CN112778601A - 阻燃低烟无卤免硅烷交联聚乙烯电缆料及其制备方法 - Google Patents
阻燃低烟无卤免硅烷交联聚乙烯电缆料及其制备方法 Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 57
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 239000003063 flame retardant Substances 0.000 title claims abstract description 51
- 239000000779 smoke Substances 0.000 title claims abstract description 30
- 229920003020 cross-linked polyethylene Polymers 0.000 title claims abstract description 29
- 239000004703 cross-linked polyethylene Substances 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 238000004132 cross linking Methods 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 14
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 14
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 239000007822 coupling agent Substances 0.000 claims abstract description 10
- 239000003112 inhibitor Substances 0.000 claims abstract description 9
- 239000003999 initiator Substances 0.000 claims abstract description 9
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 9
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 239000004925 Acrylic resin Substances 0.000 claims description 12
- 229920000178 Acrylic resin Polymers 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000002250 absorbent Substances 0.000 claims description 10
- 239000004615 ingredient Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 238000013329 compounding Methods 0.000 claims description 9
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 6
- 229920002261 Corn starch Polymers 0.000 claims description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 239000008120 corn starch Substances 0.000 claims description 6
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical group CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 6
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 5
- 230000002745 absorbent Effects 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 229920001684 low density polyethylene Polymers 0.000 claims description 4
- 239000004702 low-density polyethylene Substances 0.000 claims description 4
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 3
- 229920000578 graft copolymer Polymers 0.000 claims description 3
- 229920001912 maleic anhydride grafted polyethylene Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000006386 neutralization reaction Methods 0.000 claims description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical group COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 3
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 3
- 235000011151 potassium sulphates Nutrition 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 claims description 2
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims 2
- 229920000092 linear low density polyethylene Polymers 0.000 claims 1
- 239000004707 linear low-density polyethylene Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 3
- 239000011810 insulating material Substances 0.000 abstract description 3
- 229920000098 polyolefin Polymers 0.000 abstract description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 18
- 229920000915 polyvinyl chloride Polymers 0.000 description 17
- -1 polyethylene Polymers 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000004594 Masterbatch (MB) Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- PVYDNJADTSAQQU-UHFFFAOYSA-N prop-1-ene;hydrochloride Chemical compound Cl.CC=C PVYDNJADTSAQQU-UHFFFAOYSA-N 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical compound CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004595 color masterbatch Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- OEIWPNWSDYFMIL-UHFFFAOYSA-N dioctyl benzene-1,4-dicarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C=C1 OEIWPNWSDYFMIL-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003546 flue gas Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N o-dihydroxy-benzene Natural products OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 210000004722 stifle Anatomy 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229940070527 tourmaline Drugs 0.000 description 1
- 229910052613 tourmaline Inorganic materials 0.000 description 1
- 239000011032 tourmaline Substances 0.000 description 1
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
本发明公开了阻燃低烟无卤免硅烷交联聚乙烯电缆料及其制备方法,由以下重量份原料制成:聚烯烃树脂9.3‑9.4份、阻燃剂0.1‑0.2份、阻聚剂0.1‑0.2份、相容剂0.15‑0.2份、催化剂0.1‑0.2份、免辐射交联敏化剂0.15‑0.25份、抗氧剂0.1‑0.2份、引发剂0.1‑0.2份、偶联剂0.1‑0.2份、助剂0.1‑0.2份。本发明通过对阻燃低烟无卤免硅烷交联聚乙烯电缆料配方的优化设计,得到了机械性能、阻燃性能、加工性能优秀的复合材料,符合无卤阻燃聚烯烃绝缘料的技术要求。
Description
【技术领域】
本发明涉及阻燃绝缘材料技术领域,具体涉及阻燃低烟无卤免硅烷交联聚乙烯电缆料及其制备方法。
【背景技术】
电线电缆中主要使用聚氯乙烯(PVC)树脂,聚氯乙烯树脂是目前世界上仅次于聚乙烯的第二大树脂品种。PVC树脂由于具有刚性好、强度高、耐腐蚀、电气绝缘性好以及加工性能良好、价格低廉的优点,在电缆行业有着广泛的应用。聚氯乙烯电缆料主要用于电力电缆、控制电缆、通信电缆等各类电缆的护套材料。PVC电缆料是以聚氯乙烯为基础树脂,添加稳定剂、邻苯二甲酸二辛酯,邻苯二甲酸二异癸酯,对苯二甲酸二辛酯、偏苯三酸三辛酯等增塑剂以及碳酸钙等无机填充物、助剂和润滑剂等添加剂,经过混配捏合挤出而制备的粒子。
但是由于聚氯乙烯树脂属于不耐耐温的材料,聚氯乙烯对光、热的稳定性较差,软化点仅为80℃,在130℃就开始分解。当电线电缆在运行中存在外部和内部故障时,电线电缆很容易因耐温等级达不到要求产生溶胶并发生燃烧,电缆在传输电能过程中往往会由其自身发热、短路或火灾等引发电缆燃烧,对生命财产造成损害。为了降低故障损失,需在材料中增加特殊的被肤耦合剂材料来提高聚氯乙烯耐热性。传统的聚氯乙烯电线电缆材料最高长期耐温等级只能达到105℃,一旦电流过高或者负载高时,传统的聚氯乙烯电线电缆极其容易溶胶开裂并发生火灾,容易产生大量烟雾对周围的环境造成污染。
目前,国内电缆领域的高阻燃PVC护套料有许多,但其在大规模火焰燃烧时容易碳化,材料容易从电缆表面脱落,对电缆的实际使用产生巨大的破坏,甚至中断运行,并且电缆在燃烧过程中也会产生大量的有毒烟气、腐蚀性气体会使人窒息、中毒,不仅对逃生者和救援人员造成极大的危害而且污染环境。中国专利申请CN107619560A公开了一种耐高温阻燃PVC电缆料,所述耐高温阻燃PVC电缆料由以下重量份的组分组成:聚氯乙烯120-150份、镁铝合金5-10份、阻燃剂50-100份、分散剂20-50份和复合阻燃协效剂5.2-10份,该专利中的阻燃剂高达50-100份,占原料的百分比为25-31%,虽然提高了电缆的阻燃性能,但是大量阻燃剂的添加会引起电缆力学性能、体积电阻率和耐低温等性能的下降。中国专利申请CN105482296A公开了一种轻质耐热阻燃改性PVC树脂复混电缆料及其制备方法,该电缆料由以下重量份的原料制成:PVC树脂55-65、乙烯-醋酸乙烯共聚物30-40、拖玛琳0.01-0.02、可膨胀石墨10-15、聚四亚甲基乙二醇醚5-8、硅酸铝15-22、桐油酸3-4、六甲基二氮硅烷3-4、棉浆22-30、硬脂酸锌2-4、二甘醇二苯甲酸酯14-18、色母料8-10、助剂2-3;该电缆料将PVC树脂与乙烯-醋酸乙烯共聚物共混作为树脂基料,并以经改性处理后的棉浆作为填料,再结合具有改善加工性能功效的助剂及其它辅助原料,使得该电缆料相比于传统PVC树脂在使用时表现出更为优良的耐热阻燃性能,但是其在树脂基料中添加了较多的可膨胀石墨,由于可膨胀石墨为导电体,将其作为填料加入电缆料中会大幅降低其绝缘性能,导致漏电触电等危险的发生,具有很大的安全隐患。
综上所述,研发阻燃低烟无卤免硅烷交联聚乙烯电缆料,具有很好的市场前景。
【发明内容】
针对现有技术的上述缺陷和问题,本发明目的是提供阻燃低烟无卤免硅烷交联聚乙烯电缆料及其制备方法,通过对阻燃低烟无卤免硅烷交联聚乙烯电缆料配方的优化设计,得到了机械性能、阻燃性能、加工性能优秀的复合材料,符合无卤阻燃聚烯烃绝缘料的技术要求。
本发明所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料,由以下重量份原料制成:
本发明所述的聚烯烃树脂,选自熔体指数(MI)为2的低密度聚乙烯(LDPE)树脂或者线性低密度聚乙烯(LLDPE)中的一种,聚烯烃树脂作为基材树脂,不同的树脂由于其大分子内部结构的差异,对其接枝交联产生很大影响,所以使用不同的基材树脂或不同生产厂家的同一种类型的树脂,其用量也将随之而修正。
所述的阻燃剂,选自Al(OH)3。
所述的阻聚剂,选自对羟基苯甲醚或对叔丁基邻苯二酚,加入阻聚剂是为了抑制一些接枝和交联过程的副反应发生,加入的阻聚剂在相同条件下会先于接枝上的硅烷水解,能降低接枝聚乙烯的水解,提高接枝料的长期稳定性。
所述的相容剂,选自马来酸酐接枝聚乙烯(PE-g-MAH)。
所述的催化剂,来源于有机锡衍生物(自然交联除外),具体选自二月桂酸二丁基锡(DBDTL)。催化剂一般以母料形式加入,在二步法中,接枝料(A料)和催化剂母料(B料)是分别包装,在加入挤出机前才把A料和B料混在一起,这样是为了防止A料的预交联。
所述的免辐射交联敏化剂,选自聚乙烯醇,聚乙烯醇水溶液辐照时交联成凝胶,能有效地降低C2C交联的发生,从而提高加工流动性,添加聚乙烯醇,来明显降低所用辐照剂量。
所述的抗氧剂,选自抗氧剂1010、抗氧剂168、抗氧剂330中的一种,加入抗氧剂是为了保证聚乙烯加工过程中的稳定性及电缆的抗老化,抗氧剂在偶联剂(硅烷)接枝过程中有抑制接枝反应的作用,在二步法交联过程中,大部分的抗氧剂可在催化剂母料中加入,这样能减少对接枝过程的影响,而在一步法交联过程中,抗氧剂存在于整个接枝过程,所以其品种和量的选择更为重要。
所述的引发剂,选自过氧化二异丙苯(DCP),引发剂的用量很关键,过少导致硅烷接枝不够;过多引起聚乙烯交联,从而使其流动性降低,挤出的绝缘线芯表面粗糙,挤制困难。
所述的偶联剂,选自乙烯基不饱和硅烷,具体是乙烯基三乙氧基硅烷(A2151)或乙烯基三甲氧基硅烷(A2171),因为乙烯基三甲氧基硅烷(A2171)的水解速率快,优选乙烯基三乙氧基硅烷(A2151)。
所述的助剂,选自高吸水性丙烯酸树脂,制备方法是:将玉米淀粉与丙烯酰胺、丙烯酸在水溶液中聚合制备高吸水性树脂,原料按照以下质量比例:硫酸钾、玉米淀粉、偶氮二异庚腈、N,N-亚甲基双丙烯酰胺、丙烯酰胺、丙烯酸=1:1:0.02:0.002:1:24,反应温度为50℃,反应时间为2h,丙烯酸中和度为95%时,获得吸水倍数为700倍的吸水性树脂,得到二元接枝聚合物的高吸水性丙烯酸树脂。
本发明所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料的制备方法,包括如下步骤:
1)将阻燃剂、阻聚剂、相容剂、催化剂,按照配方量复配在一起,通过混料、造粒、冷却、包装,得到配料A;
2)将抗氧剂、引发剂、偶联剂,按照配方量复配在一起,通过混料、造粒、冷却、包装,得到配料B;
3)将聚烯烃树脂、免辐射交联敏化剂、助剂、配料A、配料B,按照配方量复配在一起,混合均匀,输送至双螺杆挤出机,经双螺杆挤出机造粒后,进行水冷热切,得到阻燃低烟无卤免硅烷交联聚乙烯电缆料。
本发明步骤3)所述的双螺杆挤出机,双螺杆挤出机中各区的温度控制如下:进料区为170-180℃,塑化区为185-190℃,机头温度为190-195℃,水冷的温度为20-40℃。
和现有技术相比,本发明具有如下优点:
1、本发明阻燃低烟无卤免硅烷交联聚乙烯电缆料的制备方法,在生产中将配料A(阻燃剂、阻聚剂、相容剂、催化剂)、配料B(抗氧剂、引发剂、偶联剂)分开混合,有利于防止物料的预交联,将聚烯烃树脂、免辐射交联敏化剂、助剂、配料A、配料B混合后就可以开机了,开机后不用再辐照,就可以到达辐照交联的各个性能参数。
2、本发明在阻燃低烟无卤免硅烷交联聚乙烯电缆料的制备过程中,加入了高吸水性丙烯酸树脂,主要成分为淀粉接枝丙烯盐酸聚合交联物,具有多羟基网状结构,可以有效的将配料A、配料B交联紧密,增强阻燃低烟无卤免硅烷交联聚乙烯电缆料的机械性能。
【具体实施方式】
以下结合实施例对本发明的具体实施方式做进一步说明。
实施例1:
阻燃低烟无卤免硅烷交联聚乙烯电缆料,由以下重量份原料制成:
实施例2:
阻燃低烟无卤免硅烷交联聚乙烯电缆料,由以下重量份原料制成:
线性低密度聚乙烯(LLDPE) | 9.4kg、 |
阻燃剂:Al(OH)<sub>3</sub> | 0.1kg、 |
阻聚剂:对叔丁基邻苯二酚 | 0.2kg、 |
相容剂:马来酸酐接枝聚乙烯(PE-g-MAH) | 0.15kg、 |
催化剂:二月桂酸二丁基锡(DBDTL) | 0.2kg、 |
免辐射交联敏化剂:聚乙烯醇 | 0.15kg、 |
抗氧剂:抗氧剂168 | 0.2kg、 |
引发剂:过氧化二异丙苯(DCP) | 0.1kg、 |
偶联剂:乙烯基三甲氧基硅烷(A2171) | 0.2kg、 |
助剂 | 0.2kg。 |
实施例3:
阻燃低烟无卤免硅烷交联聚乙烯电缆料,由以下重量份原料制成:
实施例1-3所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料的制备方法,包括如下步骤:
1)将阻燃剂、阻聚剂、相容剂、催化剂,按照配方量复配在一起,通过混料、造粒、冷却、包装,得到配料A;
2)将抗氧剂、引发剂、偶联剂,按照配方量复配在一起,通过混料、造粒、冷却、包装,得到配料B;
3)将聚烯烃树脂、免辐射交联敏化剂、助剂、配料A、配料B,按照配方量复配在一起,混合均匀,输送至双螺杆挤出机,经双螺杆挤出机造粒后,双螺杆挤出机中各区的温度控制如下:进料区为170-180℃,塑化区为185-190℃,机头温度为190-195℃,水冷的温度为20-40℃,进行水冷热切,得到阻燃低烟无卤免硅烷交联聚乙烯电缆料;
所述的助剂,选自高吸水性丙烯酸树脂,制备方法是:将玉米淀粉与丙烯酰胺、丙烯酸在水溶液中聚合制备高吸水性树脂,原料按照以下质量比例:硫酸钾、玉米淀粉、偶氮二异庚腈、N,N-亚甲基双丙烯酰胺、丙烯酰胺、丙烯酸=1:1:0.02:0.002:1:24,反应温度为50℃,反应时间为2h,丙烯酸中和度为95%时,获得吸水倍数为700倍的吸水性树脂,得到二元接枝聚合物的高吸水性丙烯酸树脂。
对比例1:
和实施例1相比,没有添加助剂(高吸水性丙烯酸树脂),其他同实施例1。
对比例2:
和实施例1相比,把助剂由高吸水性丙烯酸树脂替换为丙烯酸树脂,其他同实施例1。
对比例3:
和实施例1相比,在制备方法中,是把所有原料一次性投入,混合均匀,进行制备。
技术指标::
结论:
通过实施例1-3和对比例1-2的比较可知:本发明阻燃低烟无卤免硅烷交联聚乙烯电缆料的制备方法,在原料中添加了高吸水性丙烯酸树脂作为助剂,其主要成分为淀粉接枝丙烯盐酸聚合交联物,具有多羟基网状结构,可以有效的将配料A、配料B交联紧密,增强阻燃低烟无卤免硅烷交联聚乙烯电缆料的机械性能。
通过实施例1-3和对比例3的比较可知:对比例3的所有原料一次性投入,在制备过程中,产生了聚乙烯预交联,从而使其流动性降低,挤出的绝缘线芯表面粗糙,挤制困难,加工性能差,最后导致线缆的机械性能降低。
上述说明是针对本发明较佳可行实施例的详细说明,但实施例并非用以限定本发明的专利申请范围,凡本发明所提示的技术精神下所完成的同等变化或修饰变更,均应属于本发明所涵盖专利范围。
Claims (7)
1.阻燃低烟无卤免硅烷交联聚乙烯电缆料,其特征在于:由以下重量份原料制成:
所述的聚烯烃树脂,选自熔体指数为2的低密度聚乙烯树脂或者线性低密度聚乙烯中的一种;
所述的阻燃剂,选自Al(OH)3;
所述的阻聚剂,选自对羟基苯甲醚或对叔丁基邻苯二酚;
所述的相容剂,选自马来酸酐接枝聚乙烯;
所述的催化剂,选自二月桂酸二丁基锡;
所述的免辐射交联敏化剂,选自聚乙烯醇;
所述的抗氧剂,选自抗氧剂1010、抗氧剂168、抗氧剂330中的一种;
所述的偶联剂,选自乙烯基三乙氧基硅烷或乙烯基三甲氧基硅烷;
所述的引发剂,选自过氧化二异丙苯;
所述的助剂,选自高吸水性丙烯酸树脂,制备方法是:将玉米淀粉与丙烯酰胺、丙烯酸在水溶液中聚合制备高吸水性树脂,原料按照以下质量比例:硫酸钾、玉米淀粉、偶氮二异庚腈、N,N-亚甲基双丙烯酰胺、丙烯酰胺、丙烯酸=1:1:0.02:0.002:1:24,反应温度为50℃,反应时间为2h,丙烯酸中和度为95%时,获得吸水倍数为700倍的吸水性树脂,得到二元接枝聚合物的高吸水性丙烯酸树脂。
2.根据权利要求1所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料,其特征在于:所述的聚烯烃树脂,选自熔体指数为2的低密度聚乙烯树脂。
3.根据权利要求1所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料,其特征在于:所述的阻聚剂,选自对羟基苯甲醚。
4.根据权利要求1所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料,其特征在于:所述的抗氧剂,选自抗氧剂1010。
5.根据权利要求1所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料,其特征在于:所述的偶联剂,选自乙烯基三乙氧基硅烷。
6.根据权利要求1-5任一项所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料的制备方法,其特征在于:包括如下步骤:
1)将阻燃剂、阻聚剂、相容剂、催化剂,按照配方量复配在一起,通过混料、造粒、冷却、包装,得到配料A;
2)将抗氧剂、引发剂、偶联剂,按照配方量复配在一起,通过混料、造粒、冷却、包装,得到配料B;
3)将聚烯烃树脂、免辐射交联敏化剂、配料A、配料B,按照配方量复配在一起,混合均匀,输送至双螺杆挤出机,经双螺杆挤出机造粒后,进行水冷热切,得到阻燃低烟无卤免硅烷交联聚乙烯电缆料。
7.根据权利要求6所述的阻燃低烟无卤免硅烷交联聚乙烯电缆料的制备方法,其特征在于:步骤3)所述的双螺杆挤出机,双螺杆挤出机中各区的温度控制如下:进料区为170-180℃,塑化区为185-190℃,机头温度为190-195℃,水冷的温度为20-40℃。
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