CN112816746A - Probe card structure - Google Patents
Probe card structure Download PDFInfo
- Publication number
- CN112816746A CN112816746A CN202110011299.0A CN202110011299A CN112816746A CN 112816746 A CN112816746 A CN 112816746A CN 202110011299 A CN202110011299 A CN 202110011299A CN 112816746 A CN112816746 A CN 112816746A
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- CN
- China
- Prior art keywords
- probe
- circuit board
- test
- ring
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 138
- 238000012360 testing method Methods 0.000 claims abstract description 71
- 238000001514 detection method Methods 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Abstract
The application discloses a probe card structure, and relates to the field of integrated circuits. The probe card structure comprises a circuit board, a fixing ring, a probe cantilever bearing ring and a test probe; a detection window is formed in the circuit board, and a test circuit is arranged in the circuit board; the probe cantilever bearing ring is fixed below the circuit board through the fixing ring, and the lower end of the probe cantilever bearing ring is positioned below the detection window; the top end of the test probe is welded on the back surface of the circuit board, the test probe is connected with a test circuit in the circuit board, and the lower half part of the test probe is fixed at the bottom of the probe cantilever bearing ring; the needle tip of the test probe is exposed below the detection window; the problem that a detection window on a traditional probe card is small and is difficult to adapt to special detection conditions is solved; it is helpful to provide a wide operating space and a wide viewing field when the probe card is used for inspecting the chip.
Description
Technical Field
The present application relates to the field of integrated circuits, and more particularly, to a probe card structure.
Background
The probe card is an interface between a chip to be tested and a test apparatus in wafer testing. The probe card is used in a principle that probes on the probe card are in direct contact with pads (pads) or pins of a chip, so that signal transmission between a test device and the chip to be tested is realized.
Before the wafer leaves the factory, the probe card is used for electrically testing the chips on the wafer, so that the defects of the chips can be found, and the manufacturing process of the device can be conveniently and timely improved. Generally, in wafer level testing, probes on a probe card are brought into contact with test pads of a chip to be tested, and a test program is sent and a test result is received by a test apparatus.
At present, under certain test conditions, probes on a probe card cannot meet detection requirements easily, and if the probe card is manufactured again for each special condition, the production cost is increased, and the test time cost is increased.
Disclosure of Invention
To solve the problems in the related art, the present application provides a probe card structure. The technical scheme is as follows:
on one hand, the embodiment of the application provides a probe card structure, which comprises a circuit board, a fixing ring, a probe cantilever bearing ring and a test probe;
a detection window is formed in the circuit board, and a test circuit is arranged in the circuit board;
the probe cantilever bearing ring is fixed below the circuit board through the fixing ring, and the lower end of the probe cantilever bearing ring is positioned below the detection window;
the top end of the test probe is welded on the back surface of the circuit board, the test probe is connected with a test circuit in the circuit board, and the lower half part of the test probe is fixed at the bottom of the probe cantilever bearing ring;
the tip of the test probe is exposed below the detection window.
Optionally, the cross section of the probe cantilever carrying ring is in two wedge-shaped patterns.
Optionally, the fixing ring is sleeved at the edge of the detection window, the top end of the fixing ring is located on the front side of the circuit board, and the bottom end of the fixing ring is located on the back side of the circuit board;
the top of the probe cantilever bearing ring is fixed at the bottom end of the fixing ring.
Optionally, a bolt is arranged inside the fixing ring, and the fixing ring is connected with the circuit board through the bolt.
Optionally, the lower half of the test probe is connected to the bottom of the probe cantilever load ring by an adhesive.
Optionally, the lower half of the test probe is attached to the bottom of the probe cantilever carrying ring.
The technical scheme at least comprises the following advantages:
the probe card structure provided by the embodiment of the application comprises a circuit board, a fixing ring, a probe cantilever bearing ring and a test probe, wherein a detection window is formed in the circuit board, the fixing ring is fixed on the outer side of the detection window on the circuit board, the probe cantilever bearing ring is additionally arranged at the bottom of the fixing ring, the lower half part of the test probe is fixed by using the probe cantilever bearing ring, the space above the needle point of the test probe is increased, and the effect of expanding the detection window on the circuit board is realized; the problem that a detection window on a traditional probe card is small and is difficult to adapt to special detection conditions is solved; the probe card is beneficial to providing wide operation space and observation visual field when the probe card is used for detecting the chip, and the same probe card can be used for testing the chip to be tested in different modes.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a front view of a probe card structure provided in an embodiment of the present application;
FIG. 2 is a top view of the probe card structure shown in FIG. 1;
FIG. 3 is a front view of a conventional probe card;
FIG. 4 is a top view of the probe card of FIG. 3;
FIG. 5 is a schematic diagram of a probe card structure provided in an embodiment of the present application in use.
Detailed Description
The technical solutions in the present application will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the connection can be mechanical connection or electrical connection; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In addition, the technical features mentioned in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.
The embodiment of the present application provides a probe card structure, as shown in fig. 1 and 2, the probe card structure includes a circuit board 11, a fixing ring 12, a probe cantilever carrying ring 13, and a test probe 14.
The circuit board 11 is provided with a detection window 15, and a test circuit is arranged in the circuit board 11 and used for electrical detection of the internal condition of the chip on the wafer.
Alternatively, the detection window 15 is located at a middle position of the circuit board 11.
The probe cantilever carrying ring 13 is fixed below the circuit board 11 by the fixing ring 12, and the lower end of the probe cantilever carrying ring 13 is located below the detection window 15.
The lower end of the probe cantilever carrying ring 13 and the tip of the test probe 14 are visible from above looking down through the detection window 15.
The top of the test probe 14 is soldered to the back of the circuit board 11, the test probe 14 is connected to the test circuit in the circuit board 11, and the lower half of the test probe 14 is fixed to the bottom of the probe cantilever carrying ring 13.
The tip of the test probe 14 is not in contact with the probe cantilever carrying ring 13, and the tip of the test probe 14 is exposed below the detection window 15.
The probe card structurally comprises a plurality of test probes 14, and the distribution positions and the number of the test probes 14 are determined according to actual conditions.
The test probe 14 has a corresponding pad on the chip to be tested, and when the test probe 14 is used to test the chip to be tested on the wafer, the tip of the test probe 14 connected to the circuit board 11 is connected to the corresponding pad on the chip to be tested.
The lower half part of the test probe 14 is supported by the probe cantilever bearing ring 13, the distance between the needle point of the test probe 14 and the circuit board 11 is increased, so that a larger space is arranged above the test needle point 14, the effect of expanding the detection window 15 on the circuit board 11 is realized, and meanwhile, the connection between the needle point of the test probe 14 and a bonding pad on a chip to be detected is not influenced.
As shown in FIG. 1, the probe cantilever carrier ring 13 has two wedge-shaped cross-sections. The two wedge patterns are symmetrical patterns, or the two wedge patterns are asymmetrical patterns.
The probe cantilever carrier ring 13 surrounds the detection window 15.
The edge of detection window 15 is established to fixed ring 12 cover, and fixed ring 12's top is located the front of circuit board 11, and fixed ring 12's bottom is located the 11 backs of circuit board.
The top of the probe cantilever carrying ring 13 is fixed to the bottom end of the fixed ring 12.
The cross-section of the probe cantilever carrier ring 13 and the fixed ring 12 is shown within the dashed box 10 of fig. 1. in one example, the fixed ring 12 is provided with bolts 17 inside, and the fixed ring 12 is connected to the circuit board 11 by the bolts 17.
In one example, the lower half of the test probe 14 is attached to the bottom of the probe cantilever carrier ring 13 by an adhesive 18, as shown in FIG. 1. The adhesive is not conductive.
Optionally, the lower half of the test probe is attached to the bottom of the cantilever ring.
In one example, the solder 16 on the top of the test probe 14 and the adhesive 18 are pressed against the bottom of the probe cantilever carrier ring 13, as shown in FIG. 1.
In summary, in the probe card structure provided in the embodiment of the present application, the probe cantilever carrying ring is added at the bottom of the fixing ring, the lower half portion of the test probe is fixed by the probe cantilever carrying ring, the space above the probe tip of the test probe is increased, and the effect of expanding the detection window on the circuit board is achieved; the problem that a detection window on a traditional probe card is small and is difficult to adapt to special detection conditions is solved; the probe card is beneficial to providing wide operation space and observation visual field when the probe card is used for detecting the chip, and the same probe card can be used for testing the chip to be tested in different modes.
At present, a detection window on a conventional probe card is small, as shown in fig. 3 and 4, a fixing ring 32 is fixed on an outer side of a detection window 34 on a circuit board 31, one end of a test probe 33 is connected to a back surface of the circuit board 31, a lower half portion of the test probe 33 is directly connected to a bottom portion of the fixing ring 32, the test probe 33 is directly supported by the fixing ring 32, a distance between the test probe 33 and the circuit board 31 is small, and the detection window 34 is also small. The probe card structure that this application embodiment provided utilizes the probe cantilever of solid fixed ring bottom to bear the weight of the ring and increase the space of test probe needle point top, and the opening of detecting window 15 on the probe card increases, conveniently carries out the chip and carries out more diversified electricity and optical detection.
In one example, as shown in fig. 5, an additional pad is disposed on the chip to be tested, an additional auxiliary probe system (e.g., a cow hair probe system) is introduced, and cow hair probe 51 enters from inspection window 15 and is connected to the additional pad disposed on the chip to be tested, so as to implement the related electrical test.
In another example, since the detection window of the probe card structure provided by the embodiments of the present application provides a wider operation space and a wider observation field, the chip under test can be observed and analyzed from the detection window by using an optical analysis observation device (such as an EMMI, OBIRCH, MCT, InGaAs optical sensor, etc.).
In an alternative embodiment based on the embodiment shown in fig. 1 and 2, the circuit board is a PCB circuit board.
The material of the probe cantilever bearing ring is an insulating material; the shell of the fixing ring is made of insulating materials.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of this invention are intended to be covered by the scope of the invention as expressed herein.
Claims (6)
1. A probe card structure is characterized by comprising a circuit board, a fixing ring, a probe cantilever bearing ring and a test probe;
a detection window is formed in the circuit board, and a test circuit is arranged in the circuit board;
the probe cantilever bearing ring is fixed below the circuit board through the fixing ring, and the lower end of the probe cantilever bearing ring is positioned below the detection window;
the top end of the test probe is welded on the back surface of the circuit board, the test probe is connected with a test circuit in the circuit board, and the lower half part of the test probe is fixed at the bottom of the probe cantilever bearing ring;
the tip of the test probe is exposed below the detection window.
2. The probe card structure of claim 1, wherein the probe cantilever carrier ring has a cross-section in two wedge-shaped patterns.
3. The probe card structure of claim 1, wherein the retaining ring is disposed around the edge of the inspection window, the top end of the retaining ring is located on the front side of the circuit board, and the bottom end of the retaining ring is located on the back side of the circuit board;
the top of the probe cantilever bearing ring is fixed at the bottom end of the fixing ring.
4. The probe card structure of claim 3, wherein a bolt is disposed inside the fixing ring, and the fixing ring is connected to the circuit board through the bolt.
5. The probe card structure of claim 1, wherein the lower half of the test probe is attached to the bottom of the probe cantilever carrier ring by an adhesive.
6. The probe card structure of claim 2, wherein a lower half of the test probes abut a bottom of the probe cantilever load ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110011299.0A CN112816746A (en) | 2021-01-06 | 2021-01-06 | Probe card structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110011299.0A CN112816746A (en) | 2021-01-06 | 2021-01-06 | Probe card structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112816746A true CN112816746A (en) | 2021-05-18 |
Family
ID=75857686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110011299.0A Pending CN112816746A (en) | 2021-01-06 | 2021-01-06 | Probe card structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112816746A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113471103A (en) * | 2021-06-09 | 2021-10-01 | 上海华虹宏力半导体制造有限公司 | Probe module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003255023A (en) * | 2002-02-27 | 2003-09-10 | Seiko Epson Corp | Probe card and probe-card testing method |
| US20040119463A1 (en) * | 2002-12-18 | 2004-06-24 | Star Technologies Inc. | Probe card for testing a semiconductor |
| CN103185819A (en) * | 2011-12-27 | 2013-07-03 | 联咏科技股份有限公司 | Probe card and manufacturing method thereof |
| CN103543372A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Optical detection device |
| CN108344887A (en) * | 2017-01-25 | 2018-07-31 | 松翰有限公司 | probe head structure of cantilever type probe card |
-
2021
- 2021-01-06 CN CN202110011299.0A patent/CN112816746A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003255023A (en) * | 2002-02-27 | 2003-09-10 | Seiko Epson Corp | Probe card and probe-card testing method |
| US20040119463A1 (en) * | 2002-12-18 | 2004-06-24 | Star Technologies Inc. | Probe card for testing a semiconductor |
| CN103185819A (en) * | 2011-12-27 | 2013-07-03 | 联咏科技股份有限公司 | Probe card and manufacturing method thereof |
| CN103543372A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Optical detection device |
| CN108344887A (en) * | 2017-01-25 | 2018-07-31 | 松翰有限公司 | probe head structure of cantilever type probe card |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113471103A (en) * | 2021-06-09 | 2021-10-01 | 上海华虹宏力半导体制造有限公司 | Probe module |
| CN113471103B (en) * | 2021-06-09 | 2023-10-20 | 上海华虹宏力半导体制造有限公司 | Probe module |
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