JP4832323B2 - Manufacturing method of semiconductor device - Google Patents

Description

  The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device including a step of testing electrical characteristics of a semiconductor device at a predetermined temperature.

  In the manufacturing process of a semiconductor device, an environmental test of the semiconductor device is performed at a high temperature and a low temperature in order to guarantee the temperature reliability of the product to the customer. In this environmental test, for example, when a test is performed at a low temperature and the thermostat is opened immediately thereafter, condensation occurs in the thermostat due to a temperature difference from the outside, causing current leakage. For this reason, in order to take out the semiconductor device after the test, it is necessary to open the thermostat after reducing the temperature difference between the thermostat and the outside.

  In the environmental test, the semiconductor device is attached to a tester that measures electrical characteristics using a jig. Specifically, the semiconductor device is fitted into a jig assembled to the drive arm, and the semiconductor device is mounted on the tester in this state. At this time, it is important that the semiconductor device is positioned at a predetermined position with respect to the tester. For this reason, a certain degree of accuracy is required for the dimension of the part where the jig is assembled to the drive arm. However, if the temperature difference between the two is large, it becomes difficult to assemble the jig at a predetermined position of the drive arm due to dimensional variation due to thermal expansion. For this reason, it has to be fitted after the temperature difference between the two becomes small, which is a cause of the time required for the setup change work.

  Thus, in the conventional environmental test, it is necessary to wait until the test apparatus reaches a predetermined temperature. Therefore, there is a problem that the time for which the test apparatus is paused becomes long and the operation efficiency of the apparatus is lowered.

  On the other hand, there has been proposed a test apparatus in which a plurality of attachment / detachment operation devices for attaching / detaching a semiconductor device from a connection portion with a tester are provided and a temperature-controlled room is provided in the attachment / detachment operation device (see Patent Document 1). According to this apparatus, the detachable operating device is heated or cooled in advance before the test is performed, and the test is performed in a predetermined temperature condition in a short time by coupling the detachable operating device to the test apparatus main body when performing the test. It can be done.

  In addition, a socket presser that presses the movable part and a centering recess that centers the semiconductor device are integrated into a socket that attaches and detaches the semiconductor device by pressing and moving the movable part, and this is held by suction. An apparatus that is detachably attached to the head body is also disclosed (see Patent Document 2). According to this apparatus, it is not necessary to replace the detachable head when the semiconductor device type is changed, so that the work efficiency can be improved.

Japanese Patent Laid-Open No. 1-153973 JP-A-10-160794

  However, in the test apparatus described in Patent Document 1, it is necessary to replace the entire temperature-controlled room every time the temperature condition is changed. In addition, the temperature-controlled room occupies a considerable volume, and preparing a plurality of such parts also results in a storage space. Furthermore, Patent Document 1 does not describe any problems that occur when a jig is assembled to the drive arm.

  Moreover, in patent document 2, there is no description regarding the member which should be provided in a thermostat with respect to the test apparatus which has a thermostat.

  The present invention has been made in view of these problems. That is, an object of the present invention is to provide a method of manufacturing a semiconductor device that can further improve the operating efficiency of a test apparatus. Another object of the present invention is to provide a method of manufacturing a semiconductor device that can be tested by attaching the semiconductor device to a predetermined position of a tester.

  Other objects and advantages of the present invention will become apparent from the following description.

The method of manufacturing a semiconductor device of the present invention is a method for manufacturing a semiconductor device comprising the step of testing the electrical characteristics of the semiconductor device at a predetermined temperature using an internal tester thermostat test the electrical characteristics A step of assembling a plurality of first jigs for positioning and mounting the semiconductor device to a turntable in the thermostat; and a step of attaching the semiconductor device to the plurality of first jigs. A step of assembling a plurality of second jigs to be mounted while being precisely positioned in a storage section in the thermostat, and a plurality of the semiconductor devices inside the thermostat by a transfer device outside the thermostat And mounting the plurality of semiconductor devices to the plurality of first jigs, and the second arm at the tip of a drive arm disposed in the thermostat so as to be driven inside the thermostat. The temperature difference between the second jig and the tip of the drive arm Actuating a step of assembling at 50 ° C. the following states, by actuating the drive arm, the semiconductor device mounted on the first jig, a step of mounting the second jig, the drive arm And mounting the semiconductor device on the tester with the second jig.

  According to this embodiment, the operating efficiency of the test apparatus can be further improved. In addition, the semiconductor device can be tested by attaching it to a predetermined position of the tester.

  FIG. 1 is a schematic partial sectional view of a test apparatus according to the present embodiment. FIG. 2 is a schematic view of the test apparatus of FIG. 1 as viewed from above.

  As shown in FIG. 1 and FIG. 2, the test apparatus 1 is connected to a thermostat 3 having a shutter 2 as an opening / closing part, a drive arm 4 that can be driven inside the thermostat 3, and the thermostat 3. It has a test board 5 that constitutes a tester that tests the electrical characteristics of the semiconductor device in the thermostat 3 and a storage unit 6 that stores the semiconductor device before and after the test. Further, in the thermostat 3, a turntable 9 on which the semiconductor device 8 is placed via the first jig 7, and a second for attaching the semiconductor device 8 on the turntable 9 to the tester 5. A storage portion 11 for storing the jig 10 is provided. The turntable 9 is provided with an opening 12 through which the socket 13 of the tester 5 is exposed.

  For example, the semiconductor device 8 is tested in a state in which external leads are arranged from the side surface of the resin in which the semiconductor element is sealed. Specifically, a small outline package (SOP), a dual in-line package (DIP), etc. are mentioned. Not limited to this, various forms of the semiconductor device 8 such as quad flat package (QFP) and ball grid array package (BGA) can be selected.

  Next, the product type switching operation of the test apparatus 1 will be described.

  First, as shown in FIG. 1, the first jig 7 ′ on the turntable 9 is taken out from the opening portion of the shutter 2 to the outside of the thermostat 3 by the second transport device 14. Next, a new first jig 7 having the same structure as that of the first jig 7 ′ is held by the second transport device 14, and the inside of the thermostatic chamber 3 through the shutter 2, specifically, the turn It is assembled to the installation part (not shown) of the table 9. FIG. 1 shows a state after the first jig 7 is assembled. Since the first jig 7 is not preheated or precooled, there is a large temperature difference between the first jig 7 and the installation part.

  Next, the second jig 10 corresponding to the shape and size of the semiconductor device 8 is assembled to the drive arm 4. This assembly is usually performed before the semiconductor device 8 is transported into the thermostatic chamber 3.

  By assembling the first jig 7 and the second jig 10 and exchanging the test board 5 together with the socket 13, the type switching operation of the test apparatus 1 is completed. In the case of switching work between types having external compatibility, it is possible to replace only a limited number of parts. After completion of the product switching operation, the stabilization of the temperature inside the thermostat 3 is confirmed as necessary. Thereafter, the test of the semiconductor device 8 is started according to the following procedure.

  First, the semiconductor device 8 is transported from the storage unit 6 to the upper portion of the shutter 2 of the thermostatic chamber 3 by the first transport device 24 using an adsorption mechanism. Further, the turntable 9 is rotated around the shaft 23 so that the first jig 7 corresponding to the size and shape of the semiconductor device 8 is positioned below the shutter 2. At this time, the inside of the thermostat 3 is maintained at a predetermined temperature. In the heating test, for example, the temperature in the thermostat 3 can be set to 160 ° C. On the other hand, in the cooling test, for example, the temperature in the thermostatic chamber 3 can be set to −50 ° C. The first transport device 24 is driven by the robot 25 in the X direction and the Y direction in FIG. The same applies to the second transport device 14.

  Next, the member 22 is driven to open the shutter 2, the first transport device 24 is lowered into the thermostatic chamber 3, and the semiconductor device 8 is mounted on the first jig 7. By minimizing the area opened by the shutter 2, it is possible to suppress the temperature inside the thermostatic chamber 3 from changing. Furthermore, by keeping the inside of the thermostatic chamber 3 in a lifted state as compared with the outside air, it is possible to effectively prevent the intrusion of the outside air into the thermostatic chamber 3 when the shutter 2 is released and the accompanying temperature change. .

  The first jig 7 has a role of performing rough positioning for mounting the semiconductor device 8 at a predetermined position of the tester 5, and a plurality of the first jigs 7 can be arranged on the turntable 9. For example, the three first jigs 7 can be arranged so as to form an angle of 120 degrees with each other. By placing a plurality of semiconductor devices 8 on the turntable 9, the semiconductor device 8 before the test can be raised or lowered to the temperature in the thermostat 3 in advance.

  When the mounting of the semiconductor device 8 to the first jig 7 is completed, the first transfer device 24 is retracted outside the thermostat 3 and the shutter 2 is closed. Next, the turntable 9 is rotated so that the semiconductor device 8 is positioned below the second jig 10. Then, the drive arm 4 is lowered and the semiconductor device 8 is fitted to the second jig 10.

  The second jig 10 also has a role of positioning the semiconductor device 8 by pressing the external lead 8 a of the semiconductor device 8 so that the semiconductor device 8 is mounted at a predetermined position of the tester 5. In other words, the semiconductor device 8 is roughly positioned by the first jig 7, is then subjected to more precise positioning by the second jig 10, and is mounted at a predetermined position of the tester 5. Here, the rough positioning with the first jig 7 and the more precise positioning with the second jig specifically means the following. That is, in the step of positioning the semiconductor device 8 with respect to the test socket 13 by the second jig 10, positioning is required in order to reliably contact the test socket 13 and the external terminal of the semiconductor device 8. Dimensional accuracy increases. Compared to this, when the semiconductor device 8 is placed on the first jig 7, the connection to the test socket 13 is not performed, so that the required dimensional accuracy is maintained in the second jig 10. As compared with the step of connecting to the test socket 13, it becomes lower. For this reason, the play of the semiconductor device 8 in the state of being mounted on the first jig 7 is larger than that in the state of being attracted to the second jig 10.

  The storage unit 11 that stores the second jig 10 also stores a second jig 10 ′ corresponding to another semiconductor device having a different shape and size. As a result, the temperature of the second jig 10 'can be set to the temperature in the thermostat 3 in advance, so that the temperature increase or decrease of the temperature of the second jig 10' is awaited during the setup change operation. Instead, the second jig 10 ′ can be assembled to the drive arm 4.

  The replacement of the second jig 10 and the second jig 10 'can be performed as follows. First, the storage portion 11 is rotated about the shaft 15 so that the seating portion 11 a is positioned below the second jig 10. Next, the ring 16 a of the attachment / detachment portion 16 provided at the tip of the drive arm 4 is pressed against the storage portion 11. Thereby, the second jig 10 is separated from the attaching / detaching portion 16 and is seated on the seating portion 11 a of the storage portion 11. Next, after raising the drive arm 4, the storage portion 11 is rotated about the shaft 15 so that the second jig 10 ′ seated on the seating portion 11 b is positioned below the detachable portion 16. Then, the drive arm 4 is lowered to press the attaching / detaching portion 16 against the second jig 10 '. As a result, the second jig 10 ′ is attached to the detachable portion 16 and the setup change is completed.

  After the semiconductor device 8 is fitted to the second jig 10, the drive arm 4 is raised. As a result, the semiconductor device 8 is detached from the first jig 7. Next, the turntable 9 is rotated and stopped at a position where the socket 13 is exposed from the opening 12. Then, the drive arm 4 is lowered, and the semiconductor device 8 is mounted on the tester 5 so as to press the second jig 10 against the socket 13. For example, the external lead 8a of the semiconductor device 8 is connected to the socket 13, and the semiconductor element (not shown) and the tester 5 are electrically connected. After that, the tester 5 is used to test the required electrical characteristics of the semiconductor device 8. The tester 5 is movable in the vertical direction in FIG. That is, in FIG. 1, the tester 5 is connected to the thermostat 3, but if the clamp 17 is moved and the tester 5 is further moved downward in the figure, the tester 5 is moved away from the thermostat 3. can do. This operation is performed, for example, when the socket 13 or the test board constituting the tester 5 is replaced.

  According to the test apparatus of the present embodiment, the semiconductor device before the test can be kept in the thermostat chamber. For this reason, it is not necessary to open the thermostatic chamber every time the semiconductor device attached to the tester is replaced. In addition, the temperature of the semiconductor device can be raised or lowered in advance to the temperature in the constant temperature bath. Therefore, the time for the temperature of the thermostat or the semiconductor device to reach a predetermined temperature is shortened, and the downtime of the test apparatus is shortened.

  Further, according to the test apparatus of the present embodiment, the jig (second jig) for positioning when attaching the semiconductor device to the tester is placed in the thermostatic chamber according to the shape and size of the semiconductor device. Multiple types can be kept waiting. Therefore, it is not necessary to open the thermostatic chamber every time the setup is changed. Here, according to the study by the present inventor, after the temperature difference between the jig and the tip of the drive arm becomes 50 ° C. or less, the problems at the time of assembly can be solved by assembling the two. In this embodiment, since the jig is heated or lowered in advance to the temperature in the thermostat, the temperature difference from the drive arm is reduced, and assembly can be facilitated.

  Furthermore, according to the test apparatus of the present embodiment, the storage unit for storing the semiconductor device before the test and before the preliminary heating or the preliminary cooling is arranged outside the thermostatic chamber. Thereby, since the volume inside a thermostat can be reduced, compared with the case where a storage part is inside a thermostat, it becomes possible to shorten time until the inside of a thermostat is made into predetermined | prescribed temperature. Further, unlike Patent Document 1 in which the temperature condition is changed by replacing the temperature-controlled room, it is not necessary to prepare a plurality of temperature-controlled baths, and it is possible to save time and labor when changing the temperature condition.

  Thus, according to the test apparatus of the present embodiment, it is possible to minimize the time required for temperature rise or temperature drop during setup change. Therefore, the downtime of the apparatus can be minimized, so that the operating efficiency of the apparatus can be improved as compared with the prior art. Further, since these are assembled in a state where the temperature difference between the jig and the drive arm is reduced, problems during the assembly are reduced, and it becomes easy to test the semiconductor device attached to a predetermined position of the tester.

  By the way, similarly to the second jig, a plurality of types of the first jig are prepared according to the shape and size of the semiconductor device. When the setup is changed, the first jig 7 ′ is also replaced with the first jig 7. At this time, it is necessary to assemble the first jig 7 at a predetermined position of the turntable 9, but by providing a margin for the size of the part to be assembled, the temperature of the thermostatic chamber 3 can be reduced without preheating or precooling. The external first jig 7 can be directly assembled to the turntable 9.

  On the other hand, with the second jig, it is structurally difficult to provide a margin for the dimensions of the part to be assembled. Therefore, the assembly is performed after the temperature difference between the second jig and the distal end portion of the drive arm (the detachable portion 16 in the present embodiment) becomes 50 ° C. or less. There is preferably play of 10 μm or more and 20 μm or less between the second jig and the tip of the drive arm. At this time, if the setup change is performed using the second jig 10 'preheated or cooled in the thermostat 3 as in the present embodiment, the downtime of the test apparatus can be shortened. it can.

  FIG. 3A is an enlarged partial cross-sectional view showing a state before the first jig 7 held by the second transport device 14 is assembled to the turntable 9. FIG. 3B is a view showing a state after the first jig 7 is assembled to the turntable 9. In addition, the part which attached | subjected the same code | symbol as FIG. 1 and 2 has shown that it is the same.

  As shown in FIGS. 3A and 3B, the turntable 9 is provided with an installation portion 18 for installing the first jig 7. A plurality of installation portions 18 are provided according to the number of first jigs 7.

  The installation part 18 is a recessed part provided in the upper surface of the turntable 9, and the side surface 18a has a taper shape. A positioning pin 19 and a magnetic body 20 are provided on the bottom surface 18 b of the installation portion 18. One end of the positioning pin 19 is embedded in the bottom surface 18b of the installation portion 18, and the other end protrudes upward. On the other hand, the magnetic body 20 is embedded in the bottom surface 18b with its top surface exposed from the bottom surface 18b of the installation part 18 and not positioned above the bottom surface 18b.

  A part of the side surface 7 a of the first jig 7 has a tapered shape corresponding to the side surface 18 a of the installation portion 18. That is, the part fitted to the installation part 18 of the first jig 7 is also tapered. Further, the first jig 7 is provided with a groove 21 having a shape into which the positioning pin 19 is fitted at a position corresponding to the positioning pin 19 of the installation portion 18. Further, it is assumed that the first jig 7 is magnetized.

  When changing the setup, the first jig 7 ′ on the turntable 9 is first taken out of the thermostatic chamber 3 by the second transfer device 14 in the same manner as described with reference to FIG. . Next, the new first jig 7 is gripped by the second conveying device 14 and assembled through the shutter 2 to the inside of the thermostatic chamber 3, specifically, to the installation portion 18 of the turntable 9. At this time, since the first jig 7 is not preheated or precooled, there is a large temperature difference between the first jig 7 and the installation portion 18.

  In the present embodiment, the reason why the side surface of the installation portion and the portion of the first jig fitted therein are tapered is as follows. That is, in the above example, even if the first jig 7 approaches the temperature in the thermostatic chamber 3 and the dimensions are changed, the center of the first jig 7 is the installation portion. This is to prevent deviation from the center of 18. Even when the temperature in the thermostatic chamber 3 is high and the first jig 7 is thermally expanded, the side surface of the first jig 7 fitted to the installation portion 18 moves along the side surface 18a. Therefore, it is possible to prevent the first jig 7 from becoming difficult to remove from the installation portion 18 at the next stage change. In this case, the first jig 7 stops when the force that moves due to the dimensional change and the biasing force that acts in the direction of the installation portion 18 due to the magnetic force are balanced. On the other hand, even when the temperature in the thermostatic chamber 3 is low and the first jig 7 is thermally contracted, the urging force is applied to the first jig 7, so that the first jig 7 It is possible to prevent the tool 7 from coming off.

  3A and 3B, the positioning pin 19 plays a role of restricting the rotation of the first jig 7 in the θ direction. This effect can be further increased by providing the positioning pin 19 at a position away from the center of the installation portion 18. The sizes of the groove 21 and the positioning pin 19 are set such that they can be fitted to each other even when the dimension of the groove 21 varies due to a temperature change. However, in the present embodiment, the positioning pin 19 may not be provided.

  In this way, the first jig and the installation portion are structured as shown in FIGS. 3A and 3B, so that the first jig outside the thermostatic bath can be preheated or spared. It can be assembled directly on the turntable without cooling. That is, the first jig can be assembled to the turntable with a temperature difference larger than the temperature difference between the second jig and the tip of the drive arm. However, it is assumed that the play between the first jig and the installation portion is larger than the play between the second jig and the drive arm. For example, when the play between the first jig and the installation portion is about 3 μm, the jig can be assembled even when there is a temperature difference of about 160 ° C. between them.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

It is a partial cross-sectional schematic diagram of the test apparatus in this Embodiment. It is the schematic which looked at the test apparatus of FIG. 1 from the top. (A) is a figure which shows the state before a 1st jig | tool is assembled | attached to a turntable, (b) is a figure which shows the state after being assembled | attached.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Test apparatus 2 Shutter 3 Constant temperature bath 4 Drive arm 5 Tester 6,11 Storage part 7 1st jig | tool 8 Semiconductor device 9 Turntable 10 2nd jig | tool 12 Opening part 13 Socket 14 2nd conveying apparatus 15,23 Axis 16 Attaching / detaching part 17 Clamp 18 Installation part 19 Positioning pin 20 Magnetic body 21 Groove 22 Member 23 Robot 24 First transport means

Claims (5)

A method for manufacturing a semiconductor device including a step of testing electrical characteristics of a semiconductor device at a predetermined temperature using a tester inside a thermostat ,
Testing the electrical characteristics comprises:
Assembling a plurality of first jigs for mounting while positioning the semiconductor device to the turntable in the thermostat;
Assembling a plurality of second jigs for mounting the semiconductor device while positioning the semiconductor device more precisely than the plurality of first jigs in the storage section in the thermostat;
A step of transporting the plurality of semiconductor devices into the thermostat chamber by a transport device outside the thermostat bath, and mounting the plurality of semiconductor devices on the plurality of first jigs;
The temperature difference between the second jig and the tip of the drive arm is 50 ° C. or less at the tip of the drive arm disposed in the thermostat so that it can be driven inside the thermostat. Assembling in the state of
Activating the drive arm to attach the semiconductor device attached to the first jig to the second jig;
And a step of attaching the semiconductor device to the tester with the second jig by operating the drive arm.   2. The method of manufacturing a semiconductor device according to claim 1, wherein there is play of 10 μm or more and 20 μm or less between the second jig and the tip of the drive arm. The play between the first jig and the turntable is greater than the play between the second jig and the tip of the drive arm,
The plurality of first jigs are assembled to the turntable with a temperature difference larger than a temperature difference between the second jig and a tip portion of the drive arm. The manufacturing method of the semiconductor device of description. The upper surface of the turntable is provided with a plurality of concave installation parts whose side surfaces are tapered.
A magnetic body is embedded in the bottom surface of the plurality of installation portions,
It said plurality of first jig with assembled to the plurality of installation portions, according to any one of claims 1 to 3, characterized in that it is attracted to the installation part by the magnetic force of the magnetic body Semiconductor device manufacturing method. A positioning pin is embedded in the bottom surface of the installation part,
5. The method of manufacturing a semiconductor device according to claim 4 , wherein a groove in which the positioning pin can be fitted is provided at a position corresponding to the positioning pin of the first jig.

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