CN110842315A - Production process method of video amplifier - Google Patents
Production process method of video amplifier Download PDFInfo
- Publication number
- CN110842315A CN110842315A CN201911151826.7A CN201911151826A CN110842315A CN 110842315 A CN110842315 A CN 110842315A CN 201911151826 A CN201911151826 A CN 201911151826A CN 110842315 A CN110842315 A CN 110842315A
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- substrate
- tube shell
- video amplifier
- cleaning
- tin
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a production process method of a video amplifier, which is characterized by comprising the following steps: the manufacturing process mainly comprises the following steps: step 1) coating tin materials on a tube shell and a substrate; step 2), brazing the substrate tube shell; step 3), vapor phase ultrasonic cleaning; and 4) coating protective glue. The production process method of the video amplifier is scientific and reasonable, simple in process operation, capable of greatly improving the qualification rate of the video amplifier PIND, suitable for batch production and good in application prospect.
Description
Technical Field
The invention belongs to the technical field of mixed integrated circuit (PIND) test, and particularly relates to a production process method of a video amplifier, which can improve the qualification rate of the PIND test of the video amplifier.
Background
The hybrid integrated circuit module for spaceflight is relatively complex in stress condition and high in reliability requirement due to the particularity of the working environment, a series of tests are required before delivery and in acceptance according to a GJB 548B-2005 microelectronic device test method and program, wherein a PIND test (particle impact noise detection test) is one of the tests, the purpose is to detect free particles in a device packaging cavity, the test is a non-destructive test and is used for testing the device so as to improve the reliability of the device, and the test is commonly used for detecting redundant loose particles in the integrated circuit module and electronic device packaging in the aerospace military field.
In the existing manufactured video amplifier module, the economic loss caused by the unqualified rate of the product PIND test and the unnecessary loss brought to enterprises by wasting a large amount of manpower and material resources cause the low overall qualified rate of the product and fail to reach the expected quality target.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a production process method of a video amplifier, which is scientific and reasonable, simple in process operation, capable of greatly improving the qualification rate of the PIND of the video amplifier and suitable for batch production.
In order to achieve the purpose, the invention adopts the technical scheme that: the provided production process method of the video amplifier is characterized in that: the manufacturing process mainly comprises the following steps: step 1) coating tin materials on a tube shell and a substrate; step 2), brazing the substrate tube shell; step 3), vapor phase ultrasonic cleaning; and 4) coating protective glue.
In order to make the technical scheme more detailed and concrete, the invention also provides the following further preferable technical scheme to obtain satisfactory practical effect:
step 1), the tube shell is placed on a hot table to be preheated, rosin is dipped and coated on the position, to be placed, of the substrate inside the tube shell, molten tin wires rub back and forth in the inner area of the tube shell until the solder uniformly covers the area, to be placed, of the substrate inside the whole tube shell, and a layer of solder layer is formed on the inner surface of the tube shell.
Placing the cleaning tank with the cleaning tank for vapor phase ultrasonic cleaning, and setting a cleaning program: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (10-15) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40 percent (L), and removing rosin in the tube shell through vapor phase ultrasonic cleaning to obtain a fresh soldering tin layer on the inner surface of the tube shell, thereby completing the process of coating tin materials on the tube shell.
In the preheating process, the tube shell is placed on a hot bench with the temperature of 200 +/-5 ℃ for preheating for 3 minutes.
And (4) printing the soldering paste on the back of the substrate in a leaking manner by using the screen printing plate, wherein the soldering paste is distributed on the back of the substrate in a grid shape, and a soldering paste layer is formed on the back of the substrate to finish the process of feeding tin materials on the substrate.
In the step 2), the substrate with the tin material soldering paste layer is flatly placed in the tube shell with the tin material soldering paste layer, and the substrate and the tube shell are placed on a hot table together for preheating; and after preheating is finished, brazing is carried out, after a soldering paste layer on the back of the substrate is melted, the front end of a pair of tweezers is used for contacting the substrate, pressing the substrate downwards and slightly rubbing in each direction, friction welding is carried out, air bubbles are discharged, the substrate and the tube shell are tightly attached and welded, the tube shell with the substrate brazed is obtained, and after the process is finished, the tube shell with the substrate brazed is taken down for heat dissipation and cooling.
In the step 2), the substrate is placed in a tube shell and put on a hot bench with the temperature of 150 +/-5 ℃ for preheating for 3-4 minutes; after preheating, placing the plate on a hot bench at the temperature of 210 +/-5 ℃ for brazing; the whole soldering process is completed within 20-30 s from the melting of the soldering paste to the end of the soldering paste.
And 3) reversely buckling the tube shell brazed with the substrate, placing the tube shell in a cleaning tank for vapor phase ultrasonic cleaning, then placing the tube shell in absolute ethyl alcohol for brush cleaning for 5 +/-1 minutes by using a brush, and naturally drying.
Setting a cleaning program: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (30-35) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40% (L).
And 4) performing spot coating on the protective adhesive in the needle tube along the edge gap between the substrate and the tube shell by using a pneumatic dispenser, wherein the glue amount of the spot coating covers the soldering tin and cannot exceed the height of the substrate, and performing normal-temperature curing for 24 hours after the spot coating is finished.
Compared with the prior art, the invention has the following advantages: the production process method of the video amplifier is scientific and reasonable, simple in process operation, capable of greatly improving the qualification rate of the video amplifier PIND, suitable for batch production and good in application prospect.
Drawings
The contents of the drawings and the reference numerals in the drawings of the present specification will be briefly described as follows:
FIG. 1 is a schematic illustration of a substrate tube brazing process of the present invention;
FIG. 2 is a schematic illustration of the present invention applied with protective glue;
reference numerals: 1. a pipe shell; 2. a substrate; 3. a solder layer; 4. welding a paste layer; 5. protective glue;
Detailed Description
The following description of the embodiments of the present invention will be made in detail with reference to the accompanying drawings.
The production process method of the video amplifier mainly comprises the following steps: step 1) coating tin materials on a tube shell and a substrate; step 2), brazing the substrate tube shell; step 3), vapor phase ultrasonic cleaning; and 4) coating protective glue.
Step 1), the pipe shell 1 is placed on a hot table to be preheated, rosin is dipped and coated on the position, to be placed, of the base plate 2 inside the pipe shell 1, the melted soldering tin wire rubs back and forth in the area inside the pipe shell 1 until the soldering tin uniformly covers the area, to be placed, of the base plate 2 inside the whole pipe shell, and a layer of soldering tin layer 3 is formed on the inner surface of the pipe shell 1.
Placing the cleaning tank with the cleaning tank for vapor phase ultrasonic cleaning, and setting a cleaning program: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (10-15) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40 percent (L), and removing rosin in the tube shell by vapor phase ultrasonic cleaning to obtain a fresh soldering tin layer 3 on the inner surface of the tube shell and finish the process of soldering materials on the tube shell 1.
In the preheating process, the tube shell 1 is placed on a hot table at a temperature of 200 ± 5 ℃ to be preheated for 3 minutes.
And (3) printing the soldering paste on the back of the substrate in a leaking way by the screen printing plate, wherein the soldering paste is distributed on the back of the substrate in a grid shape, and a soldering paste layer 4 is formed on the back of the substrate to finish the process of coating tin on the substrate 2.
In the step 2), the substrate with the tin soldering paste layer is flatly placed in the tube shell 1 with the tin soldering paste layer, and the substrate and the tube shell are placed on a hot table together for preheating; and after preheating is finished, brazing is carried out, after a soldering paste layer on the back of the substrate is melted, the front end of a pair of tweezers is in contact with the substrate 2 to press the substrate 2 downwards and slightly rub in each direction, friction welding is carried out, air bubbles are discharged, the substrate and the tube shell are tightly attached and welded, the tube shell 1 with the substrate 2 brazed is obtained, and after the process is finished, the tube shell 1 with the substrate 2 brazed is taken down for heat dissipation and cooling.
In the step 2), the substrate is placed in a tube shell and put on a hot bench with the temperature of 150 +/-5 ℃ for preheating for 3-4 minutes; after preheating, placing the plate on a hot bench at the temperature of 210 +/-5 ℃ for brazing; the whole soldering process is completed within 20-30 s from the melting of the soldering paste to the end of the soldering paste.
And 3) reversely buckling the tube shell 1 brazed with the substrate 2, placing the tube shell in a cleaning tank for vapor phase ultrasonic cleaning, then placing the tube shell in absolute ethyl alcohol for brushing and cleaning for 5 +/-1 minutes by using a brush, and naturally drying.
Setting a cleaning program: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (30-35) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40% (L).
And 4) performing spot coating on the protective adhesive in the needle tube along the edge gap between the substrate and the tube shell by using a pneumatic dispenser, wherein the glue amount of the spot coating covers the soldering tin and cannot exceed the height of the substrate, and performing normal-temperature curing for 24 hours after the spot coating is finished.
The invention relates to a production process method of a video amplifier, which mainly comprises the following steps:
step 1: a tin material is coated on the package and the substrate.
Placing a nickel-plated Kovar tube shell (hereinafter referred to as a tube shell 1) on a hot bench at the temperature of 200 +/-5 ℃ for preheating for 3 minutes, dipping rosin with a cotton swab to coat the rosin on a substrate 2 to be placed in the tube shell, melting a soldering tin wire (model: Sn63Pb37) with a horseshoe-shaped soldering iron head, rubbing back and forth in an inner area of the tube shell until the soldering tin uniformly covers the whole area of the substrate placed in the tube shell, forming a layer of soldering tin layer on the inner surface of the tube shell, then placing the tube shell in a cleaning tank containing CABZOL CEG CLEANER cleaning agent for vapor phase ultrasonic cleaning, and setting a cleaning program: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (10-15) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40 percent (L), removing rosin in the tube shell by vapor-phase ultrasonic cleaning to obtain a fresh soldering tin layer 3 on the inner surface of the tube shell, namely completing the process of soldering materials on the tube shell;
and (3) printing the soldering paste (model: Sn63Pb37) on the back surface of the substrate by a screen printing plate, distributing the soldering paste on the back surface of the substrate in a grid shape, and forming a soldering paste layer 4 on the back surface of the substrate, namely completing the process of tin material on the substrate.
Step 2: and (4) brazing the substrate tube shell.
According to a schematic diagram 1 of substrate tube-shell brazing, a substrate 2 with a tin material soldering paste layer is flatly placed in a tube shell 1 with the tin material soldering paste layer, and the substrate 2 and the tube shell are placed on a hot bench at the temperature of 150 +/-5 ℃ to be preheated for 3-4 minutes; after preheating, placing the tube on a hot table at the temperature of 210 +/-5 ℃ for brazing, after a soldering paste layer on the back of the substrate is melted, contacting the front end of a tweezers with the substrate, pressing the substrate downwards, slightly rubbing the substrate in each direction, performing friction welding, discharging bubbles, enabling the substrate and the tube shell to be tightly attached and welded to obtain the tube shell with the substrate brazed, and taking down the tube shell with the substrate brazed for heat dissipation and cooling after the tube shell is finished. The whole brazing process is completed within 20-30 s from the melting to the finishing of the soldering paste, the time is strictly controlled, the time cannot be overtime, and the tin soldering oxidation during the time process is avoided to generate tin slag.
And step 3: vapor phase ultrasonic cleaning.
The tube shell with the substrate soldered is placed in a reversed way in a cleaning tank with CABZOL CEG CLEANER cleaning agent for vapor phase ultrasonic cleaning, and a cleaning program is set: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (30-35) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40 percent (L), removing the soldering flux, soldering tin particles and the like in the tube shell by vapor phase ultrasonic cleaning, then putting the tube shell into absolute ethyl alcohol, brushing and cleaning the tube shell for 5 +/-1 minutes by using a brush, and naturally drying the tube shell.
And 4, step 4: coating protective glue
According to the protective glue coating schematic diagram 2, a pneumatic dispenser is used for dispensing the protective glue 5 in the needle tube along the edge gap between the substrate 2 and the tube shell 1, the dispensed glue is covered with the soldering tin, the height of the substrate cannot be exceeded, and the normal temperature curing is carried out for 24 hours after the dispensing is finished. The protective adhesive is RTV3140 silicone adhesive.
Therefore, the process method for improving the PIND qualified rate of the video amplifier is completed.
The invention aims to provide a process method for improving the PIND yield of a video amplifier. The manufacturing process of the video amplifier manufactured at present comprises the following steps: the nickel-plated shell and the substrate are both subjected to tin coating treatment and then placed on a hot table for brazing, the tin soldering between the shell and the substrate is fast in oxidation, honeycomb-shaped welding slag welding wires exist, and the welding slag welding wires can fall off during a PIND test, so that the PIND percent of pass after capping is low. By adopting the invention, the soldering paste is used for soldering, and as the soldering flux in the soldering paste is protected in the soldering process and the soldering time is short, the soldering tin is not easy to oxidize, and honeycomb-shaped welding slag welding wires cannot be generated between the shell and the substrate; and RTV3140 silicone adhesive is coated on the edge between the shell and the substrate, and the soldering tin is covered, so that the soldering tin is prevented from falling off, primary protection is added, and the qualification rate of the video amplifier PIND is further improved.
The invention provides a production process method for improving the qualification rate of the PIND of the video amplifier, the process method is scientific and reasonable, the process operation is simple, and the popularization significance is very high. The production process method of the video amplifier is scientific and reasonable, simple in process operation, capable of greatly improving the qualification rate of the video amplifier PIND, suitable for batch production and good in application prospect.
The invention has been described above with reference to the accompanying drawings, but the invention is not limited to the above-described embodiments, and it is within the scope of the invention to use various insubstantial modifications of the inventive concept and solutions or to apply them directly to other applications.
Claims (10)
1. A production process method of a video amplifier is characterized by comprising the following steps: the manufacturing process mainly comprises the following steps: step 1) coating tin materials on a tube shell and a substrate; step 2), brazing the substrate tube shell; step 3), vapor phase ultrasonic cleaning; and 4) coating protective glue.
2. A process for producing a video amplifier as set forth in claim 1, wherein: step 1), the tube shell is placed on a hot table to be preheated, rosin is dipped and coated on the position, to be placed, of the substrate inside the tube shell, molten tin wires rub back and forth in the inner area of the tube shell until the solder uniformly covers the area, to be placed, of the substrate inside the whole tube shell, and a layer of solder layer is formed on the inner surface of the tube shell.
3. A process for producing a video amplifier as set forth in claim 2, wherein: placing the cleaning tank with the cleaning tank for vapor phase ultrasonic cleaning, and setting a cleaning program: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (10-15) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40 percent (L), and removing rosin in the tube shell through vapor phase ultrasonic cleaning to obtain a fresh soldering tin layer on the inner surface of the tube shell, thereby completing the process of coating tin materials on the tube shell.
4. A process for producing a video amplifier as set forth in claim 2, wherein: in the preheating process, the tube shell is placed on a hot bench with the temperature of 200 +/-5 ℃ for preheating for 3 minutes.
5. A process for producing a video amplifier as set forth in claim 1, wherein: and (4) printing the soldering paste on the back of the substrate in a leaking manner by using the screen printing plate, wherein the soldering paste is distributed on the back of the substrate in a grid shape, and a soldering paste layer is formed on the back of the substrate to finish the process of feeding tin materials on the substrate.
6. A process for producing a video amplifier as set forth in claim 1, wherein: in the step 2), the substrate with the tin material soldering paste layer is flatly placed in the tube shell with the tin material soldering paste layer, and the substrate and the tube shell are placed on a hot table together for preheating; and after preheating is finished, brazing is carried out, after a soldering paste layer on the back of the substrate is melted, the front end of a pair of tweezers is used for contacting the substrate, pressing the substrate downwards and slightly rubbing in each direction, friction welding is carried out, air bubbles are discharged, the substrate and the tube shell are tightly attached and welded, the tube shell with the substrate brazed is obtained, and after the process is finished, the tube shell with the substrate brazed is taken down for heat dissipation and cooling.
7. A process for producing a video amplifier as set forth in claim 6, wherein: in the step 2), the substrate is placed in a tube shell and put on a hot bench with the temperature of 150 +/-5 ℃ for preheating for 3-4 minutes; after preheating, placing the plate on a hot bench at the temperature of 210 +/-5 ℃ for brazing; the whole soldering process is completed within 20-30 s from the melting of the soldering paste to the end of the soldering paste.
8. A process for producing a video amplifier according to claim 7, wherein: and 3) reversely buckling the tube shell brazed with the substrate, placing the tube shell in a cleaning tank for vapor phase ultrasonic cleaning, then placing the tube shell in absolute ethyl alcohol for brush cleaning for 5 +/-1 minutes by using a brush, and naturally drying.
9. A process for producing a video amplifier as set forth in claim 8, wherein: setting a cleaning program: the temperature is (70 +/-5) DEG C, the immersion cleaning time is (30-35) min, and the ultrasonic time is as follows: 10min, ultrasonic power: 40% (L).
10. A process for producing a video amplifier as set forth in claim 1, wherein: and 4) performing spot coating on the protective adhesive in the needle tube along the edge gap between the substrate and the tube shell by using a pneumatic dispenser, wherein the glue amount of the spot coating covers the soldering tin and cannot exceed the height of the substrate, and performing normal-temperature curing for 24 hours after the spot coating is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911151826.7A CN110842315A (en) | 2019-11-22 | 2019-11-22 | Production process method of video amplifier |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911151826.7A CN110842315A (en) | 2019-11-22 | 2019-11-22 | Production process method of video amplifier |
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| CN110842315A true CN110842315A (en) | 2020-02-28 |
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| CN201911151826.7A Pending CN110842315A (en) | 2019-11-22 | 2019-11-22 | Production process method of video amplifier |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111570954A (en) * | 2020-05-22 | 2020-08-25 | 成都西科微波通讯有限公司 | Brazing sealing process for TO type metal package |
| CN111952152A (en) * | 2020-08-04 | 2020-11-17 | 安徽华东光电技术研究所有限公司 | Bare chip packaging method |
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| CN110213925A (en) * | 2019-06-04 | 2019-09-06 | 安徽华东光电技术研究所有限公司 | A kind of frequency pressure conversion module production method and its frequency pressure conversion module |
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