CN112928595A

CN112928595A - TO packaging-based laser with refrigeration and packaging method thereof

Info

Publication number: CN112928595A
Application number: CN202110455248.7A
Authority: CN
Inventors: 刘倚红; 钱诚; 张烜; 王永虎; 王任凡
Original assignee: Wuhan Minxin Semiconductor Co ltd
Current assignee: Wuhan Minxin Semiconductor Co ltd
Priority date: 2021-04-26
Filing date: 2021-04-26
Publication date: 2021-06-08

Abstract

The invention discloses a TO packaging-based laser with refrigeration and a packaging method thereof, relates TO the field of laser manufacturing, and can solve the technical problems that the temperature control effect is poor and the MWDM wavelength application cannot be met aiming at the TO packaging with a thermoelectric cooler at present. The laser comprises a TO base, a heat sink, a thermoelectric cooler TEC, a tungsten copper block and a DML laser chip; the tungsten copper block is L-shaped and comprises a vertical surface and a horizontal surface, the vertical surface is perpendicular TO the TO base, the horizontal surface is parallel TO the TO base, the thermoelectric refrigerator TEC comprises a cold end and a hot end, the cold end is in curing connection with the bottom of the horizontal surface of the tungsten copper block, and the hot end is in curing connection with the TO base; the heat sink comprises a first heat sink, a second heat sink and a third heat sink, the first heat sink and the third heat sink are vertically connected with the TO base in a curing mode, and the second heat sink is connected with the vertical surface of the tungsten copper block; the DML laser chip is connected with the second heat sink.

Description

TO packaging-based laser with refrigeration and packaging method thereof

Technical Field

The invention relates TO the field of laser manufacturing, in particular TO a TO packaging-based laser with refrigeration and a packaging method thereof.

Background

With the continuous development of technology, the packaging technology of semiconductor lasers includes butterfly packages, TO packages, BOX packages, and the like. Among them, the TO (Transistor Outline, first defined as a Transistor package) package refers TO a coaxial package, and belongs TO a totally enclosed package, and is widely used in the package of optoelectronic devices such as lasers due TO advantages of simple manufacturing process, low production cost, convenience in flexible use, and the like.

At present, the shortest distance between two channels of wavelength based on MWDM application is 7nm, the wavelength of a DML laser chip can drift along with the temperature change, and an electric refrigerator (TEC) needs to be heated for temperature control when the DML laser chip is used in an industrial-grade temperature range (-40-85 ℃). At present, most of lasers with TEC can be BOX packages which meet the requirements of work temperature application, and the packaging scheme has higher cost. The laser based on the TO package naturally has cost advantage, but due TO the limitation of the TO inner space and the size of the TEC, the temperature control effect of the TO package is poor, and further the application of MWDM wavelength cannot be met.

Disclosure of Invention

In view of this, the invention provides a TO package-based laser with refrigeration and a packaging method thereof, which are used for solving the technical problem that the temperature control effect of a TO package is poor and further the application of MWDM wavelength cannot be met because a cold end 31 and a hot end 32 of a thermoelectric cooler (TEC) TO package cannot be well separated from a hot surface of a base of the existing laser with TEC.

According TO an aspect of the present invention, there is provided a TO package based ribbon cooled laser, the laser comprising:

the device comprises a TO base, a heat sink, a thermoelectric cooler TEC, a tungsten copper block and a DML laser chip;

the tungsten copper block is L-shaped and comprises a vertical surface and a horizontal surface, the vertical surface is perpendicular TO the TO base, the horizontal surface is parallel TO the TO base, the thermoelectric refrigerator TEC comprises a cold end and a hot end, the cold end is in curing connection with the bottom of the horizontal surface of the tungsten copper block, and the hot end is in curing connection with the TO base;

the heat sink comprises a first heat sink, a second heat sink and a third heat sink, the first heat sink and the third heat sink are vertically connected with the TO base in a curing mode, and the second heat sink is connected with the vertical surface of the tungsten copper block;

the DML laser chip is connected with the second heat sink.

Further, the second has the via hole on the heat sink, the via hole including the symmetry set up in the first via hole of the heat sink upper end of second to and the symmetry set up in the second via hole of the heat sink lower extreme of second, first via hole and the metallization layer has been plated on the second via hole, be used for through first via hole and the second via hole makes the two-sided gold layer of the heat sink of second is connected, the heat sink of second through electrically conductive silver glue with the perpendicular solidification of tungsten copper piece is connected.

Furthermore, a solder sheet is preset on the second heat sink, and the DML laser chip is connected with the second heat sink through the solder sheet in a curing manner.

Furthermore, a third via hole and a fourth via hole are arranged on the first heat sink, the third via hole is used for establishing detachable connection with the first via hole of the second heat sink through a lead, and the fourth via hole is used for establishing detachable connection with the second via hole of the second heat sink through a lead;

the third heat sink is provided with a fifth through hole and a sixth through hole, the fifth through hole is used for being connected with the second heat sink in a detachable mode through a wire, and the sixth through hole is used for being connected with the second heat sink in a detachable mode through a wire.

Furthermore, the laser also comprises a thermistor, a backlight monitoring detector chip and a gasket;

a groove is arranged on the vertical surface of the tungsten copper block, and the thermistor is arranged in the groove;

the backlight monitoring detector chip and the gasket are connected with the horizontal plane of the tungsten copper block.

Furthermore, the thermistor, the backlight monitoring detector chip and the gasket are connected with the tungsten copper block through conductive silver adhesive in a curing mode.

Furthermore, the surface of the TO base is symmetrically provided with 2 first pins, 2 second pins and 2 third pins, insulating layers are arranged at the bottoms of the first pins, the second pins and the third pins, the 2 first pins are respectively in solidification connection with the first heat sink and the third heat sink and used for driving the DML laser chip TO emit optical signals, the 2 second pins are respectively used for establishing detachable connection with the backlight monitoring detector chip and the gasket through leads, and the 2 third pins are respectively used for establishing detachable connection with the positive electrode and the negative electrode of the thermoelectric refrigerator TEC through leads.

According TO another aspect of the invention, a packaging method for applying the TO-based packaged laser with refrigeration is provided, and the packaging method comprises the following steps:

establishing physical connection among a TO base, a heat sink, a thermoelectric cooler TEC, a tungsten copper block, a DML laser chip, a thermistor, a backlight monitoring detector chip and a gasket according TO a preset packaging position;

establishing circuit connection among the TO base, the heat sink, the thermoelectric cooler TEC, the tungsten copper block, the DML laser chip, the thermistor, the backlight monitoring detector chip and the gasket according TO a preset wiring rule;

and sealing the TO base in a pure nitrogen environment TO form physical protection, atmosphere protection and light path shaping of a product, and finally forming the TO packaging-based laser with refrigeration.

Further, the creating of the physical connection between the TO base, the heat sink, the thermoelectric cooler TEC, the tungsten copper block, the DML laser chip, the thermistor, the backlight monitoring detector chip, and the gasket according TO the preset packaging position specifically includes:

the first heat sink, the third heat sink and the hot end of the thermoelectric refrigerator TEC are connected TO the TO base in a curing mode;

heating a solder sheet preset on a second heat sink by raising the temperature of equipment, and solidifying the DML laser chip on the second heat sink by using the solder sheet;

the second heat sink is solidified and connected on the vertical surface of the tungsten copper block by conductive silver adhesive;

and curing and connecting the thermistor in the groove on the vertical surface of the tungsten copper block by using conductive silver adhesive, and curing and connecting the backlight monitoring detector chip and the gasket on the horizontal surface of the tungsten copper block.

Further, the creating of the circuit connection among the TO base, the heat sink, the thermoelectric cooler TEC, the tungsten copper block, the DML laser chip, the thermistor, the backlight monitoring detector chip, and the spacer according TO a preset wiring rule specifically includes:

connecting the first heat sink with the second heat sink and the second heat sink with the third heat sink through conducting wires, wherein the connection comprises a ground wire connection and a signal wire connection with a first pin, and the signal wire connection is used for driving the DML laser chip to emit light;

connecting the positive electrode of the thermistor with one end of the gasket through a lead, connecting the negative electrode of the thermistor with a ground wire through the horizontal plane of the tungsten copper block, and connecting the other end of the gasket with one of the second pins;

connecting the anode of the backlight monitoring detector chip with the other second pin, and connecting the cathode of the backlight monitoring detector chip with the ground wire through the horizontal plane of the tungsten copper block;

and respectively connecting the anode and the cathode of the thermoelectric refrigerator TEC with a third pin.

Compared with the prior art, the invention has the beneficial effects that:

the invention can lead the horizontal plane of the tungsten copper block to be connected with the cold end of the thermoelectric refrigerator TEC in a curing way by arranging the L-shaped tungsten copper block comprising a vertical plane and a horizontal plane and three independent ceramic heat sinks, the vertical plane of the tungsten copper block is provided with a second heat sink, and the second heat sink is connected with a DML laser chip. And the first heat sink and the third heat sink which are vertically solidified and connected with the TO base are detachably connected with the second heat sink through leads respectively. Through the arrangement mode, the cold end and the hot end of the thermoelectric cooler (TEC) can be well separated from the hot surface of the base, and the phenomenon that the heat at the hot end of the thermoelectric cooler (TEC) is transmitted to the DML laser chip in a large quantity to influence the performance of the DML laser chip is avoided. The temperature of the laser can be controlled, so that the temperature control effect of the TO package is improved, and the MWDM wavelength can be better applied in a working temperature environment.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without limiting the invention to the proper form disclosed herein. In the drawings:

fig. 1 is a schematic structural diagram of a TO package-based laser with cooling according TO an embodiment of the present invention;

FIG. 2 illustrates a schematic structural diagram of a TO submount provided by an embodiment of the invention;

fig. 3 is a schematic structural diagram illustrating a TEC of a thermoelectric cooler according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a tungsten-copper block according to an embodiment of the present invention;

fig. 5 shows a schematic structural diagram of a second heat sink according to an embodiment of the present invention.

In the figure:

1-TO base, 11-first pin, 12-second pin, 13-third pin;

2-heat sink, 21-first heat sink, 211-third via hole, 212-fourth via hole, 22-second heat sink, 221-first via hole, 222-second via hole, 23-third heat sink, 231-fifth via hole, 232-sixth via hole;

3-thermoelectric refrigerator TEC, 31-cold end, 32-hot end;

4-tungsten copper block, 41-vertical surface, 42-horizontal surface;

5-DML laser chip, 6-thermistor, 7-backlight monitoring detector chip, and 8-spacer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are only some, but not all embodiments of the invention. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or two and, unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

The invention provides a TO-packaging-based laser with refrigeration, which is shown in figure 1 and specifically comprises a TO base 1, a heat sink 2, a thermoelectric refrigerator (TEC) 3, a tungsten copper block 4, a DML laser chip 5, a thermistor 6, a backlight monitoring detector chip 7 and a gasket 8. The TO base 1 may be specifically a TO60 base, and on the TO base 1, as shown in fig. 2, a first heat sink 21 and a third heat sink 23 connected by curing may be included, and the first heat sink 21 and the third heat sink 23 are respectively vertically connected TO the TO base 1. In addition, 2

first pins

11, 2

second pins

12 and 2 third pins 13 are symmetrically arranged on the TO base 1, the first pins 11 may specifically include LD + pins and LD-pins, the second pins 12 may specifically include MPD + pins and NTC + pins, the third pins 13 may specifically include two TEC pins, and insulating layers are respectively disposed at bottoms of the first pins 11, the second pins 12 and the third pins 13 TO serve as mutual insulation between the pins and the base 1. The 2 first pins 11 are respectively connected with the first heat sink 21 and the third heat sink 23 in a curing manner and used for driving the DML laser chip 5 to emit optical signals, the MPD + pin of the second pin 12 is used for establishing a detachable connection with the backlight monitoring detector chip 7 through a wire, the NTC + pin of the second pin 12 is used for establishing a detachable connection with the spacer 8 through a wire, and the 2 third pins 13 are respectively used for establishing a detachable connection with the positive and negative electrodes of the thermoelectric cooler (TEC) 3 through wires.

Referring TO fig. 1, the heat sink 2 includes a first heat sink 21, a second heat sink 22, and a third heat sink 23, the first heat sink 21 and the third heat sink 23 are vertically connected TO the TO base 1 by curing, and the second heat sink 22 is disposed between the first heat sink 21 and the third heat sink 23 and connected TO the tungsten-copper block 4; as shown in fig. 4, the tungsten copper block 4 may be specifically an L-shaped structure, and includes a vertical surface 41 and a horizontal surface 42, the vertical surface 41 is perpendicular TO the TO base 1, the horizontal surface 42 is parallel TO the TO base 1, and the horizontal surface 42 is connected TO a thermoelectric cooler (TEC) 3. Accordingly, the second heat sink 22 is disposed on the vertical face 41 of the tungsten copper block 4. Since the first heat sink 21 and the third heat sink 22 are directly connected TO the TO base 1 and the hot side 32 of the thermo-electric cooler (TEC) 3 is also connected TO the TO base 1, the first heat sink 21 and the third heat sink 22 are connected TO the hot side 32 of the thermo-electric cooler (TEC) 3 as an indirect connection, and the ambient temperature of the hot side 32 of the thermo-electric cooler (TEC) 3 is easily conducted TO the first heat sink 21 and the third heat sink 23. In order TO avoid the temperature in the first heat sink 21 and the third heat sink 23 from being conducted TO the DML laser chip 5, thereby affecting the operation performance of the DML laser chip 5, in the present application, a second heat sink not connected TO the TO base 1 may be additionally provided, and the DML laser chip 5 is connected TO the second heat sink 2, and in order TO realize the temperature control of the DML laser chip 5, the second heat sink 2 may be specifically provided on the cold end 31 of the thermoelectric cooler (TEC) 3 not connected TO the TO base 1 through the L-shaped tungsten copper block 4. The second heat sink 22 is detachably connected with the first heat sink 21 and the third heat sink 23, so that the cold and hot ends of the thermoelectric cooler (TEC) 3 are separated, the temperature of the DML laser chip 5 can be effectively controlled, the performance influence of the environmental temperature on the DML laser chip is avoided, and the quality of the packaged laser is ensured.

Referring TO fig. 1 and 3, in order TO realize temperature control of the DML laser chip 5, a thermo-electric cooler (TEC) 3 is further included in the TO-packaged laser with cooling, wherein the thermo-electric cooler (TEC) 3 specifically operates according TO a principle that charge carriers move in a conductor TO form a current, and when the charge carriers move from a high energy level TO a low energy level, excess heat is released (i.e., heating is performed), and conversely, heat needs TO be absorbed from the outside (i.e., cooling is performed). To this end, the thermoelectric cooler (TEC) 3 includes a cold junction and a hot junction, and cooling or heating is performed by applying a forward or reverse power to the thermoelectric cooler (TEC). In this application, in order TO make thermoelectric cooler (TEC) cold side 31 and hot side 32 can carry out fine separation with the base hot side, avoid thermoelectric cooler (TEC) hot side 32's heat TO pass TO on the DML laser chip in a large number, so can solidify thermoelectric cooler (TEC) cold side 31 and tungsten copper block 4's horizontal plane 42 and be connected, with thermoelectric cooler (TEC) hot side 32 and TO base 1 solidification. Specifically, the L-shaped tungsten copper block 4 may be placed above the cold end 31 of the thermoelectric cooler (TEC) 3, that is, the cold end 31 is connected to the bottom of the horizontal surface 42 of the tungsten copper block 4 by curing. Since the hot end 32 of the thermoelectric cooler (TEC) 3 is connected to the second heat sink 22 through the first heat sink 21 and the second heat sink 22, and the wires between the second heat sink 22 and the third heat sink 23 are detachable, when the wires are not connected, the second heat sink 22 is only connected to the cold end 31 of the thermoelectric cooler (TEC) 3, and only receives the temperature of the cold end 31 of the thermoelectric cooler (TEC) 3; when the thermoelectric cooler (TEC) 3 hot end 32 is connected with the thermoelectric cooler (TEC) 3 through a wire, the thermal conductivity of the wire is low, so that a large amount of heat of the thermoelectric cooler (TEC) 3 hot end 32 is not conducted to the DML laser chip 5 of the second heat sink 22, and the thermoelectric cooler (TEC) 3 cold end 31 can realize real-time adjustment of the working temperature of the DML laser chip 5, so that the DML laser chip can be prevented from being influenced by the ambient temperature of the thermoelectric cooler (TEC) 3 hot end 32 and from wavelength drift along with temperature change, and further the DML laser chip can conform to the shortest interval between two channels of MWDM wavelength, thereby achieving good temperature control effect and ensuring the performance of the laser.

It should be noted that, when the devices are connected by using the wires, the number of the wires may be set according to actual conditions, wherein the larger the number of the wires, the more heat conducted to the second heat sink 22. Therefore, in the practical application scene, as an optional mode, the heat conduction to the DML laser chip can be reduced by simplifying the number of the wire connections under the condition of ensuring the normal work of the laser. For example, as shown in fig. 1, the wire connections of the first heat sink 21 and the second heat sink 22, and the wire connections of the second heat sink 22 and the third heat sink 23 are taken as examples, and each may include upper and lower 4 ground wires and middle 3 signal wires, however, in a specific application scenario, under a condition that the normal operation of the laser is ensured, the number of the wire connections may be reduced, for example, the 4 ground wires are reduced to 2, the middle 3 signal wires are reduced to 2, and the like, so as to further reduce the heat conduction to the DML laser chip. As another alternative, the temperature control of the DML laser chip can also be realized by adjusting the magnitude of the passive thermal load of the cold side 31 of the thermoelectric cooler (TEC) 3.

In order to improve the high-frequency performance of the laser, referring to fig. 5, the second heat sink 22 is provided with via holes, the via holes include first via holes 221 symmetrically disposed at the upper end of the second heat sink 22 and second via holes 222 symmetrically disposed at the lower end of the second heat sink 22, and metallization layers are plated on the first via holes 221 and the second via holes 221, so as to connect the front and back gold layers of the second heat sink 22 through the first via holes 221 and the second via holes 222. In a specific application scene, gold layers are arranged on the front side and the back side of the heat sink, the heat sink is made of aluminum nitride, the gold layers on the front side and the back side are not connected, and the two gold layers are not conducted. In the application, the purpose of the via hole is to make the front and back gold layers of the heat sink mutually conducted through the metallization layer in the via hole to form a ground loop, so that a signal can be grounded more quickly, and the performance of the laser can be improved. In a specific physical connection, the second heat sink 22 may be connected to the vertical surface 41 of the copper tungsten block 4 by a conductive silver adhesive.

Correspondingly, as shown in fig. 5, a chip connection position for connecting the DML laser chip 5 is further provided on the second heat sink 22, the chip connection position is matched with the size of the DML laser chip 5, a solder sheet is preset at the chip connection position, and specifically, the solder sheet can be heated by raising the temperature of the device, so that the DML laser chip 5 is placed at the chip connection position and further solidified on the second heat sink 22.

As an alternative embodiment, as shown in fig. 2, a third via hole 211 and a fourth via hole 212 are also disposed on the first heat sink 21, where the third via hole 211 is disposed at the upper end of the first heat sink 21 and corresponds to the position where the first via hole 221 on the left side of the second heat sink 22 is disposed, and the fourth via hole 212 is disposed on the right side of the first heat sink 21 and corresponds to the position where the second via hole 222 on the left side of the second heat sink 22 is disposed. The third via 211 is used to establish a detachable connection with the first via 221 of the second heat sink 22 through a wire, and the fourth via 212 is used to establish a detachable connection with the second via 222 of the second heat sink 22 through a wire.

Correspondingly, as shown in fig. 2, a fifth via hole 231 and a sixth via hole 232 are also disposed on the third heat sink 23, the fifth via hole 231 is disposed at the upper end of the third heat sink 23 and corresponds to the disposed position of the first via hole 211 on the right side of the second heat sink, and the sixth via hole 232 is disposed at the left end of the third heat sink 21 and corresponds to the disposed position of the second via hole 222 on the right side of the second heat sink 22. The fifth via 231 is used for establishing a detachable connection with the first via 221 of the second heat sink 22 through a wire, and the sixth via 232 is used for establishing a detachable connection with the second via 222 of the second heat sink 22 through a wire.

It should be noted that, similarly to the second heat sink 22, the purpose of providing the vias in the first heat sink 21 and the third heat sink 23 is to make the front and back gold layers of the heat sinks electrically connected to each other by the metallization layers in the vias, and to form a ground loop between the heat sinks by the wire connection among the first heat sink 21, the second heat sink 22, and the third heat sink 23, so that signals can be grounded more quickly. In a specific application scenario, in order to ensure the accuracy of the laser, the conducting wire for establishing the circuit connection may be made of a material with a high electrical conductivity, such as a gold wire.

Referring TO fig. 1, the TO package-based laser with refrigeration further comprises a backlight monitoring detector chip 7, and the backlight monitoring detector chip 7 is connected with the horizontal surface 42 of the tungsten copper block 4.

As a preferred embodiment, referring to fig. 3, a groove 43 is further disposed on a vertical surface 41 of the tungsten copper block 4, the thermistor 6 is disposed in the groove 43, and in order to avoid overlong connection between the thermistor 6 and the second pin 12, a spacer 8 may be disposed between the thermistor 6 and the second pin 12, specifically, the spacer 8 may be connected to a horizontal surface 42 of the tungsten copper block 4, the thermistor 6 is connected to the spacer 8 by a wire, the spacer 8 is connected to the second pin 12 by a wire, and the thermistor 6 is electrically connected to the second pin 12 by two-segment wire connection. It should be noted that, for the thermistor 6, the backlight monitoring detector chip 7, and the spacer 8 in this embodiment, a conductive silver paste curing connection mode may be adopted when establishing connection with the tungsten copper block 4.

The invention provides a packaging method of a TO packaging-based laser with refrigeration, which is shown in figure 1 and comprises the following steps:

s100, establishing physical connection among a TO base 1, a heat sink 2, a thermoelectric cooler (TEC) 3, a tungsten copper block 4, a DML laser chip 5, a thermistor 6, a backlight monitoring detector chip 7 and a gasket 8 according TO a preset packaging position;

s100, establishing circuit connection among a TO base 1, a heat sink 2, a thermoelectric cooler (TEC) 3, a tungsten copper block 4, a DML laser chip 5, a thermistor 6, a backlight monitoring detector chip 7 and a gasket 8 according TO a preset wiring rule;

s300, sealing a TO base 1 cap in a pure nitrogen environment TO form product physical protection, atmosphere protection and light path shaping, and finally forming the TO packaging-based laser.

As an alternative embodiment, when physical connections among the TO base 1, the heat sink 2, the thermoelectric cooler (TEC) 3, the tungsten copper block 4, the DML laser chip 5, the thermistor 6, the backlight monitoring detector chip 7 and the spacer 8 are created according TO preset packaging positions, the first heat sink 21, the third heat sink 3 and the hot end 32 of the thermoelectric cooler (TEC) 3 may be solidly connected TO the TO base 1; heating a solder sheet preset on the second heat sink 22 by the temperature rise of the equipment, and solidifying the DML laser chip 5 on the second heat sink 22 by using the solder sheet; the second heat sink 22 is solidified and connected on the vertical surface 41 of the tungsten copper block 4 by conductive silver adhesive; the thermistor 6 is connected in a curing way in the groove 43 of the vertical surface 41 of the tungsten copper block 4 by conductive silver adhesive, and the backlight monitoring detector chip 7 and the gasket 8 are connected on the horizontal surface 42 of the tungsten copper block 4 in a curing way.

Correspondingly, when circuit connection among the TO base 1, the heat sink 2, the thermoelectric cooler (TEC) 3, the tungsten copper block 4, the DML laser chip 5, the thermistor 6, the backlight monitoring detector chip 7 and the spacer 8 is established according TO a preset wiring rule, the first heat sink 21 and the second heat sink 22, the second heat sink 22 and the third heat sink 23 may be specifically connected by a wire, the connection includes a ground wire connection and a signal wire connection with the first pin 11, and the signal wire connection is used for driving the DML laser chip 5 TO emit light; connecting the positive electrode of the thermistor 6 with one end of the gasket 8 through a lead, connecting the negative electrode of the thermistor 6 with the ground wire through the horizontal plane 42 of the tungsten copper block 4, and connecting the other end of the gasket 8 with one of the second pins 12; connecting the positive electrode of the backlight monitoring detector chip 7 with the other second pin 12, and connecting the negative electrode of the backlight monitoring detector chip 7 with the ground wire through the horizontal plane 42 of the tungsten copper block 4; the positive and negative electrodes of the thermoelectric cooler (TEC) 3 are connected to the third pin 13, respectively.

The working principle of temperature control of the laser with refrigeration based on TO encapsulation is as follows: the TO60 airtight package with refrigeration is adopted, the laser chip is fixed on a TO60 coaxial light-emitting shaft, and current is injected and converted into light waves TO emit by applying bias voltage, and the light waves are focused outside the tube body through lens polymerization. The thermoelectric cooler TEC and the thermistor are arranged around the laser, the resistance value of the thermistor is sensitive to temperature, the peripheral circuit acquires the working temperature of the DML laser chip by monitoring the change of the resistance value, and the TEC is continuously heated or refrigerated by adding current in a certain direction to control the working temperature of the DML laser chip, so that the working temperature of the DML laser chip is kept stable, and the temperature is controllable.

According TO the TO-packaging-based laser with refrigeration and the packaging method thereof, the horizontal plane of the tungsten copper block is connected with the cold end of the thermoelectric refrigerator TEC in a curing manner by arranging the L-shaped tungsten copper block comprising the vertical plane and the horizontal plane and three independent ceramic heat sinks, the vertical plane of the tungsten copper block is provided with the second heat sink, and the DML laser chip is connected onto the second heat sink. And the first heat sink and the third heat sink which are vertically solidified and connected with the TO base are detachably connected with the second heat sink through leads respectively. Through the arrangement mode, the cold end and the hot end of the thermoelectric cooler (TEC) can be well separated from the hot surface of the base, and the phenomenon that the heat at the hot end of the thermoelectric cooler (TEC) is transmitted to the DML laser chip in a large quantity to influence the performance of the DML laser chip is avoided. The temperature of the laser can be controlled, so that the temperature control effect of the TO package is improved, and the MWDM wavelength can be better applied in a working temperature environment.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A TO package based ribbon cooled laser comprising: the device comprises a TO base (1), a heat sink (2), a thermoelectric refrigerator TEC (3), a tungsten copper block (4) and a DML laser chip (5);

the tungsten copper block (4) is L-shaped and comprises a vertical surface (41) and a horizontal surface (42), the vertical surface (41) is perpendicular TO the TO base (1), the horizontal surface (42) is parallel TO the TO base (1), the thermoelectric refrigerator TEC (3) comprises a cold end (31) and a hot end (32), the cold end (31) is connected with the bottom of the horizontal surface (42) of the tungsten copper block (4) in a curing mode, and the hot end (32) is connected with the TO base (1) in a curing mode;

the heat sink (2) comprises a first heat sink (21), a second heat sink (22) and a third heat sink (23), the first heat sink (21) and the third heat sink (23) are vertically connected with the TO base (1) in a curing mode, and the second heat sink (22) is connected with a vertical surface (41) of the tungsten copper block (4);

the DML laser chip (5) is connected with the second heat sink (22).

2. The laser according to claim 1, wherein the second heat sink (22) is provided with via holes, the via holes comprise first via holes (221) symmetrically arranged at the upper end of the second heat sink (22) and second via holes (222) symmetrically arranged at the lower end of the second heat sink (22), the first via holes (221) and the second via holes (222) are plated with metallization layers for connecting the front and back gold layers of the second heat sink (22) through the first via holes (221) and the second via holes (222), and the second heat sink (22) is connected with the vertical surface (41) of the tungsten copper block (4) through a conductive silver adhesive in a curing manner.

3. The laser according to claim 1, characterized in that a solder sheet is pre-arranged on the second heat sink (22), and the DML laser chip (5) is solidly connected with the second heat sink (22) by the solder sheet.

4. The laser according to claim 2, wherein a third via hole (211) and a fourth via hole (212) are arranged on the first heat sink (21), the third via hole (211) is used for establishing a detachable connection with the first via hole (221) of the second heat sink (22) through a conducting wire, and the fourth via hole (212) is used for establishing a detachable connection with the second via hole (222) of the second heat sink (22) through a conducting wire;

the third heat sink (23) is provided with a fifth via hole (231) and a sixth via hole (232), the fifth via hole (231) is used for establishing detachable connection with the first via hole (221) of the second heat sink (22) through a lead, and the sixth via hole (232) is used for establishing detachable connection with the second via hole (222) of the second heat sink (22) through a lead.

5. The laser according to claim 1, characterized by further comprising a thermistor (6), a backlight monitoring detector chip (7), a spacer (8);

a groove (43) is arranged on the vertical surface (41) of the tungsten copper block (4), and the thermistor (6) is arranged in the groove (43);

the backlight monitoring detector chip (7) and the gasket (8) are connected with the horizontal plane (42) of the tungsten copper block (4).

6. The laser according to claim 5, characterized in that the thermistor (6), the backlight monitoring detector chip (7), the spacer (8) and the tungsten copper block (4) are connected by curing conductive silver paste.

7. The laser of claim 6, wherein the TO base (1) is symmetrically provided with 2 first pins (11), 2 second pins (12) and 2 third pins (13) on the surface, the bottoms of the first pins (11), the second pins (12) and the third pins (13) are provided with insulating layers, the 2 first pins (11) are respectively connected with the first heat sink (21) and the third heat sink (23) in a curing manner and used for driving the DML laser chip (5) TO emit optical signals, the 2 second pins (12) are respectively used for establishing detachable connection with the backlight monitoring detector chip (7) and the spacer (8) through conducting wires, and the 2 third pins (13) are respectively used for establishing detachable connection with the positive and negative electrodes of the thermoelectric refrigerator TEC (3) through conducting wires.

8. A packaging method applied TO the TO-package-based laser with refrigeration, as claimed in any one of claims 1 TO 7, is characterized by comprising the following steps:

establishing physical connection among a TO base (1), a heat sink (2), a thermoelectric cooler TEC (3), a tungsten copper block (4), a DML laser chip (5), a thermistor (6), a backlight monitoring detector chip (7) and a gasket (8) according TO a preset packaging position;

establishing circuit connection among the TO base (1), the heat sink (2), the thermoelectric cooler TEC (3), the tungsten copper block (4), the DML laser chip (5), the thermistor (6), the backlight monitoring detector chip (7) and the gasket (8) according TO a preset wiring rule;

and sealing the TO base (1) in a pure nitrogen environment TO form physical protection, atmosphere protection and light path shaping of a product, and finally forming the TO packaging-based laser with refrigeration.

9. The method according TO claim 8, wherein the creating of the physical connection between the TO base (1), the heat sink (2), the thermoelectric cooler TEC (3), the tungsten copper block (4), the DML laser chip (5), the thermistor (6), the backlight monitor detector chip (7) and the spacer (8) according TO the preset packaging position comprises:

the first heat sink (21), the third heat sink (3) and the hot end (32) of the thermoelectric refrigerator TEC (3) are connected TO the TO base (1) in a curing mode;

heating a solder sheet preset on a second heat sink (22) by equipment temperature rise, and solidifying the DML laser chip (5) on the second heat sink (22) by using the solder sheet;

the second heat sink (22) is connected on the vertical surface (41) of the tungsten copper block (4) in a curing way by conductive silver adhesive;

and the thermistor (6) is connected in a groove (43) of the vertical surface (41) of the tungsten copper block (4) in a curing way by utilizing conductive silver adhesive, and the backlight monitoring detector chip (7) and the gasket (8) are connected on the horizontal surface (42) of the tungsten copper block (4) in a curing way.

10. The method according TO claim 8, wherein the creating of the electrical connections between the TO base (1), the heat sink (2), the thermo-electric cooler TEC (3), the tungsten copper block (4), the DML laser chip (5), the thermistor (6), the backlight monitor detector chip (7) and the spacer (8) according TO preset wiring rules comprises in particular:

connecting the first heat sink (21) and the second heat sink (22), the second heat sink (22) and the third heat sink (23) through conducting wires, wherein the connection comprises a ground wire connection and a signal wire connection with a first pin (11), and the signal wire connection is used for driving the DML laser chip (5) to emit light;

connecting the positive electrode of the thermistor (6) with one end of the gasket (8) through a lead, connecting the negative electrode of the thermistor (6) with the ground wire through the horizontal surface (42) of the tungsten copper block (4), and connecting the other end of the gasket (8) with one of the second pins (12);

connecting the positive electrode of the backlight monitoring detector chip (7) with the other second pin (12), and connecting the negative electrode of the backlight monitoring detector chip (7) with the ground wire through the horizontal plane (42) of the tungsten copper block (4);

and respectively connecting the positive electrode and the negative electrode of the thermoelectric refrigerator TEC (3) with a third pin (13).