CN208956194U - A kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV - Google Patents
A kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV Download PDFInfo
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- CN208956194U CN208956194U CN201821612622.XU CN201821612622U CN208956194U CN 208956194 U CN208956194 U CN 208956194U CN 201821612622 U CN201821612622 U CN 201821612622U CN 208956194 U CN208956194 U CN 208956194U
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Abstract
The utility model discloses a kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV, which includes visible laser, heat sink, semiconductor cooling device, cooling fin and metal shell；Visible laser insertion is mounted in heat sink mounting groove, the surface of visible laser is contacted with heat sink completely, the back side of laser-activated liquid crystal cells TV is installed by metal shell, semiconductor cooling device be mounted on metal shell and it is heat sink between, the refrigeration end of semiconductor cooling device is contacted with heat sink, the fever end of semiconductor cooling device is contacted with the inner surface of metal shell, cooling fin is mounted on the outer surface of metal shell, mounting groove coupling on the laser beam by thermal that visible laser issues is heavy is incident in light guide plate, forms area source via the diffusing structure on light guide plate.The utility model is able to solve the heat dissipation problem that present laser light source faces in ultrathin liquid crystal display television set.
Description
Technical field
The utility model relates to the radiator structures of side entering type laser-activated liquid crystal cells TV, and in particular to a kind of to utilize refrigeration semiconductor
The laser-activated liquid crystal cells TV of heat dissipation.
Background technique
Flat panel Liquid Crystal television set has developed 20 years, it has also become the essential daily electric appliance of people family.
Laser display is a kind of novel display technology of rising in recent years, with colour gamut is big, color contrast is high, chromatic rendition degree
Feature high, color saturation is high, can show that perfect picture.
But the electric light transformation efficiency of laser is relatively low, and if red laser is < 30%, green laser < 10%, and LED
Electric light transformation efficiency have been approached 50%.Therefore to use laser as the lighting source of display in addition to laser speckle to be solved
The problem of interference, also needs the electric light transformation efficiency for solving laser low and too low optoelectronic transformation efficiency bring fuel factor is high asks
Topic.
The heat dissipation problem of laser solves bad in laser display technology, will lead to the drift of laser generative center wavelength temperature
(0.3nm/ DEG C) will cause the image quality that display color temperature is inaccurate, colour cast influences display using laser writer for a long time；And
Most importantly laser radiates the bad service life that will seriously reduce laser；Meanwhile heat also results in laser
Light power decline, so that flickering effect occurs in use in display.
And the LCD TV of early stage uses cold-cathode lamp as backlight, present LCD TV uses LED as backlight
Source.Whether the color that cold-cathode lamp or LED backlight LCD TV can be shown is all poor.But LED and cold-cathode lamp do not have
There are the harsh cooling requirements of laser display, so existing flat panel Liquid Crystal TV does not provide special radiator structure for backlight,
Only radiate simply by the metal plate on liquid crystal TV set shell or shell.
Meanwhile the screen size of liquid crystal flat-plate television is increasing, thickness also comes thinner, and such as 55 inches of television sets are (aobvious
Show device) screen size be it is 1.21 meters long, 0.68 meter wide, thickness is only 5 centimetres or so.How in so big length, so small
Thickness liquid crystal flat-plate television in corresponding radiator is rationally set, guarantee the picture color of laser-activated liquid crystal cells flat panel TV not
Become, picture brightness is constant, it is long to benefit from the service life, low manufacturing cost is a very commercially valuable engineering problem.
Utility model content
In view of this, the present invention provides a kind of semiconductor heat-dissipating structures of side entering type laser-activated liquid crystal cells TV, can
Solve the heat dissipation problem that present laser light source faces in ultrathin liquid crystal display television set.
A kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV, the radiator structure include visible laser, heat
Heavy, semiconductor cooling device, cooling fin and metal shell；
Visible laser insertion is mounted in heat sink mounting groove, it is seen that the surface of light laser completely with it is heat sink
Metal shell is installed at contact, the back side of laser-activated liquid crystal cells TV, and semiconductor cooling device is mounted on metal shell/cooling fin and heat sink
Between, the refrigeration end of semiconductor cooling device is contacted with heat sink, the interior table at the fever end and metal shell of semiconductor cooling device
The non-fin face contact of face/cooling fin, the cooling fin are mounted on the outer surface of metal shell, and the visible laser issues
Laser beam by thermal it is heavy on mounting groove coupling be incident in light guide plate, via the diffusing structure forming face light on light guide plate
Source.
Further, it is described it is heat sink be made of upper heat sink plate and lower heat sink plate, upper heat sink plate be L-type plate, plate
Horizontal component processing step slot, the number of step groove are consistent with the visible laser that need to be installed；The vertical component and gold of plate
Belong to and process circular trough under the structural strengthening component on shell or metal shell is connected in heat sink plate, on circular trough and upper heat sink plate
Step groove is corresponding, and circular trough and step groove collectively constitute the mounting groove of visible laser after the two make-up, and stepped hole is most upper
The aperture of side is the light hole of laser beam；The vertical portion of plate is bonded with the outer surface of semiconductor cooling device refrigeration end.
Further, at least one temperature sensor is installed for perceiving visible light lasers on the visible laser
The junction temperature of the PN junction of the laser diode of device, when the PN junction junction temperature that temperature sensor detects visible laser is higher than setting knot
Wen Shi, temperature-control circuit to semiconductor cooling device be powered, semiconductor cooling device start to work to visible laser into
Row cooling；When temperature sensor detects the PN junction junction temperature of visible laser lower than setting junction temperature, temperature-control circuit pair
Semiconductor cooling device stops being powered, and semiconductor cooling device stops working.
Further, fan is installed on the cooling fin.
Further, the heat sink solid material using thermal conductivity greater than 100W/ (MK) is made.
Further, it is described it is heat sink using screw, riveting, key pin connection, grafting, snap connection, latch connection, it is cementing or
The mode of welding and the outer plaque of LCD TV are fixedly connected.
Further, the visible laser and it is heat sink between there are heat-conducting layers, for reducing visible laser
With it is heat sink between thermal resistance；The thermal conductivity for the material that heat-conducting layer uses is more than or equal to 0.2W/ (M.K).
Further, diversion air heat dissipation in air duct can be used between the cooling fin and fan, the air inlet in air duct is set
Air Blast fan is set, extraction fan is arranged in air outlet, and fan is aerofoil fan or vortex flow fan.
Further, the heat sink, cooling fin and fan exposed to except metal shell is covered by metal/plastic protective cover,
Metal/plastic protective cover is equipped with ventilation opening.
The utility model has the advantages that
1, the utility model improves the image quality of flat-panel monitor in the color domain coverage ratio for expanding flat-panel monitor
While, do not increase the especially local border width of appearance and complete machine thickness of FPD, is matched using semiconductor cooling device
Close cooling fin and heat sink to laser progress forced convertion cooling, this is present any laser for the flat-panel monitor of light source institute
It cannot accomplish.
2, the utility model, which is used, carries out forced heat radiation and temperature tune to visible laser using semiconductor cooling device
The visible laser central wavelength temperature as caused by accumulation of heat in liquid crystal display booting working hour is eliminated or reduced to section
Degree drift and the decaying of service life, efficiently solve laser heat dissipation problem, are taking into account the outer of liquid crystal flat panel display
While shape beauty, the laser light source service life, light caused by effects of being heated in technology in laser display are further solved
The problem of Frequency bias, picture color offset, there is extremely strong commercial application value.
3, the utility model is radiated between cooling fin and fan using air duct diversion air, and the air inlet in air duct uses
Air Blast fan, air outlet use extraction fan, can efficiently reduce the use of fan, can reach same heat dissipation effect.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model
Fig. 2 is the rearview of Fig. 1
Fig. 3 is the structural schematic diagram that air duct is arranged
Fig. 4 is the structural schematic diagram for installing protective cover additional
Fig. 5 is heat sink perspective view
Wherein, 1- visible laser, 2- light guide plate, 3- is heat sink, 31- connecting hole, the upper heat sink plate of 31A-, 33- mounting groove,
Heat sink plate under 31B-, 4- cooling fin, 5- semiconductor cooling device, 6- liquid crystal display, 7- metal shell, 72- protective cover,
The even smooth film of 8- reflective membrane, 9-, 10- brightness enhancement film, 11- fan, 12- liquid crystal display locating part, 13-PCB plate, 14- outer plaque,
15- temperature sensor, the air duct 16-, 17- plastic cement frame.
Specific embodiment
With reference to the accompanying drawings and examples, the utility model is described in detail.
As shown in Fig. 1, the utility model provides a kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV, should
Radiator structure includes visible laser 1, heat sink 3, semiconductor cooling device 5, cooling fin 4 and metal shell 7；
Wherein, it is seen that light laser 1, light guide plate 2, liquid crystal display 6, metal shell 7, reflective membrane 8, even smooth film 9, blast
Film 10 and pcb board 13 have collectively constituted side entering type LCD TV, and liquid crystal display 6 passes through the liquid crystal display locating part 12 of lower section
It is limited and is fixed with plastic cement frame 17.
As shown in Fig. 5, heat sink to be made of upper heat sink plate 31A and lower heat sink plate 31B, upper heat sink plate 31A is the plate of L-type
Material, the horizontal component processing step slot of plate, the number of step groove is consistent with the visible laser that need to be installed, lower heat sink plate
Circular trough is processed on 31B, circular trough is corresponding with the stepped hole on upper heat sink plate 31A, the two make-up backward step slot and circular trough
The mounting groove of visible laser 1 is collectively constituted, the aperture of step groove the top is the light hole of laser beam；The vertical portion of plate
Point be bonded with the outer surface of 5 refrigeration end of semiconductor cooling device, be also machined in the vertical portion of plate for semiconductor system
The connecting hole 31 that cooler part 5 connects.
At least one temperature sensor 15 is installed for perceiving the laser of visible laser 1 on visible laser 1
The junction temperature of the PN junction (PN junction) of diode, when temperature sensor 15 detects can be high by the PN junction junction temperature of light laser 1
When setting junction temperature, temperature-control circuit is powered to semiconductor cooling device (TEC) 5, semiconductor cooling device (TEC) 5
Start-up operation cools down visible laser 1；When the PN junction junction temperature that temperature sensor 15 detects visible laser 1 is low
When setting junction temperature, temperature-control circuit stops being powered to semiconductor cooling device (TEC) 5, semiconductor cooling device (TEC) 5
It stops working.
Several visible lasers 1 to form lasing fluorescence band along that can arrange heat sink 3 length direction, a side entering type
There are at least one lasing fluorescence bands in laser-activated liquid crystal cells display.
Visible laser 1 insertion be mounted in heat sink 3 mounting groove 33, it is seen that the surface of light laser 1 completely with heat
Metal shell 7 is installed at heavy 3 contact, the back side of laser-activated liquid crystal cells TV, and semiconductor cooling device 5 is mounted on metal shell 3 and heat sink 3
Between, the refrigeration end of semiconductor cooling device 5 is contacted with heat sink 3, fever end and the metal shell 7 of semiconductor cooling device 5
Inner surface contact, cooling fin 4 are mounted on the outer surface of metal shell 7, it is seen that the lower end connecting PCB board 13 of light laser 1, it is seen that
The coupling of mounting groove 33 on laser beam by thermal heavy 3 that light laser 1 issues is incident in light guide plate 2, via on light guide plate 2
Diffusing structure forms area source.
As shown in Fig. 2, fan 11 is mounted on cooling fin 5, heat dissipation effect can be enhanced；
Heat sink 3 solid material using thermal conductivity greater than 100W/ (MK) is made；Heat sink 3 use screw, riveting, key pin
Connection, the negative phototropic cover 7 for grafting, snapping connection, latching connection, cementing or welding mode and LCD TV are fixedly connected.
As shown in Fig. 3,16 diversion air heat dissipation in air duct can be used between cooling fin 4 and fan 11, air duct 16 into
Air Blast fan is arranged in air port, and extraction fan is arranged in air outlet, and fan 11 is aerofoil fan or vortex flow fan.
There are heat-conducting layer between visible laser 1 and heat sink 3, for reduce visible laser and it is heat sink between
Thermal resistance；The thermal conductivity for the material that heat-conducting layer uses is more than or equal to 0.2W/ (M.K), and material includes heat-conducting silicone grease, mixed with metal
Heat-conducting glue, heat conduction with phase change glue, silica gel heat conductive pad, plastics heat conductive pad, the graphene Heat Conduction Material/coating, diamond heat-conducting of material
Coating/material, metal/colloid composite heat-conducting gasket,
As shown in Fig. 4, expose to except metal shell 7 heat sink 3, cooling fin 4 and fan 11 be by protective cover 72
Covering, protective cover 72 are equipped with ventilation opening, and the front of liquid crystal display locating part 12 is equipped with outer plaque 14.
In conclusion the above is only the preferred embodiments of the present utility model only, it is not intended to limit the utility model
Protection scope.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all wrap
Containing being within the protection scope of the utility model.
Claims (9)
1. a kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV, which is characterized in that the radiator structure includes visible light
Laser, heat sink, semiconductor cooling device, cooling fin and metal shell；
The visible laser insertion is mounted in heat sink mounting groove, it is seen that the surface of light laser connects with heat sink completely
Metal shell is installed at touching, the back side of laser-activated liquid crystal cells TV, semiconductor cooling device be mounted on metal shell/cooling fin and it is heat sink it
Between, the refrigeration end of semiconductor cooling device is contacted with heat sink, semiconductor cooling device fever end and metal shell inner surface/
The non-fin face contact of cooling fin, the cooling fin are mounted on the outer surface of metal shell, what the visible laser issued
Mounting groove coupling on laser beam by thermal is heavy is incident in light guide plate, forms area source via the diffusing structure on light guide plate.
2. semiconductor heat-dissipating structure as described in claim 1, which is characterized in that described heat sink by upper heat sink plate and lower heat sink plate
Composition, plate of the upper heat sink plate for L-type, the horizontal component processing step slot of plate, the number of step groove are visible with what need to be installed
Light laser is consistent, and the vertical portion of plate is connected with the structural strengthening component on metal shell or metal shell；Lower heat sink plate
Upper processing circular trough, circular trough is corresponding with the step groove in upper heat sink plate, mounting groove and common group of step groove after the two make-up
At the mounting groove of visible laser, the aperture of step groove the top is the light hole of laser beam；The vertical portion of plate and half
The outer surface of conductor refrigeration device refrigeration end is bonded.
3. semiconductor heat-dissipating structure as claimed in claim 1 or 2, which is characterized in that be equipped on the visible laser
At least one temperature sensor is used to perceive the junction temperature of the PN junction of the laser diode of visible laser, when temperature sensor is visited
It measuring when the PN junction junction temperature of light laser can be higher than to setting junction temperature, temperature-control circuit is powered to semiconductor cooling device, and half
The start-up operation of conductor refrigeration device cools down visible laser；When temperature sensor detects the PN of visible laser
When junction temperature is lower than setting junction temperature, temperature-control circuit stops being powered to semiconductor cooling device, and semiconductor cooling device stops
Work.
4. semiconductor heat-dissipating structure as claimed in claim 3, which is characterized in that install fan on the cooling fin.
5. semiconductor heat-dissipating structure as claimed in claim 4, which is characterized in that the heat sink use thermal conductivity is greater than 100W/
(MK) solid material is made.
6. semiconductor heat-dissipating structure as described in claim 1, which is characterized in that described heat sink using screw, riveting, key pin company
The metal shell connect, grafting, snap connection, latching connection, cementing or welding mode and LCD TV is fixedly connected.
7. semiconductor heat-dissipating structure as described in claim 1, which is characterized in that the visible laser and it is heat sink between deposit
Having heat-conducting layer, for reduce visible laser and it is heat sink between thermal resistance；The thermal conductivity for the material that heat-conducting layer uses is big
In or equal to 0.2W/ (M.K).
8. semiconductor heat-dissipating structure as described in claim 1, which is characterized in that wind can be used between the cooling fin and fan
Air Blast fan is arranged in the heat dissipation of road diversion air, the air inlet in air duct, and extraction fan is arranged in air outlet, and fan is aerofoil fan, whirlpool
Flow fan or cross flow fan.
9. semiconductor heat-dissipating structure as described in claim 1, which is characterized in that expose to heat sink, scattered except metal shell
Backing and fan are covered by metal/plastic protective cover, and metallo-plastic protective cover is equipped with ventilation opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821612622.XU CN208956194U (en) | 2018-09-30 | 2018-09-30 | A kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821612622.XU CN208956194U (en) | 2018-09-30 | 2018-09-30 | A kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV |
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| Publication Number | Publication Date |
|---|---|
| CN208956194U true CN208956194U (en) | 2019-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821612622.XU Active CN208956194U (en) | 2018-09-30 | 2018-09-30 | A kind of semiconductor heat-dissipating structure of side entering type laser-activated liquid crystal cells TV |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110445010A (en) * | 2019-07-19 | 2019-11-12 | 东莞理工学院 | A kind of radiator of nanosecond laser |
| CN112928595A (en) * | 2021-04-26 | 2021-06-08 | 武汉敏芯半导体股份有限公司 | TO packaging-based laser with refrigeration and packaging method thereof |
-
2018
- 2018-09-30 CN CN201821612622.XU patent/CN208956194U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110445010A (en) * | 2019-07-19 | 2019-11-12 | 东莞理工学院 | A kind of radiator of nanosecond laser |
| CN112928595A (en) * | 2021-04-26 | 2021-06-08 | 武汉敏芯半导体股份有限公司 | TO packaging-based laser with refrigeration and packaging method thereof |
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