KR20000051650A - Semiconductor fabricating apparatus - Google Patents

Semiconductor fabricating apparatus Download PDF

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Publication number
KR20000051650A
KR20000051650A KR1019990002213A KR19990002213A KR20000051650A KR 20000051650 A KR20000051650 A KR 20000051650A KR 1019990002213 A KR1019990002213 A KR 1019990002213A KR 19990002213 A KR19990002213 A KR 19990002213A KR 20000051650 A KR20000051650 A KR 20000051650A
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KR
South Korea
Prior art keywords
gate door
gate
slot
wafer
transfer
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KR1019990002213A
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Korean (ko)
Inventor
윤성철
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윤종용
삼성전자 주식회사
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Priority to KR1019990002213A priority Critical patent/KR20000051650A/en
Publication of KR20000051650A publication Critical patent/KR20000051650A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: An apparatus is provided to prevent bellows from leaking caused by a fragment of broken wafer. CONSTITUTION: An apparatus includes a hexagonal transfer chamber(12) placed in a transfer robot arm(10), process chambers(14) performing etching processes, and wafer loading/unloading chambers(16,18) fixed on inside of a transfer chamber, and a cassette moving up/down with an elevator. Slot valves(22) are placed between a transfer and process chambers and between a loading/unloading and transfer chambers A slot valve includes a gate door(24) opening/closing a slot gate(20), a shaft supporting a gate door, a driver(26) reciprocating a shaft to drive a gate door, and a bellows made of thin and elastic material to seal a reciprocating shaft tightly. A shaft and driver are located on a gate door. If a shaft moves up/down, a slot gate opens/closes through a gate door.

Description

반도체 제조 장치{Semiconductor fabricating apparatus}Semiconductor fabrication apparatus

본 발명은 반도체 제조 장치에 관한 것으로, 더욱 상세하게는 웨이퍼 이동 통로인 챔버의 슬롯 게이트를 오픈 및 클로즈하는 게이트 도어의 상부로 슬롯 밸브의 벨로우즈를 위치시켜 웨이퍼의 파편으로 인해 벨로우즈에 리크가 발생되는 것을 방지할 수 있도록 한 반도체 제조 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus. More particularly, the bellows of the slot valve is positioned above the gate door that opens and closes the slot gate of the chamber, which is a wafer moving passage, so that the bellows is generated due to the fragmentation of the wafer. The present invention relates to a semiconductor manufacturing apparatus that can be prevented.

일반적으로 반도체 소자를 제조할 때 사용되는 반도체 제조 장치는 대개 싱글 웨이퍼 타입으로, 화학기상증착법이나 스퍼터링법 등을 이용한 반도체막 증착시나 패턴을 형성하기 위한 식각 공정 진행시 주로 사용되고 있다.In general, a semiconductor manufacturing apparatus used to manufacture a semiconductor device is usually a single wafer type, and is mainly used during the deposition of a semiconductor film using a chemical vapor deposition method, a sputtering method, or an etching process for forming a pattern.

예를 들어, 식각 공정용 반도체 제조 장치는 웨이퍼를 로딩/언로딩하는 웨이퍼 로딩/언로딩 챔버, 웨이퍼를 이동시키는 트랜스퍼 로봇 암이 설치되는 트랜스퍼 챔버, 식각 공정이 진행되는 프로세스 챔버를 포함하여 이루어진다.For example, the semiconductor manufacturing apparatus for an etching process includes a wafer loading / unloading chamber for loading / unloading a wafer, a transfer chamber in which a transfer robot arm for moving a wafer is installed, and a process chamber in which an etching process is performed.

또한, 트랜스퍼 챔버와 프로세스 챔버, 웨이퍼 로딩/언로딩 챔버와 트랜스퍼 챔버간의 웨이퍼 이송 경로인 슬롯 게이트는 슬롯 밸브에 의해 오픈(open) 및 클로즈(close)된다.In addition, the slot gate, which is a wafer transfer path between the transfer chamber and the process chamber, the wafer loading / unloading chamber and the transfer chamber, is opened and closed by a slot valve.

이때, 슬롯 밸브의 구동부는 게이트 도어의 하부에 위치하여 슬롯 게이트를 오픈 및 클로즈하는 게이트 도어를 상하로 구동한다.At this time, the driving unit of the slot valve is located below the gate door to drive the gate door for opening and closing the slot gate up and down.

그러나, 트랜스퍼 암을 이용하여 챔버간에 웨이퍼를 이송시킬 때, 시스템상의 에러로 인해 게이트 도어의 클로즈가 빨리 진행됨으로써, 게이트 도어에 의해 웨이퍼가 깨지거나, 트랜스퍼 암을 구동하는 구동부의 동작 불량으로 인해 웨이퍼가 떨어져서 깨져 그 파편이 벨로우즈에 대미지(damage)를 입혀 벨로우즈에 리크(leak)가 발생되는 문제점이 있다.However, when the wafer is transferred between the chambers using the transfer arm, the closing of the gate door proceeds quickly due to an error in the system, so that the wafer is broken by the gate door, or the wafer is damaged due to a malfunction of the driving unit driving the transfer arm. There is a problem in that the fragments are broken and the debris damages the bellows, causing leaks in the bellows.

이러한 벨로우즈의 리크로 인해, 슬롯 밸브의 교체가 이루어져 제품의 원가상승의 원인이 되며, 또한, 슬롯 밸브의 교체로 인한 반도체 제조 설비의 구동 정지로 인해 제품의 생산성이 저하된다.Due to the leak of the bellows, the replacement of the slot valve is made to cause a cost increase of the product, and also the productivity of the product is reduced due to the drive stop of the semiconductor manufacturing equipment due to the replacement of the slot valve.

따라서, 본 발명의 목적은 깨진 웨이퍼의 파편으로 인해 벨로우즈에 리크가 발생되는 것을 방지하는데 있다.Accordingly, it is an object of the present invention to prevent leaks in the bellows due to broken wafer fragments.

본 발명의 다른 목적은 다음의 상세한 설명 및 첨부된 도면으로부터 보다 명확해질 것이다.Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

도 1은 본 발명의 기술에 따른 실시예에 의한 반도체 제조 장치를 나타낸 구성도.1 is a block diagram showing a semiconductor manufacturing apparatus according to an embodiment according to the technology of the present invention.

도 2는 도 1의 Ⅱ-Ⅱ를 나타낸 사시도.FIG. 2 is a perspective view illustrating II-II of FIG. 1. FIG.

도 3은 슬롯 밸브의 구동 상태를 나타낸 상태도.3 is a state diagram showing a driving state of a slot valve;

이와 같은 목적을 달성하기 위하여 본 발명은 내부에 웨이퍼를 트랜스퍼하는 트랜스퍼 로봇 암이 설치되는 트랜스퍼 챔버를 중심으로 개폐수단을 개재하여 각각 선택적으로 연통되는 프로세스 챔버들과 로딩/언로딩 챔버로 이루어진 반도체 제조 장치에 있어서, 개폐수단은 트랜스퍼 챔버와 프로세스 챔버들, 트랜스퍼 챔버와 로딩/언로딩 챔버 사이에 형성된 슬롯 게이트를 개폐하는 게이트 도어, 게이트 도어의 상부면에 고정되어 게이트 도어의 상하 이동을 지지하는 지지축, 지지축을 상하 왕복이동시키며 지지축의 최대 하부 위치에서 게이트 도어가 슬롯 게이트를 클로즈하도록 하는 구동부 및 지지축을 감싸 밀봉하고 지지축의 왕복 이동에 따라 수축/팽창을 반복하는 벨로우즈를 포함할 수 있도록 한다.In order to achieve the above object, the present invention provides a semiconductor manufacturing system comprising a process chamber and a loading / unloading chamber, each of which is selectively communicated through opening and closing means, centering on a transfer chamber in which a transfer robot arm for transferring a wafer is installed. In the apparatus, the opening and closing means is a gate door for opening and closing the slot gate formed between the transfer chamber and the process chambers, the transfer chamber and the loading / unloading chamber, the support fixed to the upper surface of the gate door to support the vertical movement of the gate door The shaft and the support shaft can be reciprocated up and down, and the drive unit for closing the slot gate in the maximum lower position of the support shaft and the sealing wrap around the support shaft and the bellows to repeat the contraction / expansion according to the reciprocating movement of the support shaft.

이하 첨부된 도면을 참조하여 본 발명의 기술에 따른 실시예에 의한 반도체 제조 장치를 보다 상세히 살펴보면 다음과 같다.Hereinafter, a semiconductor manufacturing apparatus according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

도 1 내지 도 3을 참조하면, 반도체 소자 제조에 사용되는 반도체 제조 설비, 예를 들어, 식각용 반도체 제조 설비는 웨이퍼를 진공 흡착하여 이송시키는 트트랜스퍼 로붓 암(transfer robot arm; 10)이 내부에 설치되는 외주면이 육각형상으로 이루어진 트랜스퍼 챔버(12)를 구비한다.1 to 3, a semiconductor manufacturing facility used for manufacturing a semiconductor device, for example, a semiconductor manufacturing facility for etching, has a transfer robot arm 10 that vacuum-absorbs and transports a wafer therein. The outer peripheral surface to be installed is provided with the transfer chamber 12 which consists of hexagonal shape.

트랜스퍼 챔버(12)의 측면에는 내부에 반도체 칩의 제조를 위한 소정의 환경이 설정되며 웨이퍼에 대한 식각 공정이 진행되는 복수개의 프로세스 챔버들(14)과 웨이퍼를 로딩/언로딩하는 웨이퍼 로딩/언로딩 챔버들(16)(18)이 고정 설치된다.In the side of the transfer chamber 12, a predetermined environment for manufacturing a semiconductor chip is set therein, and a plurality of process chambers 14 in which an etching process for a wafer is performed and a wafer loading / unloading for loading / unloading a wafer Loading chambers 16 and 18 are fixedly installed.

로딩/언로딩 챔버(16)(18) 내부에는 웨이퍼를 수납하는 카세트(도시되지 않음)가 위치하고, 이 카세트는 엘리베이터(도시되지 않음)에 의해 상하로 움직인다.Inside the loading / unloading chambers 16 and 18, a cassette (not shown) for storing a wafer is located, which is moved up and down by an elevator (not shown).

또한, 트랜스퍼 챔버(12)와 프로세스 챔버(10) 사이, 로딩/언로딩 챔버(16)(18)와 트랜스퍼 챔버(12) 사이에는 챔버간의 웨이퍼 이송 경로인 슬롯 게이트(20)를 오픈 및 클로즈하는 개폐수단, 예컨대, 슬롯 밸브들(22)이 각각 고정 설치된다.In addition, between the transfer chamber 12 and the process chamber 10, and between the loading / unloading chamber 16, 18 and the transfer chamber 12 to open and close the slot gate 20, which is a wafer transfer path between the chambers Opening and closing means, for example, slot valves 22 are fixedly installed.

본 발명에 따르면, 슬롯 밸브(22)는 슬롯 게이트(20)를 오픈 및 클로즈하는 게이트 도어(24), 게이트 도어(24)를 기준으로 상부에 위치하도록 게이트 도어(24)의 일측면에 고정되어 게이트 도어(24)를 지지하는 지지축(도시되지 않음), 지지축을 직선 왕복운동시키며 지지축의 최대 하부 위치에서 게이트 도어(24)가 슬롯 게이트(20)를 클로즈하도록 하는 구동부(26), 지지축 외면을 전체적으로 감싸 밀봉하며 지지축의 직선 왕복운동에 따라 팽창 수축을 반복하는 얇은 절연재질로 이루어지는 벨로우즈(28)를 포함하여 이루어진다.According to the present invention, the slot valve 22 is fixed to one side of the gate door 24 to be positioned above the gate door 24 and the gate door 24 for opening and closing the slot gate 20. A support shaft (not shown) for supporting the gate door 24, a drive unit 26 for linearly reciprocating the support shaft and allowing the gate door 24 to close the slot gate 20 at the maximum lower position of the support shaft, the support shaft It includes a bellows (28) made of a thin insulating material wrapping the outer surface as a whole and repeating expansion and contraction according to the linear reciprocating motion of the support shaft.

이때, 게이트 도어(24)의 상부에 위치하는 구동부(26)는 하부 양측에 돌출된 리브(30)가 트랜스퍼 챔버(12)와 프로세스 챔버(14)의 상부면에 각각 나사고정되어 설치되고, 또는, 로딩/언로딩 챔버(16)(18)와 트랜스퍼 챔버(12)의 상부면에 각각 나사 고정되어 설치된다.At this time, the driving part 26 positioned on the upper portion of the gate door 24 is provided with ribs 30 protruding from both sides of the lower part, respectively, screwed to the upper surfaces of the transfer chamber 12 and the process chamber 14, or The screws are fixed to the upper surfaces of the loading / unloading chambers 16 and 18 and the transfer chamber 12, respectively.

이렇게 지지축과 구동부(26)가 게이트 도어(24)의 상부에 위치함으로써, 구동부(26)의 구동에 의해 지지축이 하강하면, 게이트 도어(24)가 하강하여 슬롯 게이트(20)를 클로즈하고, 지지축이 상승하면, 게이트 도어(24)가 상승하여 슬롯 게이트(20)를 오픈한다.When the support shaft and the driver 26 are positioned above the gate door 24, when the support shaft is lowered by the driving of the driver 26, the gate door 24 is lowered to close the slot gate 20. When the support shaft is raised, the gate door 24 is raised to open the slot gate 20.

종래에는 트랜스퍼 로봇 암을 이용하여 웨이퍼를 이송시킬 때, 시스템상의 에러 또는 트랜스퍼 암 구동부의 동작 불량으로 인해 웨이퍼가 깨져 생기는 파편이 떨어지면서 게이트 도어의 하부에 위치한 벨로우즈에 끼어, 얇은 절연재질로 이루어진 벨로우즈에 상처를 입혀 리크가 발생되었지만, 본 발명에서는 게이트 도어(24)의 상부에 벨로우즈(28)가 위치함으로써, 웨이퍼가 깨져 생기는 파편에 의해 벨로우즈(28)에 리크가 발생되는 것이 방지된다.Conventionally, when transferring a wafer by using a transfer robot arm, a bellows made of a thin insulating material is inserted into a bellow located at the bottom of the gate door while the debris generated by the wafer is broken due to an error in the system or a malfunction of the transfer arm drive unit. In the present invention, the bellows 28 is positioned on the upper portion of the gate door 24, thereby preventing the leak of the bellows 28 due to the fragments generated by the wafer breaking.

즉, 웨이퍼의 파편이 떨어지는 곳의 반대 위치인 게이트 도어(24)의 상부에 벨로우즈(28)가 위치하기 때문에 웨이퍼의 파편으로부터 벨로우즈(28)가 접촉되는 경우가 방지된다.That is, since the bellows 28 is located on the upper portion of the gate door 24 opposite the place where the fragments of the wafer fall, the case where the bellows 28 is contacted from the fragments of the wafer is prevented.

이는 웨이퍼의 파편이 공기보다 무거워 챔버의 바닥면 방향으로 떨어지는 것을 감안한 것으로, 웨이퍼의 파편이 플로우하는 경로상에 위치하는 벨로우즈(28)의 위치를 게이트 도어(24)의 상부로 변경한 것이다.This is in consideration of the fact that the fragments of the wafer are heavier than air and fall in the direction of the bottom surface of the chamber. The position of the bellows 28 located on the path in which the fragments of the wafer flows is changed to the upper portion of the gate door 24.

이렇게 벨로우즈의 위치 변경을 통해 웨이퍼의 파편으로 발생되는 벨로우즈의 리크 발생을 방지하여 벨로우즈의 리크로 인해 슬롯 밸브가 교체되어 제품의 제조원가가 상승하는 것을 방지할 수 있으며, 슬롯 밸브의 교체로 인해 반도체 제조 설비의 구동이 정지되는 것을 방지할 수 있어 제품의 생산성이 그만큼 향상된다.By changing the position of the bellows, it is possible to prevent the bellows leakage caused by the fragmentation of the wafer, thereby preventing the rise of the manufacturing cost of the product by replacing the slot valve due to the bellows leak. It is possible to prevent the driving of the equipment from being stopped, thereby improving the productivity of the product.

한편, 본 발명에서는 상기에서 언급한 실시예에 대해 설명하였지만, 본 발명이 당업자에 의해 다양하게 변형 실시될 수 있으며, 이렇게 변형된 실시예들은 본 발명의 기술적 사상이나 관점으로부터 개별적으로 이해되어서는 안되며, 이와 같이 변형된 실시예들은 본 발명의 첨부된 특허청구의 범위안에 속한다해야 할 것이다.On the other hand, in the present invention has been described for the above-mentioned embodiment, the present invention can be variously modified by those skilled in the art, these modified embodiments should not be individually understood from the technical spirit or point of view of the present invention. Therefore, the embodiments modified as such should fall within the scope of the appended claims of the present invention.

이상에서 살펴본 바와 같이 본 발명은 웨이퍼의 이송 경로인 슬롯 게이트를 오픈 및 클로즈하는 게이트 도어의 상부에 벨로우즈를 위치시킴으로써 웨이퍼 파편으로 인해 벨로우즈에 리크가 발생되는 것을 방지할 수 있는 효과가 있다.As described above, the present invention has an effect of preventing the leakage of the bellows due to the wafer fragments by placing the bellows on the upper portion of the gate door that opens and closes the slot gate, which is the transfer path of the wafer.

또한, 벨로우즈의 리크로 인해 슬롯 밸브가 교체되는 것이 방지됨으로써, 제품의 원가 상승을 방지할 수 있는 효과가 있다.In addition, the slot valve is prevented from being replaced due to the leaking of the bellows, thereby increasing the cost of the product.

또한, 슬롯 밸브의 교체로 인해 반도체 제조 설비의 구동이 정지되는 것을 방지함으로써, 반도체 제조 설비의 효율을 높일 수 있는 효과가 있다.되어 제품의 원가가 상승In addition, since the driving of the semiconductor manufacturing equipment is prevented from being stopped due to the replacement of the slot valve, it is possible to increase the efficiency of the semiconductor manufacturing equipment.

Claims (1)

내부에 웨이퍼를 트랜스퍼하는 트랜스퍼 로봇 암이 설치되는 트랜스퍼 챔버를 중심으로 개폐수단을 개재하여 각각 선택적으로 연통되는 프로세스 챔버들과 로딩/언로딩 챔버로 이루어진 반도체 제조 장치에 있어서,In the semiconductor manufacturing apparatus consisting of the process chambers and the loading / unloading chamber which is selectively connected to each other via the opening and closing means around the transfer chamber in which the transfer robot arm for transferring the wafer therein, 상기 개폐수단은 상기 트랜스퍼 챔버와 프로세스 챔버들, 상기 트랜스퍼 챔버와 로딩/언로딩 챔버 사이에 형성된 슬롯 게이트를 개폐하는 게이트 도어;The opening and closing means may include a gate door for opening and closing a slot gate formed between the transfer chamber and the process chambers, the transfer chamber and the loading / unloading chamber; 상기 게이트 도어의 상부면에 고정되어 상기 게이트 도어의 상하 이동을 지지하는 지지축;A support shaft fixed to an upper surface of the gate door to support vertical movement of the gate door; 상기 지지축을 상하 왕복이동시키며 상기 지지축의 최대 하부 위치에서 상기 게이트 도어가 상기 슬롯 게이트를 클로즈하도록 하는 구동부 및A drive unit for vertically reciprocating the support shaft and allowing the gate door to close the slot gate at a maximum lower position of the support shaft; 상기 지지축을 감싸 밀봉하고 상기 지지축의 왕복 이동에 따라 수축/팽창을 반복하는 벨로우즈를 포함하는 것을 특징으로 하는 반도체 제조 장치.And a bellows wrapping and sealing the support shaft and repeating contraction / expansion according to the reciprocating movement of the support shaft.
KR1019990002213A 1999-01-25 1999-01-25 Semiconductor fabricating apparatus KR20000051650A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101017148B1 (en) * 2004-06-02 2011-02-25 어플라이드 머티어리얼스, 인코포레이티드 Methods and apparatus for sealing a chamber
KR101122988B1 (en) * 2005-05-26 2012-03-12 주성엔지니어링(주) Vacuum treatment apparatus of which reinforcing member is combined at open portion of chamber
US8648977B2 (en) 2004-06-02 2014-02-11 Applied Materials, Inc. Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors
KR20160100739A (en) * 2015-02-16 2016-08-24 (주)위듀테크 Ferrite sheet and method for manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101017148B1 (en) * 2004-06-02 2011-02-25 어플라이드 머티어리얼스, 인코포레이티드 Methods and apparatus for sealing a chamber
US8206075B2 (en) 2004-06-02 2012-06-26 Applied Materials, Inc. Methods and apparatus for sealing a chamber
US8648977B2 (en) 2004-06-02 2014-02-11 Applied Materials, Inc. Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors
US9580956B2 (en) 2004-06-02 2017-02-28 Applied Materials, Inc. Methods and apparatus for providing a floating seal for chamber doors
KR101122988B1 (en) * 2005-05-26 2012-03-12 주성엔지니어링(주) Vacuum treatment apparatus of which reinforcing member is combined at open portion of chamber
KR20160100739A (en) * 2015-02-16 2016-08-24 (주)위듀테크 Ferrite sheet and method for manufacturing the same

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