CN113056119B - 层叠装置和层叠体的制造方法 - Google Patents
层叠装置和层叠体的制造方法 Download PDFInfo
- Publication number
- CN113056119B CN113056119B CN202011171428.4A CN202011171428A CN113056119B CN 113056119 B CN113056119 B CN 113056119B CN 202011171428 A CN202011171428 A CN 202011171428A CN 113056119 B CN113056119 B CN 113056119B
- Authority
- CN
- China
- Prior art keywords
- sheet
- holder
- sheets
- lamination
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003475 lamination Methods 0.000 title claims abstract description 184
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title abstract description 36
- 239000002245 particle Substances 0.000 claims abstract description 113
- 238000010030 laminating Methods 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 238000003825 pressing Methods 0.000 claims description 21
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 description 39
- 230000007246 mechanism Effects 0.000 description 36
- 230000032258 transport Effects 0.000 description 27
- 238000010586 diagram Methods 0.000 description 19
- 230000003068 static effect Effects 0.000 description 18
- 238000001179 sorption measurement Methods 0.000 description 16
- 238000006386 neutralization reaction Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 230000014759 maintenance of location Effects 0.000 description 6
- 238000002788 crimping Methods 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000010191 image analysis Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019238263A JP6987834B2 (ja) | 2019-12-27 | 2019-12-27 | 積層装置及び積層体の製造方法 |
| JP2019-238263 | 2019-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113056119A CN113056119A (zh) | 2021-06-29 |
| CN113056119B true CN113056119B (zh) | 2024-01-23 |
Family
ID=76507827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011171428.4A Active CN113056119B (zh) | 2019-12-27 | 2020-10-28 | 层叠装置和层叠体的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6987834B2 (ja) |
| CN (1) | CN113056119B (ja) |
| TW (1) | TWI760840B (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114845486B (zh) * | 2022-07-01 | 2022-11-01 | 开平依利安达电子第五有限公司 | 一种多层印刷线路板热压装置 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09219590A (ja) * | 1996-02-13 | 1997-08-19 | Hitachi Ltd | 薄膜積層基板用シートならびに薄膜積層基板、およびそれらの製造方法ならびに製造装置 |
| JP2001313227A (ja) * | 2000-04-28 | 2001-11-09 | Matsushita Electric Ind Co Ltd | 積層体の製造方法と電子部品の製造方法、及び電子部品 |
| JP2009064920A (ja) * | 2007-09-05 | 2009-03-26 | Tdk Corp | 積層型電子部品の製造方法 |
| CN101465173A (zh) * | 2008-12-31 | 2009-06-24 | 广东东邦科技有限公司 | 一种触摸屏透明导电膜及其制备方法 |
| JP2014107380A (ja) * | 2012-11-27 | 2014-06-09 | Toppan Printing Co Ltd | 金属箔積層体の製造方法および太陽電池モジュールの製造方法 |
| JP5588579B1 (ja) * | 2013-05-21 | 2014-09-10 | 日機装株式会社 | 積層装置及び積層方法 |
| CN105210228A (zh) * | 2013-05-21 | 2015-12-30 | 日机装株式会社 | 层叠装置以及层叠方法 |
| JP2018018010A (ja) * | 2016-07-29 | 2018-02-01 | 大日本印刷株式会社 | 積層装置及び調光フィルムの製造方法 |
| JP2019129028A (ja) * | 2018-01-23 | 2019-08-01 | 日機装株式会社 | 積層装置及び積層方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04158036A (ja) * | 1990-10-23 | 1992-06-01 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
| KR100910188B1 (ko) * | 2001-07-19 | 2009-07-30 | 도레이 카부시키가이샤 | 회로기판, 회로기판용 부재 및 그 제조방법 및가요성필름의 라미네이트방법 |
| JP2012069765A (ja) * | 2010-09-24 | 2012-04-05 | Tdk Corp | 積層セラミック電子部品の製造方法 |
-
2019
- 2019-12-27 JP JP2019238263A patent/JP6987834B2/ja active Active
-
2020
- 2020-09-04 TW TW109130439A patent/TWI760840B/zh active
- 2020-10-28 CN CN202011171428.4A patent/CN113056119B/zh active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09219590A (ja) * | 1996-02-13 | 1997-08-19 | Hitachi Ltd | 薄膜積層基板用シートならびに薄膜積層基板、およびそれらの製造方法ならびに製造装置 |
| JP2001313227A (ja) * | 2000-04-28 | 2001-11-09 | Matsushita Electric Ind Co Ltd | 積層体の製造方法と電子部品の製造方法、及び電子部品 |
| JP2009064920A (ja) * | 2007-09-05 | 2009-03-26 | Tdk Corp | 積層型電子部品の製造方法 |
| CN101465173A (zh) * | 2008-12-31 | 2009-06-24 | 广东东邦科技有限公司 | 一种触摸屏透明导电膜及其制备方法 |
| JP2014107380A (ja) * | 2012-11-27 | 2014-06-09 | Toppan Printing Co Ltd | 金属箔積層体の製造方法および太陽電池モジュールの製造方法 |
| JP5588579B1 (ja) * | 2013-05-21 | 2014-09-10 | 日機装株式会社 | 積層装置及び積層方法 |
| CN105210228A (zh) * | 2013-05-21 | 2015-12-30 | 日机装株式会社 | 层叠装置以及层叠方法 |
| JP2018018010A (ja) * | 2016-07-29 | 2018-02-01 | 大日本印刷株式会社 | 積層装置及び調光フィルムの製造方法 |
| JP2019129028A (ja) * | 2018-01-23 | 2019-08-01 | 日機装株式会社 | 積層装置及び積層方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI760840B (zh) | 2022-04-11 |
| CN113056119A (zh) | 2021-06-29 |
| TW202124148A (zh) | 2021-07-01 |
| JP6987834B2 (ja) | 2022-01-05 |
| JP2021104664A (ja) | 2021-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |