CN112789709A - 基板处理方法以及基板处理装置 - Google Patents
基板处理方法以及基板处理装置 Download PDFInfo
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- CN112789709A CN112789709A CN201980065636.5A CN201980065636A CN112789709A CN 112789709 A CN112789709 A CN 112789709A CN 201980065636 A CN201980065636 A CN 201980065636A CN 112789709 A CN112789709 A CN 112789709A
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Images
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- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018189984A JP7165019B2 (ja) | 2018-10-05 | 2018-10-05 | 基板処理方法および基板処理装置 |
| JP2018-189984 | 2018-10-05 | ||
| PCT/JP2019/037615 WO2020071212A1 (ja) | 2018-10-05 | 2019-09-25 | 基板処理方法および基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112789709A true CN112789709A (zh) | 2021-05-11 |
| CN112789709B CN112789709B (zh) | 2024-08-23 |
Family
ID=70055027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980065636.5A Active CN112789709B (zh) | 2018-10-05 | 2019-09-25 | 基板处理方法以及基板处理装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7165019B2 (ko) |
| KR (1) | KR102501506B1 (ko) |
| CN (1) | CN112789709B (ko) |
| TW (1) | TWI727438B (ko) |
| WO (1) | WO2020071212A1 (ko) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179185A (ja) * | 2002-11-22 | 2004-06-24 | Sharp Corp | 半導体デバイスの開封装置及び開封方法 |
| CN102686973A (zh) * | 2010-01-14 | 2012-09-19 | 普雷茨特激光技术有限公司 | 用于监视半导体晶片的薄化的原位测量晶片厚度的监视设备和方法、以及包括湿蚀刻设备和监视设备的薄化设备 |
| JP2015173148A (ja) * | 2014-03-11 | 2015-10-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2016096303A (ja) * | 2014-11-17 | 2016-05-26 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH115056A (ja) * | 1997-06-16 | 1999-01-12 | Dainippon Screen Mfg Co Ltd | 処理液供給装置 |
| US6680078B2 (en) * | 2001-07-11 | 2004-01-20 | Micron Technology, Inc. | Method for dispensing flowable substances on microelectronic substrates |
| JP5045218B2 (ja) | 2006-10-25 | 2012-10-10 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及び記憶媒体 |
| JP5457384B2 (ja) | 2010-05-21 | 2014-04-02 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
| JP6026362B2 (ja) | 2013-07-09 | 2016-11-16 | 東京エレクトロン株式会社 | 基板処理システム、基板処理システムの制御方法、及び記憶媒体 |
| KR102247118B1 (ko) * | 2013-09-26 | 2021-04-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 토출 검사 장치 |
| JP6351992B2 (ja) | 2014-02-17 | 2018-07-04 | 株式会社Ｓｃｒｅｅｎホールディングス | 変位検出装置、基板処理装置、変位検出方法および基板処理方法 |
| US20150262848A1 (en) * | 2014-03-11 | 2015-09-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method for discharge of processing liquid from nozzle |
| JP6423672B2 (ja) * | 2014-09-26 | 2018-11-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2016122681A (ja) | 2014-12-24 | 2016-07-07 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6352824B2 (ja) | 2015-01-23 | 2018-07-04 | 東芝メモリ株式会社 | 基板処理装置、制御プログラムおよび制御方法 |
| JP6541491B2 (ja) | 2015-07-29 | 2019-07-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 流下判定方法、流下判定装置および吐出装置 |
| JP6785092B2 (ja) * | 2016-08-19 | 2020-11-18 | 株式会社Ｓｃｒｅｅｎホールディングス | 変位検出装置、変位検出方法および基板処理装置 |
-
2018
- 2018-10-05 JP JP2018189984A patent/JP7165019B2/ja active Active
-
2019
- 2019-09-25 KR KR1020217009836A patent/KR102501506B1/ko active IP Right Grant
- 2019-09-25 WO PCT/JP2019/037615 patent/WO2020071212A1/ja active Application Filing
- 2019-09-25 CN CN201980065636.5A patent/CN112789709B/zh active Active
- 2019-09-27 TW TW108135169A patent/TWI727438B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179185A (ja) * | 2002-11-22 | 2004-06-24 | Sharp Corp | 半導体デバイスの開封装置及び開封方法 |
| CN102686973A (zh) * | 2010-01-14 | 2012-09-19 | 普雷茨特激光技术有限公司 | 用于监视半导体晶片的薄化的原位测量晶片厚度的监视设备和方法、以及包括湿蚀刻设备和监视设备的薄化设备 |
| JP2015173148A (ja) * | 2014-03-11 | 2015-10-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2016096303A (ja) * | 2014-11-17 | 2016-05-26 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI727438B (zh) | 2021-05-11 |
| JP2020061405A (ja) | 2020-04-16 |
| JP7165019B2 (ja) | 2022-11-02 |
| TW202021675A (zh) | 2020-06-16 |
| KR20210054557A (ko) | 2021-05-13 |
| WO2020071212A1 (ja) | 2020-04-09 |
| KR102501506B1 (ko) | 2023-02-21 |
| CN112789709B (zh) | 2024-08-23 |
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