CN112924780A - Debugging device for microwave module and manufacturing method thereof - Google Patents

Debugging device for microwave module and manufacturing method thereof Download PDF

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Publication number
CN112924780A
CN112924780A CN202110102000.2A CN202110102000A CN112924780A CN 112924780 A CN112924780 A CN 112924780A CN 202110102000 A CN202110102000 A CN 202110102000A CN 112924780 A CN112924780 A CN 112924780A
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circuit board
debugging
microwave
microwave circuit
base
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CN112924780B (en
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汪宁
方航
蔡庆刚
叶贝贝
曹振玲
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Anhui East China Institute of Optoelectronic Technology
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Anhui East China Institute of Optoelectronic Technology
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/30Reactive power compensation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The invention discloses a debugging device for a microwave module, wherein a base is divided into an upper cavity and a lower cavity, the upper cavity is provided with two grooves, one groove is in the shape of the microwave module to be debugged, and the other groove is provided with a first microwave circuit board; the lower cavity is provided with a second microwave circuit board; the side edge of the base is provided with a first radio frequency connector, a second radio frequency connector, a first DC insulator, a second DC insulator and a grounding post; a method of manufacture is also disclosed. This debugging device can realize the debugging fast, all need to use the electric iron at microstrip wire welding debugging electric capacity when need not a module of every debugging, directly presses the microstrip wire that needs welding debugging electric capacity with the simple and easy device of debugging electric capacity, realizes debugging electric capacity's matching, saves the welding time greatly, avoids welding the pollution to the module moreover. Meanwhile, the manufacturing method is simple, the debugging device manufactured by the method is used for debugging, the debugging time is greatly saved, and powerful guarantee is provided for batch debugging.

Description

Debugging device for microwave module and manufacturing method thereof
Technical Field
The invention relates to the technical field of microwave module debugging devices, in particular to a debugging device for a microwave module and a manufacturing method thereof.
Background
In recent years, microwave modules are widely applied to the fields of radars, electronic countermeasure, broadcast televisions and the like, almost all microwave modules need to be debugged after being assembled and assembled, and the performance indexes of the modules meet the product requirements through debugging; for debugging of mass products, a scientific and reasonable debugging device is very important.
Therefore, it is urgently needed to provide a scientific, reasonable, simple and time-saving debugging device to solve the technical problems.
Disclosure of Invention
The invention aims to provide a debugging device for a microwave module, which can quickly realize debugging, does not need to weld a debugging capacitor on a microstrip lead by using an electric iron when debugging a module, directly presses the microstrip lead needing to be welded with the debugging capacitor by using a simple debugging capacitor device, realizes the matching of debugging capacitors, greatly saves the welding time and avoids the pollution of welding on the module.
Another object of the present invention is to provide a manufacturing method of a debugging apparatus for microwave modules, which is simple, and the debugging apparatus manufactured by the method greatly saves debugging time and provides a strong guarantee for batch debugging.
In order to achieve the aim, the invention provides a debugging device for a microwave module, which comprises a base and a simple debugging capacitor matching tool;
the base is divided into an upper cavity and a lower cavity, the upper cavity is provided with two grooves, one of the grooves is in the shape of a microwave module to be debugged, and the groove is provided with three through holes and four screw holes; the other groove is provided with a first microwave circuit board; the lower cavity is provided with a second microwave circuit board;
a first radio frequency connector, a second radio frequency connector, a first DC insulator, a second DC insulator and a grounding column are arranged on the side edge of the base; wherein the content of the first and second substances,
the second microwave circuit board is provided with a first jack metal column, a second jack metal column and a third jack metal column; the through hole realizes the intercommunication of the upper cavity and the lower cavity, and is used for connecting the insulator on the microwave module with the jack metal column on the second microwave circuit board through the through hole to realize the electrical intercommunication;
the screw hole is used for fixing the microwave module;
the first radio frequency connector is connected with the first microwave circuit board, and the second radio frequency connector is connected with the second microwave circuit board;
the first DC insulator and the second DC insulator are connected with the second microwave circuit board;
the simple debugging capacitor matching tool is in a square structure and comprises a support pillar, a first copper sheet, a second copper sheet and a debugging capacitor; the supporting column is made of polytetrafluoroethylene materials, a first copper sheet and a second copper sheet are arranged at two ends of the supporting column, and a debugging capacitor is arranged between the first copper sheet and the second copper sheet.
The invention also provides a manufacturing method of the debugging device for the microwave module, which comprises the following steps:
step 1, manufacturing a processing structural part and a microwave circuit board;
step 2, welding the jack metal column and the microwave circuit board;
step 3, soldering the microwave circuit board, the DC insulator and the base;
step 4, welding the radio frequency connector and the grounding column with the base in an electric fitting manner;
step 5, glue filling of the microwave circuit board;
step 6, manufacturing a simple debugging capacitor matching tool;
and 7, debugging.
Preferably, in step 1, the processed structural member is manufactured according to a structural member drawing, and the base material is LY12 and is subjected to surface silver plating treatment; and manufacturing and processing the microwave circuit board according to the drawing of the microwave circuit board, wherein the microwave circuit board is made of FR-4, and the back surface of the microwave circuit board is metallized.
Preferably, in step 2, the first, second and third jack metal posts are soldered to the second microwave circuit board with the open ends of the inner holes of the first, second and third jack metal posts facing downward, and the open ends of the inner holes of the jack metal posts are flush with the back metallization layer of the microwave circuit board.
Preferably, the material of the solder wire is Sn96.5Ag3Cu0.5.
Preferably, step 3 comprises:
a. cutting SN63CR37AGS89.5 soldering lugs in the shapes and sizes of the first microwave circuit board and the second microwave circuit board by a scalpel, wherein the SN63CR37AGS89.5 soldering lugs are respectively a first soldering lug and a second soldering lug; sequentially placing the first soldering lug and the first microwave circuit board at corresponding positions of the base, then placing the second soldering lug and the second microwave circuit board at corresponding positions of the base, then placing the base on a hot bench at the temperature of 210 ℃ for sintering, and applying pressure to enable the first microwave circuit board and the second microwave circuit board to be in close welding contact with the base;
b. using a pneumatic dispenser to apply two circles of SN63CR37AGS89.5 solder pastes on the metal peripheries of the first DC insulator and the second DC insulator, then respectively installing the first DC insulator and the second DC insulator at corresponding positions of the base, placing the base on a hot bench with the temperature of 170 ℃ for preheating for 3min, then using a hot air gun to heat the first DC insulator and the second DC insulator at the solder pastes, melting the solder pastes, and completing the welding of the first DC insulator, the second DC insulator and the base; the electric soldering iron melts the solder wire to weld the first DC insulator, the second DC insulator and the second microwave circuit board together by the soldering tin, and the welding spot is smooth and bright.
Preferably, step 4 comprises:
a. the first radio frequency connector and the second radio frequency connector are fixed on the base through M2 screws, an electric soldering iron melts a soldering tin wire to solder the lap joint of the first radio frequency connector and the first microwave circuit board by using soldering tin, and the soldering points are round and bright; the electric soldering iron melts the soldering tin wire to solder the second radio frequency connector and the second microwave circuit board together by the soldering tin, and the soldering point is smooth and bright;
b. the grounding post is screwed and installed on the base through self threads.
Preferably, in step 5, the pouring sealant GMX8152-04/H and GMX8152-04/H are mixed and stirred by a pneumatic dispenser according to the mass ratio of 1:1, and the mixture is dispensed on the second microwave circuit board, so that the pouring sealant covers the whole base groove and is flush with the bottom surface of the base.
Preferably, step 6 comprises: according to the simple tool drawing for debugging capacitor matching, the first copper sheet and the second copper sheet are bonded at two ends of the supporting column through epoxy resin glue with the model of HysolEO1016, then the debugging capacitor is welded between the first copper sheet and the second copper sheet through an electric iron melting soldering wire, so that the first copper sheet and the second copper sheet are integrated, and the simple tool for debugging capacitor matching is obtained.
Preferably, step 7 comprises: the microwave module is fixedly installed on a base of the debugging device through screws, a gap between the microwave module and the first microwave circuit board is connected through a debugging capacitor, the debugging capacitor is directly pressed between the microwave module and the first microwave circuit board through the simple debugging capacitor matching tool, and a first copper sheet and a second copper sheet welded with the debugging capacitor in the simple debugging capacitor matching tool are respectively pressed on a first microstrip line and a second microstrip line of the microwave module and the first microwave circuit board, so that the debugging capacitor is quickly matched.
According to the technical scheme, the simple debugging capacitor matching device replaces the original process that when a module is debugged, an electric iron is needed to weld a debugging capacitor on a microstrip lead, and the debugging capacitor matching simple tool is directly used for pressing the microstrip lead needing to be welded with the debugging capacitor, so that the matching of the debugging capacitor is realized, the welding time is greatly saved, and the pollution of welding on the module is avoided. The debugging device is scientific, reasonable and practical in design and simple in manufacturing method, debugging time is greatly saved when the debugging device manufactured by the method is used for debugging, and powerful guarantee is provided for batch debugging.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of the front structure of a debugging device of a microwave module in the invention;
FIG. 2 is a schematic diagram of a back structure of a debugging apparatus of a microwave module according to the present invention;
FIG. 3 is a schematic diagram of the microwave module of the present invention installed in a commissioning apparatus;
fig. 4 is a schematic diagram of a simple tooling for debugging capacitor matching in the present invention.
Description of the reference numerals
1-base 2-first microwave circuit board
3-second microwave circuit board 4-first radio frequency connector
5-second radio frequency connector 6-first DC insulator
7-second DC insulator 8-grounding post
9-first receptacle metal post 10-second receptacle metal post
11-third jack metal post 12-first microstrip line
13-second microstrip line 14-via
15-screw hole 16-support column
17-first copper sheet 18-second copper sheet
19-debugging capacitor 20-microwave module
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, unless otherwise specified, the directional words "upper, lower" and the like included in the terms merely represent the orientation of the terms in the conventional use state or are colloquially known by those skilled in the art, and should not be construed as limiting the terms.
Referring to fig. 1 and 2, the debugging device for the microwave module of the present invention comprises a base 1 and a simple debugging capacitor matching tool;
the base 1 is divided into an upper cavity and a lower cavity, the upper cavity is provided with two grooves, one of the grooves is in the shape of a microwave module 20 to be debugged, and the groove is provided with three through holes 14 and four screw holes 15; the other groove is provided with a first microwave circuit board 2; the lower cavity is provided with a second microwave circuit board 3;
a first radio frequency connector 4, a second radio frequency connector 5, a first DC insulator 6, a second DC insulator 7 and a grounding post 8 are arranged on the side edge of the base 1; wherein the content of the first and second substances,
the second microwave circuit board 3 is provided with a first jack metal post 9, a second jack metal post 10 and a third jack metal post 11; the through hole 14 realizes the intercommunication of the upper cavity and the lower cavity, and is used for connecting the insulator on the microwave module 20 with the jack metal column on the second microwave circuit board 3 through the through hole 14 to realize the electrical intercommunication;
the screw hole 15 is used for fixing the microwave module 20;
the first radio frequency connector 4 is connected with the first microwave circuit board 2, and the second radio frequency connector 5 is connected with the second microwave circuit board 3;
the first DC insulator 6 and the second DC insulator 7 are connected with the second microwave circuit board 3;
the simple debugging capacitor matching tool is of a square structure and comprises a support column 16, a first copper sheet 17, a second copper sheet 18 and a debugging capacitor 19; the supporting column 16 is made of polytetrafluoroethylene materials, a first copper sheet 17 and a second copper sheet 18 are arranged at two ends of the supporting column, and a debugging capacitor 19 is arranged between the first copper sheet 17 and the second copper sheet 18.
The invention also provides a manufacturing method of the debugging device for the microwave module, which comprises the following steps:
step 1, manufacturing a processing structural part and a microwave circuit board;
step 2, welding the jack metal column and the microwave circuit board;
step 3, soldering the microwave circuit board and the DC insulator with the base 1;
step 4, welding the radio frequency connector and the grounding column with the base 1 in an electric welding manner;
step 5, glue filling of the microwave circuit board;
step 6, manufacturing a simple debugging capacitor matching tool;
and 7, debugging.
In the step 1, manufacturing a machined structural part according to a structural part drawing, wherein the base 1 is made of LY12 and is subjected to surface silver plating treatment; and manufacturing and processing the microwave circuit board according to the drawing of the microwave circuit board, wherein the microwave circuit board is made of FR-4, and the back surface of the microwave circuit board is metallized.
In step 2, the opening ends of the inner holes of the first jack metal column 9, the second jack metal column 10 and the third jack metal column 11 are welded on the second microwave circuit board 3 downwards by using an electric iron to melt the solder wires, and the opening ends of the inner holes of the jack metal columns are flush with the metallization layer on the back of the microwave circuit board.
The material of the solder wire is Sn96.5Ag3Cu0.5.
The step 3 comprises the following steps:
a. cutting SN63CR37AGS89.5 soldering lugs in the shapes and sizes of the first microwave circuit board 2 and the second microwave circuit board 3 by a scalpel, wherein the SN63CR37AGS89.5 soldering lugs are a first soldering lug and a second soldering lug respectively; sequentially placing a first soldering lug and a first microwave circuit board 2 at corresponding positions of a base 1, then placing a second soldering lug and a second microwave circuit board 3 at corresponding positions of the base 1, then placing the base on a hot bench at the temperature of 210 ℃ for sintering, and applying pressure to enable the first microwave circuit board 2 and the second microwave circuit board 3 to be in close welding contact with the base 1;
b. using a pneumatic dispenser to apply two circles of SN63CR37AGS89.5 solder pastes on the metal peripheries of the first DC insulator 6 and the second DC insulator 7, then respectively installing the two circles of SN63CR37AGS89.5 solder pastes at corresponding positions of the base 1, placing the two circles of SN63CR37AGS89.5 solder pastes on a heating platform at the temperature of 170 ℃ for preheating for 3min, then using a hot air gun to heat the solder pastes of the first DC insulator 6 and the second DC insulator 7 so as to melt the solder pastes, and completing the welding of the first DC insulator 6, the second DC insulator 7 and the base 1; the electric soldering iron melts the solder wire to weld the first DC insulator 6, the second DC insulator 7 and the second microwave circuit board 3 together by the solder, and the welding points are smooth and bright.
Step 4 comprises the following steps:
a. the first radio frequency connector 4 and the second radio frequency connector 5 are fixed on the base 1 through M2 screws, an electric soldering iron melts a soldering tin wire to solder the lap joint of the first radio frequency connector 4 and the first microwave circuit board 2 by using soldering tin, and the soldering points are smooth and bright; the electric soldering iron melts the solder wire to weld the second radio frequency connector 5 and the second microwave circuit board 3 together by the solder, and the welding spot is smooth and bright;
b. the grounding pole 8 is screwed on the base 1 through self threads.
In the step 5, the pouring sealant GMX8152-04/H and GMX8152-04/H are mixed and stirred according to the mass ratio of 1:1 by using a pneumatic dispenser, and the mixture is spot-coated on the second microwave circuit board 3, so that the pouring sealant covers the whole groove of the base 1 and is flush with the bottom surface of the base 1.
The step 6 comprises the following steps: according to the simple tooling diagram for debugging capacitor matching, the first copper sheet 17 and the second copper sheet 18 are bonded at two ends of the supporting column 16 by epoxy resin adhesive with the model number of HysolEO1016, and then the debugging capacitor 19 is welded between the first copper sheet 17 and the second copper sheet 18 by using an electric soldering iron to melt a solder wire, so that the first copper sheet 17 and the second copper sheet 18 are integrated to obtain the simple tooling for debugging capacitor matching.
Referring to fig. 3, step 7 includes: the microwave module 20 is fixedly installed on the debugging device base 1 through screws, the gap between the microwave module 20 and the first microwave circuit board 2 is connected through the debugging capacitor, and the debugging capacitor matching simple tool is directly pressed between the microwave module 20 and the first microwave circuit board 2, as shown in fig. 4, the first copper sheet 17 and the second copper sheet 18 welded with the debugging capacitor 19 on the debugging capacitor matching simple tool are respectively pressed on the first microstrip line 12 and the second microstrip line 13 of the microwave module 20 and the first microwave circuit board 2, so that the debugging capacitor is quickly matched.
It can be seen through above-mentioned technical scheme that this debugging device can realize the debugging fast, all need not to use the electric iron at microwave module and microstrip circuit board welding debugging electric capacity when every debugging module, directly presses the microstrip wire that needs welding debugging electric capacity with the simple and easy device of debugging electric capacity, realizes debugging electric capacity's matching, saves the welding time greatly, avoids welding the pollution etc. to the module moreover. The debugging device is scientific, reasonable and practical in design and simple in manufacturing method, debugging time is greatly saved when the debugging device manufactured by the method is used for debugging, and powerful guarantee is provided for batch debugging.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims (10)

1. A debugging device for a microwave module is characterized by comprising a base (1) and a simple debugging capacitor matching tool;
the base (1) is divided into an upper cavity and a lower cavity, the upper cavity is provided with two grooves, one groove is in the shape of a microwave module (20) to be debugged, and the groove is provided with three through holes (14) and four screw holes (15); the other groove is provided with a first microwave circuit board (2); the lower cavity is provided with a second microwave circuit board (3);
a first radio frequency connector (4), a second radio frequency connector (5), a first DC insulator (6), a second DC insulator (7) and a grounding column (8) are arranged on the side edge of the base (1); wherein the content of the first and second substances,
the second microwave circuit board (3) is provided with a first jack metal column (9), a second jack metal column (10) and a third jack metal column (11); the through hole (14) realizes the intercommunication of the upper cavity and the lower cavity, and is used for connecting the insulator on the microwave module (20) with the jack metal column on the second microwave circuit board (3) through the through hole (14) to realize the electrical intercommunication;
the screw hole (15) is used for fixing the microwave module (20);
the first radio frequency connector (4) is connected with the first microwave circuit board (2), and the second radio frequency connector (5) is connected with the second microwave circuit board (3);
the first DC insulator (6) and the second DC insulator (7) are connected with the second microwave circuit board (3);
the simple debugging capacitor matching tool is of a square structure and comprises a support pillar (16), a first copper sheet (17), a second copper sheet (18) and a debugging capacitor (19); the supporting column (16) is made of polytetrafluoroethylene materials, a first copper sheet (17) and a second copper sheet (18) are arranged at two ends of the supporting column, and a debugging capacitor (19) is arranged between the first copper sheet (17) and the second copper sheet (18).
2. A method for manufacturing a debugging device for a microwave module is characterized by comprising the following steps:
step 1, manufacturing a processing structural part and a microwave circuit board;
step 2, welding the jack metal column and the microwave circuit board;
step 3, soldering the microwave circuit board, the DC insulator and the base (1);
step 4, welding the radio frequency connector and the grounding column with the base (1) in an electric welding manner;
step 5, glue filling of the microwave circuit board;
step 6, manufacturing a simple debugging capacitor matching tool;
and 7, debugging.
3. The manufacturing method of the commissioning apparatus for microwave module according to claim 2, wherein in step 1, the processed structural member is manufactured according to the structural member drawing, and the base (1) is made of LY12 and is surface-silvered; and manufacturing and processing the microwave circuit board according to the drawing of the microwave circuit board, wherein the microwave circuit board is made of FR-4, and the back surface of the microwave circuit board is metallized.
4. The method for manufacturing a commissioning device for a microwave module according to claim 2, wherein in step 2, the first jack metal post (9), the second jack metal post (10) and the third jack metal post (11) are soldered with their inner hole open ends down on the second microwave circuit board (3) by melting solder wires with an electric soldering iron, and wherein the inner hole open ends of the jack metal posts are flush with the back metallization layer of the microwave circuit board.
5. The method for manufacturing the debugging device for the microwave module as claimed in claim 4, wherein the solder wire is made of Sn96.5Ag3Cu0.5.
6. The method for manufacturing a commissioning device for a microwave module according to claim 2, wherein step 3 comprises:
a. cutting SN63CR37AGS89.5 soldering lugs with the shapes and sizes of the first microwave circuit board (2) and the second microwave circuit board (3) by a scalpel, wherein the SN63CR37AGS89.5 soldering lugs are respectively a first soldering lug and a second soldering lug; sequentially placing a first soldering lug and a first microwave circuit board (2) at corresponding positions of a base (1), then placing a second soldering lug and a second microwave circuit board (3) at corresponding positions of the base (1), then placing the base on a hot bench at the temperature of 210 ℃ for sintering, and applying pressure to enable the first microwave circuit board (2) and the second microwave circuit board (3) to be in close welding contact with the base (1);
b. using a pneumatic dispenser to apply two circles of SN63CR37AGS89.5 solder paste to the metal peripheries of the first DC insulator (6) and the second DC insulator (7), then respectively installing the solder paste at corresponding positions of the base (1), placing the base on a hot bench with the temperature of 170 ℃ for preheating for 3min, then using a hot air gun to heat the solder paste of the first DC insulator (6) and the second DC insulator (7) so as to melt the solder paste, and completing the welding of the first DC insulator (6), the second DC insulator (7) and the base (1); the electric soldering iron melts the solder wire to weld the first DC insulator (6), the second DC insulator (7) and the second microwave circuit board (3) together by the solder, and the welding points are smooth and bright.
7. The method for manufacturing a commissioning device for a microwave module according to claim 2, wherein step 4 comprises:
a. the first radio frequency connector (4) and the second radio frequency connector (5) are fixed on the base (1) through M2 screws, an electric soldering iron melts a soldering tin wire to solder the lap joint of the first radio frequency connector (4) and the first microwave circuit board (2) by the soldering tin, and the soldering points are smooth and bright; the electric soldering iron melts the soldering tin wire to solder the lap joint of the second radio frequency connector (5) and the second microwave circuit board (3) by the soldering tin, and the solder joint is smooth and bright;
b. the grounding post (8) is screwed and installed on the base (1) through the thread of the grounding post.
8. The manufacturing method of the debugging device for microwave module according to claim 2, wherein in step 5, a pneumatic dispenser is used to mix and stir the potting adhesive GMX8152-04/H and GMX8152-04/H in a mass ratio of 1:1, and the mixture is dispensed on the second microwave circuit board (3) so that the potting adhesive covers the whole groove of the base (1) and is flush with the bottom surface of the base (1).
9. Method for making a commissioning device for a microwave module according to claim 2, characterized in that step 6 comprises: according to a simple tooling diagram for debugging capacitor matching, a first copper sheet (17) and a second copper sheet (18) are bonded at two ends of a supporting column (16) through epoxy resin glue with the model number of HysolEO1016, and then a soldering iron is used for melting a soldering tin wire to weld a debugging capacitor (19) between the first copper sheet (17) and the second copper sheet (18), so that the debugging capacitor is integrated, and the simple tooling for debugging capacitor matching is obtained.
10. Method for making a commissioning device for a microwave module according to claim 2, characterized in that step 7 comprises: fix the installation on debugging device base (1) with the screw with microwave module (20), the clearance is connected with the debugging electric capacity between microwave module (20) and first microwave circuit board (2), directly press between microwave module (20) and first microwave circuit board (2) with simple and easy frock of debugging electric capacity matching, make the simple and easy frock of debugging electric capacity matching weld first copper skin (17) and second copper skin (18) of debugging electric capacity (19) press respectively on first microstrip line (12), second microstrip line (13) of microwave module (20) and first microwave circuit board (2), thereby realize debugging electric capacity and match fast.
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