the process treatment. Therefore, the number of the valve plates between the process cavity and the transmission cavity is reduced, and the vacuum environment in the transmission cavity is not damaged when the process cavity is maintained.
In this embodiment, maintaining the sealing valve plate includes: replacing the sealing valve plate or cleaning the sealing valve plate.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (9)
1. A substrate processing system, comprising:
the transmission cavity is provided with a plurality of first substrate transmission ports;
the process chambers encircle the periphery of the transmission chamber, each process chamber is provided with a second substrate transmission port, the second substrate transmission ports are arranged opposite to the first substrate transmission ports one by one, each process chamber is provided with a sealing valve plate, and the sealing valve plates are used for sealing the second substrate transmission ports;
the shared valve plate is positioned in the transmission cavity, the number of the shared valve plate is smaller than the number of the first substrate transmission ports, and when the sealing valve plate of the process cavity is to be maintained, the shared valve plate is used for sealing the first substrate transmission ports corresponding to the sealing valve plate to be maintained;
the transmission rail is positioned in the transmission cavity and used for transmitting the shared valve plate;
and the driving device is used for driving the shared valve plate to move to the relative position of the sealing valve plate to be maintained along the transmission track so as to seal the corresponding first substrate transmission port.
2. The substrate processing system of claim 1, wherein a plurality of said process chambers are located on the same side of said transfer chamber; the transmission track is a straight line; the number of the shared valve plates is 1.
3. The substrate processing system of claim 1, wherein a plurality of said process chambers are located on opposite first and second sides of said transfer chamber, respectively; the transmission track is a straight line; the number of the transmission tracks is two, the number of the shared valve plates is two, one transmission track is used for transmitting one shared valve plate, one shared valve plate is used for sealing a first substrate transmission port on a first side of the transmission cavity, and the other shared valve plate is used for sealing a first substrate transmission port on a second side of the transmission cavity.
4. The substrate processing system of claim 1, wherein a plurality of said process chambers are circumferentially disposed about the transfer chamber; the transmission track is polygonal or circular arc.
5. The substrate processing system of claim 1, wherein the shared valve plate has an operational state and an idle state, wherein the shared valve plate seals the first substrate transfer port when the shared valve plate is in the operational state, and wherein the shared valve plate is positioned between adjacent process chambers when the shared valve plate is in the idle state.
6. The substrate processing system of claim 1, wherein the transfer chamber has a robot arm therein for transferring substrates to be processed; when the shared valve plate is in an idle state, the shared valve plate is lower than the height of the mechanical arm for transferring the substrate to be processed.
7. The substrate processing system of claim 1, further comprising: the equipment front end module and the vacuum lock.
8. A method of maintaining a substrate processing system, comprising:
providing a substrate processing system according to any one of claims 1 to 7;
when one of the sealing valve plates of the process cavity needs maintenance, the shared valve plate moves to a first substrate transmission port opposite to the sealing valve plate needing maintenance along a transmission track, and the shared valve plate seals the first substrate transmission port by using the driving device;
and maintaining the sealing valve plate after the first substrate transmission port is sealed.
9. The method of maintaining a substrate processing system as recited in claim 8, wherein maintaining the seal valve plate comprises: replacing the sealing valve plate or cleaning the sealing valve plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911405388.2A CN113130345B (en) | 2019-12-31 | 2019-12-31 | Substrate processing system and maintenance method thereof |
| TW109140209A TWI790499B (en) | 2019-12-31 | 2020-11-18 | Substrate processing system and maintenance method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911405388.2A CN113130345B (en) | 2019-12-31 | 2019-12-31 | Substrate processing system and maintenance method thereof |
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| Publication Number | Publication Date |
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| CN113130345A CN113130345A (en) | 2021-07-16 |
| CN113130345B true CN113130345B (en) | 2023-12-08 |
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| CN201911405388.2A Active CN113130345B (en) | 2019-12-31 | 2019-12-31 | Substrate processing system and maintenance method thereof |
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| CN (1) | CN113130345B (en) |
| TW (1) | TWI790499B (en) |
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| US7281700B2 (en) * | 2005-04-12 | 2007-10-16 | Tokyo Electron Limited | Gate valve apparatus for vacuum processing system |
| DE102012100929A1 (en) * | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Substrate processing system |
| US9994956B2 (en) * | 2014-08-11 | 2018-06-12 | University Of Kansas | Apparatus for in situ deposition of multilayer structures via atomic layer deposition and ultra-high vacuum physical or chemical vapor deposition |
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| US6095741A (en) * | 1999-03-29 | 2000-08-01 | Lam Research Corporation | Dual sided slot valve and method for implementing the same |
| US6267545B1 (en) * | 1999-03-29 | 2001-07-31 | Lam Research Corporation | Semiconductor processing platform architecture having processing module isolation capabilities |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI790499B (en) | 2023-01-21 |
| CN113130345A (en) | 2021-07-16 |
| TW202129799A (en) | 2021-08-01 |
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