CN112786506A - 一种rfid标签新型固晶设备机构 - Google Patents
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Abstract
本发明涉及射频识别技术领域,且公开了一种RFID标签新型固晶设备机构,包括下架台,所述下架台的顶部外表面设置有顶升模块,所述顶升模块的右侧且位于下架台的顶部外表面设置有吸料翻转模块,所述下架台的顶部且位于吸料翻转模块的外侧设置有上架台,所述上架台的内侧且位于顶升模块的顶部设置有料带,所述上架台的外侧外表面设置有俯拍相机,所述料带的顶部且位于上架台的底部外表面设置有固晶模块,所述上架台的底部外表面且位于料带的顶部设置有点胶模块,所述上架台的顶部外表面的两侧均设置有点胶相机模块。该RFID标签新型固晶设备机构,有效的提升了生产效率、降低了制造与维护成本同时使得固晶设备很大程度的缩小了整机尺寸。
Description
技术领域
本发明涉及射频识别技术领域,具体为一种RFID标签新型固晶设备机构。
背景技术
射频识别(RFID)是 Radio Frequency Identification 的缩写,其原理为阅读器与标签之间进行非接触式的数据通信,达到识别目标的目的,RFID 的应用非常广泛,典型应用有动物晶片、汽车晶片防盗器、门禁管制、停车场管制、生产线自动化、物料管理,RFID标签生产工艺流程主要有料带标签放卷、固晶、缓存、热压与测试、料带标签分切与收卷。其中在固晶设备生产环节中主要生产工艺是对料带标签进行视觉(相机)引导点胶、视觉(相机)引导贴晶圆等组成。
现有的固晶设备机构在使用时存在一定的弊端,首先布局分散、设备整体尺寸大,占地面积大,对厂房要求高,其次制造与维护成本高,设备机构之间连贯性低,维修较为麻烦,最后生产效率低,为此我们提出一种RFID标签新型固晶设备机构。
发明内容
(一)解决的技术问题
针对现有技术的不足,本发明提供了一种RFID标签新型固晶设备机构,具备生产效率高、降低了制造与维护成本同时使得固晶设备很大程度的缩小了整机尺寸的优点,解决了传统的布局分散、设备整体尺寸大,占地面积大,对厂房要求高,其次制造与维护成本高,设备机构之间连贯性低,维修较为麻烦,最后生产效率低的问题。
(二)技术方案
为实现上述具备生产效率高、降低了制造与维护成本同时使得固晶设备很大程度的缩小了整机尺寸的目的,本发明提供如下技术方案:一种RFID标签新型固晶设备机构,包括下架台,所述下架台的顶部外表面设置有顶升模块,所述顶升模块的右侧且位于下架台的顶部外表面设置有吸料翻转模块,所述下架台的顶部且位于吸料翻转模块的外侧设置有上架台,所述上架台的内侧且位于顶升模块的顶部设置有料带,所述上架台的外侧外表面设置有俯拍相机,所述料带的顶部且位于上架台的底部外表面设置有固晶模块,所述上架台的底部外表面且位于料带的顶部设置有点胶模块,所述上架台的顶部外表面的两侧均设置有点胶相机模块。
优选的,所述下架台的顶部外表面与上架台的底部外表面为固定焊接,所述下架台与上架台之间均为支架结构,所述顶升模块的底部与下架台为电性连接,所述顶升模块由顶升气缸、组合滑台、顶针马达和顶针构成,所述顶升模块的顶部外表面且位于下架台的顶部外表面设置有晶圆盘模块,所述晶圆盘模块的位置依靠下架台的顶部的X向马达、Y向马达、旋转马达调整,所述晶圆盘模块与下架台为电性连接。
优选的,所述吸料翻转模块位于晶圆盘模块的右侧,所述吸料翻转模块由翻转马达、下压马达、两组吸头及相关机构组成且两组吸头呈°布置,所述吸料翻转模块与下架台为电性连接。
优选的,所述料带的底部且位于上架台的内侧设置有料带托盘,所述料带托盘采用真空吸附的方式与料带的底部相切,所述料带托盘与上架台的内侧相切。
优选的,所述点胶模块的顶部外表面与上架台的底部为固定连接,所述点胶模块与料带的位置相对应,所述点胶模块主要由X向马达、Y向直线电机、点胶机构组成且根据指定位置点胶。
优选的,所述点胶相机模块为两组,所述点胶相机模块主要要由X向马达、Y向直线模组、相机组成且根据需要抓取料带所需要贴片固晶的位置,所述点胶相机模块的内侧的外侧且位于上架台的顶部外表面设置固晶相机模块,所述固晶相机模块主要由X向马达、Y向直线模组、相机组成且根据需要抓取料带所需要贴片固晶的位置没所述上架台的顶部外表面设置有与固晶相机模块以及点胶相机模块相对应的滑槽。
优选的,所述固晶模块的顶部外表面与上架台为固定连接,所述固定模块由X向马达、Y向直线模组、相机组成且根据需要抓取料带所需要贴片固晶的位置,所述飞拍相机与上架台为活动连接。
优选的,所述俯拍相机为搜索晶圆盘上晶圆的分布信息来实时调整晶圆盘的位置,所述俯拍相机与上架台的内侧为固定连接,所述俯拍相机的底部且位于吸料翻转模块的外侧设置有飞拍相机,所述飞拍相机位于吸料翻转模块的内侧,所述下架台的顶部外表面且位于飞拍相机与吸料翻转模块的内侧设置有凸台,所述飞拍相机为搜集晶圆的吸附角度、晶圆的有无信息。
(三)有益效果
与现有技术相比,本发明提供了一种RFID标签新型固晶设备机构,具备以下有益效果:
1、该RFID标签新型固晶设备机构,通过料带托盘的拉动机构,拉动料带,并且料带托盘顶部的吸附机构带动料带移动,再通过点胶相机模块内部的X向马达与Y向直线电机带动点胶相机进行实时料带点位,并且点胶模块内部的X向马达与Y向直线电机带动对料带进行点胶,从而达到了布局紧凑的效果。
2、该RFID标签新型固晶设备机构,通过顶升模块内部的顶针马达带动顶升气缸向上移动,再带动顶升模块顶部的滑台向上移动,将晶圆盘模块内部的晶圆顶出,通过吸料翻转模块利用内部的翻转马达和两组吸头夹持圆晶,同时俯拍相机搜索圆晶位置,方便调整,再通过固晶模块内部的四组音圈电机吸附圆晶,从而达到了快速入料加工的效果。
3、该RFID标签新型固晶设备机构,通过固晶相机模块内部X向马达与Y想直线模组带动相机运行,抓取吸附圆晶的实时位置,并且飞拍相机实时手机固晶模块吸附的圆晶的角度以及有无信息,从而带动吸料翻转模块运行,调整圆晶的角度与是否贴片,从而达到了提高了设备的精准性。
附图说明
图1为本发明结构立体结构示意图。
图中:1、下架台;2、顶升模块;3、吸料翻转模块;4、上架台;5、料带;6、俯拍相机;7、固晶模块;8、点胶模块;9、点胶相机模块;10、晶圆盘模块;11、料带托盘;12、固晶相机模块;13、飞拍相机。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参阅图1,一种RFID标签新型固晶设备机构,包括下架台1,下架台1的顶部外表面设置有顶升模块2,顶升模块2的右侧且位于下架台1的顶部外表面设置有吸料翻转模块3,下架台1的顶部且位于吸料翻转模块3的外侧设置有上架台4,上架台4的内侧且位于顶升模块2的顶部设置有料带5,上架台4的外侧外表面设置有俯拍相机6,料带5的顶部且位于上架台4的底部外表面设置有固晶模块7,上架台4的底部外表面且位于料带5的顶部设置有点胶模块8,上架台4的顶部外表面的两侧均设置有点胶相机模块9。
下架台1的顶部外表面与上架台4的底部外表面为固定焊接,上架台4与下架台1之间为支架结构,下架台1与上架台4内部的模块均通过PLC控制,顶升模块2的底部与下架台1为电性连接,顶升模块2由顶升气缸、组合滑台、顶针马达和顶针构成,同时,在PLC控制下气缸和顶针马达工作,顶出晶圆,顶升模块2的顶部外表面且位于下架台1的顶部外表面设置有晶圆盘模块10,晶圆盘模块10的位置依靠下架台1的顶部的X向马达、Y向马达、旋转马达调整,晶圆盘模块10与下架台1为电性连接。
吸料翻转模块3位于晶圆盘模块10的右侧,吸料翻转模块3由翻转马达、下压马达、两组吸头及相关机构组成且两组吸头呈180°布置,吸料翻转模块3在翻转马达的带动下一组吸嘴对准晶圆,下压马达工作,吸头吸附晶圆,翻转马达翻转吸头,重复以上动作,实现翻转吸附循环动作,吸料翻转模块3与下架台1为电性连接。
料带5的底部且位于上架台4的内侧设置有料带托盘11,料带托盘11采用真空吸附的方式与料带5的底部相切,料带托盘11与上架台4的内侧相切。
点胶模块8的顶部外表面与上架台4的底部为固定连接,点胶模块8与料带5的位置相对应,点胶模块8主要由X向马达、Y向直线电机、点胶机构组成且根据指定位置点胶。
点胶相机模块9为两组,点胶相机模块9主要要由X向马达、Y向直线模组、相机组成且根据需要抓取料带5所需要贴片固晶的位置,点胶相机模块9的内侧的外侧且位于上架台4的顶部外表面设置固晶相机模块12,固晶相机模块12主要由X向马达、Y向直线模组、相机组成且根据需要抓取料带5所需要贴片固晶的位置没上架台4的顶部外表面设置有与固晶相机模块12以及点胶相机模块9相对应的滑槽。
固晶模块7的顶部外表面与上架台1为固定连接,固定模块7由X向马达、Y向直线模组、相机组成且根据需要抓取料带所需要贴片固晶的位置。
俯拍相机6为搜索晶圆盘上晶圆的分布信息来实时调整晶圆盘的位置,俯拍相机6与上架台4的内侧为固定连接,俯拍相机6的底部且位于吸料翻转模块3的外侧设置有飞拍相机13,飞拍相机13位于吸料翻转模块3的内侧,下架台1的顶部外表面且位于飞拍相机13与吸料翻转模块3的内侧设置有凸台,便于工作人员操作,飞拍相机13为搜集晶圆的吸附角度、晶圆的有无信息,飞拍相机13与上架台4为活动连接。
工作时,使用者将料带5放置于料带托盘11的顶部,启动PLC控制系统,料带托盘11内部的拉动机构拉动料带5向设备的右侧移动,并且料带托盘11顶部的吸附机构带动料带5移动,提高料带5的吸附性,并且点胶相机模块9内部的X向马达与Y向直线电机带动点胶相机对料带5进行实时点位,同时点胶模块8内部的X向马达与Y向直线电机带动对料带5进行点胶,随后工作人员启动顶升模块2内部的顶针马达,带动顶升模块2内部的顶升气缸向上移动,再带动顶升模块2顶部的滑台向上移动,将晶圆盘模块10内部的晶圆顶出,同时,吸料翻转模块3利用内部的翻转马达和两组吸头夹持圆晶,同时俯拍相机6搜索圆晶位置,方便调整;工作人员再启动固晶模块7内部的四组音圈电机吸附圆晶,固晶模块7启动的同时,固晶相机模块12内部X向马达与Y想直线模组带动相机运行,抓取吸附圆晶的实时位置,并且飞拍相机13实时手机固晶模块7吸附的圆晶的角度和有无信息,通过PLC系统发送至吸料翻转模块3与顶升模块2进行重新调整与出料,随后对料带5进行点胶贴片,完成生产,各个结构均为独立的X/Y运动模组,极大的提高了生产效率,便于进行调整,从而提高了生产效率,较为实用。
综上所述,通过料带托盘11的拉动机构,拉动料带5,并且料带托盘11顶部的吸附机构带动料带5移动,再通过点胶相机模块9内部的X向马达与Y向直线电机带动点胶相机进行实时料带5点位,并且点胶模块8内部的X向马达与Y向直线电机带动对料带5进行点胶,从而达到了布局紧凑的效果;通过顶升模块2内部的顶针马达带动顶升气缸向上移动,再带动顶升模块2顶部的滑台向上移动,将晶圆盘模块10内部的晶圆顶出,通过吸料翻转模块3利用内部的翻转马达和两组吸头夹持圆晶,同时俯拍相机6搜索圆晶位置,方便调整,再通过固晶模块7内部的四组音圈电机吸附圆晶,从而达到了快速入料加工的效果;通过固晶相机模块12内部X向马达与Y想直线模组带动相机运行,抓取吸附圆晶的实时位置,并且飞拍相机13实时手机固晶模块7吸附的圆晶的角度以及有无信息,从而带动吸料翻转模块3运行,调整圆晶的角度与是否贴片,从而达到了提高了设备的精准性。
需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (8)
1.一种RFID标签新型固晶设备机构,包括下架台(1),其特征在于:所述下架台(1)的顶部外表面设置有顶升模块(2),所述顶升模块(2)的右侧且位于下架台(1)的顶部外表面设置有吸料翻转模块(3),所述下架台(1)的顶部且位于吸料翻转模块(3)的外侧设置有上架台(4),所述上架台(4)的内侧且位于顶升模块(2)的顶部设置有料带(5),所述上架台(4)的外侧外表面设置有俯拍相机(6),所述料带(5)的顶部且位于上架台(4)的底部外表面设置有固晶模块(7),所述上架台(4)的底部外表面且位于料带(5)的顶部设置有点胶模块(8),所述上架台(4)的顶部外表面的两侧均设置有点胶相机模块(9)。
2.根据权利要求1所述的一种RFID标签新型固晶设备机构,其特征在于:所述下架台(1)的顶部外表面与上架台(4)的底部外表面为固定焊接,所述下架台(1)与上架台(4)之间均为支架结构,所述顶升模块(2)的底部与下架台(1)为电性连接,所述顶升模块(2)由顶升气缸、组合滑台、顶针马达和顶针构成,所述顶升模块(2)的顶部外表面且位于下架台(1)的顶部外表面设置有晶圆盘模块(10),所述晶圆盘模块(10)的位置依靠下架台(1)的顶部的X向马达、Y向马达、旋转马达调整,所述晶圆盘模块(10)与下架台(1)为电性连接。
3.根据权利要求2所述的一种RFID标签新型固晶设备机构,其特征在于:所述吸料翻转模块(3)位于晶圆盘模块(10)的右侧,所述吸料翻转模块(3)由翻转马达、下压马达、两组吸头及相关机构组成且两组吸头呈180°布置,所述吸料翻转模块(3)与下架台(1)为电性连接。
4.根据权利要求1所述的一种RFID标签新型固晶设备机构,其特征在于:所述料带(5)的底部且位于上架台(4)的内侧设置有料带托盘(11),所述料带托盘(11)采用真空吸附的方式与料带(5)的底部相切,所述料带托盘(11)与上架台(4)的内侧相切。
5.根据权利要求1所述的一种RFID标签新型固晶设备机构,其特征在于:所述点胶模块(8)的顶部外表面与上架台(4)的底部为固定连接,所述点胶模块(8)与料带(5)的位置相对应,所述点胶模块(8)主要由X向马达、Y向直线电机、点胶机构组成且根据指定位置点胶。
6.根据权利要求1所述的一种RFID标签新型固晶设备机构,其特征在于:所述点胶相机模块(9)为两组,所述点胶相机模块(9)主要要由X向马达、Y向直线模组、相机组成且根据需要抓取料带(5)所需要贴片固晶的位置,所述点胶相机模块(9)的内侧的外侧且位于上架台(4)的顶部外表面设置固晶相机模块(12),所述固晶相机模块(12)主要由X向马达、Y向直线模组、相机组成且根据需要抓取料带(5)所需要贴片固晶的位置没所述上架台(4)的顶部外表面设置有与固晶相机模块(12)以及点胶相机模块(9)相对应的滑槽。
7.根据权利要求1所述的一种RFID标签新型固晶设备机构,其特征在于:所述固晶模块(7)的顶部外表面与上架台(1)为固定连接,所述固定模块(7)由X向马达、Y向直线模组、相机组成且根据需要抓取料带所需要贴片固晶的位置。
8.根据权利要求1所述的一种RFID标签新型固晶设备机构,其特征在于:所述俯拍相机(6)为搜索晶圆盘上晶圆的分布信息来实时调整晶圆盘的位置,所述俯拍相机(6)与上架台(4)的内侧为固定连接,所述俯拍相机(6)的底部且位于吸料翻转模块(3)的外侧设置有飞拍相机(13),所述飞拍相机(13)位于吸料翻转模块(3)的内侧,所述下架台(1)的顶部外表面且位于飞拍相机(13)与吸料翻转模块(3)的内侧设置有凸台,所述飞拍相机(13)为搜集晶圆的吸附角度、晶圆的有无信息,所述飞拍相机(13)与上架台(4)为活动连接。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113314440A (zh) * | 2021-05-13 | 2021-08-27 | 深圳新益昌科技股份有限公司 | 固晶设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010012119A1 (zh) * | 2008-07-28 | 2010-02-04 | 四川凯路威电子有限公司 | Rfid标签及其封装方法 |
CN102324393A (zh) * | 2011-09-19 | 2012-01-18 | 广东宝丽华服装有限公司 | 大幅面张装rfid倒装贴片方法及装置 |
CN208622692U (zh) * | 2018-06-26 | 2019-03-19 | 肇庆市利拓邦电子科技有限公司 | 一种rfid倒封装晶圆拾取装置 |
CN109904097A (zh) * | 2019-03-04 | 2019-06-18 | 东莞倍胜智能科技有限公司 | 一种模块化多功能ic晶片贴装设备 |
CN211247163U (zh) * | 2019-11-08 | 2020-08-14 | 东莞市磐锐机电科技有限公司 | 一种新型的多功能贴合机及其顶针模块 |
-
2020
- 2020-12-28 CN CN202011574578.XA patent/CN112786506A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010012119A1 (zh) * | 2008-07-28 | 2010-02-04 | 四川凯路威电子有限公司 | Rfid标签及其封装方法 |
CN102324393A (zh) * | 2011-09-19 | 2012-01-18 | 广东宝丽华服装有限公司 | 大幅面张装rfid倒装贴片方法及装置 |
CN208622692U (zh) * | 2018-06-26 | 2019-03-19 | 肇庆市利拓邦电子科技有限公司 | 一种rfid倒封装晶圆拾取装置 |
CN109904097A (zh) * | 2019-03-04 | 2019-06-18 | 东莞倍胜智能科技有限公司 | 一种模块化多功能ic晶片贴装设备 |
CN211247163U (zh) * | 2019-11-08 | 2020-08-14 | 东莞市磐锐机电科技有限公司 | 一种新型的多功能贴合机及其顶针模块 |
Non-Patent Citations (1)
Title |
---|
刘道远: ""RFID标签封装设备中点胶和贴片模块的设计与研究"", 《信息科技辑》, pages 1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113314440A (zh) * | 2021-05-13 | 2021-08-27 | 深圳新益昌科技股份有限公司 | 固晶设备 |
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