CN112928024A - Semiconductor structure and forming method thereof - Google Patents
Semiconductor structure and forming method thereof Download PDFInfo
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- CN112928024A CN112928024A CN201911241309.9A CN201911241309A CN112928024A CN 112928024 A CN112928024 A CN 112928024A CN 201911241309 A CN201911241309 A CN 201911241309A CN 112928024 A CN112928024 A CN 112928024A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
A semiconductor structure and a method of forming the same, comprising: providing a substrate, wherein the substrate is provided with a fin part structure, and the fin part structure comprises a plurality of overlapped first fin part layers and a second fin part layer positioned between two adjacent first fin part layers; forming a dummy gate structure crossing the fin structure on the substrate; forming grooves in the fin part structures on two sides of the pseudo gate structure; removing part of the first fin portion layer on the side wall of the groove to form a first correction fin portion layer, a first fin portion groove and a second fin portion groove; forming a first barrier layer in the first fin portion groove and a second barrier layer in the second fin portion groove, wherein the thickness of the first barrier layer is larger than that of the second barrier layer; and forming a source drain doped layer in the groove. By increasing the thickness of the first barrier layer, the isolation effect between the source-drain doping layer and the formed gate structure can be effectively improved, the parasitic capacitance between the source-drain doping layer and the gate structure is reduced, and the performance of the finally formed semiconductor structure is improved.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing technologies, and in particular, to a semiconductor structure and a method for forming the same.
Background
With the rapid development of semiconductor manufacturing technology, semiconductor devices are being developed toward higher element density and higher integration. The device is widely used as the most basic semiconductor device at present, and the traditional planar device has weak control capability on channel current, short channel effect is generated to cause leakage current, and finally the electrical performance of the semiconductor device is influenced.
In order to overcome the short channel effect of the device and suppress the leakage current, the prior art proposes a Fin field effect transistor (Fin FET), which is a common multi-gate device, and the structure of the Fin FET includes: the barrier layer covers a part of the side wall of the fin part, and the surface of the barrier layer is lower than the top of the fin part; the grid electrode structure is positioned on the surface of the barrier layer, the top of the fin part and the surface of the side wall; and the source region and the drain region are positioned in the fin parts at two sides of the grid structure.
However, the performance of the semiconductor structure formed by the prior art is poor.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a semiconductor structure and a forming method thereof, which can effectively reduce the parasitic capacitance between a source-drain doping layer and a grid structure and improve the performance of the finally formed semiconductor structure.
To solve the above problems, the present invention provides a method for forming a semiconductor structure, comprising: providing a substrate, wherein the substrate is provided with a fin part structure, and the fin part structure comprises a plurality of first fin part layers which are overlapped along the normal direction of the surface of the substrate and a second fin part layer which is positioned between two adjacent first fin part layers; forming a pseudo gate structure crossing the fin structure on the substrate, wherein the pseudo gate structure covers part of the side wall and part of the top surface of the fin structure; forming grooves in the fin part structures on two sides of the pseudo gate structure; removing part of the first fin portion layer on the side wall of the groove to form a first correction fin portion layer, a first fin portion groove and a second fin portion groove, wherein the first fin portion groove is located between the first correction fin portion layer on the bottom layer and the substrate, and the second fin portion groove is located between the second fin portion layers of the two adjacent layers; forming a first barrier layer in the first fin portion groove and a second barrier layer in the second fin portion groove, wherein the thickness of the first barrier layer is larger than that of the second barrier layer; and forming a source-drain doped layer in the groove after the first barrier layer and the second barrier layer are formed, wherein source-drain ions are arranged in the source-drain doped layer.
Optionally, the method for forming the first barrier layer and the second barrier layer includes: forming a first initial barrier layer on the side wall and the bottom surface of the groove and the side wall and the top surface of the dummy gate structure; etching the first initial barrier layer back until the bottom surface of the groove and the top surface of the pseudo gate structure are exposed to form a second initial barrier layer; forming a sacrificial layer at the bottom of the groove, wherein the sacrificial layer covers partial side walls of the second initial barrier layer, and the top surface of the sacrificial layer is lower than or flush with the top surface of the first correction fin layer at the bottom layer; etching back the second initial barrier layer until the side wall of the second fin portion layer is exposed, and forming the first barrier layer and the second barrier layer; removing the sacrificial layer after forming the first barrier layer and the second barrier layer.
Optionally, the material of the first initial barrier layer comprises silicon nitride.
Optionally, the process of forming the first initial barrier layer includes a physical vapor deposition process or a chemical vapor deposition process.
Optionally, the process for etching back the first initial barrier layer includes an anisotropic dry etching process or an anisotropic wet etching process.
Optionally, the process of etching back the second initial barrier layer includes an anisotropic dry etching process or an anisotropic wet etching process.
Optionally, the material of the sacrificial layer is different from the material of the first initial barrier layer, and the material of the sacrificial layer includes an organic material containing carbon and oxygen elements.
Optionally, the formation process of the source-drain doping layer includes an epitaxial growth process; the process for doping the source and drain ions in the source and drain doped layer comprises an in-situ doping process.
Optionally, the forming method of the groove includes: and etching the fin part structure by taking the pseudo gate structure as a mask until the top surface of the substrate is exposed, and forming the grooves in the fin part structures at two sides of the pseudo gate structure.
Optionally, the dummy gate structure includes a dummy gate layer.
Optionally, the material of the dummy gate layer includes polysilicon or amorphous silicon.
Optionally, the method for forming the fin structure includes: forming a fin material film on the substrate, wherein the fin material film comprises a plurality of layers of first fin films overlapped along the normal direction of the surface of the substrate and a second fin film positioned in two adjacent layers of the first fin films; forming a patterned layer on the fin material film; and etching the fin material film by using the patterning layer as a mask until the fin material film is exposed out of the top surface of the substrate to form the fin structure, wherein the fin structure comprises a plurality of first fin layers overlapped along the normal direction of the surface of the substrate and a second fin layer positioned between the two adjacent first fin layers.
Optionally, the material of the first fin portion layer is different from the material of the second fin portion layer; the first fin portion layer is made of monocrystalline silicon or monocrystalline silicon germanium; the material of the second fin portion layer is monocrystalline silicon germanium or monocrystalline silicon.
Optionally, after the source-drain doping layer is formed, the method further includes: forming a dielectric layer on the source-drain doping layer and the dummy gate structure, wherein the dielectric layer covers the side wall of the dummy gate structure; removing the dummy gate structure and the first correction fin portion layer covered by the dummy gate structure, and forming a gate opening in the dielectric layer and between the adjacent second fin portion layers; and forming a gate structure in the gate opening, wherein the gate structure surrounds the second fin portion layer.
Accordingly, the present invention also provides a semiconductor structure formed by any of the above methods, comprising: the fin structure comprises a plurality of first correction fin layers overlapped along the normal direction of the surface of the substrate and a second fin layer positioned between two adjacent first correction fin layers; the first fin part groove is positioned between the first correction fin part layer and the substrate, and the second fin part groove is positioned between two adjacent layers of the second fin part layers; a dummy gate structure located on the fin structure; the grooves are positioned at two sides of the pseudo gate structure; the first barrier layer is positioned in the first fin portion groove, and the second barrier layer is positioned in the second fin portion groove, and the thickness of the first barrier layer is larger than that of the second barrier layer; and the source and drain doping layer is positioned in the groove and is internally provided with source and drain ions.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the technical scheme of the invention, a first barrier layer is formed in the first fin portion groove, a second barrier layer is formed in the second fin portion groove, and the thickness of the first barrier layer is larger than that of the second barrier layer. In the subsequent manufacturing process, the first blocking layer with the increased thickness can effectively improve the isolation effect between the source-drain doping layer and the formed gate structure, reduce the parasitic capacitance between the source-drain doping layer and the gate structure, and further improve the performance of the finally formed semiconductor structure.
In addition, the thickness of the second barrier layer is small, so that the problem that when the thickness of the second barrier layer is large, the side wall of the groove is in a comb shape, and in a subsequent manufacturing process, the source-drain doped layer is not easy to grow between the first barrier layer and the second barrier layer is solved.
Drawings
FIGS. 1-3 are schematic structural diagrams of steps of a method for forming a semiconductor structure;
fig. 4 to 15 are schematic structural diagrams of steps of a semiconductor structure forming method according to an embodiment of the invention.
Detailed Description
As discussed in the background, prior art semiconductor structures have poor performance. The following detailed description will be made in conjunction with the accompanying drawings.
Referring to fig. 1, a substrate 100 is provided, where the substrate 100 has a fin structure, and the fin structure includes a plurality of first fin layers 101 overlapped along a normal direction of the substrate surface, and a second fin layer 102 located between two adjacent first fin layers 101; forming a dummy gate structure 103 crossing the fin structure on the substrate 100, wherein the dummy gate structure 103 covers part of the sidewall and part of the top surface of the fin structure.
Referring to fig. 2, a groove 104 is formed in the fin structure on both sides of the dummy gate structure 103; removing a part of the first fin layer 101 on the side wall of the groove 104 to form a first modified fin layer 105, a first fin groove (not marked) and a second fin groove (not marked), wherein the first fin groove is located between the first modified fin layer 105 on the bottom layer and the substrate 100, and the second fin groove is located between the second fin layers 102 on two adjacent layers; a first barrier layer 106 and a second barrier layer 108 located in the second fin recess are formed in the first fin recess.
Referring to fig. 3, a source-drain doped layer 107 is formed in the recess 104, and source-drain ions are contained in the source-drain doped layer 107.
In the above embodiment, in the subsequent process, the first modified fin layer 105 needs to be removed to form a gate structure. However, after the gate structure is formed, because the thickness of the first blocking layer 106 is small, the isolation performance is poor, and a parasitic capacitance is easily formed between the source/drain doping layer 107 and the gate structure, thereby resulting in poor performance of the finally formed semiconductor structure.
On the basis, the invention provides a semiconductor structure and a forming method thereof, and by increasing the thickness of the first barrier layer, the isolation effect between the source-drain doping layer and the gate structure can be effectively improved in the subsequent manufacturing process, the parasitic capacitance between the source-drain doping layer and the gate structure is reduced, and the performance of the finally formed semiconductor structure is further improved.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Fig. 4 to fig. 15 are schematic structural diagrams illustrating a process of forming a semiconductor structure according to an embodiment of the present invention.
Referring to fig. 4, a substrate 200 is provided, where the substrate 200 has a fin structure, and the fin structure includes a plurality of first fin layers 201 overlapped along a normal direction of the substrate surface, and a second fin layer 202 located between two adjacent first fin layers 201.
The material of the substrate 200 can adopt monocrystalline silicon or monocrystalline silicon germanium; in this embodiment, the substrate 200 is made of single crystal silicon germanium.
The forming method of the fin structure comprises the following steps: forming a fin material film (not shown) on the substrate 200, wherein the fin material film comprises a plurality of layers of first fin films (not shown) overlapped along the normal direction of the surface of the substrate, and a second fin film (not shown) positioned in two adjacent layers of the first fin films; forming a patterned layer (not shown) on the fin material film; and etching the fin material film by using the patterned layer as a mask until the fin material film is exposed out of the top surface of the substrate to form the fin structure, wherein the fin structure comprises a plurality of first fin layers 201 overlapped along the normal direction of the surface of the substrate and a second fin layer 202 positioned between the two adjacent first fin layers 201.
The material of the first fin portion layer 201 is different from that of the second fin portion layer 202, and the purpose of the material is to remove the first fin portion layer 201 when a gate structure is formed subsequently, so that the first fin portion layer 201 and the second fin portion layer 202 which are made of different materials have a larger etching selection ratio, and damage to the second fin portion layer 202 in the process of removing the first fin portion layer 201 is reduced.
In this embodiment, the material of the first fin layer 201 is monocrystalline silicon, and the material of the second fin layer 202 is monocrystalline silicon germanium; in other embodiments, the material of the first fin layer is single crystal silicon germanium, and the material of the second fin layer is single crystal silicon.
Referring to fig. 5, a dummy gate structure crossing the fin structure is formed on the substrate 200, and the dummy gate structure covers a portion of the sidewalls and a portion of the top surface of the fin structure.
The dummy gate structure includes: the semiconductor structure comprises a gate dielectric layer 203 positioned on the fin structure, a dummy gate layer 204 positioned on the gate dielectric layer 203, a protective layer 205 positioned on the dummy gate layer 204, and a sidewall 206 positioned on the sidewalls of the dummy gate layer 204 and the protective layer 205.
In this embodiment, the material of the dummy gate layer 204 is polysilicon; in other embodiments, the material of the dummy gate layer 204 may also be amorphous silicon.
In this embodiment, the material of the protection layer 205 is silicon nitride; in other embodiments, the material of the protective layer may also use silicon oxide.
The method for forming the side wall 206 includes: forming a side wall material layer (not shown) on the top surface of the gate dielectric layer 203, the side wall of the dummy gate layer 204, the side wall of the protection layer 205 and the top surface; and etching back the side wall material layer until the protective layer 205 and the top surface of the gate dielectric layer 203 are exposed, thereby forming the side wall 206.
The forming process of the side wall material layer is one or combination of a chemical vapor deposition process, a physical vapor deposition process or an atomic layer deposition process. The material of the sidewall spacers 206 includes silicon oxide, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbonitride or silicon oxycarbonitride.
In this embodiment, the sidewall spacers 206 are used to define the position of the subsequent source-drain doping layer.
Referring to fig. 6, a recess 207 is formed in the fin structure at both sides of the dummy gate structure.
The forming method of the groove 207 comprises the following steps: and etching the fin structure by taking the dummy gate structure as a mask until the top surface of the substrate 200 is exposed, and forming the groove 207 in the fin structure on two sides of the dummy gate structure.
In this embodiment, the groove 207 serves to provide a space for the source-drain doping layer to be formed later.
The process for etching the fin structure comprises the following steps: an anisotropic dry etching process or an anisotropic wet etching process.
In this embodiment, the process for etching the fin structure is an anisotropic dry etching process, and the parameters of the dry etching process include: the adopted etching gas comprises HBr and Ar, wherein the flow rate of HBr is 10 sccm-1000 sccm, and the flow rate of Ar is 10 sccm-1000 sccm.
Referring to fig. 7, removing a portion of the first fin layer 201 on the sidewall of the groove 207, and forming a first modified fin layer 208, a first fin groove 209, and a second fin groove 210, where the first fin groove 209 is located between the first modified fin layer 208 on the bottom layer and the substrate 200, and the second fin groove 210 is located between the second fin layers 202 on two adjacent layers.
In this embodiment, the first fin recess 209 functions to provide a space for a first barrier layer to be formed later, and the second fin recess 210 functions to provide a space for a second barrier layer to be formed later.
In this embodiment, the process of removing a portion of the first fin layer 201 is a wet etching process. The etching solution for wet etching has a good selection ratio to monocrystalline silicon and monocrystalline germanium-silicon, and can ensure that the morphology of the monocrystalline germanium-silicon is not influenced while the monocrystalline silicon is removed. The parameters of the wet etching process comprise: the etching solution is a tetramethylammonium hydroxide solution, the temperature is 20-80 ℃, and the volume percentage of the tetramethylammonium hydroxide solution is 10-80%.
After the first fin recess 209 and the second fin recess 210 are formed, a first blocking layer located in the first fin recess 209 and a second blocking layer located in the second fin recess 210 are formed, and the thickness of the first blocking layer is greater than that of the second blocking layer. Please refer to fig. 8 to 11 for a specific process of forming the first barrier layer and the second barrier layer.
Referring to fig. 8, a first initial barrier layer 211 is formed on the sidewall and bottom surface of the recess 207 and the sidewall and top surface of the dummy gate structure.
In this embodiment, the material of the first initial barrier layer 211 is silicon nitride.
In this embodiment, the first initial barrier layer 211 is formed by a physical vapor deposition process; in other embodiments, the first initial barrier layer may be formed by a chemical vapor deposition process.
Referring to fig. 9, the first initial barrier layer 211 is etched back until the bottom surface of the recess 207 and the top surface of the dummy gate structure are exposed, so as to form a second initial barrier layer 212.
The process of etching back the first initial barrier layer 211 includes an anisotropic dry etching process or an anisotropic wet etching process; in this embodiment, the process of etching back the first initial barrier layer 211 adopts an anisotropic dry etching process, and the anisotropic dry etching process parameters include: the etching gas comprises CF4And CH2F2Wherein CF4The flow rate of (1) is 50sccm to 500sccm, CH2F2The flow rate of (2) is 30sccm to 100 sccm.
Referring to fig. 10, a sacrificial layer 213 is formed at the bottom of the recess 207, the sacrificial layer 213 covers a portion of the sidewalls of the second initial barrier layer 212, and a top surface of the sacrificial layer 213 is lower than or flush with a top surface of the first modified fin layer 208 at the bottom.
The sacrificial layer 213 covers part of the sidewall of the second initial barrier layer 212, and is used for preventing the covered second initial barrier layer 212 from being etched when the second initial barrier layer 212 is etched back in the subsequent process, so as to ensure that the thickness of the first barrier layer formed in the subsequent process is larger.
The material of the sacrificial layer 213 is different from that of the first initial barrier layer 211, and since the second initial barrier layer 212 is formed by the first initial barrier layer 211, the material of the second initial barrier layer 212 is the same as that of the first initial barrier layer 211. Due to the difference of materials, a certain etching selection ratio is generated between the sacrificial layer 213 and the second initial barrier layer 212, and further, when the second initial barrier layer 212 is etched subsequently, the sacrificial layer 213 is ensured not to be removed by etching.
In this embodiment, the material of the sacrificial layer 213 is an organic material containing carbon and oxygen.
Referring to fig. 11, the second initial barrier layer 212 is etched back until the sidewalls of the second fin layer 202 are exposed, so as to form the first barrier layer 214 and the second barrier layer 215; after the first barrier layer 214 and the second barrier layer 215 are formed, the sacrificial layer 213 is removed.
The process of etching back the second initial barrier layer 212 includes an anisotropic dry etching process or an anisotropic wet etching process; in this embodiment, the process of etching back the second initial barrier layer 212 uses an anisotropic dry etching process, and the parameters of the anisotropic dry etching process include: using gases containing fluorine (e.g. CH)3F、CH2F2Or CHF3) Argon and oxygen, the etching power is 200W-400W, the pressure of the etching cavity is 30 mtorr-200 mtorr, and the etching temperature is 40 ℃ to 60 ℃.
The thickness of the first barrier layer 214 after formation is greater than the thickness of the second barrier layer 215, and the thickness direction is perpendicular to the sidewall of the first barrier layer 214, so as to increase the thickness of the first barrier layer 214. In the subsequent process, the first blocking layer 214 with increased thickness can effectively improve the isolation effect between the source-drain doping layer and the formed gate structure, reduce the parasitic capacitance between the source-drain doping layer and the gate structure, and further improve the performance of the finally formed semiconductor structure.
In addition, the thickness of the second blocking layer 215 is small, so as to prevent the sidewall of the trench 207 from being comb-shaped when the thickness of the second blocking layer 215 is large, and the source-drain doping layer is not easy to grow between the first blocking layer and the second blocking layer in a subsequent process.
Referring to fig. 12, after the first blocking layer 214 and the second blocking layer 215 are formed, a source-drain doping layer 216 is formed in the recess 207, and the source-drain doping layer 216 has source-drain ions therein.
In this embodiment, the forming process of the source-drain doping layer 216 includes an epitaxial growth process; the process of doping the source and drain ions in the source and drain doping layer 216 includes an in-situ doping process.
When the semiconductor structure is a P-type device, the material of the source-drain doping layer 216 includes: silicon, germanium, or silicon germanium; the source and drain ions are P-type ions and comprise boron ions and BF2-Ions or indium ions; when the semiconductor structure is an N-type device, the source-drain doping layer 216 is made of materials including: silicon, gallium arsenide, or indium gallium arsenide; the source and drain ions are N-type ions and comprise phosphorus ions or arsenic ions.
In this embodiment, the semiconductor structure is an N-type device, the source-drain doping layer 216 is made of silicon, and the source-drain ions are phosphorus ions.
After the source-drain doping layer 216 is formed, a dielectric layer is formed on the source-drain doping layer 216 and the dummy gate structure, and the dielectric layer covers the side wall of the dummy gate structure; removing the dummy gate structure and the first modified fin layer 208 covered by the dummy gate structure, and forming a gate opening in the dielectric layer and between the adjacent second fin layers 202; a gate structure is formed within the gate opening, the gate structure surrounding the second fin layer 202. Please refer to fig. 13 to fig. 15 for a specific process of forming the gate structure.
Referring to fig. 13, a dielectric layer 217 is formed on the source-drain doped layer 216 and the dummy gate structure, and the dielectric layer 217 covers the sidewall of the dummy gate structure.
In this embodiment, the dielectric layer 217 specifically covers the source-drain doping layer 216 and the sidewall of the dummy gate structure, and exposes the top surface of the dummy gate structure.
The forming method of the dielectric layer 217 comprises the following steps: forming an initial dielectric layer (not shown) on the source-drain doped layer 216 and the dummy gate structure, where the initial dielectric layer covers the top surface and the sidewall surface of the dummy gate structure; and flattening the initial dielectric layer until the surface of the protective layer 205 at the top of the dummy gate structure is exposed, thereby forming the dielectric layer 217.
In this embodiment, the dielectric layer 217 is made of silicon oxide.
Referring to fig. 14, the dummy gate structure and the first modified fin layer 208 covered by the dummy gate structure are removed, and a gate opening 218 is formed in the dielectric layer 217 and between the adjacent second fin layers 202.
The method of removing the dummy gate structure and the first modified fin layer 208 covered by the dummy gate structure includes: removing the dummy gate layer 204, and forming an initial gate opening (not shown) in the dielectric layer 217; the first modified fin layer 208 exposed by the initial gate opening is removed, so that the initial gate opening forms the gate opening 218.
Specifically, the method further includes removing the protection layer 205 on top of the dummy gate layer 214 before removing the dummy gate layer 214.
In this embodiment, the process of removing the first modified fin layer 208 adopts a wet etching process.
Referring to fig. 15, a gate structure 219 is formed within the gate opening 218, wherein the gate structure 219 surrounds the second fin layer 202.
The gate structure 219 includes a gate layer, the material of the gate layer is metal, and the metal material includes one or more combinations of copper, tungsten, nickel, chromium, titanium, tantalum, and aluminum.
In this embodiment, the material of the gate layer is copper.
Accordingly, an embodiment of the present invention further provides a semiconductor structure formed by the above method, with reference to fig. 12, the semiconductor structure includes: the substrate 200 is provided with a fin structure, and the fin structure comprises a plurality of first correction fin layers 208 overlapped along the normal direction of the surface of the substrate and a second fin layer 202 positioned between two adjacent first correction fin layers 208; a first fin recess between the first modified fin layer 208 and the substrate 200, and a second fin recess between two adjacent layers of the second fin layer 202; a dummy gate structure located on the fin structure; the grooves are positioned at two sides of the pseudo gate structure; a first barrier layer 214 located in the first fin recess, and a second barrier layer 215 located in the second fin recess 210, the first barrier layer 214 having a thickness greater than a thickness of the second barrier layer 215; and the source and drain doping layers 216 are positioned in the groove 207, and source and drain ions are arranged in the source and drain doping layers 216.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (15)
1. A method of forming a semiconductor structure, comprising:
providing a substrate, wherein the substrate is provided with a fin part structure, and the fin part structure comprises a plurality of first fin part layers which are overlapped along the normal direction of the surface of the substrate and a second fin part layer which is positioned between two adjacent first fin part layers;
forming a pseudo gate structure crossing the fin structure on the substrate, wherein the pseudo gate structure covers part of the side wall and part of the top surface of the fin structure;
forming grooves in the fin part structures on two sides of the pseudo gate structure;
removing part of the first fin portion layer on the side wall of the groove to form a first correction fin portion layer, a first fin portion groove and a second fin portion groove, wherein the first fin portion groove is located between the first correction fin portion layer on the bottom layer and the substrate, and the second fin portion groove is located between the second fin portion layers of the two adjacent layers;
forming a first barrier layer in the first fin portion groove and a second barrier layer in the second fin portion groove, wherein the thickness of the first barrier layer is larger than that of the second barrier layer;
and forming a source-drain doped layer in the groove after the first barrier layer and the second barrier layer are formed, wherein source-drain ions are arranged in the source-drain doped layer.
2. The method of forming a semiconductor structure of claim 1, wherein the method of forming the first barrier layer and the second barrier layer comprises: forming a first initial barrier layer on the side wall and the bottom surface of the groove and the side wall and the top surface of the dummy gate structure; etching the first initial barrier layer back until the bottom surface of the groove and the top surface of the pseudo gate structure are exposed to form a second initial barrier layer; forming a sacrificial layer at the bottom of the groove, wherein the sacrificial layer covers partial side walls of the second initial barrier layer, and the top surface of the sacrificial layer is lower than or flush with the top surface of the first correction fin layer at the bottom layer; etching back the second initial barrier layer until the side wall of the second fin portion layer is exposed, and forming the first barrier layer and the second barrier layer; removing the sacrificial layer after forming the first barrier layer and the second barrier layer.
3. The method of forming a semiconductor structure of claim 2 wherein the material of said first initial barrier layer comprises silicon nitride.
4. The method of claim 2, wherein the process of forming the first initial barrier layer comprises a physical vapor deposition process or a chemical vapor deposition process.
5. The method for forming a semiconductor structure of claim 2, wherein the process of etching back the first initial barrier layer comprises an anisotropic dry etch process or an anisotropic wet etch process.
6. The method for forming a semiconductor structure of claim 2, wherein the process of etching back the second initial barrier layer comprises an anisotropic dry etch process or an anisotropic wet etch process.
7. The method of claim 2, wherein a material of the sacrificial layer is different from a material of the first initial barrier layer, and wherein the material of the sacrificial layer comprises an organic material comprising an elemental carbon-oxygen.
8. The method for forming a semiconductor structure according to claim 1, wherein the forming process of the source-drain doping layer comprises an epitaxial growth process; the process for doping the source and drain ions in the source and drain doped layer comprises an in-situ doping process.
9. The method of forming a semiconductor structure of claim 1, wherein the recess is formed by a method comprising: and etching the fin part structure by taking the pseudo gate structure as a mask until the top surface of the substrate is exposed, and forming the grooves in the fin part structures at two sides of the pseudo gate structure.
10. The method of semiconductor structure formation of claim 1, wherein the dummy gate structure comprises a dummy gate layer.
11. The method of forming a semiconductor structure of claim 10, wherein the material of the dummy gate layer comprises polysilicon or amorphous silicon.
12. The method of claim 1, wherein the fin structure is formed by a method comprising: forming a fin material film on the substrate, wherein the fin material film comprises a plurality of layers of first fin films overlapped along the normal direction of the surface of the substrate and a second fin film positioned in two adjacent layers of the first fin films; forming a patterned layer on the fin material film; and etching the fin material film by using the patterning layer as a mask until the fin material film is exposed out of the top surface of the substrate to form the fin structure, wherein the fin structure comprises a plurality of first fin layers overlapped along the normal direction of the surface of the substrate and a second fin layer positioned between the two adjacent first fin layers.
13. The method of claim 1, wherein a material of the first fin layer is different from a material of the second fin layer; the first fin portion layer is made of monocrystalline silicon or monocrystalline silicon germanium; the material of the second fin portion layer is monocrystalline silicon germanium or monocrystalline silicon.
14. The method for forming a semiconductor structure according to claim 1, further comprising, after forming the source-drain doping layer: forming a dielectric layer on the source-drain doping layer and the dummy gate structure, wherein the dielectric layer covers the side wall of the dummy gate structure; removing the dummy gate structure and the first correction fin portion layer covered by the dummy gate structure, and forming a gate opening in the dielectric layer and between the adjacent second fin portion layers; and forming a gate structure in the gate opening, wherein the gate structure surrounds the second fin portion layer.
15. A semiconductor structure formed by the method of any of claims 1 to 14, comprising:
the fin structure comprises a plurality of first correction fin layers overlapped along the normal direction of the surface of the substrate and a second fin layer positioned between two adjacent first correction fin layers;
the first fin part groove is positioned between the first correction fin part layer and the substrate, and the second fin part groove is positioned between two adjacent layers of the second fin part layers;
a dummy gate structure located on the fin structure;
the grooves are positioned at two sides of the pseudo gate structure;
the first barrier layer is positioned in the first fin portion groove, and the second barrier layer is positioned in the second fin portion groove, and the thickness of the first barrier layer is larger than that of the second barrier layer;
and the source and drain doping layer is positioned in the groove and is internally provided with source and drain ions.
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