CN107394335A - Manufacturing process of the path of Ku wave bands four to waveguide power synthesizer - Google Patents
Manufacturing process of the path of Ku wave bands four to waveguide power synthesizer Download PDFInfo
- Publication number
- CN107394335A CN107394335A CN201710478804.6A CN201710478804A CN107394335A CN 107394335 A CN107394335 A CN 107394335A CN 201710478804 A CN201710478804 A CN 201710478804A CN 107394335 A CN107394335 A CN 107394335A
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- Prior art keywords
- probe
- base
- main body
- manufacturing process
- soldering
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
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- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Abstract
A kind of manufacturing process from path of Ku wave bands four to waveguide power synthesizer the invention discloses, including：Step 1：Make preformed soldering；Step 2：The pre-coated tin processing of structural member；Step 3：Cleaning；Step 4：Sintering；Step 5：Capping.The manufacturing process solves the problems, such as that product performance index uniformity is good during the batch production of product, realizability is strong.
Description
Technical field
The present invention relates to the technique production field of microwave power device, in particular it relates to a kind of tunnel radial wave of Ku wave bands four
Lead the manufacturing process of power combiner.
Background technology
With the high speed development of mechanics of communication, requirement more and more higher of the people to microwave applications system, especially it is in transmitting-receiving
In terms of system, operating distance and antijamming capability to receive-transmit system require more and more higher, and the size of receive-transmit system power determines
The operating distance and antijamming capability of whole system, high power amplifier are key components essential in transmitter system,
But because the power output of solid state microwave power amplifier is not high, in order to obtain powerful output, generally using the method for power combing
Multiple power amplifier parallel synthesis are exported.Therefore, power combiner arises at the historic moment, and the performance of power combiner, can
Mass production significantly depends on its manufacture craft, with the requirement more and more higher to power combiner performance indications,
Traditional manufacture craft is increasingly difficult to meet requirement, and invention is a kind of can to meet that properties of product require that and can meets batch production
Manufacture craft is extremely urgent, is also huge challenge to microwave production technology field.
The content of the invention
A kind of manufacturing process from path of Ku wave bands four to waveguide power synthesizer it is an object of the invention to provide, the work
Skill preparation method solves the problems, such as that product performance index uniformity is good during the batch production of product, realizability is strong.
To achieve these goals, the technique system the invention provides a kind of path of Ku wave bands four to waveguide power synthesizer
Make method, including：
Step 1：Make preformed soldering；
Step 2：The pre-coated tin processing of structural member；
Step 3：Cleaning；
Step 4：Sintering；
Step 5：Capping.
Preferably, step 1 includes the size according to each solder side on probe, base, main body and cover plate, cuts corresponding pre-
It is molded weld tabs, it is desirable to which the area of preformed soldering is smaller 75%-80% than the area of solder side.
Preferably, step 2 includes：
A, probe, main body and base are placed on heating platform and preheat 3-5min；
B, probe is provided with heating platform the upper surface of screwed hole one end, base groove surface, the main body back side and
The upper surface portion of base places soldering paste；
C, using electric iron uniform scratch soldering paste, until soldering paste and solder side uniformly penetrating, form eutectic so that solder side
Surface is smooth；Wherein,
The soldering paste that pre-coated tin uses is 183 DEG C of solder(ing) pastes, and the heating platform temperature setting during pre-coated tin is
120-160℃。
Preferably, fluxing agent is also placed when friction welding is carried out in step c in weld.
Preferably, step 3 includes the probe, base and main body that are covered with scolding tin after step 2 being placed in cleaning fluid soaking
Steep and be cleaned by ultrasonic, check on solder side whether there is welding residue after ultrasonic cleaning, baking oven baking is put into after passed examination
It is dry stand-by.
Preferably, step 4 includes：
A, assemble：Preformed soldering is placed into the groove of base first, probe is encased in out reeded base and led to
In hole, probe penetrates from bottom portion of groove, by through hole, ensures that the pre-coated tin face of probe fully contacts with base, secondly, preforming
Weld tabs is placed on the base equipped with probe, main body face down, is encased on the base equipped with probe and weld tabs, and probe is from master
Body central through hole passes through, and passes main body reverse side always；
B, sinter：Product after assembling is placed on heating platform and is sintered, meanwhile, used during sintering
Frock carries out application pressure to product, to ensure welding effect；Wherein,
Temperature is arranged to 240-250 DEG C in heating platform sintering process, heat time 3-5min.
Preferably, step 5 includes：
A, according to the pre-coated 120 DEG C of scolding tin of step 1 and 2 reverse side at the back side of cover plate, main body and clean up；
B, preformed soldering patch on the cover board, cover plate lid is in the main body equipped with base and probe, and is inverted to be placed on and adds
Apply pressure on hot platform and sinter；Wherein,
Temperature is arranged to 160-180 DEG C in heating platform sintering process, heat time 1-2min.
According to above-mentioned technical proposal, the present invention realizes the connection between each structural member by the way of solder welding, ensures
Contact between each solder side is close, solves the problems such as product index uniformity, is easy to mass production.Use welding
Technology mode, each parameter of production technology is easily controllable, and welding effect can be detected by X-ray.And welded using solder,
Product maintenanceability is strong, and Rework Technics are simple.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Accompanying drawing is for providing a further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is a kind of reverse structure schematic of four path for being provided in the present invention to the main body of waveguide power synthesizer；
Fig. 2 is a kind of positive structure schematic of four path for being provided in the present invention to the main body of waveguide power synthesizer；
Fig. 3 is a kind of structural representation of four path for being provided in the present invention to the base of waveguide power synthesizer；
Fig. 4 is a kind of structural representation of four path for being provided in the present invention to the cover plate of waveguide power synthesizer；
Fig. 5 is a kind of structural representation of four path for being provided in the present invention to the probe of waveguide power synthesizer；And
Fig. 6 is a kind of assembling schematic diagram of four path for being provided in the present invention to waveguide power synthesizer.
Description of reference numerals
1- main body 2- bases
3- cover plate 4- probes
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
In the present invention, in the case where not making opposite explanation, " upper and lower, inside and outside " etc. is included in the noun of locality in term
Only represent orientation of the term under normal service condition, or be skilled artisan understands that be commonly called as, and be not construed as pair
The limitation of the term.
Referring to Fig. 1-6, the present invention provides a kind of manufacturing process of path of Ku wave bands four to waveguide power synthesizer, bag
Include：
Step 1：Make preformed soldering；
Step 2：The pre-coated tin processing of structural member；
Step 3：Cleaning；
Step 4：Sintering；
Step 5：Capping.
The mode realization body that conventional radial waveguide power combiner manufacture craft generally use screw is fastenedly connected with
Fixation between base, probe, cover plate, it is strict to the requirement on machining accuracy of structural member, the cost of manufacture of raw material is added, and
Product parameters uniformity is poor.And by the above-mentioned technical proposal of the present invention, realize each structural member by the way of solder welding
Between connection, ensure that the contact between each solder side is close, solve the problems such as product index uniformity, be easy to mass
Production.Using the technology mode of welding, each parameter of production technology is easily controllable, and welding effect can be detected by X-ray.
And welded using solder, product maintenanceability is strong, and Rework Technics are simple.
Wherein, step 1 is included according to the size of each solder side on probe, base, main body and cover plate, cut it is corresponding in advance into
Type weld tabs, it is desirable to which the area of preformed soldering is smaller 75%-80% than the area of solder side.
Step 2 includes：A, probe, main body and base are placed on heating platform and preheat 3-5min；B, in heating platform
On the upper surface portion of the upper surface of screwed hole one end, base groove surface, the main body back side and base be provided with to probe place
Soldering paste；C, using electric iron uniform scratch soldering paste, until soldering paste and solder side uniformly penetrating, form eutectic so that solder side table
Face is smooth；Wherein, the soldering paste that pre-coated tin uses is 183 DEG C of solder(ing) pastes, and the heating platform temperature setting during pre-coated tin
For 120-160 DEG C.Also, also place fluxing agent in weld when friction welding is carried out in the step c of step 2.
Step 3 includes the probe, base and main body that are covered with scolding tin after step 2 being placed in cleaning fluid soaking and carrying out
It is cleaned by ultrasonic, checks on solder side whether there is welding residue after ultrasonic cleaning, it is stand-by to be put into oven for drying after passed examination.
Step 4 includes：A, assemble：Preformed soldering is placed into the groove of base first, probe be encased in be provided with it is recessed
In the base plate through holes of groove, probe penetrates from bottom portion of groove, by through hole, ensures that the pre-coated tin face of probe fully contacts with base, its
It is secondary, preformed soldering is placed on the base equipped with probe, main body face down, is encased in the base equipped with probe and weld tabs
On, probe passes through from main center's through hole, and passes main body reverse side always；B, sinter：Product after assembling is placed into and added
It is sintered on hot platform, meanwhile, application pressure is carried out to product using frock during sintering, to ensure welding effect
Fruit；Wherein, temperature is arranged to 240-250 DEG C in heating platform sintering process, heat time 3-5min.
Step 5 includes：A, done according to the pre-coated 120 DEG C of scolding tin of step 1 and 2 reverse side at the back side of cover plate, main body and cleaning
Only；B, preformed soldering patch on the cover board, cover plate lid is in the main body equipped with base and probe, and is inverted and is placed on heating platform
Upper application pressure simultaneously sinters；Wherein, temperature is arranged to 160-180 DEG C in heating platform sintering process, heat time 1-2min.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (7)
1. a kind of path of Ku wave bands four is to the manufacturing process of waveguide power synthesizer, it is characterised in that including：
Step 1：Make preformed soldering；
Step 2：The pre-coated tin processing of structural member；
Step 3：Cleaning；
Step 4：Sintering；
Step 5：Capping.
2. manufacturing process according to claim 1, it is characterised in that step 1 is included according to probe, base, main body
With the size of each solder side on cover plate, corresponding preformed soldering is cut, it is desirable to face of the area of preformed soldering than solder side
The small 75%-80% of product.
3. manufacturing process according to claim 2, it is characterised in that step 2 includes：
A, probe, main body and base are placed on heating platform and preheat 3-5min；
B, the upper surface, base groove surface, the main body back side and base of screwed hole one end are provided with to probe on heating platform
Upper surface portion place soldering paste；
C, using electric iron uniform scratch soldering paste, until soldering paste and solder side uniformly penetrating, form eutectic so that solder side surface
It is smooth；Wherein,
The soldering paste that pre-coated tin uses is 183 DEG C of solder(ing) pastes, and the heating platform temperature setting during pre-coated tin is 120-160
℃。
4. manufacturing process according to claim 3, it is characterised in that carry out welding during friction welding in step c
Also place fluxing agent in place.
5. manufacturing process according to claim 4, it is characterised in that step 3 includes that scolding tin will be covered with after step 2
Probe, base and main body, which are placed in cleaning fluid, to be soaked and is cleaned by ultrasonic, after ultrasonic cleaning check solder side on whether
There is welding residue, it is stand-by to be put into oven for drying after passed examination.
6. manufacturing process according to claim 5, it is characterised in that step 4 includes：
A, assemble：Preformed soldering is placed into the groove of base first, probe is encased in out in reeded base plate through holes,
Probe penetrates from bottom portion of groove, by through hole, ensures that the pre-coated tin face of probe fully contacts with base, secondly, preformed soldering
It is placed on the base equipped with probe, main body face down, is encased on the base equipped with probe and weld tabs, probe is from main body
Heart through hole passes through, and passes main body reverse side always；
B, sinter：Product after assembling is placed on heating platform and is sintered, meanwhile, frock is used during sintering
Application pressure is carried out to product, to ensure welding effect；Wherein,
Temperature is arranged to 240-250 DEG C in heating platform sintering process, heat time 3-5min.
7. manufacturing process according to claim 6, it is characterised in that step 5 includes：
A, according to the pre-coated 120 DEG C of scolding tin of step 1 and 2 reverse side at the back side of cover plate, main body and clean up；
B, preformed soldering patch on the cover board, cover plate lid is in the main body equipped with base and probe, and is inverted and is placed on heated flat
Apply pressure on platform and sinter；Wherein,
Temperature is arranged to 160-180 DEG C in heating platform sintering process, heat time 1-2min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710478804.6A CN107394335A (en) | 2017-06-22 | 2017-06-22 | Manufacturing process of the path of Ku wave bands four to waveguide power synthesizer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710478804.6A CN107394335A (en) | 2017-06-22 | 2017-06-22 | Manufacturing process of the path of Ku wave bands four to waveguide power synthesizer |
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| CN107394335A true CN107394335A (en) | 2017-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710478804.6A Pending CN107394335A (en) | 2017-06-22 | 2017-06-22 | Manufacturing process of the path of Ku wave bands four to waveguide power synthesizer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109570867A (en) * | 2018-12-10 | 2019-04-05 | 安徽华东光电技术研究所有限公司 | For improving the welding tooling and its welding method of large-area substrates welding penetration rate |
| CN110977072A (en) * | 2019-12-10 | 2020-04-10 | 安徽华东光电技术研究所有限公司 | Low-temperature sintering method of eutectic component |
| CN114976553A (en) * | 2022-05-14 | 2022-08-30 | 深圳天宇星通科技有限公司 | Ku waveband waveguide power combiner and preparation method thereof |
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| CN105914442A (en) * | 2016-04-14 | 2016-08-31 | 安徽华东光电技术研究所 | Ku frequency band four-path radial waveguide power combiner |
| CN106129574A (en) * | 2016-08-25 | 2016-11-16 | 安徽华东光电技术研究所 | Cavity body filter and preparation method thereof |
| CN106711558A (en) * | 2015-11-13 | 2017-05-24 | 康普公司意大利有限责任公司 | Filter component, tuning component and method of tuning filter |
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- 2017-06-22 CN CN201710478804.6A patent/CN107394335A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711558A (en) * | 2015-11-13 | 2017-05-24 | 康普公司意大利有限责任公司 | Filter component, tuning component and method of tuning filter |
| CN105914442A (en) * | 2016-04-14 | 2016-08-31 | 安徽华东光电技术研究所 | Ku frequency band four-path radial waveguide power combiner |
| CN106129574A (en) * | 2016-08-25 | 2016-11-16 | 安徽华东光电技术研究所 | Cavity body filter and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109570867A (en) * | 2018-12-10 | 2019-04-05 | 安徽华东光电技术研究所有限公司 | For improving the welding tooling and its welding method of large-area substrates welding penetration rate |
| CN110977072A (en) * | 2019-12-10 | 2020-04-10 | 安徽华东光电技术研究所有限公司 | Low-temperature sintering method of eutectic component |
| CN114976553A (en) * | 2022-05-14 | 2022-08-30 | 深圳天宇星通科技有限公司 | Ku waveband waveguide power combiner and preparation method thereof |
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Application publication date: 20171124 |