JPH11231019A - Ic positioning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC positioning device which can execute positioning of ICs of a plurality of different shapes and dimensions by common members having shapes corresponding to the shapes of the IC. SOLUTION: This IC positioning device is provided with an IC loading part 11 projected from a base plate face 12A, and IC guides 13 movably arranged opposite to the four sides of the IC loading part 11. The IC guide 13 is provided with a slotted hole 13C extending in the direction perpendicular to the each opposed side of the IC loading part, a screw 14 is inserted through the slotted hole 13C, and the IC guide 13 is fastened and fixed with the base plate face 12A by the screw 14. By freely selecting the fixed positions so as to constitute the positioning device of ICs having a variety of different dimensions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an IC positioning device which can be used, for example, in the field of an IC test device.

[0002]

2. Description of the Related Art FIG. 6 shows an example of an IC test apparatus. In this IC test apparatus, a tray group 2 for storing ICs is arranged along one side 1A of a base 1 serving as a base. The tray group 2A indicates a tray group stacked and arranged on the loader unit. The ICs to be tested are stored in the tray group 2A stacked on the loader unit.

[0003] XY from the uppermost tray of the tray group 2A
The transfer arm 3 carries out the ICs one by one by a vacuum suction head, defines the position of the IC by a positioning device 4, and transfers the IC to a turntable 5 called a soak stage. In order to receive the IC, the turntable 5 is formed with equiangular intervals at four sides of a square surrounded by upwardly inclined surfaces. The turntable 5 is, for example, clockwise in the example shown in FIG. Each time the storage unit 6 rotates by the arrangement pitch, X
-The Y transfer arm 3 drops one IC into each IC storage part 6 one by one.

[0004] 7 is an IC carried on the turntable 5
Shows a contact arm for sending the contact arm to the test section 8. The contact arm 7 picks up ICs one by one from each IC storage section 6 provided on the turntable 5 and takes out the ICs, and transports the ICs to the test section 8. The contact arm 7 has three arms, and performs an operation of rotating the three arms to sequentially send ICs to the test unit 8 and an operation of delivering the ICs that have been tested by the test unit 8 to the transfer arm 9 on the exit side. Do. The turntable 5, the contact arm 7, and the test section 8 are housed in the chamber 10,
Is controlled to a suitable high or low temperature.
The structure is such that heat stress can be applied to C.

[0005] The IC taken out by the transfer arm 9 on the exit side is sorted and stored by the XY transfer arm 11 into one of the tray groups 2C, 2D and 2E according to the result of the test. For example, defective ICs are stored in the trays of the tray group 2E, non-defective ICs are stored in the trays of the tray group 2D, and ICs requiring retesting are stored in the trays of the tray group 2C. These separations are performed by the carrier arm 10. Note that the tray group 2B indicates an empty tray group stacked in the buffer unit that stores the empty tray in the loader unit.
When the uppermost tray of the trays stacked in the tray groups 2C, 2D, and 2E becomes full, the empty tray group is carried on the tray group and used for storing ICs.

By the way, in this type of IC testing apparatus, before the IC is carried from the tray group 2A into the IC storage section 6 formed on the turntable 5 as described above, the position of the IC is determined by the positioning device 4. The IC is loaded into the IC storage section 6 provided on the turntable 5 in a state where the position is defined. The reason for providing the positioning device 4 is as follows.

The tray stacked on the tray group 2A is an IC
It is used as a tray for distributing ICs in the manufacturing company. For this reason, the shape of each IC storage portion in the tray is formed with a sufficient margin for the shape of each IC to form a partition or the like. Therefore, even if the vacuum suction head mounted on the XY transfer arm 3 suctions the IC stored in the tray, the IC is often not suctioned in a predetermined relationship with the vacuum suction head. . That is, there is a high rate that the center on the plane of the IC and the axis of the vacuum suction head are not aligned and sucked. If the IC is transported to the IC storage section 6 on the turntable 5 in this state, the IC
There is a high possibility that an accident that cannot be accurately dropped into the IC storage section 6 will occur.

For this purpose, the IC picked up from the tray is dropped into the positioning device 4 once, and the IC
, And re-adsorb by the vacuum suction head again.
The IC is transported to the IC storage section 6 on the turntable 5 in a state where the center of C and the axis of the vacuum suction head are aligned.

[0009]

As described above, the positioning device 4 uses an IC to accurately determine the position of the IC.
We have prepared positioning devices that match the shape of each product type.
7 and 8 show an example of a conventional IC positioning device 4.
FIG. 7 is a plan view, and FIG. 8 is a cross-sectional view taken along line BB shown in FIG. In the plan view shown in FIG. 7, the IC is omitted, and in FIG. 8, the IC is mounted on the IC mounting portion.
That is, the conventional IC positioning device has a square IC mounting portion 11 at the center, and a groove 12 is formed around the IC mounting portion 11. An IC guide 13 protruding above the IC mounting portion 11 is formed outside the groove 12. IC guide 13
Is a vertical surface which stands perpendicularly from the bottom surface 12A of the groove 12 at the height of the IC mounting portion 11 (position of the mounted IC terminal), and the position of the IC terminal is defined by the position of the vertical surface 13A. I do.

On the upper side of the vertical surface 13A, there is provided an inclined surface 13B which spreads outward. The inclined surface 13B guides the terminal of the IC dropped from above, guides the IC to a predetermined position, and places the IC mounting portion. The IC is mounted on 11 and positioning is performed. As shown in FIG. 8, the conventional IC positioning device has a structure integrally formed of a metal block or the like, so that, for example, ICs having different lengths L of the terminals of the ICs or different sizes of IC package portions are located. In order to decide, all of the positioning devices must be replaced.

[0011] The parts to be exchanged so as to conform to the shape of the IC for each type of IC are generally called a change kit. The change kit is frequently used not only for the positioning device 4 but also for other parts. Accordingly, a large number of change kits must be prepared for each type of IC, which places a large economic burden on the user. Also a new kind of IC
In order to test this new type of IC, a change kit must be prepared in advance. In addition, if the preparation is delayed, there is a disadvantage that the test cannot be performed until the change kit is completed.

SUMMARY OF THE INVENTION An object of the present invention is to provide an IC positioning device which has a degree of freedom with respect to the shape of an IC and which can perform accurate positioning for an IC having a desired shape by making adjustments as necessary. It is intended to provide a device.

[0013]

According to the present invention, there is provided an IC mounting portion for mounting an IC to be positioned, a groove formed surrounding the IC mounting portion, and an IC mounting portion surrounding the groove. And an IC guide having an IC guide having a sloping surface that gradually projects outward as it goes upward from the section, so that the IC guide can be moved forward and backward with respect to the IC mounting section. The present invention proposes an IC positioning device that determines the position of the IC guide according to the length of the terminal of the IC mounted on the IC mounting portion and is capable of fixing the IC guide.

Therefore, according to the IC positioning device of the present invention, the position of the IC guide can be freely changed and fixed, so that the positioning device can be configured for ICs having various terminal lengths. Can be. As a result, the same positioning device can perform positioning for ICs having different shapes. Therefore, even if there are many types of ICs having different shapes, it is not necessary to prepare a change kit for each type of IC. Economic burden can be reduced. Further, according to the present invention, even when a new product is manufactured, the test can be started immediately by adjusting the position of the IC guide as needed.

[0015]

FIG. 1 shows an embodiment of the present invention. 7 and 8 are denoted by the same reference numerals. In the drawing, reference numeral 10 denotes the whole IC positioning device according to the present invention. 11 is an IC mounting part, and 12 is this IC mounting part 11.
, 13 are IC guides arranged outside the groove 12, 13A is a vertical surface forming the groove 12, 13
B indicates an outwardly extending inclined surface formed on the IC guide 13.

In the present invention, the IC guide 13 is configured to be able to move forward and backward with respect to the IC mounting portion 11. For this purpose, for example, the bottom surface 12A of the groove 12 is used as a substrate surface, and an I
The C guide 13 is mounted. The IC guide 13 used in this embodiment is a rectangle having a long side direction in a direction parallel to the side of the IC mounting portion 11 whose planar shape is opposed to each other, and forms a long hole 13C in a short side direction of the rectangle. A screw 14 is inserted through the elongated hole 13C, and the screw 14 is screwed into a screw hole formed on the substrate surface 12A. The IC guide 13 is fixed to the substrate surface 12A by tightening the screw 14 toward the substrate surface 12A. By loosening the screw 14 and moving the IC guide 13 in the direction of the long hole 13C, the gap between the IC mounting portion 11 and the IC guide 13 can be set freely.

Accordingly, a jig 15 shown in FIGS. 3 and 4 is prepared for each type of IC. This jig 15 is used for the IC mounting portion 1.
1 and a ridge 1 surrounding the recess 15A and having the same width as the length L of an IC terminal (see FIG. 8).
5B. This jig 15 is mounted on an IC as shown in FIG.
The terminal length determined by the dimension L of the jetty 15B of the jig 15 is set on the mounting portion 11 by pressing the front end of the IC guide 13 against the periphery of the jig 15 and tightening the screw 14 at that position. It can be set as an IC positioning device for the IC that it has.

[0018]

As described above, according to the present invention, the IC guide 13 arranged so as to surround the IC mounting portion 11 can be moved, and the IC guide 13 can be fixed at an arbitrary position. The IC guide 13 and I
The gap with the C mounting part 11 can be set freely. Therefore, it is possible to freely set as an IC positioning device even for ICs having various terminal lengths, thereby obtaining an advantage that the number of change kits can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention.

FIG. 2 is a plan view of the embodiment shown in FIG.

FIG. 3 is a plan view showing an example of a jig used in the present invention.

FIG. 4 is a sectional view taken along line AA shown in FIG. 3;

FIG. 5 is a sectional view for explaining a method of setting an IC positioning device using the jig shown in FIGS. 3 and 4;

FIG. 6 shows an I to which the IC positioning device according to the present invention can be applied;
Sectional drawing for demonstrating an example of a C test apparatus.

FIG. 7 is a plan view for explaining the structure of a conventional IC positioning device.

FIG. 8 is a sectional view taken along line BB shown in FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 IC mounting part 12 Groove 12A Substrate surface 13 IC guide 13A Inclined surface 13B Slot 14 Screw 15 Jig 15A Recess 15B Jetty

Claims (1)

[Claims] An IC mounting portion for mounting an IC to be positioned, a groove formed surrounding the IC mounting portion, and an upper portion surrounding the outer periphery of the groove and above the IC mounting portion. An IC positioning device comprising: an IC guide having an inclined surface that protrudes and gradually widens outwardly toward the upper part, wherein the IC guide is configured to be able to move freely with respect to the IC mounting portion. Then, the I mounted on the IC mounting portion is
An IC positioning device characterized in that the position of the IC guide is determined according to the length of the terminal C and can be fixed.