CN112775541A - Laser cutting equipment for printed circuit board - Google Patents
Laser cutting equipment for printed circuit board Download PDFInfo
- Publication number
- CN112775541A CN112775541A CN202010729422.8A CN202010729422A CN112775541A CN 112775541 A CN112775541 A CN 112775541A CN 202010729422 A CN202010729422 A CN 202010729422A CN 112775541 A CN112775541 A CN 112775541A
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- Prior art keywords
- laser
- printed circuit
- fixed
- circuit board
- axis linear
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 33
- 239000004579 marble Substances 0.000 claims abstract description 33
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 230000001681 protective effect Effects 0.000 claims abstract description 7
- 239000000428 dust Substances 0.000 claims description 17
- 238000000605 extraction Methods 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 3
- 239000000779 smoke Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 description 14
- 238000005086 pumping Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses laser cutting equipment for a printed circuit board, which comprises a cabinet base and a protective cabinet arranged on the cabinet base, wherein a cabinet door is arranged on the front end face of the protective cabinet, a marble platform is fixed on the upper end face of the cabinet base in the protective cabinet, a marble portal frame is fixed on the marble platform, an X-axis linear module and a Y-axis linear module are arranged on the marble platform below the marble portal frame, a laser optical component for performing laser cutting on the printed circuit board is arranged on the marble portal frame, and laser emitted by the laser optical component is vertical to the upper end face of the printed circuit board. Compared with the prior art, the invention can realize the high-precision laser cutting processing of the printed circuit board and improve the yield of products; meanwhile, smoke generated during laser cutting is pumped away through a vacuumizing device; the invention is suitable for switching printed circuit boards with various specifications, improves the efficiency and reduces the material consumption.
Description
Technical Field
The invention relates to the technical field of cutting equipment of printed circuit boards, in particular to laser cutting equipment of a printed circuit board.
Background
At present, the known cutting methods of printed circuit boards include CNC cutting, stamping cutting, laser cutting, etc. The CNC cutting needs reserving a wider cutting seam and consumables such as a cutter and the like; the punching press cuts and to have wearing and tearing because of blanking die, also can lead to producing the consumptive material expense, can produce simultaneously and cut the quality unstability, and the punching press cuts cutting only being applicable to cutting of fixed single product moreover, changes the product and need change cutting die in step, and inconvenient being used for many products is nimble to be switched.
The existing laser cutting equipment runs semi-automatically, and intelligent processing cannot be realized by manually setting the coordinate value of laser cutting.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides laser cutting equipment for a printed circuit board.
In order to achieve the purpose, the invention is implemented according to the following technical scheme:
a laser cutting device for printed circuit boards comprises a cabinet base and a protective cabinet arranged on the cabinet base, wherein a cabinet door is arranged on the front end face of the protective cabinet, a marble platform is fixed on the upper end face of the cabinet base in the protective cabinet, a marble portal frame is fixed on the marble platform, an X-axis linear module and a Y-axis linear module are arranged on the marble platform below the marble portal frame, the Y-axis linear module is fixed on the upper end face of the marble platform, the X-axis linear module is fixed on the Y-axis linear module and drives the X-axis linear module to move along the Y-axis direction by the Y-axis linear module, the X-axis linear module and the Y-axis linear module are vertically distributed, a carrying board for placing the printed circuit boards is fixed on the X-axis linear module and drives the carrying board to move along the X-axis direction by the X-axis linear module, and a laser optical component for carrying out laser cutting on the printed, the laser optical component emits laser light perpendicular to the upper end face of the printed circuit board.
Furthermore, the laser optical component comprises a UV laser, a laser beam expander, a fixed reflector, a Z-axis linear module, a movable reflector and a laser scanning galvanometer; the UV laser is horizontally fixed on the upper end surface of the transverse plate, the side wall of the transverse plate is fixed on one side wall of the marble portal frame, the transverse plate is parallel to the object carrying plate, the laser beam expanding lens is fixed on the upper end surface of the transverse plate at the light outlet of the UV laser, the light inlet of the fixed reflector is fixed at the light outlet of the laser beam expanding lens, the light outlet of the fixed reflector is vertical to the light inlet of the fixed reflector, and the light outlet of the fixed reflector is vertically downward and is positioned outside the end part of the transverse plate; diaphragm tip vertical fixation has the riser, Z axle straight line module longitudinal fixation is on the outer terminal surface of riser, movable reflecting mirror and laser scanning shake the mirror and fix on Z axle straight line module by Z axle straight line module drive movable reflecting mirror and laser scanning shake the mirror along Z axle direction motion, the light-emitting window of movable reflecting mirror is fixed on the income light mouth of laser scanning mirror that shakes, laser scanning shakes the light-emitting window vertical downwards of mirror and the laser perpendicular to printed circuit board up end that jets out, the income light mouth of movable reflecting mirror and the light-emitting window mutually perpendicular of movable reflecting mirror, the income light mouth of movable reflecting mirror is perpendicular upwards and with the central line coincidence of the light-emitting window of fixed reflecting mirror.
Further, be fixed with on the outer wall of laser scanning galvanometer and install industry camera, the camera lens of industry camera is perpendicular to and is carried thing board up end, the preceding terminal surface of protection cabinet is equipped with the display, and the display is connected with industry camera and is used for receiving and shows the photo that industry camera was shot.
Further, laser scanning shakes the light-emitting port below of mirror and is equipped with square dust extraction box, and square dust extraction box one end vertical fixation is on the outer terminal surface of riser, runs through riser and square dust extraction box one end and is equipped with the dust extraction hose that communicates with square dust extraction box inside, and the other end of dust extraction hose is connected with the evacuating device who fixes in the protection cabinet, and the through-hole that supplies laser to pass through is seted up to the up end and the lower terminal surface that lie in the square dust extraction box of laser scanning mirror's light-emitting port below.
Further, the preceding terminal surface of protection cabinet is equipped with the button that is used for controlling X axle straight line module, Y axle straight line module, UV laser instrument, Z axle straight line module, laser scanning galvanometer, industry camera and evacuating device respectively.
Furthermore, a telescopic sleeve is connected between the light inlet of the movable reflector and the light outlet of the fixed reflector.
Preferably, the cabinet door is a sliding door, can be flexibly opened, and is convenient to debug and operate.
Preferably, a glass observation window is arranged on the cabinet door.
Compared with the prior art, the laser is fixed on the marble gantry platform, laser beams enter the laser scanning galvanometer through the beam expanding lens and the turn-back lens, the laser scanning galvanometer is mounted on the Z-axis linear module and moves up and down along the Z-axis direction, the X, Y-axis linear motor module can drive the printed circuit board on the carrying board to move along the X, Y-axis direction on the marble platform base, and then the printed circuit board is photographed by an industrial camera and displayed on the display so as to facilitate the visual positioning of the cutting part of the printed circuit board, so that the high-precision laser cutting processing of the printed circuit board is realized, and the product yield is improved; meanwhile, smoke generated during laser cutting is pumped away through a vacuumizing device; the invention is suitable for switching printed circuit boards with various specifications, improves the efficiency and reduces the material consumption.
Drawings
Fig. 1 is a schematic view of the external structure of the present invention.
Fig. 2 is a schematic view of the internal structure of the present invention.
Fig. 3 is a schematic structural diagram of a laser optical assembly according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. The specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
As shown in fig. 1 to 3, the laser cutting apparatus for a printed circuit board of the present embodiment includes a cabinet base 1 and a protection cabinet 2 disposed on the cabinet base 1, a cabinet door 5 is disposed on a front end surface of the protection cabinet 2, the cabinet door 5 is of a sliding door structure, specifically, an opening is disposed on the front end surface of the protection cabinet 2, a sliding rail is disposed in the opening, and the cabinet door 5 can slide in the sliding rail, which is not shown in detail in the drawings because of a more conventional structure in the field, but as known by those skilled in the art, the cabinet door 5 is of a sliding door structure, so that the cabinet door 5 can be opened more conveniently to place a printed circuit board 12 to be cut on a loading plate 11 in the protection cabinet 2; in addition, the cabinet door 5 can move only on the surface of the cabinet door 5 by adopting a sliding door mechanism, so that the space can be saved; certainly, in order to facilitate the observation of the cutting process in the protection cabinet 2 from the cabinet door 5, a glass observation window 6 is arranged on the cabinet door 5; a marble platform 7 is fixed on the upper end face of the cabinet base 1 in the protection cabinet 2, a marble portal frame 8 is fixed on the marble platform 7, an X-axis linear module 10 and a Y-axis linear module 9 are arranged on the marble platform 7 below the marble portal frame 8, the X-axis linear module 10 and the Y-axis linear module 9 can be purchased and used on the market directly, and the specific structure of the marble platform is not described again in this embodiment; the Y-axis linear module 9 is fixed on the upper end surface of the marble platform 7, the base of the X-axis linear module 10 is fixed on a sliding block on the Y-axis linear module 9, the Y-axis linear module 9 drives the X-axis linear module 10 to move along the Y-axis direction, the X-axis linear module 10 and the Y-axis linear module 9 are vertically distributed, a carrying plate 11 for placing a printed circuit board 12 is fixed on the sliding block on the X-axis linear module 10, the carrying plate 11 is driven by the X-axis linear module 10 to move along the X-axis direction, and therefore the X-axis linear module 10 and the Y-axis linear module 9 can drive the printed circuit board 12 on the carrying plate 11 to move along the X, Y axis; the marble portal frame 8 is provided with a laser optical component 13 used for carrying out laser cutting on the printed circuit board, the laser emitted by the laser optical component 13 is perpendicular to the upper end surface of the printed circuit board 12, the printed circuit board 12 on the object carrying plate 11 can be driven to move along the X, Y axis through the X-axis linear module 10 and the Y-axis linear module 9, and the laser optical component 13 can carry out point-to-line laser cutting on the printed circuit board 12.
Specifically, as shown in fig. 2 and fig. 3, the laser optical assembly 13 of the present embodiment includes a UV laser 1303, a laser beam expander 1304, a fixed mirror 1305, a Z-axis linear module 1306, a movable mirror 1307, and a laser scanning galvanometer 1308; the UV laser 1303 is horizontally fixed on the upper end surface of the transverse plate 1301, the side wall of the transverse plate 1301 is fixed on one side wall of the marble portal frame 8, the transverse plate 1301 and the object carrying plate 11 are parallel to each other, in order to make the UV laser 1303 installed more stably, as shown in fig. 2, a supporting table (not marked in the figure) for installing the transverse plate 1301 is also installed on the side wall of the marble portal frame 8, the laser beam expanding lens 1304 is fixed on the upper end surface of the transverse plate 1301 at the light outlet of the UV laser 1303, the light inlet of the fixed reflector 1305 is fixed at the light outlet of the laser beam expanding lens 1304, the light outlet of the fixed reflector 1305 is perpendicular to the light inlet of the fixed reflector 1305, that is, the reflector in the fixed reflector 1305 forms a 45-degree included angle with the emergent light of the laser beam expanding lens 1304, and the light outlet of the fixed reflector 1305 is vertically downward and located; a vertical plate 1302 is vertically fixed at the end of the horizontal plate 1301, the Z-axis linear module 1306 is longitudinally fixed on the outer end face of the vertical plate 1302, the movable reflecting mirror 1307 and the laser scanning galvanometer 1308 are fixed on the Z-axis linear module 1306, the movable reflecting mirror 1307 and the laser scanning galvanometer 1308 are driven by the Z-axis linear module 1306 to move along the Z-axis direction, and the laser scanning galvanometer 1308 can move up and down under the drive of the Z-axis linear module so as to achieve the purpose of adjusting the laser focus emitted from the light outlet of the laser scanning galvanometer 1308; the light outlet of the movable reflector 1307 is fixed on the light inlet of the laser scanning galvanometer 1308, and the purpose of the laser scanning galvanometer 1308 is to improve the precision of laser positioning, the light outlet of the laser scanning galvanometer 1308 is vertically downward and the emitted laser is perpendicular to the upper end surface of the printed circuit board 12, the light inlet of the movable reflector 1307 is perpendicular to the light outlet of the movable reflector 1307, that is, the reflective mirror in the movable reflector 1307 forms a 45-degree included angle with the light outlet of the fixed reflector 1305, and the light inlet of the movable reflector 1307 is vertically upward and coincides with the center line of the light outlet of the fixed reflector 1305.
Since the printed circuit board is a precision device, the X-axis line module 10, the Y-axis line module 9, and the Z-axis line module 1306 require high precision, and therefore, for example, line modules having a precision of 0.05mm can be purchased directly on the market.
In some embodiments, as shown in fig. 3, an extensible sleeve 1309 is connected between the light inlet of the movable reflecting mirror 1307 and the light outlet of the fixed reflecting mirror 1305, and the movable reflecting mirror 1307 and the fixed reflecting mirror 1305 are connected through the extensible sleeve 1309, which can ensure that light emitted from the fixed reflecting mirror 1305 can be emitted into the movable reflecting mirror 1307 in a straight line.
In some embodiments, as shown in fig. 3, an industrial camera 1310 is fixed on an outer wall of the laser scanning galvanometer 1308, a lens of the industrial camera 1310 faces vertically to an upper end face of the object carrying plate 11, a display 4 is disposed on a front end face of the protection cabinet 2, the display 4 is connected with the industrial camera 1310 for receiving and displaying a photo taken by the industrial camera, the photo on the display 4 is displayed in real time to achieve visual positioning of a cutting portion of the printed circuit board, and then the X-axis linear module 10, the Y-axis linear module and the Z-axis linear module can be operated to move outside the protection cabinet 2, so as to perform point-to-line laser cutting on the printed circuit board 12. Certainly, in order to facilitate the operation outside the protection cabinet 2, the front end surface of the protection cabinet 2 is provided with buttons 3 for controlling the X-axis linear module 10, the Y-axis linear module 9, the UV laser 1303, the Z-axis linear module 1306, the laser scanning galvanometer 1308, and the industrial camera 1310, respectively.
In some embodiments, as shown in fig. 3, a square dust-pumping box 1311 is disposed below the light outlet of the laser scanning galvanometer 1308, one end of the square dust-pumping box 1311 is vertically fixed to the outer end face of the vertical plate 1302, a dust-pumping hose 1312 communicated with the inside of the square dust-pumping box is disposed through one end of the vertical plate 1302 and one end of the square dust-pumping box 1311, the other end of the dust-pumping hose 1312 is connected to a vacuum device (not shown) fixed in the protection cabinet 2, the vacuum device exhausts the pumped dust out of the protection cabinet 2, and through holes 1313 for allowing laser to pass through are disposed on the upper end face and the lower end face of the square dust-pumping box 1311 below the light outlet of the laser scanning galvanometer 1308. The square dust extraction box 1311 is arranged to extract smoke dust generated during laser cutting, and cutting precision is prevented from being affected. In order to control the cabinet 2, a button 3 of a vacuum extractor is arranged on the front end surface of the cabinet 2.
When the laser cutting equipment for the printed circuit board is used for carrying out laser cutting on the printed circuit board 12, the specific operation process is as follows:
firstly, the purpose of adjusting the laser focus emitted from the light outlet of the laser scanning galvanometer 1308 is achieved by adjusting the up-and-down motion under the driving of the Z-axis linear module by a button outside the protection cabinet 2, after the laser focus is adjusted, the printed circuit board 12 is placed on the object carrying plate 11 by the cabinet door 5, then the cabinet door 5 is closed, the industrial camera 1310 and the display 4 are opened, the industrial camera 1310 photographs the printed circuit board 12 and displays the picture of the printed circuit board 12 on the display 4 in real time, the X-axis linear module 10 and the Y-axis linear module 9 are controlled by the button outside the protection cabinet 2 to drive the printed circuit board 12 on the object carrying plate 11 to move along the X, Y axis direction to reach the cutting starting point, then the UV laser 1303 emits laser, and the button outside the protection cabinet 2 is controlled to control the X-axis linear module 10 and the Y-axis linear module 9 to drive the printed circuit board 12 on the object carrying plate 11 to move along, The Y-axis direction moves, so that the laser light source is fixed, and the high-precision laser cutting processing of the printed circuit board is realized by only moving the printed circuit board 12; the vacuum extractor is started to extract the smoke generated during the laser cutting while the printed circuit board 12 is cut.
The technical solution of the present invention is not limited to the limitations of the above specific embodiments, and all technical modifications made according to the technical solution of the present invention fall within the protection scope of the present invention.
Claims (8)
1. The utility model provides a printed circuit board laser cutting equipment, includes rack base and the protection cabinet of setting on rack base, and the preceding terminal surface of protection cabinet is equipped with cabinet door, its characterized in that: a marble platform is fixed on the upper end surface of the cabinet base in the protective cabinet, a marble portal frame is fixed on the marble platform, an X-axis linear module and a Y-axis linear module are arranged on the marble platform below the marble portal frame, the Y-axis linear module is fixed on the upper end surface of the marble platform, the X-axis linear module is fixed on the Y-axis linear module and drives the X-axis linear module to move along the Y-axis direction, the X-axis linear module and the Y-axis linear module are vertically distributed, a carrying plate for placing a printed circuit board is fixed on the X-axis linear module and is driven by the X-axis linear module to move along the X-axis direction, the marble portal frame is provided with a laser optical component for carrying out laser cutting on the printed circuit board, and laser emitted by the laser optical component is perpendicular to the upper end face of the printed circuit board.
2. Laser cutting device of a printed circuit board according to claim 1, characterized in that: the laser optical component comprises a UV laser, a laser beam expander, a fixed reflector, a Z-axis linear module, a movable reflector and a laser scanning galvanometer; the UV laser is horizontally fixed on the upper end surface of the transverse plate, the side wall of the transverse plate is fixed on one side wall of the marble portal frame, the transverse plate is parallel to the object carrying plate, the laser beam expanding lens is fixed on the upper end surface of the transverse plate at the light outlet of the UV laser, the light inlet of the fixed reflector is fixed at the light outlet of the laser beam expanding lens, the light outlet of the fixed reflector is vertical to the light inlet of the fixed reflector, and the light outlet of the fixed reflector is vertically downward and is positioned outside the end part of the transverse plate; diaphragm tip vertical fixation has the riser, Z axle straight line module longitudinal fixation is on the outer terminal surface of riser, movable reflecting mirror and laser scanning shake the mirror and fix on Z axle straight line module by Z axle straight line module drive movable reflecting mirror and laser scanning shake the mirror along Z axle direction motion, the light-emitting window of movable reflecting mirror is fixed on the income light mouth of laser scanning mirror that shakes, laser scanning shakes the light-emitting window vertical downwards of mirror and the laser perpendicular to printed circuit board up end that jets out, the income light mouth of movable reflecting mirror and the light-emitting window mutually perpendicular of movable reflecting mirror, the income light mouth of movable reflecting mirror is perpendicular upwards and with the central line coincidence of the light-emitting window of fixed reflecting mirror.
3. Laser cutting device of a printed circuit board according to claim 2, characterized in that: the utility model discloses a laser scanning shakes the camera, including laser scanning galvanometer, camera lens, protection cabinet, display, camera lens, the outer wall of laser scanning galvanometer is fixed with on and installs industry camera, and the camera lens of industry camera is perpendicular to be towards in carrying thing board up end, the preceding terminal surface of protection cabinet is equipped with the display, and the display is connected with industry camera and is used for receiving and showing the photo that industry camera was shot.
4. Laser cutting device of a printed circuit board according to claim 2 or 3, characterized in that: the laser scanning shakes the light-emitting port below of mirror and is equipped with square dust extraction box, and square dust extraction box one end vertical fixation is on the outer terminal surface of riser, runs through riser and square dust extraction box one end and is equipped with the dust extraction hose that communicates with square dust extraction box inside, and the other end of dust extraction hose is connected with the evacuating device who fixes in the protection cabinet, and the through-hole that supplies laser to pass through is seted up to the up end and the lower terminal surface of the square dust extraction box that is located laser scanning shakes the light-emitting port below of mirror.
5. Laser cutting device of a printed circuit board according to claim 4, characterized in that: the front end face of the protection cabinet is respectively provided with a button for controlling an X-axis linear module, a Y-axis linear module, a UV laser, a Z-axis linear module, a laser scanning galvanometer, an industrial camera and a vacuumizing device.
6. Laser cutting device of a printed circuit board according to claim 2, characterized in that: and a telescopic sleeve is connected between the light inlet of the movable reflector and the light outlet of the fixed reflector.
7. Laser cutting device of a printed circuit board according to claim 1, characterized in that: the cabinet door is a sliding door.
8. Laser cutting device of a printed circuit board according to claim 7, characterized in that: and a glass observation window is arranged on the cabinet door.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010729422.8A CN112775541A (en) | 2020-07-27 | 2020-07-27 | Laser cutting equipment for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010729422.8A CN112775541A (en) | 2020-07-27 | 2020-07-27 | Laser cutting equipment for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112775541A true CN112775541A (en) | 2021-05-11 |
Family
ID=75750130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010729422.8A Pending CN112775541A (en) | 2020-07-27 | 2020-07-27 | Laser cutting equipment for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112775541A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113478101A (en) * | 2021-07-21 | 2021-10-08 | 常州机电职业技术学院 | Processing protector that chip substrate cutting equipment used |
| CN116197552A (en) * | 2023-04-06 | 2023-06-02 | 江苏跃格智能装备有限公司 | Intelligent laser cutting equipment with master-slave camera configuration |
| CN117377218A (en) * | 2023-12-05 | 2024-01-09 | 天津雨滨科技有限公司 | Circuit board laser cutting printing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116197552A (en) * | 2023-04-06 | 2023-06-02 | 江苏跃格智能装备有限公司 | Intelligent laser cutting equipment with master-slave camera configuration |
| CN117377218A (en) * | 2023-12-05 | 2024-01-09 | 天津雨滨科技有限公司 | Circuit board laser cutting printing device |
| CN117377218B (en) * | 2023-12-05 | 2024-02-02 | 天津雨滨科技有限公司 | Circuit board laser cutting printing device |
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