CN211557619U - Waterproof good heat dissipation's circuit board - Google Patents
Waterproof good heat dissipation's circuit board Download PDFInfo
- Publication number
- CN211557619U CN211557619U CN201922455020.9U CN201922455020U CN211557619U CN 211557619 U CN211557619 U CN 211557619U CN 201922455020 U CN201922455020 U CN 201922455020U CN 211557619 U CN211557619 U CN 211557619U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- fixedly connected
- mounting seat
- mount pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 60
- 239000002826 coolant Substances 0.000 claims abstract 2
- 239000007788 liquid Substances 0.000 claims abstract 2
- 238000001816 cooling Methods 0.000 claims description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005057 refrigeration Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 230000006641 stabilisation Effects 0.000 abstract description 2
- 238000011105 stabilization Methods 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 8
- 239000012528 membrane Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a waterproof good heat dissipation's circuit board, including mount pad, recess, thermal-arrest board, circuit board body, heat dissipation mechanism, the mid point department at mount pad top is seted up flutedly, the bottom fixedly connected with thermal-arrest board of recess inner wall, the top fixedly connected with circuit board body of thermal-arrest board, the top of circuit board body is run through the recess and is extended to its outside, the bottom of mount pad is provided with heat dissipation mechanism, heat dissipation mechanism includes the cooler bin, the top of cooler bin and the bottom fixed connection of mount pad, the inside of cooler bin is provided with the coolant liquid. The utility model discloses a mount pad, recess, thermal-arrest board, circuit board body and heat dissipation mechanism mutually support, have realized the effect that the radiating effect is good, can effectually dispel the heat to the heat that the circuit board produced, have effectively improved the job stabilization nature of circuit board, have effectively avoided the circuit board to burn out because of the heat is too high, have greatly improved the life of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a waterproof good heat dissipation's circuit board.
Background
In the application of high-power supply circuit board, if the heat dissipation is not good probably trigger overtemperature prote device and the breakpoint stop work, very even can make a sound the life and the reliability of components and parts, in prior art, can distribute away fast effectively for the heat that guarantees that high-power subassembly sent, generally pretend large tracts of land fin and high power fan on the PCB board, dispel the heat through the mode of thermal convection. The existing heat dissipation mode plays a good heat dissipation role for a common PCB, but the problem of insufficient heat dissipation still exists for some high-power circuit boards, and therefore a circuit board with good waterproof and heat dissipation properties is provided to solve the problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a waterproof good heat dissipation's circuit board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a circuit board with good waterproof and heat dissipation performance comprises a mounting seat, a groove, a heat collecting plate, a circuit board body and a heat dissipation mechanism, wherein the groove is formed in the middle point of the top of the mounting seat;
the heat dissipation mechanism comprises a cooling box, the top of the cooling box is fixedly connected with the bottom of a mounting seat, cooling liquid is arranged in the cooling box, a semiconductor refrigeration sheet is fixedly connected to the left side of the inner wall of the cooling box, four heat conduction rods are fixedly connected to the bottom of a heat collection plate at equal intervals, the bottoms of the heat conduction rods sequentially penetrate through a groove and the mounting seat and extend into the mounting seat, a cooling pipe is sleeved on the surface of each heat conduction rod, a micro water pump is fixedly connected to the bottom of the inner wall of the cooling box, a water outlet pipe is fixedly connected to the right side of the micro water pump, one end, close to the water outlet pipe, of each cooling pipe sequentially penetrates through the mounting seat and the cooling box and extends into the cooling box and is fixedly connected with the water outlet pipe, one end, far away from the water outlet pipe, of each cooling pipe sequentially penetrates through the mounting seat and the cooling, the utility model discloses a semiconductor refrigeration piece, miniature pump and heat dissipation motor, including mount pad, heat dissipation motor, fixedly connected with heat dissipation pivot, the right side of heat dissipation pivot runs through the mount pad and extends to its inside fixedly connected with radiator vane on the output shaft of heat dissipation motor, the air inlet has been seted up on the top that the mount pad left side just is located heat dissipation motor, the left bottom fixedly connected with controller of mount pad, semiconductor refrigeration piece, miniature pump and heat dissipation motor respectively with controller electric connection.
Preferably, the surface of the circuit board body is clamped with the inner wall of the groove.
Preferably, a waterproof film is laid on the surface of the circuit board body.
Preferably, the cooling pipe is fixedly connected with the mounting seat.
Preferably, the cooling pipe is communicated with the water outlet pipe.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a mount pad, recess, thermal-arrest board, circuit board body and heat dissipation mechanism mutually support, have realized the effect that the radiating effect is good, can effectually dispel the heat to the heat that the circuit board produced, have effectively improved the job stabilization nature of circuit board, have effectively avoided the circuit board to burn out because of the heat is too high, have greatly improved the life of circuit board.
2. The utility model discloses a set up the water proof membrane, effectively improved the waterproof performance of circuit board body.
Drawings
FIG. 1 is a structural section view in elevation of the present invention;
fig. 2 is a schematic structural diagram of the front view of the present invention.
In the figure: the heat dissipation device comprises a mounting seat 1, a groove 2, a heat collection plate 3, a circuit board body 4, a heat dissipation mechanism 5, a cooling box 501, a semiconductor refrigeration sheet 502, a heat conduction rod 503, a cooling pipe 504, a miniature water pump 505, a water outlet pipe 506, a heat dissipation port 507, a heat dissipation motor 508, a heat dissipation rotating shaft 509, a heat dissipation blade 510, an air inlet 511, a controller 512 and a waterproof membrane 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a circuit board with good waterproof and heat dissipation properties includes a mounting base 1, a groove 2, a heat collecting plate 3, a circuit board body 4, and a heat dissipation mechanism 5, wherein the groove 2 is formed at a midpoint of the top of the mounting base 1, the heat collecting plate 3 is fixedly connected to the bottom of an inner wall of the groove 2, the circuit board body 4 is fixedly connected to the top of the heat collecting plate 3, the top of the circuit board body 4 penetrates through the groove 2 and extends to the outside of the circuit board body, the surface of the circuit board body 4 is clamped with the inner wall of the groove 2, the heat dissipation mechanism 5 is arranged at the bottom of the mounting base 1, a waterproof film 6 is laid on the surface of the circuit board body 4, and the waterproof property of.
The heat dissipation mechanism 5 comprises a cooling box 501, the top of the cooling box 501 is fixedly connected with the bottom of the mounting seat 1, cooling liquid is arranged inside the cooling box 501, a semiconductor refrigeration sheet 502 is fixedly connected to the left side of the inner wall of the cooling box 501, four heat conduction rods 503 are fixedly connected to the bottom of the heat collection plate 3 at equal intervals, the bottoms of the heat conduction rods 503 sequentially penetrate through the groove 2 and the mounting seat 1 and extend to the inside of the mounting seat 1, a cooling pipe 504 is sleeved on the surface of the heat conduction rods 503, a micro water pump 505 is fixedly connected to the bottom of the inner wall of the cooling box 501, a water outlet pipe 506 is fixedly connected to the right side of the micro water pump 505, one end of the cooling pipe 504, which is close to the water outlet pipe 506, sequentially penetrates through the mounting seat 1 and the cooling box 501 and extends to the inside of the cooling box 501 and is fixedly connected with the water outlet pipe 506, one, fixed connection between cooling tube 504 and the mount pad 1, communicate each other between cooling tube 504 and the outlet pipe 506, thermovent 507 has been seted up on the right side of mount pad 1, the fixed position that just corresponds thermovent 507 in mount pad 1 left side has heat dissipation motor 508, fixedly connected with heat dissipation pivot 509 on the output shaft of heat dissipation motor 508, the right side of heat dissipation pivot 509 runs through mount pad 1 and extends to its inside fixedly connected with radiator fin 510, air inlet 511 has been seted up on the left side of mount pad 1 and the top that is located heat dissipation motor 508, the left bottom fixedly connected with controller 512 of mount pad 1, semiconductor refrigeration piece 502, micro-water pump 505 and heat dissipation motor 508 respectively with controller 512 electric connection.
The working principle is as follows: when the circuit board body 4 works, the semiconductor chilling plate 502, the heat dissipation motor 508 and the micro water pump 505 are started through the controller 512, heat generated by the circuit board body 4 is absorbed by the heat collection plate 3, then the heat is transferred to the heat conduction rod 503, meanwhile, the micro water pump 505 extracts cooling liquid in the cooling box 501, then the cooling liquid sequentially passes through the water outlet pipe 506 and the cooling pipe 504, so that the cooling liquid can absorb heat on the surface of the heat conduction rod 503, finally, the cooling liquid flows back to the cooling box 501 from the other end of the cooling pipe 504, meanwhile, the semiconductor chilling plate 502 cools the cooling liquid in the cooling box 501, the cooling effect of the cooling liquid is ensured, meanwhile, the heat dissipation motor 508 drives the heat dissipation rotating shaft 509 and the heat dissipation blades 510 to rotate, and therefore, heat on the surface of the heat conduction rod 503 is blown to the heat dissipation opening 507, and therefore the heat dissipation effect is.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a waterproof good heat dissipation's circuit board, includes mount pad (1), recess (2), thermal-arrest board (3), circuit board body (4), heat dissipation mechanism (5), its characterized in that: a groove (2) is formed in the middle point of the top of the mounting seat (1), a heat collecting plate (3) is fixedly connected to the bottom of the inner wall of the groove (2), a circuit board body (4) is fixedly connected to the top of the heat collecting plate (3), the top of the circuit board body (4) penetrates through the groove (2) and extends to the outside of the groove, and a heat dissipation mechanism (5) is arranged at the bottom of the mounting seat (1);
heat dissipation mechanism (5) include cooler bin (501), the top of cooler bin (501) and the bottom fixed connection of mount pad (1), the inside of cooler bin (501) is provided with the coolant liquid, left side fixedly connected with semiconductor refrigeration piece (502) of cooler bin (501) inner wall, four heat conduction stick (503) of bottom equidistance fixedly connected with of thermal-arrest board (3), the bottom of heat conduction stick (503) runs through recess (2) and mount pad (1) in proper order and extends to the inside of mount pad (1), cooling tube (504) have been cup jointed on the surface of heat conduction stick (503), the bottom fixedly connected with miniature pump (505) of cooler bin (501) inner wall, the right side fixedly connected with outlet pipe (506) of miniature pump (505), the one end that cooling tube (504) are close to outlet pipe (506) runs through mount pad (1) and cooler bin (501) in proper order and extends to the inside of cooler bin (501) and is fixed with outlet pipe (506) One end of the cooling pipe (504), which is far away from the water outlet pipe (506), sequentially penetrates through the mounting seat (1) and the cooling tank (501) and extends into the cooling tank (501), a heat dissipation port (507) is arranged on the right side of the mounting seat (1), a heat dissipation motor (508) is fixedly connected on the left side of the mounting seat (1) and corresponds to the position of the heat dissipation port (507), the output shaft of the heat dissipation motor (508) is fixedly connected with a heat dissipation rotating shaft (509), the right side of the heat dissipation rotating shaft (509) penetrates through the mounting seat (1) and extends to the interior of the mounting seat to be fixedly connected with a heat dissipation blade (510), an air inlet (511) is arranged at the left side of the mounting seat (1) and positioned at the top of the heat dissipation motor (508), the bottom of the left side of the mounting seat (1) is fixedly connected with a controller (512), the semiconductor refrigeration piece (502), the micro water pump (505) and the heat dissipation motor (508) are respectively electrically connected with the controller (512).
2. The circuit board of claim 1, wherein: the surface of the circuit board body (4) is clamped with the inner wall of the groove (2).
3. The circuit board of claim 1, wherein: and a waterproof film (6) is laid on the surface of the circuit board body (4).
4. The circuit board of claim 1, wherein: the cooling pipe (504) is fixedly connected with the mounting seat (1).
5. The circuit board of claim 1, wherein: the cooling pipe (504) is communicated with the water outlet pipe (506).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922455020.9U CN211557619U (en) | 2019-12-30 | 2019-12-30 | Waterproof good heat dissipation's circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922455020.9U CN211557619U (en) | 2019-12-30 | 2019-12-30 | Waterproof good heat dissipation's circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211557619U true CN211557619U (en) | 2020-09-22 |
Family
ID=72512080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922455020.9U Expired - Fee Related CN211557619U (en) | 2019-12-30 | 2019-12-30 | Waterproof good heat dissipation's circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211557619U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066770A (en) * | 2021-03-19 | 2021-07-02 | 深圳市嘉兴南电科技有限公司 | Silicon controlled chip for outdoor switch power supply |
-
2019
- 2019-12-30 CN CN201922455020.9U patent/CN211557619U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066770A (en) * | 2021-03-19 | 2021-07-02 | 深圳市嘉兴南电科技有限公司 | Silicon controlled chip for outdoor switch power supply |
| CN113066770B (en) * | 2021-03-19 | 2022-08-30 | 深圳市嘉兴南电科技有限公司 | Silicon controlled chip for outdoor switch power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200922 |