CN113066770A - Silicon controlled chip for outdoor switch power supply - Google Patents
Silicon controlled chip for outdoor switch power supply Download PDFInfo
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- CN113066770A CN113066770A CN202110294476.0A CN202110294476A CN113066770A CN 113066770 A CN113066770 A CN 113066770A CN 202110294476 A CN202110294476 A CN 202110294476A CN 113066770 A CN113066770 A CN 113066770A
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- fixedly connected
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- cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of silicon controlled rectifier chips, and particularly relates to a silicon controlled rectifier chip for an outdoor switching power supply. This outdoor silicon controlled rectifier chip for switching power supply through the heat dissipation mechanism that sets up, can produce a large amount of heats in the chip working process after, the cooling plate can the very first time with the leading-in self of the chip heat in the installation shell, in the quick leading-in second radiator of the heat in the leading-in cooling plate to reach preliminary radiating purpose through the air current.
Description
Technical Field
The invention relates to the technical field of silicon controlled rectifier chips, in particular to a silicon controlled rectifier chip for an outdoor switching power supply.
Background
The thyristor is called SCR for short, and is a high-power electrical component, also called thyristor. It has the advantages of small volume, high efficiency, long service life, etc. In an automatic control system, the device can be used as a high-power driving device to realize the control of high-power equipment by using a low-power control. It is widely applied to speed regulating systems, power regulating systems and follow-up systems of alternating current and direct current motors.
The controllable silicon is divided into a unidirectional controllable silicon and a bidirectional controllable silicon. The TRIAC is also called a TRIAC, abbreviated to TRIAC. The bidirectional thyristor is structurally equivalent to two unidirectional thyristors which are reversely connected, and the bidirectional thyristor has a bidirectional conduction function. The on-off state of which is determined by the gate G. The positive (or negative) pulse is applied to the control electrode G to turn it on in the positive (or reverse) direction. The device has the advantages of simple control circuit and no reverse voltage resistance problem, and is particularly suitable for being used as an alternating-current contactless switch.
The existing silicon controlled chip has poor heat dissipation capability, is operated in a high-temperature environment for a long time, is easy to greatly weaken the service life of the silicon controlled chip, is not stable enough to be installed, is easy to loosen and damage, and needs to be redesigned.
Disclosure of Invention
The invention aims to provide a silicon controlled rectifier chip for an outdoor switching power supply, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an outdoor silicon controlled rectifier chip for switching power supply, includes the shell, the equal fixedly connected with heat dissipation mechanism in shell and the top, bottom fixedly connected with stop gear in the shell, fixedly connected with fixed establishment in the middle of the heat dissipation mechanism back, fixedly connected with chip in the fixed establishment.
The heat dissipation mechanism comprises a cooling box, the cooling box is fixedly connected with the inner top of the shell, the inner bottom of the cooling box is fixedly connected with a first heat dissipation sheet, the left side of the cooling tank is fixedly connected with a liquid filling port, the right side of the cooling tank is fixedly connected with a water pump of the shell, the left side of the water pump is fixedly connected with a water pumping pipe, the left end of the water pumping pipe is fixedly connected with a cooling tank, the right side of the water pump is fixedly connected with a water outlet pipe, the right end of the water outlet pipe penetrates to the right side of the shell, the right side of the bottom of the cooling box is fixedly connected with a liquid inlet pipe, the top of the shell is fixedly connected with a second radiating fin, the back of the second radiating fin is fixedly connected with a cooling plate at the top of the shell, the middle of the second radiating fin is fixedly connected with a cooling pipe, the bottom end of the right side of the cooling pipe is fixedly connected with a water outlet pipe, the cooling tube is characterized in that a circulating tube is fixedly connected to the top end of the right side of the cooling tube, and a liquid inlet tube is fixedly connected to the bottom end of the circulating tube.
Preferably, the first cooling fins are densely distributed in the cooling box at equal intervals, the second cooling fins are densely distributed at the top of the shell at equal intervals, and the second cooling fins and the cooling plate are integrally formed.
Preferably, fixed establishment includes the installation shell, installation shell fixed connection is in the middle of the cooling plate back, top fixedly connected with top stopper in the installation shell, both sides are at top stopper bottom fixedly connected with side stopper in the installation shell, the spacing frame of side stopper bottom fixedly connected with in the installation shell, the installation shell bottom is provided with the bottom plate, the first fixture block of bottom plate both sides fixedly connected with, the installation shell both sides correspond first fixture block and inlay and have the block rubber, the block rubber is close to first fixture block one side fixedly connected with second fixture block, the installation shell has first fixture block through the second fixture block joint.
Preferably, a clamping groove is formed in one side, close to the first clamping block, of the second clamping block, and the second clamping block is clamped with the first clamping block through the clamping groove.
Preferably, the chip is sleeved in the middle of the limiting frame, and the bottom plate is fixedly connected in the middle of the chip.
Preferably, stop gear includes the mount, mount fixed connection is bottom in the shell, sliding connection has the stabilizer bar in the middle of the mount top, stabilizer bar bottom fixedly connected with insulated column, insulated column top fixedly connected with spring, spring top fixedly connected with mount, insulated column bottom fixedly connected with welding block.
Preferably, a sliding hole is formed in the middle of the top of the fixing frame, and the fixing frame is connected with the stabilizer bar in a sliding mode through the sliding hole.
Preferably, the bottom of the shell is provided with a through hole corresponding to the insulating column, and the shell is connected with the insulating column through the through hole in a sliding manner.
Compared with the prior art, the invention has the beneficial effects that:
1. the controllable silicon chip for the outdoor switching power supply can generate a large amount of heat in the working process of the chip through the arranged heat dissipation mechanism, the cooling plate can guide the heat of the chip in the installation shell into the cooling plate at the first time, the heat in the guided cooling plate is quickly guided into the second heat dissipation plate, so that the primary heat dissipation purpose is achieved through air flow, meanwhile, the water pump in the shell works to convey cooling liquid in the cooling box into the cooling pipe through the water pumping pipe and the water outlet pipe, the cooling pipe guides the heat in the second heat dissipation plate into the cooling pipe through the cooling liquid, the cooling liquid carrying the heat flows back into the cooling box through the circulating pipe, the heat in the cooling liquid in the backflow process is contacted with cold air through the outer wall of the circulating pipe, the cooling purpose of the cooling liquid is achieved, the cooling liquid flows back into the cooling liquid in the cooling box, the heat is guided into the first heat dissipation plate, and the first heat dissipation plate, therefore, the purpose of fully cooling and radiating the heat generated by the chip can be achieved, and the problems that the heat radiating capacity of the silicon controlled chip is poor, the silicon controlled chip runs in a high-temperature environment for a long time, and the service life of the silicon controlled chip is easily and greatly shortened are solved.
2. This outdoor silicon controlled rectifier chip for switching power supply, through the fixed establishment who sets up, when fixed chip, fill in the installation shell with the chip is whole, and pass spacing frame in the installation shell, until installing between the top stopper in the installation shell and the side stopper, through first fixture block joint in the draw-in groove of second fixture block this moment, thereby it is sealed bottom the installation shell through the bottom plate, guaranteed that the chip is steady fixed in the installation shell, the effectual installation of having solved is stable inadequately, lead to the problem of not hard up damage easily.
3. This outdoor silicon controlled rectifier chip for switching power supply through the stop gear who sets up, will weld the piece welding on the circuit board to guaranteed overall structure's stability, and when receiving vibrations, the spring can offset and eliminate the vibrations power that receives, makes the vibrations power can not directly transmit to the circuit mainboard on, causes the chip in the installation shell can not become flexible, and has guaranteed overall structure's stability.
Drawings
FIG. 1 is a schematic diagram of a front oblique perspective structure of the present invention;
FIG. 2 is a schematic view of a three-dimensional dumping structure of the present invention;
FIG. 3 is a front cross-sectional view of the heat dissipation mechanism and the housing;
FIG. 4 is an enlarged view of the structure at A in FIG. 3;
FIG. 5 is a schematic front sectional view of a mounting mechanism for mounting a heat dissipating mechanism on a back surface of a substrate;
fig. 6 is an enlarged view of the structure at B in fig. 5.
In the figure: 1. a heat dissipation mechanism; 11. a liquid filling port; 111. a cooling tank; 12. a first heat sink; 13. a liquid inlet pipe; 131. a water pumping pipe; 132. a water outlet pipe; 14. a water pump; 15. a second heat sink; 16. a cooling tube; 17. a cooling plate; 18. a circulation pipe; 2. a housing; 3. a fixing mechanism; 31. a top stop block; 32. a side limiting block; 33. a limiting frame; 34. mounting a shell; 35. a base plate; 36. a card slot; 37. a first clamping block; 38. a second fixture block; 39. a rubber block; 4. a chip; 5. a limiting mechanism; 51. a stabilizer bar; 52. a fixed mount; 53. a through hole; 54. welding the blocks; 55. an insulating column; 56. a spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides an outdoor silicon controlled rectifier chip for switching power supply, includes shell 2, in the shell 2 with the equal fixedly connected with heat dissipation mechanism 1 in top, bottom fixedly connected with stop gear 5 in the shell 2, fixedly connected with fixed establishment 3 in the middle of the 1 back of heat dissipation mechanism, fixedly connected with chip 4 in the fixed establishment 3.
The heat dissipation mechanism 1 comprises a cooling box 111, the cooling box 111 is fixedly connected with the inner top of a shell 2, the inner bottom of the cooling box 111 is fixedly connected with a first heat dissipation sheet 12, the left side of the cooling box 111 is fixedly connected with a liquid filling opening 11, the right side of the shell 2 of the cooling box 111 is fixedly connected with a water pump 14, the left side of the water pump 14 is fixedly connected with a water pumping pipe 131, the left end of the water pumping pipe 131 is fixedly connected with the cooling box 111, the right side of the water pump 14 is fixedly connected with a water outlet pipe 132, the right end of the water outlet pipe 132 penetrates through the right side of the shell 2, the right side of the bottom of the cooling box 111 is fixedly connected with a liquid inlet pipe 13, the top of the shell 2 is fixedly connected with a second heat dissipation sheet 15, the back of the second heat dissipation sheet 15 is fixedly connected with a cooling plate 17 at the top, the first radiating fins 12 are densely distributed in the cooling box 111 at equal intervals, the second radiating fins 15 are densely distributed at the top of the shell 2 at equal intervals, the second radiating fins 15 and the cooling plate 17 are integrally formed, after a large amount of heat can be generated in the working process of the chip 4 through the arranged radiating mechanism 1, the cooling plate 17 can guide the heat of the chip 4 in the mounting shell 334 into the cooling plate 17 at the first time, the heat in the guided cooling plate 17 is quickly guided into the second radiating fins 15, so that the primary radiating purpose is achieved through air flow, meanwhile, the water pump 14 in the shell 2 works to convey the cooling liquid in the cooling box 111 into the cooling pipe 16 through the water pumping pipe 131 and the water outlet pipe 132, the cooling pipe 16 guides the heat in the second radiating fins 15 into the cooling liquid through the cooling liquid, the cooling liquid carrying the heat flows back into the cooling box 111 through the circulating pipe 18, and the heat in the cooling liquid is contacted with cold air through the outer wall of the circulating pipe, the purpose of cooling the cooling liquid is achieved, the cooling liquid flows back to the cooling box 111, heat is conducted into the first cooling fin 12, the first cooling fin 12 is cooled through air flowing, and therefore the purpose of fully cooling and radiating the heat generated by the chip 4 is achieved, the problem that the heat radiating capacity of the silicon controlled rectifier chip is poor, the silicon controlled rectifier chip runs in a high-temperature environment for a long time, and the service life of the silicon controlled rectifier chip is easily and greatly shortened is solved.
The fixing mechanism 3 comprises a mounting shell 34, the mounting shell 34 is fixedly connected to the middle of the back surface of the cooling plate 17, a top limiting block 31 is fixedly connected to the top part in the mounting shell 34, side limiting blocks 32 are fixedly connected to the bottom part of the top limiting block 31 at two sides in the mounting shell 34, a limiting frame 33 is fixedly connected to the bottom part of the side limiting block 32 in the mounting shell 34, a bottom plate 35 is arranged at the bottom part of the mounting shell 34, first clamping blocks 37 are fixedly connected to two sides of the bottom plate 35, rubber blocks 39 are inlaid into two sides of the mounting shell 34 corresponding to the first clamping blocks 37, second clamping blocks 38 are fixedly connected to one side of the rubber blocks 39 close to the first clamping blocks 37, the first clamping blocks 37 are clamped to the mounting shell 34 through the second clamping blocks 38, clamping grooves 36 are formed in one side of the second clamping blocks 38 close to the first clamping blocks 37, a chip 4 is sleeved in the, through the fixed establishment 3 that sets up, when fixed chip 4, fill in the installation shell 34 with chip 4 whole, and pass spacing frame 33 in installation shell 34, until installing between top stopper 31 and the side stopper 32 in installation shell 34, this moment through first fixture block 37 joint in the draw-in groove 36 of second fixture block 38, thereby it is sealed bottom installation shell 34 through bottom plate 35, guaranteed that chip 4 is steady fixed in installation shell 34, the effectual installation of having solved is stable inadequately, lead to the problem of not hard up damage easily.
The limiting mechanism 5 comprises a fixing frame 52, the fixing frame 52 is fixedly connected to the inner bottom of the shell 2, a stabilizer bar 51 is connected in the middle of the top of the fixing frame 52 in a sliding manner, an insulating column 55 is fixedly connected to the bottom end of the stabilizer bar 51, a spring 56 is fixedly connected to the top of the insulating column 55, a fixing frame 52 is fixedly connected to the top end of the spring 56, a welding block 54 is fixedly connected to the bottom end of the insulating column 55, a sliding hole is formed in the middle of the top of the fixing frame 52, the fixing frame 52 is connected with the stabilizer bar 51 in a sliding manner through the sliding hole, a through hole 53 is formed in the bottom of the shell 2 corresponding to the insulating column 55, the shell 2 is connected with the insulating column 55 in a sliding manner through the through hole 53, the limiting mechanism 5 is arranged, the welding block 54 is welded on the, the chip 4 in the mounting shell 34 is not loosened, and the stability of the whole structure is ensured.
When the heat dissipation device is used, after a large amount of heat is generated in the working process of the chip 4 through the arranged heat dissipation mechanism 1, the cooling plate 17 can guide the heat of the chip 4 in the mounting shell 334 into the cooling plate 17 at the first time, the heat guided into the cooling plate 17 is quickly guided into the second heat dissipation fins 15, so that the purpose of primary heat dissipation is achieved through air flow, meanwhile, the water pump 14 in the shell 2 works to convey cooling liquid in the cooling box 111 into the cooling pipe 16 through the water pumping pipe 131 and the water outlet pipe 132, the cooling pipe 16 guides the heat in the second heat dissipation fins 15 through the cooling liquid, the cooling liquid carrying the heat flows back into the cooling box 111 through the circulating pipe 18, the heat in the cooling liquid in the backflow process is contacted with cold air through the outer wall of the circulating pipe 18, the purpose of cooling the cooling liquid is achieved, the cooling liquid flows back into the cooling box 111, and the heat is guided into the first heat dissipation fins, when the first heat sink 12 is cooled by the air flow, the heat generated by the chip 4 can be sufficiently cooled and dissipated, when the chip 4 is fixed, the whole chip 4 is plugged into the mounting shell 34, and passes through the limiting frame 33 in the mounting shell 34 until the chip is mounted between the top limiting block 31 and the side limiting block 32 in the mounting shell 34, at this time, the chip is clamped in the clamping groove 36 of the second clamping block 38 through the first clamping block 37, thereby sealing the bottom of the mounting case 34 through the bottom plate 35, ensuring the stable fixation of the chip 4 in the mounting case 34, soldering the solder bumps 54 on the circuit board, thereby ensuring the stability of the whole structure, and when receiving vibration, the spring 56 can counteract and eliminate the vibration force, the vibration force is not directly transmitted to the circuit main board, so that the chip 4 in the mounting shell 34 is not loosened, and the stability of the whole structure is ensured.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides an outdoor silicon controlled rectifier chip for switching power supply, includes shell (2), its characterized in that: the heat dissipation device is characterized in that heat dissipation mechanisms (1) are fixedly connected to the inner part and the top part of the shell (2), a limiting mechanism (5) is fixedly connected to the bottom part in the shell (2), a fixing mechanism (3) is fixedly connected to the middle of the back surface of the heat dissipation mechanism (1), and a chip (4) is fixedly connected to the inside of the fixing mechanism (3);
the heat dissipation mechanism (1) comprises a cooling box (111), the cooling box (111) is fixedly connected to the inner top of the shell (2), a first cooling fin (12) is fixedly connected to the inner bottom of the cooling box (111), a liquid filling port (11) is fixedly connected to the left side of the cooling box (111), a water pump (14) is fixedly connected to the right side of the cooling box (111) of the shell (2), a water pumping pipe (131) is fixedly connected to the left side of the water pump (14), a cooling box (111) is fixedly connected to the left side of the water pumping pipe (131), a water outlet pipe (132) is fixedly connected to the right side of the water pump (14), the right end of the water outlet pipe (132) penetrates through the right side of the shell (2), a liquid inlet pipe (13) is fixedly connected to the right side of the bottom of the cooling box (111), a second cooling fin (15) is fixedly connected to the top of the shell (2), and, fixedly connected with cooling tube (17) in the middle of second fin (15), cooling tube (16) right side bottom fixedly connected with outlet pipe (132), cooling tube (16) right side top fixedly connected with circulating pipe (18), circulating pipe (18) bottom fixedly connected with feed liquor pipe (13).
2. The silicon controlled rectifier chip for the outdoor switching power supply according to claim 1, characterized in that: the first radiating fins (12) are densely distributed in the cooling box (111) at equal intervals, the second radiating fins (15) are densely distributed at the top of the shell (2) at equal intervals, and the second radiating fins (15) and the cooling plate (17) are integrally formed.
3. The silicon controlled rectifier chip for the outdoor switching power supply according to claim 1, characterized in that: the fixing mechanism (3) comprises a mounting shell (34), the mounting shell (34) is fixedly connected to the middle of the back surface of the cooling plate (17), a top limiting block (31) is fixedly connected to the inner top of the mounting shell (34), side limiting blocks (32) are fixedly connected to the bottom of the top limiting block (31) at two sides in the mounting shell (34), the bottom of the side limiting block (32) in the mounting shell (34) is fixedly connected with a limiting frame (33), a bottom plate (35) is arranged at the bottom of the mounting shell (34), first clamping blocks (37) are fixedly connected to two sides of the bottom plate (35), rubber blocks (39) are embedded on two sides of the mounting shell (34) corresponding to the first clamping blocks (37), a second clamping block (38) is fixedly connected to one side of the rubber block (39) close to the first clamping block (37), the mounting shell (34) is clamped with a first clamping block (37) through a second clamping block (38).
4. The silicon controlled rectifier chip for the outdoor switching power supply according to claim 3, characterized in that: a clamping groove (36) is formed in one side, close to the first clamping block (37), of the second clamping block (38), and the first clamping block (37) is clamped on the second clamping block (38) through the clamping groove (36).
5. The silicon controlled rectifier chip for the outdoor switching power supply according to claim 3, characterized in that: chip (4) have been cup jointed in the middle of spacing frame (33), bottom plate (35) fixed connection is in the middle of chip (4).
6. The silicon controlled rectifier chip for the outdoor switching power supply according to claim 1, characterized in that: stop gear (5) are including mount (52), bottom in mount (52) fixed connection shell (2), sliding connection has stabilizer bar (51) in the middle of mount (52) top, stabilizer bar (51) bottom fixedly connected with insulated column (55), insulated column (55) top fixedly connected with spring (56), spring (56) top fixedly connected with mount (52), insulated column (55) bottom fixedly connected with welding block (54).
7. The silicon controlled rectifier chip for the outdoor switching power supply according to claim 6, characterized in that: the middle of the top of the fixing frame (52) is provided with a sliding hole, and the fixing frame (52) is connected with a stabilizing rod (51) in a sliding mode through the sliding hole.
8. The silicon controlled rectifier chip for the outdoor switching power supply according to claim 6, characterized in that: the bottom of the shell (2) is provided with a through hole (53) corresponding to the insulating column (55), and the shell (2) is connected with the insulating column (55) through the through hole (53) in a sliding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110294476.0A CN113066770B (en) | 2021-03-19 | 2021-03-19 | Silicon controlled chip for outdoor switch power supply |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110294476.0A CN113066770B (en) | 2021-03-19 | 2021-03-19 | Silicon controlled chip for outdoor switch power supply |
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| CN113066770A true CN113066770A (en) | 2021-07-02 |
| CN113066770B CN113066770B (en) | 2022-08-30 |
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| CN112510889A (en) * | 2020-11-25 | 2021-03-16 | 浙江驭马智能科技有限公司 | Low-noise circulation cooling ready-package sealing dustproof motor |
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| CN210928407U (en) * | 2019-09-04 | 2020-07-03 | 李素花 | Terminal controller cooling device for electric power system scheduling |
| CN210928421U (en) * | 2019-10-11 | 2020-07-03 | 深圳市欧诺克科技有限公司 | Direct current bus servo driver |
| CN210576336U (en) * | 2019-11-25 | 2020-05-19 | 深圳库博能源科技有限公司 | Improve heat radiation structure of high-efficient energy storage of new forms of energy battery |
| CN211557619U (en) * | 2019-12-30 | 2020-09-22 | 无锡兆奕达电子科技有限公司 | Waterproof good heat dissipation's circuit board |
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| CN113066770B (en) | 2022-08-30 |
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