CN215768662U

CN215768662U - Solderless interconnection device for realizing insulator end face bonding test

Info

Publication number: CN215768662U
Application number: CN202121557021.5U
Authority: CN
Inventors: 孙红怡; 董昌慧; 蒯永清; 王灿
Original assignee: Nanjing Hengdian Electronics Co ltd
Current assignee: Nanjing Hengdian Electronics Co ltd
Priority date: 2021-07-08
Filing date: 2021-07-08
Publication date: 2022-02-08
Anticipated expiration: 2031-07-08

Abstract

The utility model discloses a solderless interconnection device for realizing bonding test of an end face of an insulator, which comprises: the front surface of the base is provided with an insulator inner conductor placing mechanism, the position of the front surface of the base, which is positioned at the upper side of the first positioning step, is provided with a screw hole, and the screw hole is used for realizing the fixation between the pressing plate and the base by screwing in a screw; a second positioning step is arranged on the lower side of the insulator inner conductor placing mechanism on the base, a guide groove corresponding to the position of the screw hole is formed in the pressing plate, a pressing plate positioning pin extending downwards is arranged on the lower edge of the pressing plate, and the pressing plate positioning pin is used for positioning the insulator. The utility model solves the problem that the insulator has a large economic loss caused by scrapping of the microwave assembly due to poor coating of the inner conductor; the operation is convenient, the solderless interconnection device can test a plurality of insulators simultaneously by using a screw fastening mode, and the working efficiency can be greatly improved.

Description

Solderless interconnection device for realizing insulator end face bonding test

Technical Field

The utility model relates to a solderless interconnection device, in particular to a solderless interconnection device for realizing an insulator end face bonding test, and belongs to the technical field of structural components.

Background

Microwave modules are becoming more and more compact, lightweight, multifunctional, and highly reliable as important electronic device modules in many fields such as satellite, radar, wireless, and wired communications. Insulators are widely used in microwave assemblies as bridges for electrical connections. The feed insulator is used as one kind of insulator, so that the drive circuit and the radio frequency circuit can be separated in the microwave assembly to generate physical isolation, the drive circuit is prevented from polluting the radio frequency circuit, and the electromagnetic shielding effect of the assembly can be increased.

The feed insulator is generally assembled by adopting a method of bonding conductive adhesive or welding solder to the tube shell, and the operation is simpler. The inner conductor of the insulator is generally interconnected with the radio frequency circuit and the driving motor by welding and bonding respectively. The radio frequency circuit can avoid pollution caused by welding through bonding. Bonding is generally carried out after the chip bonds and the cladding material requirement to the insulator inner conductor is higher, consequently, in case insulator inner conductor cladding material is bad, can not bond, can lead to microwave subassembly reworking degree of difficulty greatly increased, can lead to whole subassembly to scrap even, causes great economic loss. Therefore, it is necessary to provide a solderless interconnection apparatus for implementing an insulator end face bonding test to detect the incoming insulator material.

Disclosure of Invention

The utility model provides a solderless interconnection device for realizing the bonding test of the end face of an insulator aiming at the technical problems in the prior art, and the technical scheme has the advantages of simple and practical structure, repeated use of the solderless interconnection device and low cost.

In order to achieve the technical purpose, the utility model adopts the following technical scheme.

The utility model provides a solderless interconnection device for realizing bonding test of an end face of an insulator, which comprises: the front surface of the base is provided with an insulator inner conductor placing mechanism, the insulator inner conductor placing mechanism is used for placing an inner conductor at one end of an insulator, a first positioning step is arranged above the insulator inner conductor placing mechanism on the front surface of the base, the side surface of the first positioning step is flush with the end part of the side surface of the insulator inner conductor placing mechanism, a screw hole is arranged at the position, located on the upper side of the first positioning step, on the front surface of the base, and the screw hole is used for fixing the pressing plate and the base through screwing in a screw; a second positioning step is arranged on the base and positioned at the lower side of the insulator inner conductor placing mechanism, and the side surface of the second positioning step exceeds the end part of the side surface of the insulator inner conductor placing mechanism;

the pressing plate is provided with a guide groove corresponding to the position of the screw hole, and the guide groove is used for enabling the screw hole to move in the guide groove when the pressing plate moves downwards; and the lower edge of the pressing plate is provided with a pressing plate positioning pin which extends downwards and is used for positioning the insulator.

Furthermore, the insulator inner conductor placing mechanism is a positioning through hole.

Still further, the size of through-hole is 0.6mm ~ 1.0 mm.

Furthermore, the insulator inner conductor placing mechanism is a positioning groove.

Further, the base is made of aluminum alloy 5A05, and the thickness of the base is 10-15 mm. The pressure plate is made of aluminum alloy 5A05, and the thickness of the pressure plate is 2.5 mm-3.5 mm.

Furthermore, the height of the first positioning step is 1.0 mm-1.5 mm.

Furthermore, the thickness of the positioning pin of the pressure plate is 1.0 mm-1.5 mm, and the length is 4.5 mm-5.0 mm.

Furthermore, the guide groove is a circular arc quadrangle, wherein the length of the straight line at two ends is 3.0 mm-4.0 mm, and the diameter of the circular arc at two ends is 3.0 mm-3.5 mm.

Furthermore, the hole diameter of the screw hole is 2.0mm, and the processing depth of the screw hole is 3.0 mm-5.0 mm.

Compared with the prior art, the utility model has the following advantages:

1) the technical scheme is simple in structure, and by designing the solderless interconnection device for realizing the bonding test of the end face of the insulator, the problem that the insulator is likely to have poor inner conductor coating, so that the microwave assembly is scrapped to generate large economic loss is solved; 2) the operation is convenient, the solderless interconnection device can test a plurality of insulators simultaneously by using a screw fastening mode, and the working efficiency can be greatly improved; 3) when the solderless interconnection device is used for bonding testing the insulator, the insulator is not damaged, the insulator which is qualified in testing can be continuously used as a product element for assembly 4) the solderless interconnection device is not damaged in the operation process and can be used repeatedly; 5) the technical scheme has low cost and is convenient for further popularization.

Drawings

FIG. 1 is a schematic diagram of the structure of a base of an embodiment of the apparatus; wherein, 1(a) is a schematic diagram of the front structure of the base, and 1(b) is a schematic diagram of the side structure of the base;

FIG. 2 is a schematic diagram of the platen of an exemplary embodiment of the apparatus; wherein 2(a) is a schematic diagram of the front structure of the pressure plate, and 2(b) is a schematic diagram of the side structure of the pressure plate;

FIG. 3 is a schematic diagram of the assembly of an embodiment of the apparatus with an insulator; wherein 3(a) is a front structural schematic diagram of the assembly, and 3(b) is a side structural schematic diagram of the assembly;

FIG. 4 is a schematic diagram of the interconnection of the insulator inner conductor and the gold wire in an embodiment of the device; wherein 4(a) is a front structure schematic diagram of the interconnection of the insulator inner conductor and the gold wire, and 4(b) is a side structure schematic diagram of the interconnection of the insulator inner conductor and the gold wire;

in the figure: 1. a base; 2. the insulator inner conductor placing mechanism; 3. screw holes; 4. a first positioning step; 5. pressing a plate; 6. a guide groove; 7. a press plate positioning pin; 8. m2 screw; 9. an insulator; 10. bonding wires; 11. an insulator inner conductor; 12. and a second positioning step.

Detailed Description

For the purpose of enhancing an understanding of the present invention, the present embodiment will be described in detail below with reference to the accompanying drawings.

Example (b): as shown in fig. 1 to 4, a solderless interconnection apparatus for implementing an insulator end face bonding test includes: the front side of the base 1 is provided with an insulator inner conductor placing mechanism 2, the insulator inner conductor placing mechanism 2 is used for placing an inner conductor at one end of an insulator, a first positioning step 4 is arranged on the upper side of the insulator inner conductor placing mechanism 2 on the front side of the base 1, the side surface of the first positioning step 4 is flush with the end part of the side surface of the insulator inner conductor placing mechanism 2, and a screw hole 3 is arranged at the position, located on the upper side of the first positioning step 4, on the front side of the base 1; a second positioning step 12 is arranged on the base 1 and positioned at the lower side of the insulator inner conductor placing mechanism 2, and the side surface of the second positioning step 12 exceeds the end part of the side surface of the insulator inner conductor placing mechanism 2;

a guide groove 6 corresponding to the screw hole 3 is arranged on the pressing plate 5, and the guide groove 6 is used for enabling the screw hole 3 to move in the guide groove 6 when the pressing plate 5 moves downwards; the lower edge of the pressing plate 5 is provided with a pressing plate positioning pin 7 which extends downwards, the pressing plate positioning pin 7 is used for positioning an insulator, and the screw hole 3 is used for fixing the pressing plate 5 and the base 1 through screwing in a screw.

Referring to fig. 1 to 4, in the embodiment, the insulator inner conductor placing mechanism 2 is arranged to effectively place the insulator inner conductor 11, and the insulator is prevented from shaking in the bonding test process. The insulator inner conductor placing mechanism 2 can adopt a positioning groove, and the length of the positioning groove in the specific embodiment is designed according to needs. Alternatively, the positioning grooves may extend through the front and rear of the base 1. In other embodiments, the insulator inner conductor placement mechanism 2 may be designed as a positioning hole or a positioning through hole. If the positioning through hole is adopted, the size of the positioning through hole is optionally 0.6 mm-1.0 mm.

Optionally, the thickness of the pressure plate 5, excluding the thickness of the pressure plate positioning pin 7, is slightly greater than or equal to the thickness of the first positioning step 4, but cannot be less than the thickness of the first positioning step 4. In the embodiment, the thickness of the pressure plate 5 excluding the thickness of the pressure plate positioning pin 7 is the same as that of the first positioning step 4, as shown in fig. 3.

The application method of the solderless interconnection device for realizing the insulator end face bonding test provided by the embodiment is as follows:

placing the inner conductor of the insulator 9 to be tested into the insulator inner conductor placing mechanism 2, and placing the lower side of the kovar ring of the insulator on the second positioning step 12; aligning the guide groove 6 of the pressing plate 5 with the screw hole 3, sliding the side surface of the pressing plate 5 downwards along the side surface of the base 1, and contacting a kovar ring of the insulator through a positioning pin 7 of the pressing plate to realize the positioning of the insulator 9; screws are screwed into the screw holes 3 to fix the pressing plate 5 and the base 1, and then the insulator 9 is fixed. And when the insulator end face bonding test is carried out, the end face of the insulator inner conductor 11 is used for bonding the bonding wire 10.

The technical scheme of the utility model has simple structure, and solves the problem of great economic loss caused by scrapping of microwave components due to the poor coating of the inner conductor of the insulator; the operation is convenient, the solderless interconnection device can test a plurality of insulators simultaneously by using a screw fastening mode, and the working efficiency can be greatly improved; when the solderless interconnection device is used for bonding testing the insulator, the insulator is not damaged, and the insulator which is qualified in testing can be continuously used as a product element for assembly; the solderless interconnection device has no damage in the operation process and can be used repeatedly; the technical scheme has low cost and is convenient for further popularization.

On the basis of the above embodiments, in a specific embodiment, the pressing plate 5 is made of aluminum alloy 5a05, the thickness of the pressing plate 5 is 2.5mm to 3.5mm, the surface thickness is too thin, the processing deformation is caused, and the preheating efficiency is low during the too thick bonding process. The base 1 is made of aluminum alloy 5A05, and the thickness of the base 1 is 10-15 mm. The guide groove 6 is arc quadrangle, wherein the length of the straight line is 3.0 mm-4.0 mm, the diameter of the arc is 3.0 mm-3.5 mm, and the screw can easily slide. M2 screw 8 can be selected optionally, and the length of M2 screw 8 is not less than 5mm, so that the screw can be effectively fastened. The aperture of the screw hole 3 is 2.0mm, the processing depth of the screw hole 3 is 3.0 mm-5.0 mm, and effective fastening of the screw can be ensured.

Optionally, the thickness of the press plate positioning pin 7 is 1.0 mm-1.5 mm, the length is 4.5 mm-5.0 mm, and the press plate positioning pin is easy to process and not easy to deform.

Optionally, the height of the first positioning step 4 from the second positioning step 12 is 1.0 mm to 1.5 mm. The height is too small, the insulator cannot be fixed, and the height is too large, so that the bonding sight is shielded.

It should be noted that the above-mentioned embodiments are not intended to limit the scope of the present invention, and all equivalent modifications and substitutions based on the above-mentioned technical solutions are within the scope of the present invention as defined in the claims.

Claims

1. A solderless interconnect device for enabling testing of end face bonding of an insulator, comprising: the front surface of the base is provided with an insulator inner conductor placing mechanism, the insulator inner conductor placing mechanism is used for placing an inner conductor at one end of an insulator, a first positioning step is arranged above the insulator inner conductor placing mechanism on the front surface of the base, the side surface of the first positioning step is flush with the end part of the side surface of the insulator inner conductor placing mechanism, a screw hole is arranged at the position, located on the upper side of the first positioning step, on the front surface of the base, and the screw hole is used for fixing the pressing plate and the base through screwing in a screw; a second positioning step is arranged on the base and positioned at the lower side of the insulator inner conductor placing mechanism, and the side surface of the second positioning step exceeds the end part of the side surface of the insulator inner conductor placing mechanism;

2. The solderless interconnect device of claim 1, wherein the insulator inner conductor placement mechanism is a positioning via.

3. The solderless interconnect device of claim 2, wherein the through hole has a size of 0.6mm to 1.0 mm.

4. The solderless interconnect device of claim 1, wherein the insulator inner conductor placement mechanism is a detent.

5. The solderless interconnection apparatus for implementing an insulator end face bonding test according to claim 1, wherein the base material is aluminum alloy 5a05, and the thickness of the base is 10 mm to 15 mm.

6. The solderless interconnection apparatus of claim 1, wherein the pressing plate material is aluminum alloy 5A05 with a thickness of 2.5mm to 3.5 mm.

7. The solderless interconnect device of claim 1, wherein the first positioning step has a height of 1.0 mm to 1.5 mm.

8. The solderless interconnection apparatus of claim 1, wherein the platen locating pin has a thickness of 1.0 mm to 1.5mm and a length of 4.5 mm to 5.0 mm.

9. The solderless interconnection apparatus of claim 1, wherein the guide groove is a quadrilateral arc, and the length of the straight line at the two ends is 3.0 mm-4.0 mm, and the diameter of the arc at the two ends is 3.0 mm-3.5 mm.

10. The solderless interconnection apparatus for implementing an insulator end face bonding test according to claim 1, wherein the hole diameter of the screw hole is 2.0mm, and the processing depth of the screw hole is 3.0mm to 5.0 mm.