CN112789334B - 层叠体及固化密封体的制造方法 - Google Patents

层叠体及固化密封体的制造方法 Download PDF

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Publication number
CN112789334B
CN112789334B CN201880098044.9A CN201880098044A CN112789334B CN 112789334 B CN112789334 B CN 112789334B CN 201880098044 A CN201880098044 A CN 201880098044A CN 112789334 B CN112789334 B CN 112789334B
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China
Prior art keywords
layer
resin layer
energy ray
cured
curable resin
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Chinese (zh)
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CN112789334A (zh
Inventor
佐藤明德
高丽洋佑
阿久津高志
垣内康彦
冈本直也
山田忠知
中山武人
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Lintec Corp
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Lintec Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
CN201880098044.9A 2018-10-02 2018-10-02 层叠体及固化密封体的制造方法 Active CN112789334B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/036812 WO2020070790A1 (ja) 2018-10-02 2018-10-02 積層体及び硬化封止体の製造方法

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CN112789334A CN112789334A (zh) 2021-05-11
CN112789334B true CN112789334B (zh) 2023-04-07

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JP (1) JP7129110B2 (ko)
KR (1) KR102543787B1 (ko)
CN (1) CN112789334B (ko)
WO (1) WO2020070790A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113613893B (zh) 2019-03-15 2023-11-21 琳得科株式会社 粘合片及半导体装置的制造方法
CN112918912A (zh) * 2021-01-20 2021-06-08 江苏金恒新型包装材料有限公司 一种环保型bopp镭射转移膜、生产方法及生产装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017078052A1 (ja) * 2015-11-04 2017-05-11 リンテック株式会社 第1保護膜形成用シート
CN107017173A (zh) * 2015-11-13 2017-08-04 日东电工株式会社 半导体封装体的制造方法
JP2018141086A (ja) * 2017-02-28 2018-09-13 日東電工株式会社 粘着テープ
WO2018181769A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 粘着シート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594853B2 (ja) 1981-02-23 1984-02-01 株式会社日立製作所 半導体装置
JP2009035635A (ja) * 2007-08-01 2009-02-19 Nitto Denko Corp 非汚染性熱剥離型粘着シート
JP5744434B2 (ja) 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
JP6000595B2 (ja) 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
JP2014239154A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 半導体装置の製造方法
CN107075323A (zh) * 2014-11-13 2017-08-18 Dic株式会社 双面粘胶带、物品及分离方法
JP6779719B2 (ja) * 2016-09-06 2020-11-04 太陽インキ製造株式会社 ファンアウト型のウエハレベルパッケージ用反り矯正材
JP6835434B2 (ja) * 2016-12-01 2021-02-24 富士通コネクテッドテクノロジーズ株式会社 電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017078052A1 (ja) * 2015-11-04 2017-05-11 リンテック株式会社 第1保護膜形成用シート
CN107017173A (zh) * 2015-11-13 2017-08-04 日东电工株式会社 半导体封装体的制造方法
JP2018141086A (ja) * 2017-02-28 2018-09-13 日東電工株式会社 粘着テープ
WO2018181769A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 粘着シート

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Publication number Publication date
JPWO2020070790A1 (ja) 2021-09-24
CN112789334A (zh) 2021-05-11
KR102543787B1 (ko) 2023-06-14
JP7129110B2 (ja) 2022-09-01
WO2020070790A1 (ja) 2020-04-09
KR20210044836A (ko) 2021-04-23

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