CN216930397U - Intelligent printed circuit board with high temperature resistant function - Google Patents

Abstract

The utility model relates to the technical field of circuit boards, and discloses an intelligent printed circuit board with high temperature resistance function. A heat-conducting plate is fixedly arranged on the lower surface of the plate main body, and two hollow plates are arranged inside the casing, and a plurality of heat dissipation pipes are fixedly connected between the two hollow plates, and the plurality of heat-dissipating pipes are all connected to the heat conduction. The bottom of the shell is provided with a water storage shell, the inner two ends of the water storage shell are respectively fixed with a water outlet pipe and a water inlet pipe, and the upper ends of the water outlet pipe and the water inlet pipe are both connected with the corresponding hollow plates Fixed connection, the inside of the water storage shell is provided with a micro circulation pump, and the lower end of the water outlet pipe is fixedly connected with the water outlet of the micro circulation pump. The utility model has good heat dissipation performance and can greatly improve the high temperature resistance performance of the circuit board.

Description

An intelligent printed circuit board with high temperature resistance

technical field

The utility model relates to the technical field of circuit boards, in particular to an intelligent printed circuit board with a high temperature resistance function.

Background technique

Printed circuit boards are more common in daily life. With the development of science and technology, the number of electronic components installed on intelligent printed circuit boards is increasing, and the heat generated during work is increasing.

Most of the traditional smart printed circuit boards rely on air to dissipate heat naturally, with low heat dissipation efficiency and poor high temperature resistance. When working in a high temperature environment, a large amount of heat will accumulate, causing damage to the printed circuit board, resulting in economic losses.

Utility model content

The purpose of the utility model is to solve the problems that most of the intelligent printed circuit boards in the prior art rely on air to dissipate heat naturally, the heat dissipation efficiency is low, and the high temperature resistance performance is poor, and an intelligent printed circuit with high temperature resistance function is proposed. plate.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

An intelligent printed circuit board with high temperature resistance function includes a casing and a circuit board main body, the circuit board main body is fixedly arranged on the inner upper end of the casing, and a heat conduction plate is fixedly arranged on the lower surface of the circuit board main body, so the The interior of the casing is provided with two hollow plates, a plurality of heat dissipation pipes are fixedly connected between the two hollow plates, and the plurality of heat dissipation pipes are all in conflict with the heat conduction plate, and the bottom of the casing is provided with a plurality of heat dissipation pipes. The water storage shell, the inner two ends of the water storage shell are respectively fixed with a water outlet pipe and a water inlet pipe, and the upper ends of the water outlet pipe and the water inlet pipe are fixedly connected with the corresponding hollow plates, and the interior of the water storage shell is provided with a water outlet pipe and a water inlet pipe. In the micro-circulating pump, the lower end of the water outlet pipe is fixedly connected with the water outlet of the micro-circulating pump, the lower end of the casing is provided with cooling grooves on both sides, and the cooling mechanism is arranged inside the cooling pipe.

Preferably, the heat dissipation mechanism includes a rotating rod and a fan blade, the rotating rod is rotatably arranged inside the heat dissipation pipe, one end of the rotating rod extends to the outside of the heat dissipation pipe, and the fan blade is fixedly sleeved on the inside of the heat dissipation pipe. A plurality of baffles are fixedly arranged on the side wall of the inner end of the rotating rod, the middle part of the heat dissipation pipe is fixedly provided with a baffle, and the upper side of the baffle is provided with a through groove.

Preferably, both sides of the casing are provided with through grooves.

Preferably, the rotating rod is rotatably connected to the cooling pipe through a sealed bearing.

Preferably, the interiors of the two through grooves are fixedly provided with dust-proof nets.

Preferably, the main body of the circuit board is fixedly connected to the housing through screws.

Compared with the prior art, the utility model provides an intelligent printed circuit board with high temperature resistance function, which has the following beneficial effects:

The intelligent printed circuit board with high temperature resistance function absorbs the heat of the main body of the circuit board through the heat conduction plate, and then the micro circulation pump circulates the liquid in the heat dissipation pipe, so that the heat dissipation pipe can dissipate heat to the heat conduction plate, and the liquid flow in the heat dissipation pipe pushes the block Even if the rotating rod drives the fan blades to rotate, the air flow in the casing can be accelerated, that is, the heat dissipation of the circuit board body can be efficiently performed, and the high temperature resistance performance of the circuit board body can be greatly improved.

The parts not involved in the device are the same as the prior art or can be realized by adopting the prior art. The utility model has good heat dissipation performance and can greatly improve the high temperature resistance performance of the circuit board.

Description of drawings

1 is a schematic structural diagram of an intelligent printed circuit board with a high temperature resistance function proposed by the utility model;

FIG. 2 is a schematic diagram of the internal structure of FIG. 1 .

In the picture: 1 shell, 2 heat conduction plate, 3 circuit board main body, 4 hollow plate, 5 heat pipe, 6 water storage shell, 7 micro circulation pump, 8 water outlet pipe, 9 water inlet pipe, 10 dustproof net, 11 partition plate , 12 levers, 13 blades, 14 baffles.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inside", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation , are constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

1-2, an intelligent printed circuit board with high temperature resistance function includes a casing 1 and a circuit board main body 3, the circuit board main body 3 is fixedly arranged on the inner upper end of the casing 1, and the lower surface of the circuit board main body 3 A heat-conducting plate 2 is fixedly arranged, two hollow plates 4 are arranged inside the casing 1, and a plurality of heat-dissipating pipes 5 are fixedly connected between the two hollow-core plates 4. The bottom of the housing 1 is provided with a water storage shell 6, and the inner two ends of the water storage shell 6 are respectively fixed with a water outlet pipe 8 and a water inlet pipe 9, and the upper ends of the water outlet pipe 8 and the water inlet pipe 9 are fixedly connected with the corresponding hollow plate 4. , the interior of the water storage shell 6 is provided with a micro-circulating pump 7, the lower end of the water outlet pipe 8 is fixedly connected with the water outlet of the micro-circulating pump 7, the lower end of the shell 1 is provided with cooling grooves on both sides, and the interior of the cooling pipe 5 is provided with cooling mechanism.

The heat dissipation mechanism includes a rotating rod 12 and a fan blade 13 , the rotating rod 12 is rotatably arranged inside the heat dissipation pipe 5 , one end of the rotating rod 12 extends to the outside of the heat dissipation pipe 5 , and the fan blade 13 is fixedly sleeved on the outer end of the rotating rod 12 . A plurality of baffles 14 are fixedly arranged on the inner side wall of one end of the rotating rod 12 , a partition plate 11 is fixedly arranged in the middle of the heat dissipation pipe 5 , and a through groove is opened on the upper side of the partition plate 11 .

Both sides of the casing 1 are provided with through grooves to facilitate the flow of air in the casing 1 .

The rotating rod 12 is rotatably connected to the heat dissipation pipe 5 through a sealed bearing, so as to improve the sealing performance between the rotating rod 12 and the heat dissipation pipe 5 .

The inside of the two through grooves are fixedly provided with a dustproof net 10 to improve the dustproof performance of the casing 1 .

The circuit board main body 3 is fixedly connected to the housing 1 through screws, which facilitates disassembly and maintenance of the circuit board main body 3 .

In the present invention, when in use, since the heat-conducting plate 2 absorbs the heat of the circuit board body 3 , the micro-circulation pump 7 circulates the liquid in the heat-dissipating pipe 5 and the water storage shell 6 , so that the heat-dissipating pipe 5 conducts the heat transfer to the heat-conducting plate 2 . Efficient heat dissipation, the liquid flow in the heat dissipation pipe 5 pushes the baffle 14, that is, the rotating rod 12 drives the fan blades 13 to rotate, that is, the air flow in the casing 1 can be accelerated, that is, the circuit board main body 3 can be efficiently dissipated, which can greatly improve the High temperature resistance of the circuit board body 3 .

The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Equivalent replacement or modification of the new technical solution and its utility model concept shall be included within the protection scope of the present utility model.

Claims (6)

1. The utility model provides an intelligence printed circuit board with high temperature resistant function, includes casing (1) and circuit board main part (3), its characterized in that, circuit board main part (3) are fixed to be set up in the inside upper end of casing (1), the lower fixed surface of circuit board main part (3) is provided with heat-conducting plate (2), the inside of casing (1) is provided with two hollow core boards (4), two a plurality of cooling tubes (5) of fixedly connected with between hollow core board (4), a plurality of all inconsistent with heat-conducting plate (2) of cooling tube (5), the bottom of casing (1) is provided with water storage shell (6), the inside both ends of water storage shell (6) are fixed respectively and are provided with outlet pipe (8) and inlet tube (9), the upper end of outlet pipe (8) and inlet tube (9) all with corresponding hollow core board (4) fixed connection, the inside of water storage shell (6) is provided with miniature circulating pump (7), the lower extreme of outlet pipe (8) and the delivery port fixed connection of miniature circulating pump (7), the radiating groove has all been seted up to the lower extreme both sides of casing (1), the inside of cooling tube (5) is provided with heat dissipation mechanism.

2. The intelligent printed circuit board with the high temperature resistance function according to claim 1, wherein the heat dissipation mechanism comprises a rotating rod (12) and fan blades (13), the rotating rod (12) is rotatably disposed inside the heat dissipation pipe (5), one end of the rotating rod (12) extends to the outer side of the heat dissipation pipe (5), one end of the fan blades (13) is fixedly sleeved on one end of the outer side of the rotating rod (12), a plurality of baffles (14) are fixedly disposed on the side wall of one end of the inner side of the rotating rod (12), a partition plate (11) is fixedly disposed in the middle of the heat dissipation pipe (5), and a through groove is formed in the upper side of the partition plate (11).

3. The intelligent printed circuit board with the high temperature resistance function according to claim 1, wherein through grooves are formed on both sides of the housing (1).

4. The intelligent printed circuit board with high temperature resistant function as claimed in claim 2, wherein the rotating rod (12) is rotatably connected with the heat radiating pipe (5) through a sealed bearing.

5. The intelligent printed circuit board with high temperature resistance according to claim 3, wherein a dust screen (10) is fixedly arranged inside each of the through grooves.

6. The intelligent printed circuit board with high temperature resistance function according to claim 1, wherein the circuit board main body (3) is fixedly connected with the housing (1) through screws.

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