CN112930023A - Cooling fin and server - Google Patents
Cooling fin and server Download PDFInfo
- Publication number
- CN112930023A CN112930023A CN202110091165.4A CN202110091165A CN112930023A CN 112930023 A CN112930023 A CN 112930023A CN 202110091165 A CN202110091165 A CN 202110091165A CN 112930023 A CN112930023 A CN 112930023A
- Authority
- CN
- China
- Prior art keywords
- chip
- heat sink
- base
- heat
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 description 33
- 230000005855 radiation Effects 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Abstract
The invention discloses a radiating fin and a server. The heat sink includes: a base; a plurality of first heat fins fixed to the base and extending toward one side of the base; at least one second heat fin fixed to the base and extending toward an opposite side of the base; and the fixing part is arranged between the at least one second radiating fin and the chip and is used for fixedly connecting the at least one second radiating fin to the side wall of the chip arranged on the printed circuit board. According to the scheme of the invention, the fixing part is arranged between the second radiating fins and the chip, and at least one second radiating fin is fixedly connected to the side wall of the chip welded on the printed circuit board through the fixing part, so that the contact area between the chip and the radiating fin is increased, the radiating effect is obviously improved, meanwhile, holes are prevented from being formed in the printed circuit board, and the layout and wiring space of the printed circuit board is increased.
Description
Technical Field
The invention relates to the field of radiating fins, in particular to a radiating fin and a server.
Background
With the continuous updating and development of server products, chips are updated, the density of signal lines is increased, the number of supported functions is increased, the power consumption of the chips is increased, the generated heat is increased continuously, and the heat dissipation requirement can be met by a heat dissipation sheet with a larger volume. However, the board card has a limited area, and the heat dissipation area needs to be increased to meet the heat dissipation requirement under the condition of not increasing the volume.
At present, the contact surface between the heat sink and the chip is as large as the chip, and the heat sink is fixed to the printed circuit board mainly by screws. For example, fig. 1A shows a schematic view of a conventional heat sink structure, and fig. 1B shows a schematic view of a PCB for fixing the heat sink, wherein the heat sink is fixed to the top of a chip 200 that is usually soldered on the PCB (Printed Circuit Board) by forming a hole 110 on the PCB, and then fixing the heat sink to the hole 110 with a screw, or directly adhering the heat sink to the top of the chip 200. However, the above two methods have the following disadvantages: firstly, the contact area between the heat sink and the chip is limited, and the heat sink cannot meet the increasing heat dissipation requirement of the chip; secondly, the PCB layout and wiring space is occupied by adopting a punching mode, which is not beneficial to the design of a high-density circuit board.
Disclosure of Invention
In view of the above, it is desirable to provide a heat sink and a server that can increase the area of the heat sink without punching holes on the printed circuit board.
According to a first aspect of the present invention, there is provided a heat sink comprising:
a base;
a plurality of first heat fins fixed to the base and extending toward one side of the base;
at least one second heat fin fixed to the base and extending toward an opposite side of the base;
and the fixing part is arranged between the at least one second radiating fin and the chip and is used for fixedly connecting the at least one second radiating fin to the side wall of the chip arranged on the printed circuit board.
In one embodiment, the second heat dissipation fins are two pieces;
the two second radiating fins are arranged in parallel and clamped to one end of the chip far away from the printed circuit board through the fixing part.
In one embodiment, the second heat dissipation chip is four;
the four second radiating fins are sequentially connected end to form a quadrangular prism and are clamped to one end, far away from the printed circuit board, of the chip through the fixing part.
In one embodiment, the cross-sectional shape of the quadrangular prism is the same as the cross-sectional shape of the chip, and the cross-section of the quadrangular prism is larger than that of the chip.
In one embodiment, the fixing portion is a spring piece, the spring piece is disposed between the second heat dissipation fin and the side wall of the chip, and the middle portion of the spring piece is bent inward.
In one embodiment, the fixing portion is a heat conductive silicone, and the heat conductive silicone is attached between the at least one second heat dissipation fin and the side wall of the chip.
In one embodiment, the length of the second cooling fin is greater than the thickness of the chip.
In one embodiment, the base, the first heat dissipation fins and the second heat dissipation fins are made of aluminum alloy.
In one embodiment, a heat conducting medium is coated between one side of the base close to the second radiating fins and the top wall of the chip.
According to a second aspect of the present invention, there is provided a server comprising the heat sink described above.
Above-mentioned fin and server, through extending formation first heat radiation fin and second heat radiation fin respectively along base both sides, set up the fixed part between second heat radiation fin and chip to through the fixed part with at least one second heat radiation fin fixed connection to the chip lateral wall of welding on printed circuit board, thereby increased the area of contact of chip and fin, the promotion radiating effect that is showing, avoided trompil on printed circuit board simultaneously, increased printed circuit board's overall arrangement wiring space.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1A is a schematic view of a conventional PCB with a heat sink attached
FIG. 1B is a schematic diagram of a conventional PCB with a heat sink attached;
fig. 2 is a schematic structural diagram of a heat sink according to an embodiment of the present invention;
fig. 3A is a schematic view illustrating a fourth heat dissipation fin according to another embodiment of the present invention;
FIG. 3B is a schematic view of the bottom view of FIG. 3A;
fig. 4A is a schematic structural view of a heat sink with a fixing portion being a spring plate according to another embodiment of the present invention;
fig. 4B is a partial schematic view of a spring plate according to another embodiment of the invention.
[ description of reference ]
1: a base;
2: a first heat radiation fin;
3: a second heat radiation fin;
4: a fixed part; 41: a spring plate;
5: a chip;
6: a printed circuit board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In one embodiment, referring to fig. 2, the present invention provides a heat sink, which includes a base 1, first heat dissipating fins 2, second heat dissipating fins 3, and a fixing portion 4.
The first radiating fins 2 extend from one side of the base 1 to form a plurality of first radiating fins 2; the first heat dissipation fins may extend vertically or be bent, and a plurality of the first heat dissipation fins are arranged at predetermined intervals, for example, the heat dissipation plate shown in fig. 1A. The second heat dissipation fins 3 extend from the other side of the base 1 to form at least one second heat dissipation fin 3. The fixing portion 4 is disposed between the at least one second heat dissipating fin and the chip 5, and is used for fixedly connecting the at least one second heat dissipating fin 3 to a sidewall of the chip 5, wherein the chip 5 is soldered on the printed circuit board 6.
In some embodiments, the fixing portion may be an adhesive material, such as a heat conductive silicone, or a rigid connector, such as a screw, a buckle, a spring, etc.
Above-mentioned fin and server, through extending formation first heat radiation fin and second heat radiation fin respectively along base both sides, set up the fixed part between second heat radiation fin and chip to through the fixed part with at least one second heat radiation fin fixed connection to the chip lateral wall of welding on printed circuit board, thereby increased the area of contact of chip and fin, the promotion radiating effect that is showing, avoided trompil on printed circuit board simultaneously, increased printed circuit board's overall arrangement wiring space.
In another embodiment, the second heat dissipating fins 3 are two pieces, the two pieces of second heat dissipating fins 3 are disposed in parallel, one end of the chip 5 away from the printed circuit board 6 is placed between the two pieces of second heat dissipating fins 3, and a set of sidewalls of the chip 5 is engaged with the two pieces of second heat dissipating fins through the fixing portion 4.
For example, the chip is usually a regular cube, the cross section of the chip is mostly rectangular or square, at this time, two second heat dissipation chips arranged in parallel and at intervals are adopted, and a group of side walls of the chip is clamped between the two second heat dissipation chips.
In another embodiment, please refer to fig. 3A and 3B in combination, fig. 3A is a schematic diagram of four second heat dissipation fins, fig. 3B is a bottom view of fig. 3A, and the number of the second heat dissipation chips 5 is four;
the four second radiating fins 3 are sequentially connected end to form a quadrangular prism, and one end, far away from the printed circuit board 6, of the chip 5 extends into the quadrangular prism and is clamped with the quadrangular prism through the fixing part 4.
For example, different from the previous embodiment, the present embodiment is a pattern formed by enclosing four second heat dissipation fins, so as to enclose four sides of the chip.
Preferably, the cross-sectional shape of the quadrangular prism is the same as the cross-sectional shape of the chip 5, and the cross-section of the quadrangular prism is larger than the cross-section of the chip 5. For example, if a chip has a square cross section, four heat dissipation chips surround a regular quadrangular prism, and the cross section of the quadrangular prism is slightly larger than that of the chip, so that the chip can extend into the quadrangular prism and be clamped or adhered.
In another embodiment, please refer to fig. 4A and 4B, fig. 4A shows a heat sink with a fixing portion being a spring, fig. 4B is a partial schematic view of the spring, the fixing portion 4 is a spring, the spring is disposed between the second heat dissipating fins 3 and the side wall of the chip 5, and the middle portion of the spring is bent inward.
It should be noted that, in the specific implementation process, the number of the elastic pieces may be set according to the number of the second heat dissipation fins and the size of the chip, for example, if a structure of a group of two second heat dissipation fins parallel to the side wall of the chip is adopted, the elastic piece may be fixed on one of the second heat dissipation fins, or a plurality of elastic pieces may be fixed on the second heat dissipation fins, or of course, a manner of fixing the elastic pieces on the second heat dissipation fins on both sides may be adopted, as long as the elastic pieces can ensure that the chip is clamped. If the fixed part adopts the shell fragment formula, can guarantee fixed effect on the one hand at second heat radiation fin in the heat conduction silica gel of coating on the lateral wall of chip contact in order to guarantee leading-in effect, the other party is convenient for the chip.
In another embodiment, the fixing portion 4 is a thermal conductive silicone, and the thermal conductive silicone is attached between the at least one second heat dissipation fin 3 and the side wall of the chip 5.
Preferably, the length of the second radiator fin 3 is greater than the thickness of the chip 5. For example, the chip generally has a certain thickness, and in order to increase the contact area between the chip and the second heat dissipation fins as much as possible, the vertical extension length of the second heat dissipation fins may be set to be slightly greater than the height of the chip, so as to ensure that the sidewalls of the chip can be fully contacted with the second heat dissipation fins, thereby ensuring the heat dissipation effect.
Preferably, the base 1, the first radiator fins 2, and the second radiator fins 3 are made of aluminum alloy.
Preferably, a heat conducting medium is coated between one side of the base 1 close to the second radiator fins 3 and the top wall of the chip 5.
In another embodiment, to facilitate understanding of the technical solution of the present invention, the following describes an assembly method of the heat sink by taking the structure shown in fig. 3A as an example as follows:
step 1: firstly, welding a chip on a printed circuit board, and coating heat-conducting silica gel on the top of the chip (namely, the end face far away from the circuit board);
and 3, sleeving a quadrangular prism formed by enclosing four second radiating fins on the top of the chip, applying certain pressure to the vertical direction to ensure that the first elastic sheet is deformed outwards, so that the side wall of the chip is enclosed by the second radiating fins, and fixing the radiating fins on the side wall of the chip through the elastic sheets after the elastic sheets rebound.
Therefore, the heat sink of the present invention has at least the following technical effects: (1) the elastic sheets are in contact with the periphery of the chip, so that the contact area between the chip and the radiating fin is increased; (2) the PCB does not need to be additionally provided with holes, so that the layout and wiring space of the PCB is saved; (3) the structure is compact, the device can be used for many times, and the cost is low; (4) the elastic sheet is adopted to ensure the fixing effect of the chip with the radiating fins, and the chip is not easy to fall off and convenient to detach and install.
In yet another embodiment, the present invention further provides a server comprising the heat sink described above for dissipating heat from at least one chip soldered on a printed circuit board.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. Although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A heat sink, characterized in that the heat sink comprises:
a base;
a plurality of first heat fins fixed to the base and extending toward one side of the base;
at least one second heat fin fixed to the base and extending toward an opposite side of the base;
and the fixing part is arranged between the at least one second radiating fin and the chip and is used for fixedly connecting the at least one second radiating fin to the side wall of the chip arranged on the printed circuit board.
2. The heat sink as recited in claim 1 wherein the second heat sink fin is two pieces;
the two second radiating fins are arranged in parallel and clamped to one end of the chip far away from the printed circuit board through the fixing part.
3. The heat sink as recited in claim 1 wherein the second heat sink chip is four;
the four second radiating fins are sequentially connected end to form a quadrangular prism and are clamped to one end, far away from the printed circuit board, of the chip through the fixing part.
4. A heat sink as recited in claim 3 wherein the cross-sectional shape of the quadrangular prism is the same as the cross-sectional shape of the chip, the cross-section of the quadrangular prism being larger than the cross-section of the chip.
5. The heat sink as claimed in any one of claims 2 to 4, wherein the fixing portion is a spring, the spring is disposed between the second heat sink and the sidewall of the chip, and the middle portion of the spring is bent inward.
6. The heat sink as claimed in claim 1, wherein the fixing portion is a thermally conductive silicone applied between the at least one second heat sink fin and the side wall of the chip.
7. The heat sink as recited in claim 1 wherein the length of the second cooling fin is greater than the thickness of the chip.
8. The heat sink as recited in claim 1, wherein the base, the first fins and the second fins are made of aluminum alloy.
9. The heat sink as set forth in claim 1, wherein a heat conducting medium is coated between a side of the base adjacent to the second cooling fins and a top wall of the chip.
10. A server, characterized in that the server comprises a heat sink according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110091165.4A CN112930023A (en) | 2021-01-22 | 2021-01-22 | Cooling fin and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110091165.4A CN112930023A (en) | 2021-01-22 | 2021-01-22 | Cooling fin and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112930023A true CN112930023A (en) | 2021-06-08 |
Family
ID=76165246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110091165.4A Withdrawn CN112930023A (en) | 2021-01-22 | 2021-01-22 | Cooling fin and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112930023A (en) |
-
2021
- 2021-01-22 CN CN202110091165.4A patent/CN112930023A/en not_active Withdrawn
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210608 |