TWI821590B - Substrate processing system, valve elements and working methods - Google Patents

Abstract

A substrate processing system includes: a first chamber provided with a first substrate transmission port; a second chamber with a second substrate transmission port; a sealing case disposed between the first chamber and the second chamber and including a first opening corresponding to the first substrate transmission port and a second opening corresponding to the second substrate transmission port, the sealing case connected to the first substrate transmission port and the second substrate transmission port, a first step located on the surrounding of the first substrate transmission port or the first opening; a first gate valve disposed in the sealing case; a second gate valve disposed in the sealing case; a driving device driving the first gate valve and/or the second gate valve to move to let first gate valve seal the first step, and/or let second gate valve seal the second substrate transmission port. The efficiency of the substrate processing system is elevated.

Description

Substrate handling systems, valve components and methods of operation

The invention relates to the field of semiconductors, and in particular to a substrate processing system, a valve component and a working method of the substrate processing system.

Existing substrate processing systems are usually vacuum cluster equipment. The vacuum cluster equipment includes a front-end module of the equipment, a load/unload chamber (Load Lock Chamber), a second chamber, and a first chamber surrounding the second chamber. Among them, a robot arm (Robot) is installed in the second cavity. The robot arm is used to take out the substrate to be processed from the loading/unloading cavity and place it into any first cavity. In the first cavity, the substrate to be processed is The substrate is processed. After the processing of the substrate to be processed is completed, the robot arm takes out the processed substrate from the first chamber and transfers the processed substrate to the outside atmospheric environment.

In the existing substrate processing system, a valve is provided between the transfer chamber and the process chamber, and between the transfer chamber and the loading/unloading chamber. When the valve needs to be replaced, removing the valve will destroy the vacuum environment of the transfer chamber, process chamber and loading/unloading chamber, making it difficult for the substrate processing system to continue processing the substrates to be processed. Therefore, the existing substrate processing system has a high crash frequency. , the processing efficiency of the substrate to be processed is low.

The technical problem solved by the present invention is to provide a substrate processing system, a valve component and a working method of the substrate processing system, so as to improve the substrate processing efficiency of the substrate processing system.

In order to solve the above technical problems, the present invention provides a substrate processing system, which includes: a first chamber having a first substrate transfer port; a second chamber having a second substrate transfer port; a sealing shell located at the first substrate transfer port; Between the first cavity and the second cavity, the sealing shell includes a first opening and a second opening. The first opening corresponds to the first substrate transfer port, and the second opening corresponds to the second substrate transfer port. The sealing shell and the first substrate transfer port It is connected with the second substrate transmission port, and a first step is provided around the first substrate transmission port or the first opening; the first valve is located in the sealing shell; the second valve is located in the sealing shell; the driving device drives the first valve and/or the third The two valves move to make the first valve seal the first step, and/or make the second valve seal the second substrate transfer port.

In an embodiment of the present invention, when the opening area of the first opening is larger than the opening area of the first substrate transfer port, there is a first step around the first substrate transfer port, and the first valve seals the first substrate transfer port or the first opening. Around the first steps.

In an embodiment of the present invention, when the opening area of the first opening is less than or equal to the opening area of the first substrate transfer port, there is a first step around the first opening, and the first valve is used to seal the first step around the first opening. steps.

In an embodiment of the present invention, when the opening area of the second opening is larger than the opening area of the second substrate transfer port, the second valve seals the second substrate transfer port or the second opening.

In an embodiment of the present invention, when the opening area of the second opening is less than or equal to the opening area of the second substrate transfer port, the second valve seals the second opening.

In an embodiment of the invention, the side wall of the second valve seals the second substrate transfer port.

In an embodiment of the present invention, there is a second step around the second substrate transfer port or the second opening, and the second valve seals the second step.

In an embodiment of the invention, the first valve and the second valve have the same or different sizes.

In an embodiment of the present invention, the first chamber is a process chamber, and the second chamber is a transmission chamber.

In an embodiment of the present invention, the number of process chambers is greater than one, and each process chamber surrounds the transmission chamber; a first valve, a second valve and a sealing shell are disposed between each process chamber and the transmission chamber.

In an embodiment of the invention, the first chamber is a vacuum chamber, and the second chamber is a transmission chamber.

In an embodiment of the present invention, the driving device includes a power device and a driving rod connected to the power device, and the first valve and the second valve are fixed on the driving rod.

Correspondingly, the present invention also provides a valve component for a substrate processing system including: a first valve; a second valve; a valve housing surrounding the first valve and the second valve, the valve housing having a first opening and a second opening, the first There is a first step around the opening; a driving device moves the first valve to seal the first step, and/or moves the second valve to seal the second opening.

In an embodiment of the invention, the side wall of the second valve seals the second opening.

In an embodiment of the invention, a second step is provided around the second opening, and the second valve seals the second step.

In an embodiment of the invention, the driving device moves the first valve upward to seal the first step, and/or moves the second valve toward the second opening to seal the second opening.

Correspondingly, the present invention also provides a working method of a substrate processing system, which includes: providing the above substrate processing system; using a driving device to move the first valve and/or the second valve so that the first valve seals the first step, and/or causing the second valve to seal the second substrate transfer port.

In an embodiment of the present invention, when the first valve seals the first substrate transfer port, the second valve is replaced; or when the second valve seals the second substrate transfer port, the first valve is replaced.

Compared with the existing technology, the technical solution of the embodiment of the present invention has the following beneficial effects: In the substrate processing system provided by the technical solution of the present invention, the first valve is used to seal the first step, which is beneficial to ensuring that the vacuum environment is maintained in the first chamber; The second valve is used to seal the second substrate transfer port, which is beneficial to ensuring that a vacuum environment is maintained in the second chamber. When the first valve needs maintenance, make the second valve seal the second substrate transfer port, then the vacuum environment can still be maintained in the second chamber. When the second valve needs maintenance, make the first valve seal the first substrate transfer port, then A vacuum environment can still be maintained in the first chamber. When the vacuum environment can still be maintained in the first cavity or the second cavity, the process processing can still be continued in the first cavity or the second cavity without shutting down. Therefore, it is beneficial to reduce the frequency of machine crashes and improve the processing efficiency of the substrate to be processed. . In addition, when the driving device is used to seal the first step of the first valve, the driving force applied will not be reduced by the plate of the first valve, but will be completely transmitted to the sealing device at the top of the first valve. Therefore, only a small amount of force is required. The driving force can achieve better sealing effect. Moreover, by using the first valve to seal the first step, the rigidity requirement for the material of the first valve is low.

100: Process chamber

101:Transmission cavity

102: Vacuum chamber

200, 300: first cavity

201, 301: First substrate transmission port

202, 302: Second cavity

203, 303: Second substrate transmission port

204, 304, 400, 500: sealed shell

205, 305, 401, 501: first valve

205a, 206a, 305a, 401a, 501a: Plate

205b, 206b, 305b, 401b, 501b, 502b: sealing device

206, 306, 402, 502: Second valve

207:Driving rod

208:Cover

209, 309, 405, 505: first opening

210, 310, 406, 506: Second opening

211, 311, 404, 504: the first step

212, 407: The second step

230:First screw

240:Second screw

307, 403, 503: driving device

Figure 1 is a top view of a substrate processing system; Figure 2 is a schematic cross-sectional structural diagram of a substrate processing system of the present invention; Figure 3 is a schematic structural diagram of the first valve sealing the first substrate transfer port in the substrate processing system of Figure 2; Figures 4 and 5 are structural schematic diagrams of each step of sealing the second substrate transfer port with the second valve in the substrate processing system in Figure 2; Figure 6 is a schematic structural diagram of the first valve unloading in the substrate processing system of Figure 2; Figure 7 is a schematic cross-sectional structural diagram of another substrate processing system of the present invention; Figure 8 is a seal of the first valve in the substrate processing system of Figure 7 A schematic structural diagram of a substrate transfer port; Figure 9 is a schematic structural diagram of the second valve sealing the second substrate transfer port in the substrate processing system of Figure 7; Figure 10 is a schematic structural diagram of a valve component used in the substrate processing system of the present invention ; Figure 11 is a side view of the first valve in the valve assembly in Figure 10; Figure 12 is a structural schematic diagram of another valve component used in the substrate processing system of the present invention; Figure 13 is a second valve component in Figure 12 Side view of the valve; Figure 14 is a flow chart of the working method of the substrate processing system of the present invention.

As mentioned in the background art, the existing substrate processing system has low processing efficiency for substrates. In order to solve the above technical problem, the technical solution of the present invention provides a vacuum sealing device, including: a first cavity, and the first cavity has a first substrate transfer port. ; The second cavity has a second substrate transfer port, and the second cavity and the first cavity are arranged in the horizontal direction; the sealing shell is located between the first cavity and the second cavity, and the sealing shell is connected with the first substrate transfer port and the third cavity. The two substrate transmission ports are connected; the first valve is located in the sealing shell; the second valve is located in the sealing shell, and the second valve and the first valve are arranged in the horizontal direction; the driving device drives the movement of the first valve and/or the second valve, The first valve is caused to seal the first substrate transfer port, and/or the second valve is caused to seal the second substrate transfer port. The substrate processing system has high efficiency in processing substrates.

In order to make the above objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

Figure 1 is a top view of a substrate processing system.

Please refer to Figure 1. The substrate processing system includes: a process chamber 100, a transfer chamber 101 and a vacuum chamber 102. The process chamber 100 and the vacuum chamber 102 surround the transfer chamber 101.

The process chamber (Process Module, PM) 100 is a vacuum environment and is used for semiconductor processing on the substrate to be processed.

The transfer chamber (Transfer Module, TM) 101 is in a vacuum environment, and there is a robotic arm in the transfer chamber 101 for transferring the substrate to be processed in the transfer chamber 101 into one of the process chambers 100 .

The vacuum chamber (Loadlock) 102 is used to switch between the atmospheric environment and the vacuum environment.

Figure 2 is a schematic cross-sectional structural diagram of a substrate processing system of the present invention.

Please refer to Figure 2. The first chamber 200 has a first substrate transfer port 201; the second chamber 202 has a second substrate transfer port 203; the sealing shell 204 is located between the first cavity 200 and the second cavity 202, and the sealing shell 204 includes a An opening 209 and a second opening 210. The first opening 209 corresponds to the first substrate transfer port 201, the second opening 210 corresponds to the second substrate transfer port 203, and the sealing shell 204 corresponds to the first substrate transfer port 201 and the second substrate transfer port. The first substrate transfer port 201 or the first opening 209 is connected with the first step 211; the first valve 205 is located in the sealing shell 204; the second valve 206 is located in the sealing shell 204; the driving device drives the first valve 205 And/or the second valve 206 moves, causing the first valve 205 to seal the first step 211, and/or causing the second valve 206 to seal the second substrate transfer port 203.

In one embodiment, the first cavity 200 is a process module (PM), and the process cavity is in a vacuum environment. The substrate to be processed is subjected to a semiconductor process in the first cavity 200. The semiconductor process is The process includes: a plasma etching process, the first substrate transfer port 201 of the first cavity 200 is used to transfer in or out the substrate to be processed; the second cavity 202 is a transfer cavity (Transfer Modul, TM), and the transfer cavity is a vacuum Environment, there is a robot arm (not shown in the figure) in the second chamber 202, and the robot arm is used to grab the substrate and transfer the substrate in or out through the second substrate transfer port 203.

In another embodiment, the first chamber 200 is a transfer chamber, and the second chamber 202 is a vacuum chamber (Loadlock).

In this embodiment, the driving device includes a power device (not shown in the figure) and a driving rod 207 connected with the power device.

In this embodiment, the driving device moves the first valve 205 upward so that the first valve 205 seals the first step 211 and makes the first chamber 200 a vacuum environment. When the second valve 206 needs to be replaced or maintained, the first valve 205 seals the first step 211, which is beneficial to ensuring a vacuum environment in the first chamber 200, so that the semiconductor process in the first chamber 200 is not interrupted, which is beneficial to improving the efficiency of the process. The substrate processing efficiency of the substrate processing system.

In this embodiment, the driving device moves the second valve 206 toward the second substrate transfer port 203 and moves the second valve 206 to seal the second substrate transfer port 203 so that the second chamber 202 becomes a vacuum environment. When the first valve 205 needs to be replaced or maintained, the second valve 206 seals the second substrate transfer port 203, which is beneficial to ensuring a vacuum environment in the second chamber 202, so that the semiconductor process in the second chamber 202 is not destroyed, which is beneficial to Improve the substrate processing efficiency of the substrate processing system.

In this embodiment, the size of the first valve 205 is different from the size of the second valve 206 . In other embodiments, the first valve and the second valve are the same size.

In this embodiment, when the first cavity 200 is a process cavity and the second cavity 202 is a transfer cavity, if the number of process cavities is greater than 1, multiple process cavities surround the transfer cavity, and there is a gap between each process cavity and the transfer cavity. Both have a first valve 205, a second valve 206 and a sealing shell 204.

Figure 3 is a schematic structural diagram of the first valve sealing the first substrate transfer port in the substrate processing system of Figure 2.

In this embodiment, the opening area of the first opening 209 is equal to the opening area of the first substrate transfer port 201. There is a first step 211 around the first opening 209, and the first valve 205 is used to seal the first step 211. The first valve 205 is matched with the first step 211 using a driving device, and the first valve 205 seals the first step 211 .

In this embodiment, the first valve 205 includes a plate 205a and a sealing device 205b. The plate 205a includes a vertical portion and an extension portion extending outward from one end of the vertical portion. The sealing device 205b is located above and extends from the other end of the vertical portion. above the head. When the driving device is used to seal the first step 211 of the first valve 205, the driving force applied will not be reduced by the plate and can be completely transmitted to the sealing device. Therefore, only a smaller driving force is required to achieve better results. sealing effect. Moreover, by using the first valve 205 to seal the first step 211, the rigidity requirement of the material of the first valve 205 is low.

In other embodiments, the opening area of the first opening is smaller than the opening area of the first substrate transfer port, there is a first step around the first opening, and the driving device causes the first valve to seal the first opening; or, the opening area of the first opening is The opening area is larger than the opening area of the first substrate transfer port, and there is a first step around the first substrate transfer port or the first opening, and the driving device causes the first valve to seal the first substrate transfer port or the first opening.

In this embodiment, when the second valve 206 needs to be maintained or replaced, the first valve 205 seals the first step 211, which is beneficial to ensuring the vacuum environment in the first chamber 200 and preventing the semiconductor process in the first chamber 200 from being destroyed. Interruption, therefore, helps improve the processing efficiency of the substrate processing system.

Figures 4 and 5 are schematic structural diagrams of each step of sealing the second substrate transfer port with the second valve in the substrate processing system in Figure 2.

The method of driving the device to cause the second valve 206 to seal the second substrate transfer port 203 includes: (1) using the drive device to drive the second valve 206 toward the second substrate transfer port 203 . (2) After the second valve 206 moves toward the second substrate transfer port 203, the driving device is used to move the second valve 206 toward the second substrate transfer port 203 to seal the second substrate transfer port 203. Among them, Figure 4 corresponds to the structural schematic diagram of using the driving device to move the second valve 206 toward the second substrate transfer port 203, and Figure 5 corresponds to using the driving device to move the second valve 206 toward the second substrate transfer port 203 to seal the second substrate. Transmission port 203.

In this embodiment, the opening area of the second opening 210 is equal to the opening area of the second substrate transfer port 203. There is a second step 212 around the second opening 210, and the second valve 206 seals the second step 212. The second valve 206 is matched with the second step 212 using a driving device, and the second valve 206 is used to achieve sealing of the second step 212 .

In this embodiment, the second valve 206 includes a plate 206a and a sealing device 206b. The plate 206a includes a vertical portion and an extension extending outward from one end of the vertical portion. The sealing device 206b is located above and extends from the other end of the vertical portion. When the driving device is used to seal the second step 212 above the second valve 206, the driving force applied will not be reduced by the plate and can be completely transmitted to the sealing device. Therefore, only a small driving force is required. A better sealing effect can be achieved. Moreover, the second valve 206 is used to seal the second step 212, and the rigidity requirement of the material of the second valve 206 is low.

In other embodiments, the opening area of the second opening is smaller than the opening area of the second substrate transfer port, there is a second step around the second opening, and the driving device causes the second valve to seal the second opening; or, the opening area of the second opening is Larger than the opening area of the second substrate transfer port, there is a second step around the second substrate transfer port or the second opening, and the driving device causes the second valve to seal the second substrate transfer port or the second opening.

In this embodiment, when the first valve 205 needs maintenance or replacement, the second valve 206 seals the second opening 210, which is beneficial to ensuring the vacuum environment in the second chamber 202 so that the processing in the second chamber 202 is not interrupted. , Therefore, it is beneficial to improve the processing efficiency of the substrate processing system.

The following is an example of unloading the first valve: Figure 6 is a schematic structural diagram of the substrate processing system in Figure 2 unloading the first valve.

The first valve 205 and the second valve 206 are fixed on the driving rod 207. Specifically, the first valve 205 is fixed on the driving rod 207 through the first screw 230, and the second valve 206 is fixed on the driving rod 207 through the second screw 240. .

The substrate processing system also includes: a cover plate 208 that covers the top of the sealing shell. When it is necessary to disassemble the first valve 205 or the second valve 206, the cover plate 208 needs to be opened.

The method of disassembling the first valve 205 includes: (1) making the second valve 206 seal the second substrate transfer port 203 . (2) After the second valve 206 seals the second substrate transfer port 203, open the cover 208. (3) After opening the cover 208, remove the first screw 230 to separate the first valve 205 from the driving rod 207.

During the process of disassembling the first valve 205, the second valve 206 seals the second substrate transfer port 203, so that the second chamber 202 is still in a vacuum environment, so that the corresponding semiconductor process can still be performed in the second chamber 202. Therefore, it is beneficial To improve the processing efficiency of the substrate processing system.

The method of disassembling the second valve 206 includes: (1) making the first valve 205 seal the first substrate transfer port 201 . (2) After the first valve 205 seals the first substrate transfer port 201, open the cover 208. (3) After opening the cover 208, remove the second screw 240 to separate the second valve 206 from the driving rod 207.

Figure 7 is a schematic cross-sectional structural diagram of another substrate processing system of the present invention.

Please refer to Figure 7. The first cavity 300 has a first substrate transfer port 301; the second cavity 302 has a second substrate transfer port 303; the sealing shell 304 is located between the first cavity 300 and the second cavity 302, and the sealing shell 304 includes The first opening 309 and the second opening 310, the first opening 309 corresponds to the first substrate transfer port 301, the second opening 310 corresponds to the second substrate transfer port 303, and the sealing shell 304 corresponds to the first substrate transfer port 301 and the second substrate The transmission port 303 is connected, and a first step 311 is set around the first substrate transmission port 301 or the first opening 309; the first valve 305 is located in the sealing shell 304; the second valve 306 is located in the sealing shell 304; the driving device 307 drives The first valve 305 and/or the second valve 306 move, so that the first valve 305 seals the first step 311, and/or the second valve 306 seals the second substrate transfer port 303.

The first valve 305 seals the first step 311 to ensure that the vacuum environment is maintained in the first chamber 300; the second valve 306 is used to seal the second substrate transfer port 303 to ensure that the vacuum environment is maintained in the second chamber 302. When the first valve 305 needs maintenance, the second valve 306 is made to seal the second substrate transfer port 203, so that the vacuum environment can still be maintained in the second chamber 302. When the second valve 306 needs maintenance, the first valve 305 is made to seal the second substrate transfer port 203. With a step 311, the vacuum environment can still be maintained in the first chamber 300. Since the vacuum environment can still be maintained in the first cavity 300 or the second cavity 302, the semiconductor process can still be continued in the first cavity 300 or the second cavity 302 without shutting down. Therefore, it is beneficial to reduce the crash frequency and improve the processing time. substrate processing efficiency.

Figure 8 is a schematic structural diagram of the first valve sealing the first substrate transfer port in the substrate processing system of Figure 7.

In this embodiment, the opening area of the first opening 309 is equal to the opening area of the first substrate transfer port 301. There is a first step 311 around the first opening 309, and the first valve 305 seals the first step 311. The first valve 305 is matched with the first step 311 using a driving device, and the first valve 305 seals the first step 311 .

In this embodiment, the first valve 305 includes a plate 305a and a sealing device 305b. The plate 305a includes a vertical portion and an extension extending outward from one end of the vertical portion. The sealing device 305b is located above and extends from the other end of the vertical portion. When the driving device is used to seal the first step 311 above the first step 311, the driving force applied will not be reduced by the plate and can be completely transmitted to the sealing device. Therefore, only a small driving force is required to seal the first step 311. Achieve better sealing effect. Moreover, the first valve 305 is used to seal the first step 311, and the rigidity requirements for the material of the first valve 305 are low.

In other embodiments, the opening area of the first opening is smaller than the opening area of the first substrate transfer port, there is a first step around the first opening, and the driving device causes the first valve to seal the first opening; or, the opening area of the first opening is The opening area is larger than the opening area of the first substrate transfer port, and there is a first step around the first substrate transfer port, and the driving device causes the first valve to seal the first substrate transfer port or the first opening.

Figure 9 is a schematic structural diagram of the second valve sealing the second substrate transfer port in the substrate processing system of Figure 7.

In this embodiment, the opening area of the second opening 310 is equal to the opening area of the second substrate transfer port 303 , and the driving device 307 causes the side wall of the second valve 306 to seal the second opening 310 .

In other embodiments, the opening area of the second opening is smaller than the opening area of the second substrate transfer port, and the driving device causes the side wall of the second valve to seal the first opening; or, the opening area of the second opening is larger than that of the second substrate transfer port. The opening area is such that the driving device causes the side wall of the second valve to seal the second substrate transfer port or the second opening.

Figure 10 is a schematic structural diagram of a valve component used in a substrate processing system of the present invention; Figure 11 is a side view of the first valve in the valve assembly of Figure 10.

Please refer to Figure 10. The valve component used in the substrate processing system of the present invention includes: a first valve 401; a second valve 402; a sealing shell 400 located around the first valve 401 and the second valve 402. The sealing shell 400 There is a first opening 405 and a second opening 406, and a first step 404 is provided around the first opening 405; the driving device 403 moves the first valve 401 to seal the first step 404, and/or moves the second valve 402 to seal Second opening 406.

In this embodiment, the method of using the driving device 403 to seal the first opening 405 includes: using the driving device 403 to move the first valve 401 upward so that the first valve 401 seals the first step 404 .

In this embodiment, there is a second step 407 around the second opening 405; the method of using the driving device 403 to seal the second opening 406 includes: (1) using the driving device 403 to move the second valve 402 toward the second step 407. (2) After moving the second valve 402 toward the second step 407, the second valve 402 is made to seal the second step 407.

In this embodiment, the first valve 401 has the same shape as the second valve 402 . Taking the shape of the first valve 401 as an example for explanation, please refer to Figure 11. Figure 11 is a side view of the first valve in the valve assembly of Figure 10.

The first valve 401 includes a plate 401a and a sealing device 401b. The plate 401a includes a vertical part and an extension extending outward from one end of the vertical part. The sealing device 401b is located above the other end of the vertical part and above the extension. Using a driving device , when the first valve 401 seals the first step, the driving force applied will not be reduced by the plate and can be completely transmitted to the sealing device. Therefore, only a smaller driving force is needed to achieve a better sealing effect. Moreover, using the first valve 401 to seal the first step requires low rigidity of the material of the first valve 401 .

Figure 12 is a schematic structural diagram of another valve component used in a substrate processing system of the present invention; Figure 13 is a side view of the second valve in the valve component of Figure 12.

Please refer to Figure 12. The valve component used in the substrate processing system of the present invention includes: a first valve 501; a second valve 502; a sealing shell 500 located around the first valve 501 and the second valve 502, and the sealing shell 500 has a third An opening 505 and a second opening 506. The first opening 505 has a first step 504; the driving device 503 is used to move the first valve 501 to seal the first step 504, and/or to move the second valve 502 to seal the first step 504. Two openings 506.

In this embodiment, the shape of the first valve 501 is the same as the shape of the first valve in the embodiment shown in FIG. 11 .

In this embodiment, when the second valve 502 seals the second opening 506, the side wall of the second valve 502 seals the second opening 506.

In this embodiment, the structure of the first valve 501 is different from the shape of the second valve 502, wherein the shape of the first valve 501 is the same as that of the embodiment shown in FIG. 11 . Please refer to Figure 13 for the shape of the second valve 502.

Please refer to Figure 13, which is a side view of the second valve in the valve assembly of Figure 12.

The second valve 502 includes a sealing device 502b located on a side wall of the second valve 502 .

Figure 14 is a flow chart of the working method of the substrate processing system of the present invention.

Please refer to Figure 14, step S1: provide the above substrate processing system; step S2: use the driving device to move the first valve and/or the second valve, so that the first valve seals the first step, and/or the second valve Seal the second substrate transfer port.

The first valve is used to seal the first step, which is beneficial to ensuring that the vacuum environment is maintained in the first cavity; the second valve is used to seal the second substrate transfer port, which is beneficial to ensuring that the vacuum environment is maintained in the second cavity. When the first valve needs maintenance, make the second valve seal the second substrate transfer port, then the vacuum environment can still be maintained in the second chamber. When the second valve needs maintenance, make the first valve seal the first substrate transfer port, then A vacuum environment can still be maintained in the first chamber. When the vacuum environment can still be maintained in the first cavity or the second cavity, the semiconductor process can still be continued in the first cavity or the second cavity without shutting down. Therefore, it is beneficial to reduce the frequency of downtime and improve the processing efficiency of the substrate to be processed. .

Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the protection scope of the invention should be subject to the scope defined by the patent application.

200: first cavity

201: First substrate transmission port

202:Second chamber

203: Second substrate transmission port

204:Sealed shell

205:First valve

206:Second valve

209:First opening

210:Second opening

211:The first step

Claims (18)

A substrate processing system, which includes: a first chamber having a first substrate transfer port; a second chamber having a second substrate transfer port; a sealing shell located in the first Between the cavity and the second cavity, the top of the sealing shell has a cover plate. The sealing shell includes a first opening and a second opening. The first opening corresponds to the first substrate transfer port, and the second opening corresponds to In the second substrate transfer port, the sealing shell is connected to the first substrate transfer port and the second substrate transfer port, and a first step is provided around the first substrate transfer port or the first opening; a first valve, is located in the sealing shell; a second valve is located in the sealing shell; a driving device drives the first valve and/or the second valve to move, so that the first valve seals the first step, and/or makes the The second valve seals the second substrate transfer port. As in the substrate processing system of claim 1, when the opening area of the first opening is larger than the opening area of the first substrate transfer port, the first valve seals the first substrate transfer port or the first substrate transfer port around the first opening. The first step. As in the substrate processing system of claim 1, when the opening area of the first opening is less than or equal to the opening area of the first substrate transfer port, the first valve seals the first step around the first opening. The substrate processing system according to claim 1, when the opening area of the second opening When the opening area is larger than the opening area of the second substrate transfer port, the second valve seals the second substrate transfer port or the second opening. In the substrate processing system of claim 1, when the opening area of the second opening is less than or equal to the opening area of the second substrate transfer port, the second valve seals the second opening. The substrate processing system of claim 1, wherein the side wall of the second valve seals the second substrate transfer port. As in the substrate processing system of claim 1, when there is a second step around the second substrate transfer port or around the second opening, the second valve seals the second step. The substrate processing system of claim 1, wherein the first valve and the second valve have the same or different sizes. The substrate processing system of claim 1, wherein the first chamber is a process chamber and the second chamber is a transfer chamber. As for the substrate processing system described in claim 9, when the number of the process chambers is greater than 1, each process chamber surrounds the transfer chamber, and the first valve and the second valve are arranged between each process chamber and the transfer chamber. and the sealed shell. As for the substrate processing system of claim 1, the first chamber is a vacuum chamber, and the second chamber is a transfer chamber. The substrate processing system of claim 1, wherein the driving device includes a power device and a driving rod connected to the power device, and the first valve and the second valve are fixed on the driving rod. A valve component for a substrate processing system, comprising: a first valve; a second valve; a sealing shell surrounding the first valve and the second valve, the sealing shell having a first opening and a second opening, and a first step surrounding the first opening, The top of the sealing shell has a cover plate; a driving device moves the first valve to seal the first step, and/or moves the second valve to seal the second opening. The valve component of claim 13, wherein the side wall of the second valve seals the second opening. The valve component of claim 13, wherein a second step is provided around the second opening, and the second valve seals the second step. The valve element of claim 13, wherein the driving device moves the first valve upward to seal the first step, and/or moves the second valve toward the second opening to seal the second opening. A working method of a substrate processing system, which includes: providing the substrate processing system as described in claim 1 to claim 12; using the driving device to move the first valve and/or the second valve to cause the first valve to move. The valve seals the first step, and/or the second valve seals the second substrate transfer port. In the working method described in claim 17, when the first valve seals the first substrate transfer port, the second valve is replaced; when the second valve seals the second substrate transfer port, the first valve is replaced.