CN110177436A - Ku wave band 120W power amplifier prime module making process - Google Patents
Ku wave band 120W power amplifier prime module making process Download PDFInfo
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- CN110177436A CN110177436A CN201910509160.1A CN201910509160A CN110177436A CN 110177436 A CN110177436 A CN 110177436A CN 201910509160 A CN201910509160 A CN 201910509160A CN 110177436 A CN110177436 A CN 110177436A
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- shell
- feed insulator
- microwave circuit
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000012212 insulator Substances 0.000 claims abstract description 115
- 238000003466 welding Methods 0.000 claims abstract description 28
- 238000004140 cleaning Methods 0.000 claims abstract description 23
- 238000005476 soldering Methods 0.000 claims description 48
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 16
- 238000002955 isolation Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000006071 cream Substances 0.000 claims description 13
- 239000000155 melt Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 10
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000010923 batch production Methods 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of Ku wave band 120W power amplifier prime module making processes, comprising: step 1 welds microwave circuit boards (2) and insulator and cavity；Step 2, welding component and feed insulator；Step 3 carries out low-temperature welding to feed insulator；Step 4, vapour phase cleaning；Step 5, Denso welding；Step 6, capping.The production craft science of the Ku wave band 120W power amplifier prime module making process is practical, has very strong practical operation, and equipment investment is small, is applicable in batch production.
Description
Technical field
The present invention relates to microwave module technical field of manufacturing process, and in particular, to a kind of Ku wave band 120W power amplifier prime
Module making process.
Background technique
Microwave power amplifier is widely used to the fields such as radar, electronic countermeasure, radio and television, microwave power in recent years
Amplifier is the important component of microwave telecommunication devices, and High-power amplifier mainly includes prime module, driving stage module, power supply and control
System and four part of final block, the effect of prime module are that gain and numerical control attenuation and temperature benefit are provided for system amplifying circuit
It repays, and the small signal of input system is tentatively amplified.
Accordingly, it is desirable to provide a kind of manufacture craft is clear, it is applicable in batch production and every technical performance index is full
The Ku wave band 120W power amplifier prime module making process of sufficient machine requirement.
Summary of the invention
The object of the present invention is to provide a kind of Ku wave band 120W power amplifier prime module making process, Ku wave band 120W
The production craft science of power amplifier prime module making process is practical, has very strong practical operation, and equipment investment is small,
It is applicable in batch production.
To achieve the goals above, the present invention provides a kind of Ku wave band 120W power amplifier prime module making process,
Include:
Step 1 welds microwave circuit boards and insulator and cavity；
Step 2, welding component and feed insulator；
Step 3 carries out low-temperature welding to feed insulator；
Step 4, vapour phase cleaning；
Step 5, Denso welding；
Step 6, capping.
Preferably, step 1 includes:
A, that weld tabs is cut into microwave circuit plate shape and weld tabs edge with scalpel is 0.9-1.1mm smaller than printed board, obtains
To preformed soldering；Wherein, weld tabs is the SAC217 DEG C of weld tabs of 0.05mm；
B, low-residual scaling powder is successively coated on shell, preformed soldering, then successively by preformed soldering, microwave electricity
On the smooth loading shell corresponding position of road plate；Wherein, low-residual scaling powder is Alpha EF-9301 scaling powder；
C, with pneumatic dispenser in the first RF isolation, the second RF isolation, the 16th feed insulator and the tenth
Two lap welding cream of spot printing is separately mounted to shell corresponding position hole with tweezers clamping insulator again on seven feed insulator metal outer rings
It is interior, briquetting is then packed into shell, is pressed on microwave circuit boards, and covers cover board and is screwed, so that briquetting is tightly pressed against
On microwave circuit boards；Wherein, soldering paste is OM338 soldering paste；
D, it is placed in the thermal station that temperature is 245 DEG C and is brazed, during paste melts, play screwdriver with cross and persistently revolve
Tight screw removes cooling after the completion of soldering, obtains first assembly to exclude the bubble between microwave circuit boards and shell.
Preferably, step 2 includes:
A, with pneumatic dispenser at first assembly component pad to be pasted spot printing soldering paste, clamped under the microscope with tweezers
Component is mounted on respective pad soldering paste position, and device is placed centrally；Wherein, soldering paste is SN63CR37AGS89.5 soldering paste；
B, insulator, the 4th feed insulator, the 5th feed insulator, the 6th feed are fed in third with pneumatic dispenser
Insulator, the 7th feed insulator, the 8th feed two lap welding cream of spot printing on insulator metal outer ring, then exhausted with tweezers clamping feed
Edge is mounted in the hole of shell corresponding position；Wherein, soldering paste is SN63CR37AGS89.5 soldering paste；
C, it is placed in the thermal station that temperature is 205 DEG C and is sintered, during paste melts, put between two parties with tweezers adjusting device
It puts, while adjusting feed insulator is vertical with shell puts, obtain the second component.
Preferably, step 3 includes:
A, insulator, the tenth feed insulator, the 11st feed insulator, the 12nd are fed the 9th with pneumatic dispenser
Feed insulator, the 13rd feed insulator, the 14th feed insulator, the 15th feed spot printing two on insulator metal outer ring
Lap welding cream, then clamp feed insulator with tweezers and be mounted in the hole of shell corresponding position；Wherein, soldering paste is Sn43Pb43Bi14 weldering
Cream；
B, it is placed in the thermal station that temperature is 175 DEG C and is sintered, during paste melts, adjust feed insulator with tweezers
It is vertical with shell to put, obtain third component.
Preferably, step 4 includes: to lay flat third component face down in the cleaning basket for being placed in automatic vapour phase cleaning machine clearly
It washes, is taken out after cleaning；Wherein, automatic vapour phase cleaning machine parameter setting: temperature is 70-80 DEG C, embathes time 600s, is surpassed
Sound: 100s, power: 30%, drying time: 300s.
6, Ku wave band 120W power amplifier prime module making process according to claim 5, which is characterized in that step 5
Include:
A, it cuts metal indium sheet and pads and isolator is mounted on shell at the isolator back side, and with screw, use electric iron
Melting solder stick welds two pins of isolator with microwave circuit boards lap-joint, wipes solder joint with alcohol swab；
B, it cuts metal indium sheet and pads and amplifier is mounted on shell at the amplifier back side, and with screw；Use electric iron
Melting solder stick welds two pins of amplifier with microwave circuit boards lap-joint, wipes solder joint with alcohol swab；
C, third is fed insulator to the 15th feed insulator and microwave circuit boards with leading by electric iron melting solder stick
Wire bonding is got up, and wipes solder joint with alcohol swab；
D, the 16th feed insulator and the 17th are fed insulator and amplifier conducting wire by electric iron melting solder stick
It welds, wipes solder joint with alcohol swab；
E, the first SMA radio-frequency joint and the 2nd SMA radio-frequency joint are mounted on the first RF isolation and the second radio frequency is exhausted
On edge inner core and it is screwed on shell.
Preferably, step 6 includes cover board being fixed on shell using screw to complete capping.
According to the above technical scheme, the present invention first welds microwave circuit boards and insulator with cavity, then welds
Component and feed insulator；Secondly, carrying out low-temperature welding to feed insulator；Again, vapour phase cleaning is carried out；Finally, carrying out
Denso welding and capping.By test, environmental test, every technical performance index is all satisfied the product produced with this process
Machine requirement, and this manufacture craft is clear, is applicable in batch production.
Other features and advantages of the present invention will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
The drawings are intended to provide a further understanding of the invention, and constitutes part of specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is Ku wave band 120W power amplifier prime module assembling schematic diagram provided by the invention.
Description of symbols
1- shell 2- microwave circuit boards
Sub- the second RF isolation of J2- of the first RF isolation of J1-
J3- third feeds insulator J4- the 4th and feeds insulator
J5- the 5th feeds insulator J6- the 6th and feeds insulator
J7- the 7th feeds insulator J8- the 8th and feeds insulator
J9- the 9th feeds insulator J10- the tenth and feeds insulator
J11- the 11st feeds insulator J12- the 12nd and feeds insulator
J13- the 13rd feeds insulator J14- the 14th and feeds insulator
J15- the 15th feeds insulator J16- the 16th and feeds insulator
J17- the 17th feeds insulator U5- isolator
The first SMA radio-frequency joint of U6- amplifier K1-
The 2nd SMA radio-frequency joint of K2-
Specific embodiment
Below in conjunction with attached drawing, detailed description of the preferred embodiments.It should be understood that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
In the present invention, in the absence of explanation to the contrary, the noun of locality that " upper and lower, inside and outside " etc. is included in the term
Only represent orientation of the term under normal service condition, or be those skilled in the art understand that be commonly called as, and be not construed as pair
The limitation of the term.
Referring to Fig. 1, the present invention provides a kind of Ku wave band 120W power amplifier prime module making process, comprising:
Step 1 welds microwave circuit boards 2 and insulator and cavity；
Step 2, welding component and feed insulator；
Step 3 carries out low-temperature welding to feed insulator；
Step 4, vapour phase cleaning；
Step 5, Denso welding；
Step 6, capping.
Wherein, step 1 includes:
A, that weld tabs is cut into microwave circuit plate shape and weld tabs edge with scalpel is 0.9-1.1mm smaller than printed board, obtains
To preformed soldering；Wherein, weld tabs is the SAC217 DEG C of weld tabs of 0.05mm；
B, low-residual scaling powder is successively coated on shell, preformed soldering, then successively by preformed soldering, microwave electricity
On smooth 1 corresponding position of loading shell of road plate 2；Wherein, low-residual scaling powder is Alpha EF-9301 scaling powder；
C, with pneumatic dispenser in the sub- J1 of the first RF isolation, the sub- J2 of the second RF isolation, the 16th feed insulator J16
Shell 1 is separately mounted to tweezers clamping insulator again with two lap welding cream of spot printing on the 17th feed insulator J17 metal outer ring
In the hole of corresponding position, briquetting is then packed into shell 1, is pressed on microwave circuit boards 2, and cover cover board and be screwed, so that
Briquetting is tightly pressed against on microwave circuit boards 2；Wherein, soldering paste is OM338 soldering paste；
D, it is placed in the thermal station that temperature is 245 DEG C and is brazed, during paste melts, play screwdriver with cross and persistently revolve
Tight screw removes cooling after the completion of soldering, obtains first assembly to exclude the bubble between microwave circuit boards 2 and shell 1.
Step 2 includes:
A, with pneumatic dispenser at first assembly component pad to be pasted spot printing soldering paste, clamped under the microscope with tweezers
Component is mounted on respective pad soldering paste position, and device is placed centrally；Wherein, soldering paste is SN63CR37AGS89.5 soldering paste；
B, insulator J3, the 4th feed insulator J4, the 5th feed insulator J5, the are fed in third with pneumatic dispenser
Six feed insulator J6, the 7th feed insulator J7, the 8th feed two lap welding cream of spot printing on insulator J8 metal outer ring, then use tweezer
Sub-folder takes feed insulator to be mounted in 1 corresponding position hole of shell；Wherein, soldering paste is SN63CR37AGS89.5 soldering paste；
C, it is placed in the thermal station that temperature is 205 DEG C and is sintered, during paste melts, put between two parties with tweezers adjusting device
It puts, while adjusting feed insulator is vertical with shell 1 puts, obtain the second component.
Step 3 includes:
A, insulator J9, the tenth feed insulator J10, the 11st feed insulator are fed the 9th with pneumatic dispenser
J11, the 12nd feed insulator J12, the 13rd feed insulator J13, the 14th feed insulator J14, the 15th feed are exhausted
Two lap welding cream of spot printing on edge J15 metal outer ring, then clamp feed insulator with tweezers and be mounted in 1 corresponding position hole of shell；
Wherein, soldering paste is Sn43Pb43Bi14 soldering paste；
B, it is placed in the thermal station that temperature is 175 DEG C and is sintered, during paste melts, adjust feed insulator with tweezers
It is vertical with shell to put, obtain third component.
Step 4 includes: to lay flat third component face down in the cleaning basket for being placed in automatic vapour phase cleaning machine to clean, cleaning
After take out；Wherein, automatic vapour phase cleaning machine parameter setting: temperature is 70-80 DEG C, embathes time 600s, ultrasound: 100s,
Power: 30%L, drying time: 300s.
Step 5 includes:
A, it cuts metal indium sheet and pads and isolator U5 is mounted on shell 1 at the back side isolator U5, and with screw, electricity consumption
Soldering iron melting solder stick welds two pins of isolator U5 with 2 lap-joint of microwave circuit boards, wipes solder joint with alcohol swab；
B, it cuts metal indium sheet and pads and amplifier U6 is mounted on shell 1 at the back side amplifier U6, and with screw；Electricity consumption
Soldering iron melting solder stick welds two pins of amplifier U6 with 2 lap-joint of microwave circuit boards, wipes solder joint with alcohol swab；
C, third is fed insulator to the 15th feed insulator and microwave circuit boards 2 with leading by electric iron melting solder stick
Wire bonding is got up, and wipes solder joint with alcohol swab；
D, the 16th feed insulator J16 and the 17th are fed insulator J17 and amplifier by electric iron melting solder stick
U6 is welded with conducting wire, wipes solder joint with alcohol swab；
E, the first SMA radio-frequency joint K1 and the 2nd SMA radio-frequency joint K2 are mounted on the first RF isolation J1 and second
On the sub- J2 inner core of RF isolation and it is screwed on shell 1.
Step 6 includes cover board being fixed on shell 1 using screw to complete capping.
Through the above technical solutions, first microwave circuit boards and insulator are welded with cavity, then welding component
With feed insulator；Secondly, carrying out low-temperature welding to feed insulator；Again, vapour phase cleaning is carried out；Finally, carrying out Denso weldering
It connects and covers.By test, environmental test, every technical performance index is all satisfied complete machine and wants the product produced with this process
It asks, and this manufacture craft is clear, is applicable in batch production.
Specifically, in one embodiment, step 1: firstly, with scalpel by weld tabs (model: SAC217 DEG C of thickness
It 0.05mm) is cut into microwave circuit plate shape, and weld tabs edge is 1mm smaller than printed board, obtains preformed soldering.
Then, low-residual scaling powder (model: Alpha EF-9301) successively is coated on shell, preformed soldering, then
It successively will be on preformed soldering, smooth 1 corresponding position of loading shell of microwave circuit boards 2；
Then, with pneumatic dispenser on insulator J1, J2, J16, J17 metal outer ring two lap welding cream of spot printing (model:
OM338 it), then with tweezers clamping insulator J1, J2, J16, J17 is separately mounted in 1 corresponding position hole of shell, then by briquetting
It is packed into shell 1, is pressed on microwave circuit boards 2, and cover cover board and be screwed, so that briquetting is tightly pressed against microwave circuit boards 2
On.
It is brazed finally, being placed in the thermal station that temperature is 245 DEG C, during paste melts, plays screwdriver not with cross
Stop tightening screw, to exclude the bubble between microwave circuit boards and shell as far as possible, removes cooling after the completion of soldering, obtain first group
Part.
Step 2: firstly, with pneumatic dispenser at first assembly component pad to be pasted spot printing soldering paste (model:
SN63CR37AGS89.5), it is mounted on respective pad soldering paste position with tweezers clamping component under the microscope, device is placed in the middle
It places；
Then, with pneumatic dispenser feed insulator J3, J4, J5, J6, J7, J8 metal outer ring on two lap welding cream of spot printing
(model: SN63CR37AGS89.5), then clamp feed insulator J3, J4, J5, J6, J7, J8 with tweezers and be mounted on shell 1 accordingly
In location hole；
Then, it is placed in the thermal station that temperature is 205 DEG C and is sintered, during paste melts, if any device skew, need to use
Tweezers adjusting device, puts device between two parties；It if any feed insulator skew, need to be adjusted with tweezers, make to feed insulator and shell
Body is vertically put, and the second component is obtained.
Step 3: firstly, with pneumatic dispenser in feed insulator J9, J10, J11, J12, J13, J14, J15 metal outer ring
Upper two lap welding cream of spot printing (model: Sn43Pb43Bi14), then with tweezers clamp feed insulator J9, J10, J11, J12, J13,
J14, J15 are mounted in 1 corresponding position hole of shell；
Then, it is placed in the thermal station that temperature is 175 DEG C and is sintered, it is askew if any feed insulator during paste melts
Tiltedly, it need to be adjusted with tweezers, making feed, insulator is vertical with shell puts, and obtains third component.
Step 4: it is placed in the cleaning basket of automatic vapour phase cleaning machine firstly, third component face down is laid flat, it can not heap
Folded, select automatic cleaning function, automatic vapour phase cleaning machine parameter setting: temperature is 75 DEG C, embathes time 600s, ultrasound: 100s,
Power: 30% (L), drying time: 300s takes out third component, delivers next process after cleaning.
Step 5: firstly, cutting the metal indium sheet of suitable dimension size, padding at the back side isolator U5, and will be isolated with screw
Device U5 is mounted on shell, is welded two pins of isolator U5 and microwave circuit boards lap-joint with electric iron fusion weld tin silk
Come, wipes solder joint with alcohol swab；
Secondly, cutting the metal indium sheet of suitable dimension size, pad pacifies amplifier U6 at the back side amplifier U6, and with screw
On shell；Two pins of amplifier U6 are welded with microwave circuit boards lap-joint with electric iron fusion weld tin silk, are used
Alcohol swab wipes solder joint；
Again, electric iron melting solder stick will feed insulator J3~J15 and microwave circuit boards and be welded with conducting wire, weld
The mellow and full light of point wipes solder joint with alcohol swab；
Then, electric iron melting solder stick will feed insulator J16, J17 and amplifier U6 and be welded with conducting wire, solder joint
Mellow and full light wipes solder joint with alcohol swab；
Finally, SMA radio-frequency joint K1, K2 are mounted on sub- J1, J2 inner core of RF isolation and are screwed in shell
On.
Step 6: cover board being fixed on shell with screw, completes capping.
So far, a kind of KU wave band 120W power amplifier prime module making is completed.
It is described the prefered embodiments of the present invention in detail above in conjunction with attached drawing, still, the present invention is not limited to above-mentioned realities
The detail in mode is applied, within the scope of the technical concept of the present invention, a variety of letters can be carried out to technical solution of the present invention
Monotropic type, these simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the present invention to it is various can
No further explanation will be given for the combination of energy.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (7)
1. a kind of Ku wave band 120W power amplifier prime module making process characterized by comprising
Step 1 welds microwave circuit boards (2) and insulator and cavity；
Step 2, welding component and feed insulator；
Step 3 carries out low-temperature welding to feed insulator；
Step 4, vapour phase cleaning；
Step 5, Denso welding；
Step 6, capping.
2. Ku wave band 120W power amplifier prime module making process according to claim 1, which is characterized in that step 1
Include:
A, that weld tabs is cut into microwave circuit plate shape and weld tabs edge with scalpel is 0.9-1.1mm smaller than printed board, obtains pre-
Form weld tabs；Wherein, weld tabs is the SAC217 DEG C of weld tabs of 0.05mm；
B, low-residual scaling powder is successively coated on shell, preformed soldering, then successively by preformed soldering, microwave circuit boards
(2) on smooth loading shell (1) corresponding position；Wherein, low-residual scaling powder is Alpha EF-9301 scaling powder；
C, with pneumatic dispenser in the first RF isolation (J1), the second RF isolation (J2), the 16th feed insulator
(J16) and on the 17th feed insulator (J17) metal outer ring two lap welding cream of spot printing is installed with tweezers clamping insulator respectively again
In shell (1) corresponding position hole, briquetting is then packed into shell (1), is pressed on microwave circuit boards (2), and covers cover board use
Screw is fixed, so that briquetting is tightly pressed against on microwave circuit boards (2)；Wherein, soldering paste is OM338 soldering paste；
D, it is placed in the thermal station that temperature is 245 DEG C and is brazed, during paste melts, play screwdriver with cross and persistently screw spiral shell
Nail removes cooling after the completion of soldering, obtains first assembly to exclude the bubble between microwave circuit boards (2) and shell (1).
3. Ku wave band 120W power amplifier prime module making process according to claim 2, which is characterized in that step 2
Include:
A, with pneumatic dispenser at first assembly component pad to be pasted spot printing soldering paste, clamp first device with tweezers under the microscope
Part is mounted on respective pad soldering paste position, and device is placed centrally；Wherein, soldering paste is SN63CR37AGS89.5 soldering paste；
B, with pneumatic dispenser third feed insulator (J3), the 4th feed insulator (J4), the 5th feed insulator (J5),
6th feed insulator (J6), the 7th feed insulator (J7), the 8th feed two lap welding of spot printing on insulator (J8) metal outer ring
Cream, then clamp feed insulator with tweezers and be mounted in shell (1) corresponding position hole；Wherein, soldering paste SN63CR37AGS89.5
Soldering paste；
C, it is placed in the thermal station that temperature is 205 DEG C and is sintered, during paste melts, put between two parties with tweezers adjusting device,
Adjusting feed simultaneously, insulator is vertical with shell (1) puts, and obtains the second component.
4. Ku wave band 120W power amplifier prime module making process according to claim 3, which is characterized in that step 3
Include:
A, insulator (J9), the tenth feed insulator (J10), the 11st feed insulator are fed the 9th with pneumatic dispenser
(J11), the 12nd feed insulator (J12), the 13rd feed insulator (J13), the 14th feed insulator (J14), the tenth
Two lap welding cream of spot printing on five feed insulator (J15) metal outer rings, then clamp feed insulator with tweezers and be mounted on shell (1) phase
It answers in location hole；Wherein, soldering paste is Sn43Pb43Bi14 soldering paste；
B, it is placed in the thermal station that temperature is 175 DEG C and is sintered, during paste melts, adjust feed insulator and shell with tweezers
Body is vertically put, and third component is obtained.
5. Ku wave band 120W power amplifier prime module making process according to claim 4, which is characterized in that step 4
Include: to lay flat third component face down in the cleaning basket for being placed in automatic vapour phase cleaning machine to clean, is taken out after cleaning；Its
In, automatic vapour phase cleaning machine parameter setting: temperature is 70-80 DEG C, embathes time 600s, ultrasound: 100s, power: 30% (L),
Drying time: 300s.
6. Ku wave band 120W power amplifier prime module making process according to claim 5, which is characterized in that step 5
Include:
A, it cuts metal indium sheet and pads and isolator (U5) is mounted on shell (1) at the back side isolator (U5), and with screw, use
Electric iron melting solder stick welds two pins of isolator (U5) and microwave circuit boards (2) lap-joint, with alcohol cotton rub
Wipe solder joint；
B, it cuts metal indium sheet and pads and amplifier (U6) is mounted on shell (1) at the back side amplifier (U6), and with screw；With
Electric iron melting solder stick welds two pins of amplifier (U6) and microwave circuit boards (2) lap-joint, with alcohol cotton rub
Wipe solder joint；
C, third is fed insulator to the 15th feed insulator and microwave circuit boards (2) and uses conducting wire by electric iron melting solder stick
It welds, wipes solder joint with alcohol swab；
D, the 16th feed insulator (J16) and the 17th are fed insulator (J17) and amplifier by electric iron melting solder stick
(U6) it is welded with conducting wire, wipes solder joint with alcohol swab；
E, the first SMA radio-frequency joint (K1) and the 2nd SMA radio-frequency joint (K2) are mounted on the first RF isolation (J1) and the
On two RF isolations (J2) inner core and it is screwed on shell (1).
7. Ku wave band 120W power amplifier prime module making process according to claim 6, which is characterized in that step 6
Including using screw that cover board is fixed on shell (1) to complete capping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN111988913A (en) * | 2020-08-04 | 2020-11-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of Ku-band power amplifier driver module |
| CN112924780A (en) * | 2021-01-26 | 2021-06-08 | 安徽华东光电技术研究所有限公司 | Debugging device for microwave module and manufacturing method thereof |
| CN114171877A (en) * | 2021-12-07 | 2022-03-11 | 南京长峰航天电子科技有限公司 | Ku frequency band power synthesis module and assembling method thereof |
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