CN112802814A - Parallel aluminum wire and packaging assembly for integrated circuit packaging - Google Patents
Parallel aluminum wire and packaging assembly for integrated circuit packaging Download PDFInfo
- Publication number
- CN112802814A CN112802814A CN201911104137.0A CN201911104137A CN112802814A CN 112802814 A CN112802814 A CN 112802814A CN 201911104137 A CN201911104137 A CN 201911104137A CN 112802814 A CN112802814 A CN 112802814A
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- China
- Prior art keywords
- aluminum
- parallel
- wire
- aluminum wire
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
Abstract
The invention discloses a parallel aluminum wire and a packaging assembly for packaging an integrated circuit, wherein the parallel aluminum wire comprises at least two aluminum wires which are distributed in parallel and an aluminum strip for connecting the aluminum wires into a whole, the integrated circuit packaging assembly comprises the parallel aluminum wire, a chip, a lead frame base island and a lead frame pin, the chip is fixed on the lead frame base island, one end of the aluminum wire in the parallel aluminum wire is fixed with the chip through an aluminum wire chip welding point, the other end of the aluminum wire is fixed with the lead frame pin through an aluminum wire pin welding point, one end of the aluminum strip in the parallel aluminum wire is fixed with the chip through an aluminum strip chip welding point, and the other end of the aluminum strip in the parallel aluminum wire is fixed with the lead frame pin through an. According to the invention, the welding distance between two or more aluminum wires is not required to be reserved, the two or more aluminum wires and the aluminum strip can be simultaneously welded, the welding spot position is ensured not to be deviated, the operation efficiency of a product is improved, and meanwhile, the welding cross section area can be increased to provide more current carrying.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a parallel aluminum wire and a packaging assembly used for packaging an integrated circuit.
Background
With the rapid development of miniaturization and integration of semiconductor packages, the aluminum wire bonding process has good performance and strength, and thus, the application of the aluminum wire bonding process in thin packages of power devices is more and more extensive in recent years.
And along with the higher and higher requirement of the terminal product on the conduction current, a single aluminum wire can not meet the conduction requirement of the product, and two or more aluminum wires are required to be connected. The aluminum wire welding device is limited by the structural characteristics of the aluminum wire chopper and the wire conduit, after the welding of the first aluminum wire is completed during the welding of the aluminum wire, if the distance between the welding point position of the second aluminum wire and the welding point position of the first aluminum wire is too narrow, the welding point or the wire arc of the first aluminum wire can be touched by the aluminum wire chopper or the wire conduit, the welding and the arc-drawing of the second aluminum wire can be influenced, meanwhile, the damage of the welding point and the wire arc of the first aluminum wire can also be caused, so certain distance and space are required to be reserved in the forming process of welding two or more aluminum wires and radian, and certain process limitation is brought to the chip structural design and the packaging design. Meanwhile, the repeated welding of two or more aluminum wires on a single product can also reduce the operation efficiency and restrict the improvement of the productivity.
Disclosure of Invention
It is an object of the present invention to overcome the above problems in the prior art and to provide a parallel aluminum line for an integrated circuit package.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
a parallel aluminum wire for an integrated circuit package comprises at least two aluminum wires distributed in parallel and an aluminum strip for connecting the aluminum wires into a whole.
Furthermore, in the parallel aluminum wires used for the integrated circuit package, the wire diameters of the aluminum wires are equal or different.
Furthermore, in the parallel aluminum wires used in the integrated circuit package, the connection position of the aluminum strip is the root part or the middle part of the aluminum wire.
Further, in the parallel aluminum lines used in the integrated circuit package, the end portions of the aluminum strips are flush with or protrude outward relative to the outermost aluminum lines.
Further, in the parallel aluminum lines used in the integrated circuit package, the number of the aluminum lines is preferably 2.
Further, in the parallel aluminum lines used in the integrated circuit package, the number of the aluminum lines is preferably 3.
The utility model provides an integrated circuit encapsulation subassembly that contains parallel aluminum wire, this integrated circuit encapsulation subassembly includes parallel aluminum wire, chip, lead frame base island and lead frame pin, the chip is fixed on the lead frame base island, the one end of aluminum wire is fixed with the chip through aluminum wire chip bonding point in the parallel aluminum wire, and the other end is fixed with the lead frame pin through aluminum wire pin bonding point, the one end of aluminum strip is fixed with the chip through aluminum strip chip bonding point in the parallel aluminum wire, and the other end is fixed with the lead frame pin through aluminum strip pin bonding point.
The invention has the beneficial effects that:
1. the parallel aluminum wires can be welded at one time, the welding distance between two or more aluminum wires does not need to be reserved, and the process design is broken through to improve the utilization rate of the surface nip structure of the chip.
2. The parallel aluminum wire structure is composed of the aluminum wire and the aluminum strip, and has larger cross section area than the bonding welding point of the common aluminum strip or the aluminum wire, so that the connection is more stable and the current-carrying capacity is higher.
3. According to the invention, the aluminum wires are arranged on two sides of the parallel aluminum wire structure, and a specially-made chopper and a conduit can be used in a matching manner in the welding process, so that the position of a welding spot is ensured not to deviate.
4. The parallel aluminum wires are matched with the special chopper, so that two or more aluminum wires can be welded simultaneously, and the operating efficiency of products is improved.
Of course, it is not necessary for any one product that embodies the invention to achieve all of the above advantages simultaneously.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a parallel aluminum line according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a parallel aluminum line according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a three-parallel aluminum line according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a quad parallel aluminum line according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a five-parallel aluminum line according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a six-parallel aluminum line according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a seven integrated circuit package assembly in accordance with an embodiment of the present invention;
in the drawings, the components represented by the respective reference numerals are listed below:
1-aluminum wire, 101-aluminum wire die bond pad, 102-aluminum wire pin bond pad, 2-aluminum tape, 201-aluminum tape die bond pad, 202-aluminum tape pin bond pad, 3-chip, 4-lead frame base island, 5-lead frame pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, the parallel aluminum wire includes two aluminum wires 1 distributed in parallel and an aluminum strip 2 for connecting the aluminum wires into a whole, a connection position of the aluminum strip 2 is located at a bottom end of the aluminum wire 1, two ends of the aluminum strip 2 are not protruded relative to the two aluminum wires 1, and wire diameters of the two aluminum wires 1 are equal.
The parallel aluminum wire of this embodiment structural design is reasonable, need not reserve welding interval between two or many aluminum wires, can realize two or many aluminum wires 1 and aluminium strip 2 while welding, guarantees that the solder joint position does not take place the skew to promote the operating efficiency of product, also can increase the welding cross-sectional area simultaneously and in order to provide more current carrying capacity.
Example two
Referring to fig. 2, the parallel aluminum wire includes three aluminum wires 1 distributed in parallel and an aluminum strip 2 for connecting the aluminum wires into a whole, a connection position of the aluminum strip 2 is located at a bottom end of the aluminum wire 1, two ends of the aluminum strip 2 do not protrude from the two aluminum wires 1, and wire diameters of the two aluminum wires 1 are equal.
EXAMPLE III
Referring to fig. 3, the parallel aluminum wire for an integrated circuit package includes two aluminum wires 1 distributed in parallel and an aluminum strip 2 for connecting the aluminum wires into a whole, a connection position of the aluminum strip 2 is located in a middle portion of the aluminum wire 1, two ends of the aluminum strip 2 do not protrude from the two aluminum wires 1, and wire diameters of the two aluminum wires 1 are equal.
Example four
Referring to fig. 4, the parallel aluminum wire for packaging an integrated circuit includes two aluminum wires 1 distributed in parallel and an aluminum strip 2 for connecting the aluminum wires into a whole, a connection position of the aluminum strip 2 is located at a bottom end of the aluminum wire 1, two ends of the aluminum strip 2 protrude outwards relative to the two aluminum wires 1, and wire diameters of the two aluminum wires 1 are equal.
EXAMPLE five
Referring to fig. 5, the parallel aluminum wire includes two aluminum wires 1 distributed in parallel and an aluminum strip 2 for connecting the aluminum wires into a whole, a connection position of the aluminum strip 2 is located at a bottom end of the aluminum wire 1, two ends of the aluminum strip 2 do not protrude from the two aluminum wires 1, and wire diameters of the two aluminum wires 1 are not equal.
EXAMPLE six
Referring to fig. 6, the parallel aluminum wire includes three aluminum wires 1 distributed in parallel and an aluminum strip 2 for connecting the aluminum wires into a whole, a connection position of the aluminum strip 2 is located at a bottom end of the aluminum wire 1, two ends of the aluminum strip 2 are not protruded relative to the two aluminum wires 1, wire diameters of the two aluminum wires 1 are not equal, and a wire diameter of the aluminum wire 1 located in the middle is smaller than wire diameters of the aluminum wires 1 located at two sides.
EXAMPLE seven
This embodiment is an integrated circuit packaging subassembly, refer to fig. 7 and show, this integrated circuit packaging subassembly includes parallel aluminum wire, chip 3, lead frame base island 4 and lead frame pin 5, chip 3 fixes on lead frame base island 4, the one end of aluminum wire 1 is fixed with chip 3 through aluminum wire chip bonding pad 101 in the parallel aluminum wire, the other end passes through aluminum wire pin bonding pad 102 and is fixed with lead frame pin 5, the one end of aluminum strip 2 is fixed with chip 3 through aluminum strip chip bonding pad 201 in the parallel aluminum wire, the other end passes through aluminum strip pin bonding pad 202 and is fixed with lead frame pin 5.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (7)
1. A parallel aluminum line for use in an integrated circuit package, comprising: the parallel aluminum wires comprise at least two aluminum wires which are distributed in parallel and aluminum strips which are used for connecting the aluminum wires into a whole.
2. The parallel aluminum line for use with an integrated circuit package of claim 1, wherein: the wire diameters of the aluminum wires are equal or different.
3. The parallel aluminum line for use in an integrated circuit package of claim, wherein: the connection position of the aluminum strip is the root part or the middle part of the aluminum wire.
4. The parallel aluminum line for use with an integrated circuit package of claim 1, wherein: the end of the aluminum strip is flush with the outermost aluminum wire or protrudes outward relative to the outermost aluminum wire.
5. The parallel aluminum line for use in an integrated circuit package of any of claims 1-4, wherein: the number of the aluminum wires is preferably 2.
6. The parallel aluminum line for use in an integrated circuit package of any of claims 1-4, wherein: the number of the aluminum wires is preferably 3.
7. An integrated circuit package assembly comprising the parallel aluminum lines of any of claims 1-4, wherein: the integrated circuit packaging assembly comprises a parallel aluminum wire, a chip, a lead frame base island and a lead frame pin, wherein the chip is fixed on the lead frame base island, one end of the aluminum wire in the parallel aluminum wire is fixed with the chip through an aluminum wire chip welding point, the other end of the aluminum wire is fixed with the lead frame pin through an aluminum wire pin welding point, one end of an aluminum strip in the parallel aluminum wire is fixed with the chip through an aluminum strip chip welding point, and the other end of the aluminum strip is fixed with the lead frame pin through an aluminum strip pin welding point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911104137.0A CN112802814A (en) | 2019-11-13 | 2019-11-13 | Parallel aluminum wire and packaging assembly for integrated circuit packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911104137.0A CN112802814A (en) | 2019-11-13 | 2019-11-13 | Parallel aluminum wire and packaging assembly for integrated circuit packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112802814A true CN112802814A (en) | 2021-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911104137.0A Pending CN112802814A (en) | 2019-11-13 | 2019-11-13 | Parallel aluminum wire and packaging assembly for integrated circuit packaging |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000049184A (en) * | 1998-05-27 | 2000-02-18 | Hitachi Ltd | Semiconductor device and production thereof |
| CN106229307A (en) * | 2016-08-01 | 2016-12-14 | 长电科技（宿迁）有限公司 | The Welding Structure of aluminum steel pad surface secondary load and process thereof |
| CN209607731U (en) * | 2019-05-06 | 2019-11-08 | 常州市润祥电子科技有限公司 | A kind of strip projected parts aluminium strip and package assembling that integrated antenna package uses |
-
2019
- 2019-11-13 CN CN201911104137.0A patent/CN112802814A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000049184A (en) * | 1998-05-27 | 2000-02-18 | Hitachi Ltd | Semiconductor device and production thereof |
| CN106229307A (en) * | 2016-08-01 | 2016-12-14 | 长电科技（宿迁）有限公司 | The Welding Structure of aluminum steel pad surface secondary load and process thereof |
| CN209607731U (en) * | 2019-05-06 | 2019-11-08 | 常州市润祥电子科技有限公司 | A kind of strip projected parts aluminium strip and package assembling that integrated antenna package uses |
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Application publication date: 20210514 |