KR20100021150A - Load lock chamber and substrate processing apparatus including the same - Google Patents

Abstract

PURPOSE: A load lock chamber and a substrate processing apparatus including the same are provided to minimize the wear of a vacuum sealing unit by arranging a shock absorbing plate between the load lock chamber and a door. CONSTITUTION: A lower plate(331) and an upper plate(332) are opposed each other and spaced apart. A side wall is connected to the lower plate and the upper plate and defines an inner space. The side wall forms an entrance/exit for a substrate. A shock absorbing plate(370) is arranged on the outside the entrance/exit. A first vacuum sealing unit(374) is inserted between the shock absorbing plate and the side wall. The cross section for the first vacuum sealing unit is a ring shape. A door is arranged on the outside of the shock absorbing plate.

Description

Load Lock Chamber and Substrate Processing Apparatus Including The Same}

The present invention relates to a substrate processing apparatus including a load lock chamber, and more particularly, a substrate for a semiconductor device or a flat panel display device including a load lock chamber and a load lock chamber including a buffer plate and a vacuum sealing means in the form of a curved line. It relates to processing equipment.

In general, to manufacture a semiconductor device or a flat panel display device, a thin film deposition process for depositing a thin film of a specific material on a substrate, a photolithography process for exposing or hiding selected areas of the thin films using a photosensitive material, and a selected area After removing the thin film and patterning as desired, the etching (etching) process, etc., most of these processes are carried out in the chamber of the substrate processing equipment designed to the optimum environment for the process.

In particular, in recent years, a process chamber, a load lock chamber, and a transfer chamber for transferring a substrate between the load lock chamber and the process chamber are integrally connected in order to increase substrate processing capability. The substrate processing apparatus of the substrate is widely used, and the chamber arrangement of the substrate processing apparatus is a cluster type for processing a plurality of substrates independently and in parallel and a series of sequential processes for processing a plurality of substrates in series. It can be divided into in-line type.

1 is a plan view of a conventional cluster type substrate processing equipment.

As shown in FIG. 1, the cluster type substrate processing equipment 60 includes a transfer chamber 10, a process chamber 20, a load lock chamber 30, a transfer unit 40, and a load port 50. Include.

The plurality of process chambers 20 and the plurality of load lock chambers 30 are radially coupled around the transfer chamber 10, one side of the transfer unit 40 is connected to the load lock chamber 30, and the transfer unit ( The other side of the 40 is connected to the load port 50 for exchanging the substrate (S) with the outside of the equipment.

The process chamber 20 is a space for performing processes such as thin film deposition and etching on the substrate S while maintaining a high vacuum (low pressure) state, and the transfer chamber 10 is a transfer chamber robot 12 located therein. The vacuum state is maintained as a space for transferring the substrate S between the process chamber 20 and the process chamber 20 or between the process chamber 20 and the load lock chamber 30.

A first slot valve 22 is opened and closed between the transfer chamber 10 and the process chamber 20 to open and close the substrate. The second slot valve is between the transfer chamber 10 and the load lock chamber 30. 32 is installed.

The transfer unit 40 loads the unprocessed substrate S into the load lock chamber 30 or transfers the substrate S from the load lock chamber 30 to the load port 50 using the internal transfer robot 42. As a space to be carried out, the atmospheric pressure is maintained, and a cassette (not shown) loaded with the substrate S is placed in the load port 50.

When the load lock chamber 30 is connected with the transfer chamber 10 to play a buffer role between the transfer chamber 10 in a vacuum state and the transfer unit 40 in atmospheric pressure, the load lock chamber 30 is converted into a vacuum state and connected to the transfer unit 40. In this case, the vacuum state and the atmospheric state are repeated during the substrate exchange process.

In order to increase the substrate processing speed, two or more load lock chambers 30 may be connected to the side of the transfer chamber 10, and at least one slot may be installed in the load lock chamber 30 to set the substrate S therein. do.

2 is a plan view of a conventional inline substrate processing equipment.

As shown in FIG. 2, the inline substrate processing apparatus 160 includes a transfer chamber 110, a process chamber 120, and a load lock chamber 130.

The plurality of process chambers 120 and the load lock chamber 130 are connected in a line along the long side of the rectangular transfer chamber 110. Therefore, unlike the cluster type substrate processing equipment (60 of FIG. 1), the number of process chambers 120 and the load lock chamber 130 connected to the transfer chamber 110 can be easily increased. However, the number of process chambers 120 and the load lock chamber 130 connected in consideration of the moving speed or distance of the transfer chamber robot 112 in the transfer chamber 110 may be limited.

The guide rail 114 is installed for the linear reciprocating motion of the transfer chamber robot 112 in the transfer chamber 110, and the transfer chamber robot 112 moves along the guide rail 114. ) Or exchange the load lock chamber 130 and the substrate (S).

In such substrate processing equipment, the load lock chambers 30 and 130 connected around the transfer chambers 10 and 110 may be manufactured to have a single slot, but may have two or more slots as shown in FIG. 3. It may be manufactured.

3 is a cross-sectional view of a load lock chamber of a conventional substrate processing equipment.

As shown in FIG. 3, the load lock chamber 230 is connected to the lower plate 231 and the upper plate 232, which are spaced apart from each other facing each other and serve as a bottom and a cover, and the lower plate and the upper plate 231 and 232, respectively. A side wall 233 defining an inner space and an inner wall 234 formed at an inner central portion thereof to separate and define an inner space into a lower first slot 230a and an upper second slot 230b. Here, the lower plate, the upper plate, the side wall, and the inner wall 231, 232, 233, 234 is formed in one piece.

A first substrate entrance 236 is formed on one sidewall of the first and second slots 230a and 230b, respectively, and is connected to the transfer part at atmospheric pressure, and a vacuum is formed on the other sidewalls of the first and second slots 230a and 230b. Second substrate entrances 235 connected to the transfer chamber in a state are respectively formed.

First and second slots 230a and 230b and doors 237 for controlling communication with the outside are formed at the first substrate entrance 236, respectively, and the first and second slots 230a and 230b are in a vacuum state. In this case, the door 237 seals the first substrate entrance 236 and a vacuum such as an O-ring between the side wall 233 of the first substrate entrance 236 and each door 237 for this purpose. A sealing means (not shown) is interposed.

In addition, inside each of the first and second slots 230a and 230b, a substrate support 238 is formed to temporarily set the substrate loaded from the outside. An access space of the robot arm is provided between the substrate and the substrate support 238. In order to secure the upper surface of the substrate support 238, a lift pin (not shown) for mounting the substrate protrudes. Two or more substrate support 238 may be installed in one slot.

In addition, each of the first and second slots 230a and 230b alternately maintains a vacuum state and an atmospheric pressure state. For this purpose, each of the first and second slots 230a and 230b has an exhaust line for reducing the vacuum pressure (not shown). C) and an intake line (not shown) pressurized to atmospheric pressure.

The load lock chamber 230 of the substrate processing equipment alternately has an atmospheric pressure state and a vacuum state alternately. Accordingly, the lower plate, the upper plate, the side walls, and the inner walls 231, 232, 233, and 234 of the load lock chamber 230 are alternately provided. The load lock chamber 230 receives a force that is periodically changed by a change in the pressure difference inside and outside.

That is, when the load lock chamber 230 is in a vacuum state, the lower plate, the upper plate, and the side walls 231, 232, and 233 receive a compressive force from the outside to the inside, and the load lock chamber 230 is at atmospheric pressure. In this case, the compressive force applied to the lower plate, the upper plate and the side walls 231, 232, and 233 is eliminated.

In addition, since the first and second slots 230a and 230b are spaces that are separated from each other and operate independently, the inner wall 234 when the first slot 230a is in a vacuum state and the second slot 230b is in an atmospheric pressure state. When the first slot 230a is at atmospheric pressure and the second slot 230b is in a vacuum state, the inner wall 234 is forced downward.

As the size of a large area flat panel display device increases, and thus the size of the substrate and the substrate processing equipment increases, the effect of this repetitive force on the load lock chamber of the substrate processing equipment increases, for example, due to variations in the pressure difference. According to the change of the phosphorous force, deformation such as bending occurs in the lower plate, the upper plate and the inner wall of the load lock chamber.

4 is a cross-sectional view illustrating a case in which the load lock chamber of FIG. 3 is deformed.

As shown in FIG. 4, when the first slot 230a of the load lock chamber 230 of the substrate processing equipment is at atmospheric pressure and the second slot 230b is in a vacuum state, the upper plate forming the second slot 230b is formed. 232, the side wall 233, and the inner wall 234 are subjected to a compressive force toward the inside of the second slot 230b, whereby a center portion of the upper plate 232 and the inner wall 234 having a relatively large area are second to the second. Bend phenomenon occurs toward the inside of the slot (230b).

Thereafter, when the first and second slots 230a and 230b are both at atmospheric pressure, the compressive force is released and restored to the shape of FIG. 3. Accordingly, the lower plate of the load lock chamber 230 during the operation of the substrate processing equipment is performed. 231, the top plate 232 and the inner wall 234 are repeatedly deformed and restored, and by the deformed and restored, the side wall 233 is moved up and down by the force in the vertical direction, and the door 237 and the side wall. (233) spaced at an undesired distance, adversely affects the maintenance of the vacuum.

In addition, the O-ring having an O-shaped cross section, which is a vacuum sealing means interposed between the door 237 and the side wall 233, has high abrasion resistance to the horizontal force but very low abrasion resistance to the vertical force. The o-rings are in contact with the door 237 and the side wall 233 at one point, respectively, and the contact points are forced in opposite directions by the vertical movement of the door 237 and the side wall 233. The force in the opposite direction receives the rotational force about the center of the o-ring. The o-ring rubs against the door 237 and the side walls 233 by rotation and as a result wears.

That is, the periodic vertical movement of the sidewall 233 of the load lock chamber 230 causes the o-ring damage and the vacuum breakage of the load lock chamber 230, and the substrate processing equipment for replacing the o-ring. It causes production costs to increase due to downtime.

Although not shown, in the case of the in-line type substrate processing equipment, the shape of the load lock chamber is the same, and the above problems are the same.

The present invention has been devised to solve the above problems, and includes a load lock chamber and a load lock chamber capable of maintaining a stable pressure and minimizing wear of the vacuum sealing means even in the shanghai of the load lock chamber side wall caused by the pressure difference fluctuations Its purpose is to provide substrate processing equipment.

The present invention is to achieve the above object, and the lower and spaced apart facing each other; A side wall connected to the lower plate and the upper plate to define an inner space and having a substrate entrance; A buffer plate disposed outside the substrate entrance; A first vacuum sealing means interposed between the buffer plate and the side wall and having a ring-shaped cross section; It provides a load lock chamber for a substrate processing equipment including a door disposed outside the buffer plate.

The first vacuum sealing means has a U-shaped or V-shaped cross section and is arranged to correspond to the circumference of the first substrate entrance, the buffer plate is formed with an opening corresponding to the substrate entrance, and the buffer plate is a fastening means or its It is fixed by a pair of supports connected to both ends.

The load lock chamber for substrate processing equipment may further include a gap holding means interposed between the buffer plate and the side wall to maintain a separation gap, and a second vacuum sealing means interposed between the door and the buffer plate.

In addition, the load lock chamber for the substrate processing equipment further includes a protrusion projecting in the horizontal direction from the side wall around the substrate entrance, the buffer plate is a vertical portion formed with an opening corresponding to the substrate entrance, and horizontal from the vertical portion Protruding in the direction may be made of a horizontal portion corresponding to the protrusion.

In this case, the vacuum sealing means is interposed between the horizontal portion and the protrusion.

The load lock chamber for the substrate processing equipment further includes at least one inner wall formed at a central portion of the inner space to separate and define the inner space into at least two slots.

On the other hand, the present invention, the load port for exchanging the substrate with the outside; A transfer part connected to the load port and at atmospheric pressure; A load lock chamber connected to the transfer unit and repeating a vacuum state and an atmospheric pressure state, the lower plate and the upper plate facing each other and spaced apart from each other, connected to the lower plate and the upper plate to define an inner space, and a sidewall on which a first substrate entrance is formed; The load lock including a buffer plate disposed outside the first substrate entrance, a ring-shaped first vacuum sealing means interposed between the buffer plate and the side wall, and having an open cross section, and a door disposed outside the buffer plate. A chamber; A transfer chamber connected to the load lock chamber to transfer the substrate; Provided is a substrate processing apparatus including at least one process chamber connected to the transfer chamber to process the substrate.

According to the present invention, by placing a buffer plate between the slot of the load lock chamber and the door, and through the vacuum sealing means of the U-shaped or V-shaped cross section between the slot and the buffer plate, the upper and lower sides of the slot side wall due to the pressure difference fluctuation The movement can be prevented from being transferred to the door, and the downtime of the substrate processing equipment for replacing the vacuum sealing means can be minimized. In addition, by forming a projection in the horizontal direction on the side wall of the slot and corresponding to the horizontal portion of the buffer plate, it is possible to maintain the vacuum of the load lock chamber more stably and to further prevent wear of the vacuum sealing means.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

Referring to the preferred embodiment of the present invention with reference to the accompanying drawings in detail as follows, for the same parts only the reference numerals will be used the same name.

5 is a perspective view of a load lock chamber of a substrate processing apparatus according to a first embodiment of the present invention, FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5, and FIG. 7 is an enlarged view of portion A of FIG. 6. to be.

Although not shown in Figures 5, 6 and 7, in the cluster type substrate processing apparatus according to the first embodiment, the transfer portion and the transfer chamber is connected to both ends of the load lock chamber 330, the load port is connected to the other side of the transfer portion A plurality of process chambers are connected around the transfer chamber, and the load lock chamber 330 of FIGS. 5, 6 and 7 may be applied to the in-line type substrate processing equipment.

5, 6 and 7, the load lock chamber 330 of the substrate processing equipment according to the first embodiment of the present invention, the bottom plate 331 facing each other and spaced apart and serve as a floor and cover respectively; The upper plate 332, the side wall 333 connected to the lower plate and the upper plate 331, 332 to define an inner space, and formed in an inner central portion thereof to form the lower first slot 330a and the upper second portion. Slot 330b includes an inner wall 334 that defines separation.

Here, the lower plate, the upper plate, the side wall, and the inner wall 331, 332, 333, and 334 are formed in one piece, but in another embodiment, the inner wall may be formed in two parts to configure the first and second slots to be two independent chambers. have. In addition, although the first embodiment shows that two slots are formed in the load lock chamber by one inner wall, in another embodiment, the inner wall may be configured as one slot by removing the inner wall, and the load lock chamber may be included by adding the inner wall. The number of slots can be configured more than three.

The lower plate, the upper plate, and the inner walls 331, 332, and 334 have a size corresponding to the size of the substrate, and thus have a larger area than the side wall 333.

First sidewalls 333 of the first and second slots 330a and 330b are formed with first substrate entrances 336 connected to a transfer unit (not shown) at atmospheric pressure, respectively, and the first and second slots 330a, The second sidewall 333 of 330b is formed with a second substrate entrance 335 connected to a transfer chamber (not shown) in a vacuum state, respectively.

In each of the first and second slots 330a and 330b, a substrate support 338 is formed to temporarily set a substrate loaded from the outside. An entrance space of the robot arm is formed between the substrate and the substrate support 338. In order to secure the upper surface of the substrate support 338, a lift pin (not shown) for mounting the substrate protrudes. Two or more substrate support units 338 may be installed in one slot.

Each of the first and second slots 330a and 330b alternately maintains a vacuum state and an atmospheric pressure state, and for this purpose, an exhaust line (not shown) to depressurize the vacuum to each of the first and second slots 330a and 330b. ) And an intake line (not shown) pressurized to atmospheric pressure.

The buffer plate 370 is disposed outside the first substrate entrance 336, and the door 337 is disposed outside the buffer plate 370.

Both ends of the buffer plate 370 are connected to and fixed to a pair of supports 378, and an opening 372 corresponding to the first substrate entrance 336 is formed in the buffer plate 370. The buffer plate 370 absorbs and buffers the shankdong of the lower plate, the upper plate, and the inner walls 331, 332, and 334 due to the pressure difference between the first and second slots 330a and 330b and is delivered to the door 337. Prevents. Meanwhile, in another embodiment, the buffer plate may be directly fixed to the chamber side wall without a support using a fastening means such as a screw.

The door 337 controls communication between the first and second slots 330a and 330b and the outside. When the first and second slots 330a and 330b are in a vacuum state, the door 337 is a buffer plate 370. The opening 372 is sealed, and when the first and second slots 330a and 330b are at atmospheric pressure, the door 337 opens the opening 372 of the buffer plate 370.

The first vacuum sealing means 374 is interposed between the buffer plate 370 and the side walls 333 of the first and second slots 330a and 330b to seal the pressure, and the door 337 and the buffer plate 370 are interposed therebetween. A second vacuum sealing means 339 is interposed therebetween. In addition, first and second recesses 370a and 337a are formed in the buffer plate 370 and the door 337 to fix the first and second vacuum sealing means 374 and 339.

In addition, the spacing means 376 maintains a uniform spacing d (e.g., about 3 mm) between the buffer plate 370 and the side walls 333 of the first and second slots 330a and 330b. It may be interposed, the third recessed portion 370b may be formed in the buffer plate 370 to fix the gap holding means 376.

Here, the first vacuum sealing means 374 has a U-shaped or V-shaped ring shape so as to maintain a vacuum without abrasion even in the vertical movement of the side walls 333 of the first and second slots 330a and 330b. It is characterized by that. That is, in cross-sectional view, the first vacuum sealing means 374 has an open curved shape in which one side is separated, thereby contacting the first contact point 374a in contact with the side walls 333 of the first and second slots 330a and 330b. Even if) moves up and down, the force due to the up and down movement is absorbed by the first vacuum sealing means 374 so that the second contact point 374b contacting the buffer plate 370 does not move up and down. Accordingly, the first vacuum sealing means 374 has abrasion resistance to the vertical movement of the side walls 333 of the first and second slots 330a and 330b and maintains a vacuum. In order to secure wear resistance, the first vacuum sealing means 374 may be formed of a polymer material such as hydrogenated nitrile butadiene rubber (HNBR).

In addition, the second vacuum sealing means 339 is formed in the shape of a ring having a circular cross-section or a U-shaped or V-shaped cross-section to the first and second slots 330a, 330b by the buffer plate 370 It is also possible to prepare for the case where the absorption buffer of the vertical movement of the side wall 333 of the () is insufficient.

Therefore, in the substrate processing equipment according to the first embodiment of the present invention, the buffer plate 370 is disposed between the side walls 333 and the door 337 of the first and second slots 330a and 330b, Between the sidewalls 333 of the second slots 330a and 330b and the buffer plate 370, the first vacuum sealing means 374 having a U-shaped or V-shaped cross section is interposed, whereby the first and The vertical movement of the side walls 333 of the second slots 330a and 330b may be prevented from being transferred to the door, and the downtime of the substrate processing equipment for replacing the vacuum sealing means may be minimized.

On the other hand, in the substrate processing equipment according to the second embodiment of the present invention, the sealing portions of the buffer plate and the load lock chamber are horizontally arranged, thereby achieving a more stable vacuum sealing for the shandong of the load lock chamber.

8 is a cross-sectional view of a substrate processing apparatus according to a second embodiment of the present invention, and FIG. 9 is an enlarged view of a portion B of FIG. 8.

Although not shown in Figures 8 and 9, in the cluster type substrate processing apparatus according to the second embodiment, the transfer portion and the transfer chamber is connected to both ends of the load lock chamber 430, the load port is connected to the other side of the transfer portion, the transfer A plurality of process chambers are connected around the chamber, and the load lock chamber 430 of FIGS. 8 and 9 may be applied to the in-line type substrate processing equipment.

8 and 9, the load lock chamber 430 of the substrate processing equipment according to the second embodiment of the present invention, the bottom plate 431 and the top plate facing each other are spaced apart and serve as a bottom and a cover, respectively ( 432, sidewalls 433 connected to the lower and upper plates 431 and 432 to define an inner space, and formed at an inner central portion thereof to form a lower first slot 430a and an upper second slot ( 430b) includes an inner wall 434 that defines separation.

Here, the lower plate, the upper plate, the side wall, and the inner wall 431, 432, 433, 434 are formed in one piece, but in other embodiments, the inner wall may be formed in two parts so that the first and second slots are configured as two independent chambers. have. In another embodiment, the inner wall may be removed to form one slot, or the inner wall may be added to configure the number of slots included in the load lock chamber to three or more slots.

The lower plate, the upper plate, and the inner walls 431, 432, and 434 have a size corresponding to the size of the substrate, and thus have a larger area than the side wall 433.

At one side wall 433 of the first and second slots 430a and 430b, a first substrate entrance 436 connected to a transfer unit (not shown) under atmospheric pressure is formed, respectively, and the first and second slots 430a, Second sidewalls 433 of 430b are each formed with a second substrate entrance 435 connected to a transfer chamber (not shown) in a vacuum state.

In addition, a protrusion 433a protruding in the horizontal direction is formed around the first substrate entrance 436 of the other sidewall 433 of the first and second slots 430a and 430b connected to the transfer unit (not shown).

Inside each of the first and second slots 430a and 430b, a substrate support 438 for temporarily placing a substrate loaded from the outside is formed. An entrance space of the robot arm is formed between the substrate and the substrate support 438. In order to secure the upper surface of the substrate support 438, a lift pin (not shown) for mounting the substrate protrudes. Two or more substrate support 438 may be installed in one slot.

Each of the first and second slots 430a and 430b alternately maintains a vacuum state and an atmospheric pressure state, and for this purpose, an exhaust line (not shown) to depressurize the vacuum to each of the first and second slots 430a and 430b. ) And an intake line (not shown) pressurized to atmospheric pressure.

A buffer plate 470 is disposed outside the first substrate entrance 436, and a door 437 is disposed outside the buffer plate 470.

Both ends of the buffer plate 470 are connected to and fixed to a pair of supports (not shown), and the lower plate, the upper plate, and the inner wall 431, 432, 434 due to the pressure difference between the first and second slots 430a and 430b. Absorbs and buffers the shangdong of the () to prevent the transfer to the door (437). Meanwhile, in another embodiment, the buffer plate may be directly fixed to the chamber side wall without a support using a fastening means such as a screw.

The buffer plate 470 includes a vertical portion 477 having an opening 472 corresponding to the first substrate entrance 436, and a horizontal portion 478 protruding horizontally from the vertical portion 477. The horizontal portion 478 corresponds to the protrusion 433a of the side wall 433 to maintain the vacuum sealing of the first and second slots 430a and 430b. That is, in the load lock chamber 430 of the substrate processing apparatus according to the second embodiment, the protrusion 433a and the horizontal portion 478 are arranged horizontally to maintain the vacuum tightness, and the sidewalls 433 of the sidewalls according to the pressure difference change. Even when the force due to the shangdong is transmitted to the protrusion 433a, the horizontal portion 478 serves to support it, thereby maintaining the vacuum more stably.

The door 437 controls communication between the first and second slots 430a and 430b and the outside. When the first and second slots 430a and 430b are in a vacuum state, the door 437 is a buffer plate 470. The opening 472 is sealed, and when the first and second slots 430a and 430b are at atmospheric pressure, the door 437 opens the opening 472 of the buffer plate 470.

The first vacuum sealing means 474 is interposed between the horizontal portion 478 of the buffer plate 470 and the protrusion 433a of the side walls 433 of the first and second slots 430a and 430b to seal the pressure. The second vacuum sealing means 439 is interposed between the door 437 and the vertical portion 477 of the buffer plate 470. First and second recesses 470a and 437a are formed in the horizontal portion 478 and the door 437 of the buffer plate 470 to fix the first and second vacuum sealing means 474 and 439, respectively. do.

In addition, a uniform spacing d between the horizontal portion 478 of the buffer plate 470 and the protrusion 433a of the side walls 433 of the first and second slots 430a and 430b may be, for example, about 3 mm. The gap holding means 476 may be interposed to maintain the gap, and a third recess 470b may be formed in the horizontal portion 478 of the buffer plate 470 to fix the gap holding means 476. .

Here, the first vacuum sealing means 374 has a U-shaped cross section to maintain the vacuum without abrasion even in the vertical movement of the protrusions 433a of the side walls 433 of the first and second slots (430a, 430b) Or a V-shaped ring. Some components of the shanghai copper of the side wall 433 due to the pressure difference can be changed by the left and right movement of the protrusion 433a. The first vacuum sealing means 474 has a curved shape in which one side is separated in cross section. Thus, even if the first contact point 474a in contact with the protruding portion 433a of the side walls 433 of the first and second slots 430a and 430b moves left and right, the force due to the left and right movement is not limited to the first vacuum sealing means ( The second contact point 474b absorbed by the 474 and contacting the horizontal portion 478 of the buffer plate 470 does not move left and right. Accordingly, the first vacuum sealing means 474 has abrasion resistance to the left and right movement of the protrusion 433a of the side walls 433 of the first and second slots 430a and 330b and maintains a vacuum. In order to secure wear resistance, the first vacuum-sealing means 474 may be formed of a polymer material such as hydrogenated nitrile butadiene rubber (HNBR).

In addition, the second vacuum sealing means 439 is formed in the shape of a ring having a circular cross-section or a U-shaped or V-shaped cross-section first and second slots 430a, 430b by the buffer plate 470 It is also possible to prepare for the case where the absorption buffer of the vertical movement of the side wall 433 of the () is insufficient.

Therefore, in the substrate processing equipment according to the second embodiment of the present invention, the buffer plate 470 is disposed between the side walls 433 and the door 437 of the first and second slots 430a and 430b, Between the protrusion 433a of the side walls 433 of the second slots 430a and 430b and the horizontal portion 478 of the buffer plate 470, a first vacuum sealing means 474 having a U-shaped or V-shaped cross section is formed. By interposing, the vertical movement of the side walls 433 of the first and second slots 430a and 430b due to the pressure difference is prevented from being transferred to the door, and the downtime of the substrate processing equipment for replacing the vacuum sealing means is minimized. can do.

1 is a plan view of a conventional cluster type substrate processing equipment.

Figure 2 is a plan view of a conventional inline substrate processing equipment.

3 is a cross-sectional view of a load lock chamber of a conventional substrate processing equipment.

4 is a cross-sectional view illustrating a case in which the load lock chamber of FIG. 3 is deformed.

5 is a perspective view of the load lock chamber of the substrate processing equipment according to the first embodiment of the present invention.

6 is a cross-sectional view taken along the line VI-VI of FIG. 5.

7 is an enlarged view of a portion A of FIG. 6.

8 is a cross-sectional view of a substrate processing equipment according to a second embodiment of the present invention.

9 is an enlarged view of a portion B of FIG. 8.

* Description of the symbols for the main parts of the drawings *

330, 430: load lock chamber 370, 470: buffer plate

337, 437: doors 374, 474: first vacuum sealing means

339, 439: Second vacuum sealing means 378, 478: Spacing means

Claims (8)

A bottom plate and a top plate spaced apart from each other; A side wall connected to the lower plate and the upper plate to define an inner space and having a substrate entrance; A buffer plate disposed outside the substrate entrance; A first vacuum sealing means interposed between the buffer plate and the side wall and having a ring-shaped cross section; A door disposed outside the buffer plate Load lock chamber for substrate processing equipment comprising a. The method of claim 1, The first vacuum sealing means is a U-shaped or V-shaped cross section, the load lock chamber for substrate processing equipment disposed to correspond to the circumference of the first substrate entrance. The method of claim 1, The buffer plate is formed with an opening corresponding to the substrate entrance, the buffer plate is a load lock chamber for substrate processing equipment is fixed by a pair of supports connected to the fastening means or both ends thereof. The method of claim 1, And a second vacuum sealing means interposed between the buffer plate and the side wall to maintain a spaced interval, and a second vacuum sealing means interposed between the door and the buffer plate. The method of claim 1, Further comprising a projection protruding in the horizontal direction from the side wall around the substrate entrance, the buffer plate is a vertical portion formed with an opening corresponding to the substrate entrance, the horizontal portion protrudes in the horizontal direction from the vertical portion corresponding to the projection Load lock chamber for substrate processing equipment consisting of a portion. The method of claim 5, The vacuum sealing means is a load lock chamber for substrate processing equipment interposed between the horizontal portion and the protrusion. The method of claim 1, And at least one inner wall formed in a central portion of the inner space to define and separate the inner space into at least two slots. A load port for exchanging a substrate with an outside; A transfer part connected to the load port and at atmospheric pressure; A load lock chamber connected to the transfer unit and repeating a vacuum state and an atmospheric pressure state, the lower plate and the upper plate facing each other and spaced apart from each other, connected to the lower plate and the upper plate to define an inner space, and a sidewall on which a first substrate entrance is formed; The load lock including a buffer plate disposed outside the first substrate entrance, a ring-shaped first vacuum sealing means interposed between the buffer plate and the side wall, and having an open cross section, and a door disposed outside the buffer plate. A chamber; A transfer chamber connected to the load lock chamber to transfer the substrate; At least one process chamber connected to the transfer chamber to process the substrate Substrate processing equipment comprising a.

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