CN112834788A - Tester joint and butt joint assembly - Google Patents
Tester joint and butt joint assembly Download PDFInfo
- Publication number
- CN112834788A CN112834788A CN202011322855.8A CN202011322855A CN112834788A CN 112834788 A CN112834788 A CN 112834788A CN 202011322855 A CN202011322855 A CN 202011322855A CN 112834788 A CN112834788 A CN 112834788A
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- 210000001503 joint Anatomy 0.000 title description 3
- 238000003032 molecular docking Methods 0.000 claims abstract description 252
- 238000010168 coupling process Methods 0.000 claims abstract description 35
- 238000005859 coupling reaction Methods 0.000 claims abstract description 35
- 230000008878 coupling Effects 0.000 claims abstract description 32
- 239000012530 fluid Substances 0.000 claims description 41
- 238000004140 cleaning Methods 0.000 claims description 29
- 238000013459 approach Methods 0.000 claims description 4
- 230000003750 conditioning effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 35
- 238000012937 correction Methods 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 15
- 238000012546 transfer Methods 0.000 description 10
- 238000001816 cooling Methods 0.000 description 7
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to processors. Specifically, according to an embodiment of the present invention, there may be provided a tester coupling part which can be coupled to any one of a tester and a handler provided with a socket base which can receive a device, including a docking plate in which an opening part for exposing the device provided in the socket base to the handler and a plurality of guide parts having one of a groove and a protrusion are formed, at least a portion of the plurality of guide parts being coupled to a plurality of tester guides formed in the tester so that the docking plate can be coupled to the tester, and a docking assembly.
Description
Technical Field
The invention relates to a tester joint and a butt joint component.
Background
A test handler (test handler) is a device that supports testing of devices such as semiconductor elements manufactured by a predetermined manufacturing process, classifies electronic components according to the test results, and then loads them into customer trays (customer trays).
In order for the test handler to test devices such as semiconductor elements, a TESTER (TESTER) is required to electrically connect the devices and test them. Such a tester is manufactured separately from the test handler and may be shipped separately from the test handler. On the other hand, in order to use the test handler and the tester, the tester needs to be securely attached to the test handler. Conventionally, a test handler and a tester are fastened by bolt fastening.
However, in order to stably operate the device, it is necessary to perform inspection regularly or irregularly, and when a problem occurs in the tester, it is necessary to separate the tester from the test processor. Since this separation is performed by a user placing his or her hand in the test handler and directly unbolting it, it is difficult to separate the tester from the test handler once it is docked to the test handler.
In addition, when the test handler is separated from and coupled to the tester multiple times, the screw thread formed in the socket base as a part of the tester may be damaged. In order to replace the socket base, a large number of wires provided around the socket base need to be reconnected, and the replacement time is long. In addition, when the wiring is not accurately connected after the socket base is replaced, there is also a case where the entire tester is replaced.
Therefore, a tester combining part capable of easily combining and separating the tester and the test handler is required.
Disclosure of Invention
The present invention has been made in view of the above background, and aims to provide a tester bonding section that can be easily bonded to and separated from a tester.
In addition, it is intended to provide a tester joint capable of preventing a dew condensation phenomenon from occurring around a device during a test.
According to an aspect of the present invention, there may be provided a tester coupling part which may be coupled to any one of a tester and a handler provided with a socket base which may receive a device, including a docking plate in which a plurality of opening parts for exposing the device provided in the socket base to the handler and a guide part having one shape of a groove and a protrusion are formed, at least a portion of the plurality of guide parts being coupled to a plurality of tester guides formed in the tester so that the docking plate may be coupled to the tester.
Further, there may be provided a tester combining part which can be combined with any one of a tester provided with a socket base which can accommodate a device and a processor, including: a docking assembly engageable with the socket base; and a docking plate formed with an opening portion for exposing the device disposed in the socket base to the handler and surrounding at least a portion of the docking assembly, the docking plate being capable of fixing a position of the socket base with respect to the docking plate by supporting the docking assembly when the tester approaches the docking plate by a predetermined distance or less.
Further, there may be provided a tester combining part, the docking assembly including an auxiliary docking unit connectable with the socket base, the docking plate including a locking device in which a clamping member is provided to be driven to advance and retreat toward the auxiliary docking unit in order to selectively support the auxiliary docking unit, the clamping member supporting the auxiliary docking unit connected with the socket base, whereby the locking device may fix a position of the socket base with respect to the docking plate.
Further, a tester coupling part may be provided, wherein the auxiliary docking unit includes a roller part that rotates by being in contact with the chucking member advanced toward the auxiliary docking unit, and the chucking member is driven to advance and retreat toward the roller part.
Further, a tester combining part may be provided, and the docking assembly may include a cleaning kit, which may form a cleaning flow path together with the socket base and flow a humidity adjusting fluid through the cleaning flow path.
Further, a tester combining part may be provided, the docking assembly having a combining hole formed therein, a combining protrusion formed in the socket base being penetratingly inserted into the combining hole, and the docking plate may fix a position of the socket base with respect to the docking plate by combining with the combining protrusion penetrating the combining hole.
Further, there may be provided a docking assembly which is capable of being combined with either a tester provided with a socket base capable of accommodating a device or a processor for transferring the device to the tester, the docking assembly including: an auxiliary docking unit connectable with the socket base; and a cleaning kit that forms a cleaning flow path together with the socket base, and that allows the humidity adjustment fluid received from either the tester or the processor to flow through the cleaning flow path.
According to the present invention, it is possible to easily combine and separate the tester.
In addition, the dew condensation phenomenon can be prevented from occurring around the device when the device is tested.
Drawings
FIG. 1 is a top view of a processor according to an embodiment of the invention.
Fig. 2 is a perspective view of a tester interface according to an embodiment of the present invention.
Fig. 3 is a bottom perspective view of the tester interface of fig. 2.
Fig. 4 is an exploded perspective view of the tester attachment part of fig. 2.
Figure 5 shows a side view of the locking device moving towards the roll portion of figure 2.
Fig. 6 is a perspective view of the auxiliary docking unit, the cleaning kit, and the socket base of fig. 2.
Fig. 7 is a transverse cross-sectional view of the main docking unit of fig. 2.
Fig. 8 is a transverse sectional view of the temperature adjusting unit of fig. 2.
Fig. 9 is a bottom view of the cleaning kit of fig. 7.
Fig. 10 is a perspective view of a docking assembly and a socket base according to a second embodiment of the present invention.
Detailed Description
Hereinafter, specific embodiments for implementing the spirit of the present invention will be described in detail with reference to the accompanying drawings.
In addition, in explaining the present invention, when it is judged that a specific explanation of a related known configuration or function may make the gist of the present invention unclear, a detailed description thereof will be omitted.
In addition, when a component is referred to as being "connected," "supported," "communicated," "supplied," "docked," "coupled," "fastened," and "secured" to another component, it is to be understood that the component may be directly connected, supported, communicated, supplied, docked, coupled, fastened, and secured to the other component, but other components may exist in between.
The terminology used in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular references include plural references unless the context clearly dictates otherwise.
In addition, terms including ordinal numbers such as first, second, etc., may be used to describe various constituent elements, but the corresponding constituent elements are not limited by the terms. These terms are only used to distinguish one constituent element from another constituent element.
The meaning of "comprising" as used in the specification is to specify the presence of stated features, regions, integers, steps, actions, elements, and/or components, but does not preclude the presence or addition of other specified features, regions, integers, steps, actions, elements, components, and/or groups thereof.
In addition, in this specification, expressions of the bottom surface and the like are explained based on the drawings in the drawings, and it is to be noted that if the direction of the corresponding object is changed, it may be expressed differently. Meanwhile, in this specification, the up-down direction may be the up-down direction of fig. 4.
The tester interface 10 according to an embodiment of the present invention may be integrated with any one of the processor 1 and the tester 2. Hereinafter, the tester 2 will be explained first.
Hereinafter, a specific configuration of the processor 1 including the tester junction 10 of the embodiment of the present invention will be explained with reference to the drawings.
The processor 1 may test the devices manufactured by the manufacturing process, classify them into various classes according to the test results, and load them onto customer trays. The processor 1 may be detachably combined with the tester 2. Such a handler 1 may include a tester-joining section 10, a base plate 20, a frame 30, a first shuttle unit 40, a second shuttle unit 50, a component supply unit 60, a temperature-adjusting section 70, a loading section 80, and an unloading section 90.
The tester binding 10 will be described in detail hereinafter.
The substrate 20 may provide a portion to be combined with the tester interface 10. The bottom surface of the substrate 20 may be coupled to the tester interface 10, and the substrate 20 may be fastened to the tester interface 10 by bolts.
The frame 30 may support the tester-coupling section 10, the base plate 20, the first shuttle unit 40, the second shuttle unit 50, the component supply unit 60, the temperature adjustment section 70, the loading section 80, and the unloading section 90.
The first shuttle unit 40 may move the device under test from the first loading area 41 to the first swap area 42 and the device under test from the first swap area 42 to the first unloading area 43.
The second shuttle unit 50 may move the device under test from the second loading area 51 to the second swap area 52 and the device under test from the second swap area 52 to the second unloading area 53.
The component supplying unit 60 may transfer the device to be tested from the first and second exchanging areas 42 and 52 to the socket base 2a, or transfer the tested device from the socket base 2a to the first and second exchanging areas 42 and 52.
The temperature conditioning section 70 may heat or cool the equipment to be tested before supplying it to the first and second shuttle units 40, 50.
The loading part 80 may provide a space in which devices to be tested by the tester 2 are loaded.
The unloading section 90 may provide a space in which devices that have been tested by the tester 2 are loaded.
Referring to fig. 2 to 4, the tester-coupling portion 10 may provide a portion coupled with the tester 2 and a space for loading or unloading a device into the tester 2. Such a tester bonding part 10 may be bonded to the bottom surface of the substrate 20 and may be fastened to the substrate 20 by bolts. When the tester connecting unit 10 is connected to the tester 2, the position of the tester 2 can be fixed after alignment. In this specification, the tester interface 10 may be directly/indirectly docked or undocked with the tester 2 by a hard docking or automatic docking method described later. Wherein docking may mean that the tester interface 10 is coupled or connected to the tester 2, and undocking may mean that the coupling or connection is released. On the other hand, in the present specification, the tester junction 10 has been described as being included in the processor 1, but may be a separate structure that is not included in the processor 1. Therefore, the tester connecting unit 10 may be connected to either the processor 1 or the tester 2. Such a tester interface 10 may include a docking plate 100 and a docking assembly 200.
Referring to fig. 3, docking station 110 may provide a portion that interfaces with tester 2 and a space for devices to pass through tester 2. An opening portion 111 may be formed in such a docking base 110, the opening portion 111 being used to expose the device provided in the receptacle base 2a to the disposer 1. In other words, the opening portion 111 is used to expose the device provided in the socket base 2a to the component supply unit 60. Such an opening 111 may be formed to be open from the center of the docking base 110.
Hereinafter, the hard docking manner will be explained with reference to fig. 3. Hard docking may be achieved by combining a groove-like guide 112 formed on docking base 110 with a tester guide formed on tester 2. In other words, during the ascent of the tester 2 toward the bottom surface of the docking base 110, the tester guide will be inserted into the groove-like guide 112 of the docking base 110, so that the docking plate 100 can be combined with the tester 2. In addition, during hard docking, the tester guide will be inserted into the groove-like guide 112, so that the position of the tester 2 relative to the docking base 110 can be aligned. When the hard docking is completed, the socket base 2a of the tester 2 may be closely attached to the bottom surface of the docking base 110, and the socket base 2a may be positioned below the opening 111.
On the other hand, the kinds of the tester 2 may be various according to different manufacturers of the tester 2. The position of the tester guide formed on the tester 2 may be different depending on the type of the tester 2, and the size and form of the tester guide may be different. Accordingly, a plurality of groove-shaped guide portions 112 may be formed in the docking base 110, and the plurality of groove-shaped guide portions 112 may be formed at different positions of the docking base 110 to be inserted into tester guides provided in the various kinds of testers 2. In addition, the groove-like guide portions 112 may have different sizes and shapes so as to be inserted into tester guides provided in various kinds of testers 2. Therefore, the plurality of groove-like guide portions 112 included in the docking base 110 according to an embodiment of the present invention can be combined with guides formed on various kinds of testers 2, i.e., tester guides having different positions, sizes, and forms. In other words, various kinds of testers 2 can be combined with the docking plate 100 by means of hard docking.
Further, a guide portion 113 having a projection shape may be formed on the docking base 110, and a groove-like tester guide may be formed on the tester 2. Therefore, during the hard docking, the protruding-shaped tester guide of the tester 2 is first inserted into the groove-shaped guide portion 112 of the docking base 110 to perform the first correction, and then the protruding-shaped guide portion 113 of the docking base 110 is inserted into the groove-shaped tester guide to perform the second correction. As described above, correction is performed more than once during hard docking, so that the position of tester 2 with respect to docking base 110 can be accurately adjusted. The protruding guide portion 113 and the groove-like tester guide may be formed in plural numbers. In addition, the groove-like guide portion 112 for the first correction may be formed at a position farther from the opening portion 111 than the projection-shaped guide portion 112 for the second correction. The tester guide of the protrusion shape for such first correction may be longer and thicker than the guide portion 113 of the protrusion shape for the second correction. Since such a protrusion for the first correction and a protrusion for the second correction are different in shape, more accurate position correction can be achieved when the second correction is performed.
On the other hand, the first correction may be performed by the guide portion 113 having a protrusion shape, and the second correction may be performed by the guide portion 112 having a groove shape. In this case, the protrusion-shaped guide portion 113 may be formed at a position farther from the opening 111 than the groove-shaped guide portion 112. In addition, the guide part 113 of the protrusion shape for the first correction may be shorter and thinner than the tester guide of the protrusion shape for the second correction.
In the above-described hard docking method, while the tester 2 is raised toward the bottom surface of the docking base 110, the projection-shaped tester guide is inserted into the groove-shaped guide portion 112 of the docking base 110, and the projection-shaped guide portion 113 is inserted into the groove-shaped tester guide, so that the docking base 110 and the tester 2 are coupled. However, this is merely an example, and either of the groove-shaped guide portion 112 and the protrusion-shaped guide portion 113 may be formed in the docking base 110. Therefore, during the hard docking, the protrusion-shaped guide 113 of the docking base 110 is to be inserted into the groove-shaped tester guide, thereby coupling the docking base 110 with the tester 2, or the protrusion-shaped tester guide is to be inserted into the groove-shaped guide 112 of the docking base 110, thereby making it possible to couple the docking base 110 with the tester 2.
The locking device 120 may support an auxiliary docking unit 230 of the docking assembly 200, which will be described later, and may fix the socket base 2a to the docking base 110. In other words, the locking device 120 may fix the relative position of the socket base 2a with respect to the docking base 110 by supporting the auxiliary docking unit 230 connected to the socket base 2 a. The locking device 120 may include a clamping member 121 and a driving portion 122.
Referring to fig. 5, in order to selectively support the auxiliary docking unit 230, the clamping member 121 may be driven to advance and retreat toward the auxiliary docking unit 230. Such a clamping member 121 may fix the auxiliary docking unit 230 by supporting the roller portion 232 of the auxiliary docking unit 230. In addition, the chucking member 121 may advance and retreat toward the roller portion 232, and may be driven by the driving portion 122. A plurality of the clamping members 121 may be provided, and the plurality of clamping members 121 may support the auxiliary docking unit 230 at different positions. In this specification, as shown in fig. 5, it is shown that the chucking member 121 moves toward the roller portion 232 and supports the roller portion 232 at one side of the roller portion 232, but this is merely an example, and the roller portion 232 may be gripped at both sides of the roller portion. In such a locking device 120, the auxiliary docking unit 230 is integrated with the socket base 2a, so that the socket base 2a may not be directly supported but the auxiliary docking unit 230 may be supported to fix the position of the socket base 2 a.
The driving unit 122 can advance and retract the chucking member 121 toward the roller unit 232. For example, the driving portion 122 may be constituted by a hydraulic cylinder, and the clamp 121 may be driven by the hydraulic pressure of the hydraulic cylinder. In addition, a plurality of driving portions 122 may be provided, and a plurality of clamping members 121 may be driven.
The operation part 130 may control operations of the plurality of driving parts 122. In other words, the operating portion 130 may operate the chucking member 121 or stop the operation by the plurality of driving portions 122. Such an operation part 130 may be provided at one side of the docking base 110.
Hereinafter, the automatic docking manner will be explained. The automatic docking is a manner in which the locking device 120 supports and fixes the auxiliary docking unit 230 to fix the socket base 2a when the tester 2 is raised by the manipulator. In other words, in the automatic docking manner, when the tester 2 approaches the docking plate 100 by a predetermined distance or less, the docking plate 100 supports the docking assembly 200 so that the socket base 2a can be fixed with respect to the docking plate 100. In this way, the docking assembly 200 may be used not only to fix the socket base 2a but also to determine the position. In addition, if higher accuracy is required, the position of the receptacle base 2a may be guided by at least one more pin (e.g., the main array of pins 214), similar to the hard docking manner.
Such automatic docking may be controlled by the operation part 130. When the tester 2 ascends toward the bottom of the docking base 110 and approaches the docking base 110 by a predetermined distance or less, the operating part 130 can rotate at a predetermined angle. When the operating part 130 is rotated at a predetermined angle, the plurality of driving parts 122 may drive the plurality of clamps 121 to move the plurality of clamps 121 toward the auxiliary docking unit 230. When the automatic docking is completed, the plurality of clamping members 121 may support the auxiliary docking unit 230 at different positions, and the socket base 2a connected to the auxiliary docking unit 230 may be fixed to the lower side of the opening portion 111.
To release the automatic docking, the operation of the plurality of driving parts 122 may be stopped when the operating part is rotated at an angle before the driving of the driving part 122. In addition, the driving of the plurality of grippers 121 is stopped, and the plurality of grippers 121 are moved toward the plurality of driving parts 122, so that the support of the auxiliary docking unit 230 can be released. When the support of the auxiliary docking unit 230 is released, the fixation of the socket base 2a may be released.
On the other hand, in this specification, it is described that automatic docking is performed after hard docking is performed, but automatic docking can be independently performed in a docking manner separate from hard docking. Therefore, only the hard docking can be performed, and even if the hard docking is not performed, the socket base 2a can be fixed by the automatic docking.
Referring to fig. 4 and 6, when the socket base 2a is lifted and set under the opening 111 by hard docking or automatic docking, the docking assembly 200 may align and fix the position of the socket base 2 a. In addition, the docking assembly 200 may adjust the temperature of a portion or peripheral portion of the socket base 2a, and may also adjust the temperature of the device supported on the socket base 2 a. The docking assembly 200 can prevent the dewing phenomenon by reducing the humidity around the socket base 2 a. Such a docking assembly 200 may pre-cool or pre-heat the device by supplying a temperature regulating fluid to the device prior to performing a test, and may regulate the temperature of the device during the test, even after the test is completed. On the other hand, the docking assembly 200 may supply a temperature-adjusting fluid into the socket base 2a to adjust the temperature of the device from before the hard docking or the automatic docking is performed. Such a docking assembly 200 may include a main docking unit 210, a temperature adjusting unit 220, an auxiliary docking unit 230, and a cleaning kit 240.
When the socket base 2a is raised and positioned at the lower side of the opening portion 111, the main docking unit 210 may align the socket base 2a to a predetermined position. In addition, the main docking unit 210 may heat the socket base 2 a. Such a main docking unit 210 may include an auxiliary temperature adjusting unit 211, a bimetal 212, a shielding body 213, and a main alignment pin 214.
Referring to fig. 7, the heating device 211 may change the temperature of the socket base 2a by heating the socket base 2 a. When it is required to rapidly change the temperature of the socket base 2a adjusted to a predetermined temperature range by the temperature adjusting unit 220, such a heating device 211 heats the socket base 2a, so that the temperature of the socket base 2a can be adjusted. For example, the heating device 211 may be a heater, and the heater may heat the socket base 2 a. A plurality of such heating devices 211 may be provided.
The bimetal 212 may prevent the socket base 2a from overheating. Such a bimetal 212 may automatically cut off the power of the heating device 211 when the socket base 2a is overheated, thereby stopping the operation of the heating device 211.
The shielding body 213 may prevent heat generated from the heating device 211 from being diffused to the outside. Such shielding 213 may be a heat insulating material.
Referring to fig. 4 and 6, the main alignment pins 214 may align the positions of the socket base 2 a. Such a main alignment pin 214 may be inserted inside an auxiliary alignment pin 234 of an auxiliary docking unit 230, which will be described later. For example, the main alignment pins 214 are inserted into the auxiliary alignment pins 234, and the auxiliary alignment pins 234 are inserted into the alignment members 270 fixed to the socket base 2a, so that the position of the socket base 2a can be aligned and fixed. In this way, the main alignment pins 214 may be aligned and fixed in position with respect to the receptacle base 2a of the main docking unit 210.
The temperature adjusting unit 220 may supply a temperature adjusting fluid for a heating apparatus or a cooling apparatus into the socket base 2 a. In other words, a high-temperature fluid may be supplied into the socket base 2a for heating the equipment, and a low-temperature fluid may be supplied into the socket base 2a for cooling the equipment. Such a temperature adjusting unit 220 may supply fluid whose temperature is adjusted in advance, i.e., high temperature or low temperature fluid adjusted to a predetermined temperature, to the equipment. In addition, the temperature adjusting unit 220 may adjust the temperature around the socket base 2a by supplying the temperature adjusting fluid to the socket base 2a, and may adjust the temperature of the device mounted on the socket base 2 a.
The temperature adjusting unit 220 may be selectively connected to the contact portion 250 to supply a temperature adjusting fluid. For example, when the docking base 110 is combined with the tester 2, the temperature adjusting unit 220 is connected to the contact portion 250, and a temperature adjusting fluid for a heating device or a cooling device may be supplied to the device of the socket base 2 a. In addition, when the docking base 110 is separated from the tester 2, the temperature adjusting unit 220 may be separated from the contact part 250. Such a temperature adjusting unit 220 may simultaneously or independently supply the fluid into the plurality of contact portions 250. In addition, the temperature adjustment of the temperature adjustment unit 220 may be controlled in real time. For example, the Temperature adjustment unit 220 may be an Automatic Temperature Controller (ATC). Such a temperature adjustment unit 220 may be supported on the main docking unit 210. The temperature adjusting unit 220 may include a body portion 221, a fluid inflow port 222, and a barrier 223.
The body 221 may support the fluid inlet 222 and the stopper 223. In addition, the body part 221 may be supported by the main docking unit 210. Referring to fig. 8, a transfer channel 221a may be formed in the main body 221, and the temperature adjusting fluid supplied from the fluid inlet 222 may flow through the transfer channel 221 a. The transfer channel 221a may provide a channel for flowing the temperature-adjusting fluid supplied from the fluid inlet 222 to a communicating member (not shown). A part of the transfer channel 221a may communicate with the fluid inlet 222, and another part of the transfer channel 221a may communicate with a contact portion 250, which will be described later, via a communication member. The transfer channel 221a may be separated from the contact portion 250 when the docking base 110 is separated from the tester 2, and may communicate with the contact portion 250 when the docking base 110 is coupled to the tester 2.
The fluid inlet 222 may be supplied with a temperature-regulating fluid for heating or cooling the device from the outside. Such a fluid inlet 222 may be connected to one side end of the body 221. Further, a plurality of fluid inlets 222 may be provided, and the plurality of fluid inlets 222 may be connected to the transfer channel 221 a.
The stopper 223 can prevent the socket base 2a connected to the tester 2 from rising above a predetermined range. In other words, when the socket base 2a ascends, the stopper 223 contacts the auxiliary docking unit 230 connected to the socket base 2a, so that the socket base 2a and the auxiliary docking unit 230 can be prevented from ascending more than a predetermined range. In addition, when the socket base 2a and the auxiliary docking unit 230 are raised, the stopper 223 may be inserted into a groove (not shown) formed in the auxiliary docking unit 230 and may contact the auxiliary docking unit 230 therein. Such a stopper 223 may be connected to the body part 221 and may be formed to protrude from the body part 221. In addition, a plurality of stoppers 223 may be provided, and the socket base 2a and the auxiliary docking unit 230 may be prevented from rising above a predetermined range by being inserted into a plurality of grooves of the auxiliary docking unit 230.
The auxiliary docking unit 230 may support the socket base 2a and the cleaning kit 240 by being connected to the cleaning kit 240 connected to the socket base 2 a. In addition, the auxiliary docking unit 230 may provide a portion supported by the locking device 120 when the tester 2 is combined with the docking base 110. Such an auxiliary docking unit 230 is supported by the locking device 120 so that the socket base 2a can be positioned at the lower side of the opening portion 111. Such an auxiliary docking unit 230 may include an auxiliary docking body 231, a roller portion 232, a projection portion 233, and an auxiliary aligning pin 234.
Referring to fig. 6, the auxiliary docking body 231 may support the roller portion 232, the protrusion portion 233, and the auxiliary aligning pin 234. Such an auxiliary docking body 231 may be connected to a washing kit 240. In addition, a groove may be formed in the auxiliary docking body 231, and the groove may be in contact with the stopper 223 of the temperature adjusting unit 220. For example, when the auxiliary docking body 231 is raised toward the docking base 110 together with the socket base 2a, the stopper 223 is inserted into a groove formed in the auxiliary docking body 231, thereby bringing the auxiliary docking body 231 into contact with the stopper 223.
When performing the automatic docking, the roller portion 232 may be a portion supported by the clamping member 121 of the locking device 120. Such a roller portion 232 may be rotated with respect to the auxiliary docking unit 230 to prevent damage by the clamping member 121. In this way, the roller 232 rotates in accordance with the movement of the clamp 121, and the auxiliary docking unit 230 can be prevented from being damaged by the pressing force of the advancing and retreating clamp 121.
The projections 233 may support an auxiliary alignment pin 234, which will be described later. For example, a hole (not shown) into which the auxiliary array pin 234 can be inserted may be formed in the projection 233, and the projection 233 may support the auxiliary array pin 234 by inserting the auxiliary array pin 234 into the hole. Such a protrusion 233 may be formed to protrude from the outer circumferential surface of the auxiliary docking main body 231.
The auxiliary alignment pins 234 align the positions of the socket bases 2 a. Such auxiliary aligning pins 234 are inserted into holes formed in the aligning member 270 fixed to the socket base 2a, thereby aligning and fixing the position of the socket base 2 a. In addition, the main alignment pins 214 may be inserted inside the auxiliary alignment pins 234 and may support the main alignment pins 214. The auxiliary alignment pins 234 may be inserted into the bundle alignment holes 242, which will be described later, and inserted into the bundle alignment holes 242 and the alignment member 270, thereby aligning and fixing the positions of the socket bases 2 a.
The cleaning kit 240 can prevent dew condensation from occurring around the socket base 2a by supplying the humidity adjusting fluid to the socket base 2 a. In other words, when the temperature adjusting unit 220 supplies a low-temperature adjusting fluid to the equipment to cool the equipment, the washing kit 240 can prevent the generation of dew condensation by supplying air of low humidity to the socket base 2 a. For example, dry air, a purge gas, or the like can be used as the humidity adjusting fluid. In addition, the cleaning kit 240 may be powered off when the device is heated (e.g., during a high temperature test) and powered on when the device is cooled (e.g., during a low temperature test).
In such a cleaning kit 240, a cleaning inlet 241 may be formed, and the cleaning inlet 241 may receive fluid from an external device (not shown). In addition, the cleaning kit 240 may form a cleaning flow path together with the socket base 2 a. In other words, the cleaning flow path may be formed to be surrounded by the cleaning kit 240 and the socket base 2 a. Referring to fig. 9, when the humidity adjusting fluid is supplied from the outside to the washing inlet 241, the fluid may be discharged to the outside in a predetermined direction (for example, an arrow direction in fig. 9) from a washing flow path formed inside the washing kit 240. Such a cleaning flow inlet 241 may be formed in plurality. In this way, the humidity adjusting fluid circulates and washes the inside of the kit 240 and is discharged, so that it is possible to prevent a dew condensation phenomenon that may occur in the socket base 2 a.
In addition, a set alignment hole 242 into which the auxiliary alignment pin 234 can be inserted may be formed in the washing set 240.
The contact part 250 may receive a temperature-adjusting fluid for a heating apparatus or a cooling apparatus from the temperature adjusting unit 220 and supply it into the manifold 260. One side of the contact portion 250 may selectively communicate with the transfer flow path 221a of the temperature adjusting unit 220 through a communication member, and the other side of the contact portion 250 may communicate with the manifold 260. Therefore, when the tester 2 is separated from the docking base 110, the contact part 250 may be separated from the temperature adjusting unit 220. A plurality of such contacts 250 may be provided.
The manifold 260 may receive a temperature adjusting fluid for a heating device or a cooling device from the contact portion 250, and may supply the received fluid around the socket base 2 a. Additionally, the manifold 260 may supply the fluid received from the contact 250 directly to the device.
The alignment member 270 may be provided with a portion into which the auxiliary alignment pins 234 are inserted. Such an alignment member 270 may be fixedly supported on one side of the socket base 2 a. Therefore, by inserting the auxiliary aligning pins 234 into the aligning member 270, the positions of the socket base 2a and the aligning member 270 with respect to the docking base 110 can be aligned and fixed.
Hereinafter, the action and effect of the processor 1 having the above-described structure will be described.
A user may use a hard docking method to couple docking plate 100 to tester 2. During hard docking, tester 2 may be raised toward docking plate 100. In this way, while the tester 2 is raised toward the bottom surface of the docking base 110, the protrusion-shaped tester guide will be inserted first into the groove-shaped guide portion 112 of the docking base 110 to make the first correction, and the protrusion-shaped guide portion 113 of the docking base 110 may be inserted later into the groove-shaped tester guide to make the second correction. When the hard docking is completed, the socket base 2a of the tester 2 may be disposed under the opening portion 111 formed in the docking base 110, and the position of the socket base 2a may be fixed.
Alternatively, a user may use an automated docking method to couple docking plate 100 to tester 2. During automatic docking, it may be raised toward the docking plate 100. When the tester 2 is positioned on the bottom surface of the docking base 110, the user may rotate the operating part 130 to drive the plurality of locking devices 120. When the operating part 130 rotates, the plurality of driving parts 122 may advance the plurality of grippers 121 at different positions toward the roller part 232 of the auxiliary docking unit 230. The plurality of clamping members 121 may fix the position of the socket base 2a connected to the auxiliary docking unit 230 by supporting the auxiliary docking unit 230.
While the position of the socket base 2a is set to the lower side of the opening portion 111 of the docking plate 100 by at least one of the hard docking method and the automatic docking method, the main alignment pins 214 and the auxiliary alignment pins 234 may be inserted into the kit alignment holes 242 and the alignment members 270. In this way, the main alignment pins 214 are inserted into the alignment member 270 and the auxiliary alignment pins 234, the alignment member 270 is fixed to the socket base 2a, and the auxiliary alignment pins 234 are inserted into the bundle alignment holes 242, so that the main alignment pins 214 can align and fix the position of the socket base 2 a. When the position of the socket base 2a is aligned and fixed by the main alignment pins 214, the tester 2 can be electrically connected with the socket base 2a to perform the device test.
On the other hand, the temperature adjusting unit 220 may adjust the device temperature of the socket base 2a during the test. Such a temperature adjusting unit 220 may receive a temperature adjusting fluid for a heating apparatus or a cooling apparatus from the fluid inflow port 222, and supply it to the contact portion 250. The fluid flowing to the contact portion 250 may be supplied to the apparatus through the manifold 260. Such device temperature adjustment of the temperature adjustment unit 220 may be controlled in real time. In addition, when the device is cooled by the temperature adjusting unit 220, the purge kit 240 supplies dry air to the socket base 2a, so that it is possible to prevent a dew condensation phenomenon that may occur around the socket base 2 a. Such operation of the cleaning kit 240 may be performed simultaneously with the temperature regulation of the apparatus.
When the test is completed, the equipment of the socket base 2a may be moved to the first exchange area 42 or the second exchange area 52 by the component supply unit 60.
The processor 1 according to an embodiment of the present invention has an effect that it can be easily combined with and separated from the tester 2. In addition, there is an effect that the temperature of the device can be adjusted during the test. In addition, when the auxiliary docking unit 230 is damaged, the auxiliary docking unit 230 is separated from the socket base 2a and only the auxiliary docking unit 230 is replaced, thereby having an effect that the socket base 2a is not replaced.
On the other hand, in addition to such a structure, according to the second embodiment of the present invention, the main docking unit 210, the temperature adjusting unit 220, the auxiliary docking unit 230, and the cleaning kit 240 may be omitted in the docking assembly 200. Hereinafter, the second embodiment of the present invention will be described further with reference to fig. 10. In describing the second embodiment, differences from the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.
A hole (not shown) may be formed in the docking base 110, which may be combined with the combining protrusion 2b of the socket base 2 a. The docking base 110 may be coupled to a coupling protrusion 2b, and the coupling protrusion 2b may pass through a coupling hole 201, which will be described later, to fix a position with respect to the docking base 110.
The docking assembly 200 may be combined with the socket base 2a and may be supported on the docking base 110. Such a docking assembly 200 may have a coupling hole 201 formed therein, and the coupling hole 201 may have a coupling protrusion 2b of the socket base 2a inserted therein. The coupling hole 201 and the coupling protrusion 2b may be formed in plural. Therefore, by inserting the plurality of coupling protrusions 2b of the socket base 2a into the plurality of coupling holes 201 of the docking assembly 200, the position of the socket base 2a with respect to the docking assembly 200 can be fixed. In addition, when the coupling protrusion 2b is inserted into the coupling hole 201, the docking assembly 200 and the socket base 2a may be fastened by a bolt.
A bonding roller 202 may be provided in the docking assembly 200. Such a bonding roller 202 may rotate to prevent damage by the locking device 120. In addition, the bonding roller 202 may be supported by the locking device 120.
Hereinafter, the action and effect of the processor 1 of the second embodiment of the present invention will be explained.
A user may join the socket base 2a with the docking assembly 200 before joining the tester 2 with the docking plate 100. A user may fix the socket base 2a to the docking assembly 200 by inserting the plurality of coupling protrusions 2b of the socket base 2a into the plurality of coupling holes 201 of the docking assembly 200. In addition, the docking assembly 200 and the other portion of the socket base 2a may be fastened by bolts.
When the socket base 2a is securely connected with the docking assembly 200, the tester 2 may be raised toward the bottom surface of the docking plate 100. The coupling protrusion 2b of the socket base 2a, which penetrates the coupling hole 201 of the docking assembly 200, may be inserted into a hole formed in the docking base 110. In this way, the coupling protrusions 2b of the socket base 2a are inserted into the coupling holes 201 of the docking assembly 200 and the holes formed in the docking base 110 together, so that the position of the docking assembly 200 can be aligned and fixed in the docking base 110. In addition, when the socket base 2a is disposed under the opening 111, the user can drive the locking device 120 through the operation part 130. The clamping member 121 of the locking device 120 supports the coupling roller 202 of the docking assembly 200 so that the docking assembly 200 and the socket base 2a can be fixed to the docking plate 100 at a certain position.
Such a tester-coupling portion 10 has an effect of easily coupling or decoupling the socket base 2a with the docking base 110 through the docking assembly 200.
Although the embodiments of the present invention have been described in the specific embodiments, these are merely examples, and the present invention is not limited thereto, and should be construed as having the broadest scope according to the basic ideas disclosed in the present specification. One skilled in the art may combine/replace the disclosed embodiments to achieve a pattern of shapes not shown without departing from the scope of the invention. In addition, one skilled in the art can easily change or modify the embodiments disclosed based on the present specification, and it is clear that such changes or modifications also fall within the scope of the present invention.
Claims (7)
1. A tester-incorporating section capable of incorporating either a tester provided with a socket base for housing a device or a processor,
includes a docking plate having an opening formed therein for exposing the device disposed in the socket base to the processor and a plurality of guide portions having one of a groove and a protrusion for detachably coupling to the tester,
at least a portion of the plurality of guides is coupled with a plurality of tester guides formed in the tester so that the docking plate can be coupled with the tester.
2. A tester-incorporating section that can be incorporated into any one of a tester and a processor provided with a socket base for housing a device, comprising:
a docking assembly engageable with the socket base; and
a docking plate formed with an opening for exposing the device disposed in the socket base to the disposer and enclosing at least a portion of the docking assembly,
the docking plate supports the docking assembly so that a position of the socket base relative to the docking plate can be fixed when the tester approaches the docking plate below a predetermined distance.
3. The tester interface of claim 2,
the docking assembly includes an auxiliary docking unit connectable with the socket base,
the docking plate includes a locking device in which a chucking member is provided to be driven to advance and retreat toward the auxiliary docking unit in order to selectively support the auxiliary docking unit,
the clamping member supports the auxiliary docking unit connected to the socket base so that the locking device can fix the position of the socket base with respect to the docking plate.
4. The tester interface of claim 3,
the auxiliary docking unit includes a roller portion that rotates by being in contact with the clamping member advancing toward the auxiliary docking unit,
the clamp is driven to advance and retreat toward the roller portion.
5. The tester interface of claim 2, wherein the docking assembly comprises a cleaning kit configured to form a cleaning flow path with the socket base and to flow a humidity conditioning fluid through the cleaning flow path.
6. The tester interface of claim 2,
a coupling hole is formed in the docking assembly, a coupling protrusion formed in the socket base is penetratingly inserted into the coupling hole,
the docking plate is coupled to the coupling protrusion penetrating the coupling hole, so that the position of the socket base with respect to the docking plate can be fixed.
7. A docking module capable of being combined with any one of a tester provided with a socket base for accommodating a device and a handler for transferring the device to the tester,
the humidity control device includes a cleaning kit that forms a cleaning flow path together with the socket base, and that allows a humidity control fluid received from either the tester or the processor to flow through the cleaning flow path.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0151742 | 2019-11-22 | ||
| KR1020190151742A KR20210063164A (en) | 2019-11-22 | 2019-11-22 | Tester coupling portion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112834788A true CN112834788A (en) | 2021-05-25 |
| CN112834788B CN112834788B (en) | 2024-09-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011322855.8A Active CN112834788B (en) | 2019-11-22 | 2020-11-23 | Tester joint and butt joint assembly |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20210063164A (en) |
| CN (1) | CN112834788B (en) |
| TW (2) | TW202223421A (en) |
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| TW201908751A (en) * | 2017-07-20 | 2019-03-01 | 韓商泰克元股份有限公司 | Sorting machine for testing electronic components having an environment maintaining chamber, and maintaining the environment maintaining chamber in a dry state |
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| US6282093B1 (en) * | 1999-06-11 | 2001-08-28 | Thomas & Betts International, Inc. | LGA clamp mechanism |
| JP2002156408A (en) * | 2000-11-20 | 2002-05-31 | Advantest Corp | Kit and method for cleaning socket connecting terminal, and electronic part tester |
| US7235964B2 (en) * | 2003-03-31 | 2007-06-26 | Intest Corporation | Test head positioning system and method |
| MY151553A (en) * | 2009-08-18 | 2014-06-13 | Multitest Elektronische Syst | Two abutting sections of an align fixture together floatingly engaging an electronic component |
| PH12017000234A1 (en) * | 2016-09-02 | 2018-07-23 | Knight Auto Prec Engineering Pte Ltd | Handling assembly of semiconductor test equipment |
| US10551411B2 (en) * | 2018-02-09 | 2020-02-04 | Silicon Laboratories Inc. | Semiconductor test system with flexible and robust form factor |
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2019
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- 2020-11-20 TW TW109140865A patent/TWI757986B/en active
- 2020-11-23 CN CN202011322855.8A patent/CN112834788B/en active Active
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| KR101333435B1 (en) * | 2012-03-30 | 2013-11-26 | 세메스 주식회사 | Test handler |
| CN104950145A (en) * | 2014-03-25 | 2015-09-30 | 爱德万测试株式会社 | Handler apparatus, device holder, and test apparatus |
| CN106955855A (en) * | 2015-12-29 | 2017-07-18 | 泰克元有限公司 | Separator for testing semiconductor element |
| CN107282474A (en) * | 2016-04-12 | 2017-10-24 | 泰克元有限公司 | Separator for testing electronic parts |
| CN207104388U (en) * | 2017-06-29 | 2018-03-16 | 苏州华徕光电仪器有限公司 | A kind of auxiliary clamp of workpiece |
| TW201908751A (en) * | 2017-07-20 | 2019-03-01 | 韓商泰克元股份有限公司 | Sorting machine for testing electronic components having an environment maintaining chamber, and maintaining the environment maintaining chamber in a dry state |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202120927A (en) | 2021-06-01 |
| TWI757986B (en) | 2022-03-11 |
| CN112834788B (en) | 2024-09-20 |
| TW202223421A (en) | 2022-06-16 |
| KR20210063164A (en) | 2021-06-01 |
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