CN205376498U - IGBT module integration heat radiation structure in converter - Google Patents
IGBT module integration heat radiation structure in converter Download PDFInfo
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- CN205376498U CN205376498U CN201620090491.8U CN201620090491U CN205376498U CN 205376498 U CN205376498 U CN 205376498U CN 201620090491 U CN201620090491 U CN 201620090491U CN 205376498 U CN205376498 U CN 205376498U
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- igbt module
- heat
- conducting piece
- heat dissipation
- dissipation structure
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Abstract
IGBT module integration heat radiation structure in converter, including IGBT module and radiator body, still include the heat -conducting piece on the radiator body, the IGBT module is fixed through the solder paste of evenly paining on the heat -conducting piece. The beneficial effects of the utility model are that, IGBT module and heat -conducting piece have welded into whole back, very big reduction the thermal resistance of IGBT module to the radiator, IGBT's operating temperature is the toboggan also, has improved the security and the reliability of device by a wide margin.
Description
Technical field
This utility model belongs to IGBT module integral heat dissipation structure in the heat abstractor of microelectronic device, particularly converter.
Background technology
Intelligence transistor modular is the device for power switching of a kind of advanced person, has high power transistor high current density, low saturation voltage and high voltage bearing advantage and the advantage of field-effect transistor high input impedance, high switching frequency and low driving power.And intelligence transistor modular has been internally integrated logic, control, detection and protection circuit; it is easy to use; not only reduce volume and the development time of system; also greatly strengthen the reliability of system; adapt to the developing direction modularity of current power device, Composite and power integrated circuit, obtained in field of power electronics and be increasingly widely applied.
Now being applied to the IGBT of template without cuprio in converter, have stronger price advantage, but be because without copper base, radiating effect is not good.Heat-conducting silicone grease is smeared for being substantially employing bottom without cuprio template IGBT, then again device is installed on above radiator, although the method is very general, but there are the following problems: heat conductive silica gel quality is uneven, capacity of heat transmission difference is very big, some producer selects and talks about improperly, the heat radiation of IGBT is caused very big impact, even causes the quick aging of device to damage；The general all viscous fluids of heat-conducting silicone grease, and general device is right angle setting, so certainly will cause heat-conducting silicone grease is flowed downward out by gravity for a long time, result in IGBT and radiator intermediate formation cavity, leverages the effect of heat radiation；As time goes on, the high temperature of device, can cause that the heat-conducting silicone grease of fluid type is slowly aging and become dry, also affect the radiating effect of IGBT.
Utility model content
The purpose of this utility model is to overcome above-mentioned deficiency, it is provided that a kind of simple in construction, less costly, IGBT module integral heat dissipation structure in converter easy to use.
For achieving the above object, the technical solution adopted in the utility model is:
IGBT module integral heat dissipation structure in converter, including IGBT module and radiator body, described radiator body also includes heat-conducting piece, and described IGBT module is fixed on described heat-conducting piece by the solder(ing) paste of uniform application.
Preferably: described heat-conducting piece adopts copper material to make.
Preferably: described radiator body adopts aluminum bronze composite to make.
Preferably: on described heat-conducting piece, the solder(ing) paste thickness of uniform application is 0.3mm.
Preferably: described radiator body is also associated with several radiating fins.
Preferably: the spacing between described radiating fin is 2mm-3mm.
Preferably: the bottom of described radiator body is wider than the bottom of heat-conducting piece.
Preferably: described IGBT module is without copper base, and bottom surface is smooth.
The beneficial effects of the utility model are, IGBT module and heat-conducting piece greatly reduce the IGBT module thermal resistance to radiator after being welded into entirety, and the operating temperature of IGBT also significantly declines, and the safety and reliability of device is greatly improved.
Accompanying drawing explanation
Fig. 1 structural representation of the present utility model.
Wherein: 1-IGBT module, 2-radiator body, 3-heat-conducting piece, 4-radiating fin.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this utility model is described in further detail:
IGBT module integral heat dissipation structure in converter, including IGBT module 1 and radiator body 2, described radiator body 2 also includes heat-conducting piece 3, and described IGBT module 1 is fixed on described heat-conducting piece 3 by the solder(ing) paste of uniform application.After welding, without carrying out the operations such as traditional screw reinforcing again, decreasing because the screw tightness impact on heat radiation, the most concentration place that generates heat in the bottom of IGBT conducts heat on radiator body 2 by heat-conducting piece 3, it is possible to by the IGBT heat Quick diffusing produced to external environment condition.
Preferably: described heat-conducting piece 3 adopts copper material to make.Thermal resistance situation according to unlike material, the thermal resistance of aluminum is 237W/mK, and the thermal resistance of copper is 401W/mK, from data, the thermal resistance of copper is far smaller than the thermal resistance of aluminum, IGBT first rapid large-area heat conduction to copper material part, copper material is partially due to there is the only small thermal resistance of bigger thermal capacitance, it is possible to quickly absorb and heat that conduction IGBT module 1 distributes.
Preferably: described radiator body 2 adopts aluminum bronze composite to make.Copper chemically angle is seen and is fallen within a kind of inert metal, good stability, has a stronger antioxidant anticorrosive ability, thus the long service life of aluminum bronze radiator, heat up rapidly simultaneously, energy-efficient.
Preferably: on described heat-conducting piece 3, the solder(ing) paste thickness of uniform application is 0.3mm, the thickness of solder(ing) paste can guarantee that IGBT module 1 and heat-conducting piece 3 firm welded, will not affect again the conduction of heat between IGBT module 1 and heat-conducting piece 3 because thickness is excessive.
Preferably: described radiator body 2 is also associated with several radiating fins 4, and the spacing between described radiating fin 4 is 2mm-3mm.Radiating fin 4 is used for and air heat-exchange, and the spacing between radiating fin 4, as heat dissipation wind channel, enhances the effect to IGBT heat exchange, thus solves the heat dissipation problem of IGBT.
Preferably: the bottom of described radiator body 2 is wider than the bottom of heat-conducting piece 3, so heat-conducting piece 3 can conduct heat to radiating fin 4.
Preferably: described IGBT module 1 is without copper base, and bottom surface is smooth, after the uniform application solder(ing) paste of IGBT module 1 bottom surface, can carry out welding fastening with heat-conducting piece 3.
The above is preferred implementation of the present utility model; certainly the interest field of this utility model can not be limited with this; should be understood that; for those skilled in the art; the technical solution of the utility model is modified or equivalent replacement, without departure from the protection domain of technical solutions of the utility model.
Claims (8)
1. IGBT module integral heat dissipation structure in converter, it is characterized in that: include IGBT module (1) and radiator body (2), also including heat-conducting piece (3) on described radiator body (2), described IGBT module (1) is fixed on described heat-conducting piece (3) by the solder(ing) paste of uniform application.
2. IGBT module integral heat dissipation structure in converter according to claim 1, it is characterised in that: described heat-conducting piece (3) adopts copper material to make.
3. IGBT module integral heat dissipation structure in converter according to claim 1, it is characterised in that: described radiator body (2) adopts aluminum bronze composite to make.
4. IGBT module integral heat dissipation structure in converter according to claim 1, it is characterised in that: the solder(ing) paste thickness of the upper uniform application of described heat-conducting piece (3) is 0.3mm.
5. IGBT module integral heat dissipation structure in converter according to claim 1, it is characterised in that: described radiator body (2) is also associated with several radiating fins (4).
6. IGBT module integral heat dissipation structure in converter according to claim 1, it is characterised in that: the spacing between described radiating fin (4) is 2mm-3mm.
7. IGBT module integral heat dissipation structure in converter according to claim 3, it is characterised in that: the bottom of described radiator body (2) is wider than the bottom of heat-conducting piece (3).
8. IGBT module integral heat dissipation structure in converter according to claim 1, it is characterised in that: described IGBT module (1) is without copper base, and bottom surface is smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620090491.8U CN205376498U (en) | 2016-01-29 | 2016-01-29 | IGBT module integration heat radiation structure in converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620090491.8U CN205376498U (en) | 2016-01-29 | 2016-01-29 | IGBT module integration heat radiation structure in converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205376498U true CN205376498U (en) | 2016-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620090491.8U Active CN205376498U (en) | 2016-01-29 | 2016-01-29 | IGBT module integration heat radiation structure in converter |
Country Status (1)
| Country | Link |
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| CN (1) | CN205376498U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109565929A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Radiator, circuit board and calculating equipment |
-
2016
- 2016-01-29 CN CN201620090491.8U patent/CN205376498U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109565929A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Radiator, circuit board and calculating equipment |
| WO2020087389A1 (en) * | 2018-10-31 | 2020-05-07 | 北京比特大陆科技有限公司 | Radiator, circuit board and computing device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |